Independent temperature control system of chip aging machine

Abstract

The utility model belongs to the technical field of semiconductor testing, and particularly relates to an independent temperature control system of a chip aging machine, which comprises an aging machine table and a plurality of groups of chips to be tested connected with the aging machine table, the chips to be tested are connected with an independent temperature control socket, the independent temperature control socket is connected with a switching mechanism in an inserted manner, and the switching mechanism is connected with the aging machine table. The switching mechanism is in signal connection with a computer, and the computer is in data transmission with the chip to be tested through the switching mechanism and the independent temperature control socket. According to the utility model, the test temperature of the chip to be tested can be accurately adjusted and controlled, the problems of insufficient temperature and overtemperature are solved, the stability and accuracy of the chip aging test are ensured, the problem of temperature limitation is solved, the time of chip test is shortened, and the productivity utilization rate of an aging machine is greatly improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor testing, and in particular relates to an independent temperature control system for a chip aging machine. Background Art

[0002] Semiconductor testing is a key step in the semiconductor design, production, packaging, and testing process. It uses specific instruments to inspect devices to identify defects, verify whether the devices meet design goals, and separate good from bad products. Semiconductor testing can ensure that produced chips meet the required yield, reduce cost and waste, and provide effective test data to improve design and manufacturing. High temperatures are used to accelerate the electrical performance of the chip to assess its reliability and stability. Therefore, aging verification technology is currently used to test chips. Although this ensures that all chips are at the same temperature, individual differences among chips in the same batch can easily lead to large differences in junction and case temperatures. When the chip temperature exceeds the allowable range, it may cause melting or other inaccurate test results.

[0003] There are existing studies addressing the issues with current chip aging verification technology, such as patent application CN204241639U, a high-power chip aging verification device. This device monitors the chip's temperature by connecting a temperature control device to the chip, addressing the current issue of chip aging verification technology being unable to produce accurate test results. However, while existing chip aging verification devices can ensure that chips with varying power consumption are aged at a uniform temperature and produce accurate test results, they struggle to precisely adjust and control temperature fluctuations, severely impacting the stability and accuracy of chip aging tests. Therefore, a new technical solution is needed to address these issues. Utility Model Content

[0004] The purpose of the present invention is to provide an independent temperature control system for a chip aging machine to solve the problem raised in the above background technology that the current chip aging verification device is difficult to accurately adjust and control the temperature changes, thereby seriously affecting the stability and accuracy of the chip aging test.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an independent temperature control system for a chip aging machine, comprising an aging machine and several groups of chips to be tested connected to the aging machine, the several groups of chips to be tested being arranged in parallel, the chips to be tested being electrically connected to the power supply of the aging machine and simultaneously connected to the communication signal of the aging machine, the chips to be tested being connected to an independent temperature control socket, the independent temperature control socket being connected to a switching mechanism, the switching mechanism being signal-connected to a computer, the computer being set to transmit data with the chip to be tested through the switching mechanism and the independent temperature control socket.

[0006] Furthermore, the independent temperature control socket is divided into a thermal resistor socket and a heating socket, and the heating socket is arranged in parallel with the thermal resistor socket; one end of the thermal resistor socket and the heating socket are both connected to the chip to be tested, and the chip to be tested is connected to the adapter mechanism through the thermal resistor socket and the heating socket.

[0007] Furthermore, the adapter mechanism includes an adapter plate that is signal-connected to the thermistor socket and the heating socket, and the adapter plate is provided with a heating circuit and a temperature display circuit, and the heating circuit and the temperature display circuit are arranged in parallel; the heating circuit is connected to the heating socket through the adapter plate, and the temperature display circuit is connected to the thermistor socket through the adapter plate.

[0008] Furthermore, the heating circuit includes a pulse width modulation switch, one end of the pulse width modulation switch is electrically connected to the heating socket through an adapter board and is connected to the chip to be tested through the heating socket, and the other end of the pulse width modulation switch is connected to the computer signal through the adapter board; the temperature display circuit includes an analog switch, one end of the analog switch is electrically connected to the thermistor socket through an adapter board and is connected to the chip to be tested through the thermistor socket, and the other end of the analog switch is connected to a digital-to-analog converter and is connected to the computer signal through the digital-to-analog converter and the adapter board.

[0009] Compared with the prior art, the beneficial effects of the present invention are:

[0010] 1. The utility model connects an independent temperature control socket to the chip under test, so that the temperature change of the chip under test can be reflected more quickly and accurately during the aging test. Then, by using the data analysis function of the computer, the temperature of the chip under test can be accurately adjusted and controlled during the aging test, effectively avoiding the phenomenon of under-temperature and over-temperature of the chip under test during the aging test, ensuring the stability and accuracy of the chip aging test. In addition, the temperature can be adjusted according to the different specifications of the chips under test, solving the problem of temperature limitation, effectively shortening the chip test time, and greatly improving the production capacity utilization rate of the aging machine;

[0011] 2. The utility model adopts a heating socket and a heating circuit to ensure a uniform heating temperature during the aging test of the chip under test, so that the chip under test can obtain accurate test results. The temperature measurement of the thermal resistor and the display function of the temperature display circuit enable the chip under test to quickly and accurately measure the temperature change under computer analysis, so that the chip under test can adjust the heating temperature in real time according to the temperature change, ensuring the stability and accuracy of the chip aging test;

[0012] 3. The utility model adopts an analog switch as a temperature display circuit, which effectively reduces the number of digital-to-analog converters used and effectively reduces the cost of chip aging testing. It adopts a pulse width modulation switch as a heating circuit, so that the chip aging test can adjust the temperature in time under the temperature display of the temperature display circuit, achieving the purpose of real-time temperature control, and effectively avoiding the phenomenon of under-temperature and over-temperature of the chip to be tested during the aging test, thereby ensuring the stability and accuracy of the chip aging test. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0014] Figure 2 for Figure 1 Schematic diagram of the connection between the chip under test and the aging machine;

[0015] Figure 3 for Figure 1 Schematic diagram of the structure of the connection between the chip under test and the independent temperature control socket;

[0016] Figure 4 for Figure 1 Schematic diagram of the structure of the connection between the independent temperature control socket, the adapter mechanism and the computer.

[0017] Among them: 1. Burn-in machine; 2. Chip to be tested; 3. Independent temperature control socket; 301. Thermal resistor socket; 302. Heating socket; 4. Adapter mechanism; 401. Adapter board; 5. Computer; 6. Heating circuit; 601. Pulse width modulation switch; 7. Temperature display circuit; 701. Analog switch; 8. Digital-to-analog converter. DETAILED DESCRIPTION

[0018] The following examples are used to further illustrate the content of the present invention, but do not limit the application of the present invention.

[0019] See also Figures 1-4 The utility model provides an independent temperature control system for a chip aging machine, comprising an aging machine 1 for chip testing and several groups of chips to be tested 2 connected to the aging machine 1, the several groups of chips to be tested 2 are arranged in parallel, the chips to be tested 2 are electrically connected to the power supply of the aging machine 1, the communication of the aging machine 1 is connected to the signal of the chips to be tested 2, the chips to be tested 2 are connected to an independent temperature control socket 3 for measuring and adjusting temperature changes, the independent temperature control socket 3 is connected to a switching mechanism 4 for switching, the switching mechanism 4 is signal-connected to a computer 5 for analyzing temperature changes and controlling temperature rise and fall, the computer 5 is set to transmit data with the chips to be tested 2 through the switching mechanism 4 and the independent temperature control socket 3, so that the temperature of the chips to be tested 2 can be controlled in real time.

[0020] See also Figure 1and Figure 3-Figure 4 The independent temperature control socket 3 is divided into a thermal resistance socket 301 for measuring temperature changes and a heating socket 302 for heating. The heating socket 302 is arranged in parallel with the thermal resistance socket 301.

[0021] One end of the thermal resistor socket 301 and the heating socket 302 are both connected to the chip under test 2, and the chip under test 2 is connected to the adapter mechanism 4 through the thermal resistor socket 301 and the heating socket 302;

[0022] The adapter mechanism 4 includes an adapter board 401 connected to the thermal resistor socket 301 and the heating socket 302. The adapter board 401 is provided with a heating circuit 6 for controlling the heating socket to heat and a temperature display circuit 7 for reading the real-time temperature of the chip under test 2. The heating circuit 6 and the temperature display circuit 7 are arranged in parallel.

[0023] The heating circuit 6 is connected to the heating socket 302 via an adapter board 401. The heating circuit 6 includes a pulse width modulation switch 601 for adjusting the temperature of the chip under test 2. One end of the pulse width modulation switch 601 is electrically connected to the heating socket 302 via the adapter board 401 and is connected to the chip under test 2 via the heating socket 302. The other end of the pulse width modulation switch 601 is connected to the computer 5 for signal communication via the adapter board 401.

[0024] The temperature display circuit 7 is connected to the thermistor socket 301 through the adapter board 401; the temperature display circuit 7 includes an analog switch 701 for displaying temperature changes, one end of the analog switch 701 is electrically connected to the thermistor socket 301 through the adapter board 401 and is connected to the chip to be tested 2 through the thermistor socket 301, and the other end of the analog switch 701 is connected to a digital-to-analog converter 8 for conversion and is connected to the computer 5 signal through the digital-to-analog converter 8 and the adapter board 401.

[0025] The working principle and use process of this utility model: Figure 1-4 As shown in the figure, after the independent temperature control system of the chip aging machine is assembled, it is installed as a whole in the chip testing equipment. Its purpose is to enable the temperature of the chip 2 to be tested to be accurately adjusted and controlled during the aging test, solving the problem of under-temperature and over-temperature of the chip 2 to be tested during the aging test, and ensuring the stability and accuracy of the chip aging test;

[0026] When chip aging test is required, the operator first connects several groups of test chips 2 to the power supply and communication of the aging machine 1, and then connects several groups of test chips 2 to the independent temperature control sockets 3. Then, the thermal resistor sockets 301 of the independent temperature control sockets 3 are connected to the analog switch 701 and the digital-to-analog converter 8 of the temperature display circuit 7 through the adapter board 401. At the same time, the heating sockets 302 of the independent temperature control sockets 3 are connected to the pulse width modulation switch 601 of the heating circuit 6 through the adapter board 401. Then, the analog switch 701 and the digital-to-analog converter 8 are connected in parallel with the pulse width modulation switch 601 and connected to the computer 5 signal. Then, the aging machine 1 is started. Since the thermal resistor will change rapidly due to temperature, when the thermal resistor sockets 301 detect the temperature change of the test chip 2, the temperature change signal will be transmitted through the analog switch 701 and the digital-to-analog converter. The converter 8 converts the data and transmits it to the computer 5. The computer 5 analyzes the temperature changes and displays the temperature analysis results on a digital display screen (the functions and structures of conventional equipment such as digital display screens are well known in the art, and the connection settings are also common knowledge, so they are not explained here in detail and are not shown in the accompanying drawings). The computer 5 also reads the temperature of the chip under test 2. When the displayed temperature is undertemperature, the computer 5 controls the heating socket 302 via the pulse width modulation switch 601 to heat the chip under test 2 until the temperature reaches the test temperature of the chip under test 2. When the displayed temperature is overtemperature, the computer 5 controls the heating socket 302 via the pulse width modulation switch 601 to stop heating the chip under test 2 until the temperature reaches the test temperature of the chip under test 2. This ensures that the chip under test 2 is always within the test temperature range, ensuring the stability and accuracy of the chip aging test.

Claims

1. A chip aging machine independent temperature control system, including an aging machine and several groups of chips to be tested connected to the aging machine, characterized in that: The chip to be tested is connected to an independent temperature control socket, the independent temperature control socket is connected to a switching mechanism, the switching mechanism is signal-connected to a computer, and the computer is set to transmit data with the chip to be tested through the switching mechanism and the independent temperature control socket.

2. The independent temperature control system for a chip aging machine according to claim 1, characterized in that: The independent temperature control socket is divided into a thermal resistance socket and a heating socket, and the heating socket and the thermal resistance socket are arranged in parallel.

3. The independent temperature control system for a chip aging machine according to claim 2, characterized in that: One end of the thermal resistor socket and the heating socket are both connected to the chip to be tested, and the chip to be tested is connected to the switching mechanism through the thermal resistor socket and the heating socket.

4. The independent temperature control system for a chip aging machine according to claim 3, characterized in that: The adapter mechanism includes an adapter plate that is signal-connected to the thermal resistor socket and the heating socket. A heating circuit and a temperature display circuit are separately arranged in the adapter plate, and the heating circuit and the temperature display circuit are arranged in parallel.

5. The independent temperature control system for a chip aging machine according to claim 4, characterized in that: The heating circuit is connected to the heating socket through an adapter plate, and the temperature display circuit is connected to the thermal resistor socket through an adapter plate.

6. The independent temperature control system for a chip aging machine according to claim 5, characterized in that: The heating circuit includes a pulse width modulation switch, one end of which is electrically connected to the heating socket through an adapter board and is connected to the chip to be tested through the heating socket, and the other end of the pulse width modulation switch is connected to the computer signal through the adapter board.

7. The independent temperature control system for a chip aging machine according to claim 5, characterized in that: The temperature display circuit includes an analog switch, one end of which is electrically connected to a thermistor socket through an adapter board and is connected to the chip to be tested through the thermistor socket, and the other end of the analog switch is connected to a digital-to-analog converter and is connected to a computer signal through the digital-to-analog converter and the adapter board.

8. The independent temperature control system for a chip aging machine according to claim 1, characterized in that: The chip to be tested is electrically connected to a power supply of the aging machine.

9. The independent temperature control system for a chip aging machine according to claim 1 or 8, characterized in that: The chip to be tested is connected to the aging machine via a communication signal.

10. The independent temperature control system for a chip aging machine according to claim 1, characterized in that: The groups of chips to be tested are arranged in parallel.

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