Novel notebook computer heat dissipation structure

Abstract

The novel notebook computer heat dissipation structure comprises a CPU step type fin, a CPU stamping part elastic piece riveting assembly, a CPU fan, a GPU step type fin, a GPU die casting copper block assembly and a GPU fan. The CPU step type fin is arranged on the left rear portion of the CPU stamping part elastic piece riveting assembly, the left side end of the heat pipe assembly is clamped in a rectangular notch of the CPU step type fin, and the CPU fan is arranged on the front side of the CPU step type fin. The GPU step-shaped fin is arranged on the right rear portion of the GPU die casting copper block assembly, the right side end of the heat pipe assembly is clamped in a step-shaped notch of the GPU step-shaped fin, and the GPU fan is arranged on the front side of the GPU step-shaped fin. The CPU step-shaped fin is formed by stacking a plurality of single fins with the same notches, and the GPU step-shaped fin is formed by stacking a plurality of single fins with different notches in sequence. And the step-shaped radiating fins are designed, so that the radiating area is increased, the wind resistance is reduced, and the radiating efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of computer components, in particular to a novel heat dissipation structure for a notebook computer. Background Art

[0002] In recent years, with the booming electronics industry, demand for lightweight and integrated electronic products has increased significantly. Consequently, to cater to consumers, laptops are becoming increasingly thinner. This results in the cooling fins within the lower cover becoming shorter, reducing their heat dissipation area and thus inadequate heat dissipation. Furthermore, the fan outlet within existing laptop cooling structures is often obscured by the solid cooling fins and heat pipes, resulting in increased wind resistance and reduced heat dissipation efficiency, further impacting the cooling effect.

[0003] In view of this, the inventors conducted in-depth research on the above-mentioned defects in the prior art, and thus came up with this case. Utility Model Content

[0004] To solve the above technical problems, we proposed a new notebook computer heat dissipation structure. We used the limited space to design stepped heat dissipation fins to increase its heat dissipation area, and changed the structural form of the air outlet at the step to reduce the fan wind resistance and allow the cooling fan to blow out the air smoothly, thereby increasing the heat dissipation efficiency.

[0005] In order to achieve the above-mentioned purpose, the technical solution of the present utility model is as follows:

[0006] A novel notebook computer heat dissipation structure includes a CPU stepped fin, a CPU stamping part spring-loaded riveted assembly, a CPU fan, a GPU stepped fin, a GPU die-cast copper block assembly, and a GPU fan; the CPU stamping part spring-loaded riveted assembly is fixed to the lower left middle portion of a heat pipe assembly, the CPU stepped fin is arranged behind the left side of the CPU stamping part spring-loaded riveted assembly, and the left end of the heat pipe assembly is clamped in a rectangular notch of the CPU stepped fin, and the CPU fan is arranged in front of the CPU stepped fin; the GPU die-cast copper block assembly is fixed to the lower right middle portion of the heat pipe assembly, the GPU stepped fin is arranged behind the right side of the GPU die-cast copper block assembly, and the right end of the heat pipe assembly is clamped in a stepped notch of the GPU stepped fin, and the GPU fan is arranged in front of the GPU stepped fin;

[0007] The CPU step-type fin is formed by stacking and fixing a plurality of single fins with the same notch size in sequence, and after the plurality of single fins with the same notch size are stacked and fixed in sequence, a rectangular notch is formed in the middle of the CPU step-type fin, and the shape of the rectangular notch is adapted to the left end of the heat pipe assembly; the GPU step-type fin is formed by stacking and buckling a plurality of single fins with different notch sizes in sequence, and the single fins with the same notch size are stacked and buckled together, and after the plurality of single fins with different notch sizes are stacked and buckled in sequence, a step-type notch is formed in the middle of the GPU step-type fin, and the shape of the step-type notch is adapted to the right end of the heat pipe assembly.

[0008] Preferably, the CPU step-type fin is composed of a plurality of A single fins with a rectangular notch A in the middle of the upper side, which are superimposed and buckled together; the GPU step-type fin is composed of a plurality of A single fins with a rectangular notch A in the middle of the upper side, B single fins with a rectangular notch B, and C single fins with a rectangular notch C, which are superimposed and buckled together, and here all A single fins are buckled together to form section A, all B single fins are buckled together to form section B, and all C single fins are buckled together to form section C.

[0009] Preferably, the main body dimensions of the single fin A, the single fin B, and the single fin C are the same, the width of the rectangular notch A is smaller than that of the rectangular notch B, and the width of the rectangular notch B is smaller than that of the rectangular notch C.

[0010] Preferably, the segment A formed by buckling the A single fin, the segment B formed by buckling all the B single fins, and the segment C formed by buckling all the C single fins are connected in sequence.

[0011] Preferably, the surfaces of the CPU step-type fins and the GPU step-type fins are treated with nickel to form a nickel anti-rust layer.

[0012] Through the above technical scheme, the utility model is designed with a CPU step-type fin, a CPU stamping spring riveted assembly, a CPU fan, a GPU step-type fin, a GPU die-cast copper block assembly and a GPU fan; the CPU step-type fin is formed by stacking and fixing a plurality of single fins with the same notch size in sequence, and after the plurality of single fins with the same notch size are stacked and fixed in sequence, a rectangular notch is formed in the middle of the CPU step-type fin, and the shape of the rectangular notch is adapted to the left end of the heat pipe assembly; the GPU step-type fin is formed by stacking and fixing a plurality of single fins with different notch sizes in sequence, and the single fins with the same notch size are stacked and fastened together, and after the plurality of single fins with different notch sizes are stacked and fastened in sequence, a step-type notch is formed in the middle of the GPU step-type fin, and the shape of the step-type notch is adapted to the right end of the heat pipe assembly. The CPU and GPU stepped fins utilize limited space to increase their heat dissipation area. A new air outlet structure is designed at the steps to allow air to blow out smoothly, reducing fan wind resistance and increasing heat dissipation efficiency. This solves the problem of poor heat dissipation caused by the reduced height of the heat sink fins due to the reduced structural space, resulting in a decreasing heat dissipation area. It also avoids the problem of increased wind resistance and reduced heat dissipation efficiency caused by the fan being blocked by heat pipes and the fins being too short. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0014] Figure 1 This is an exploded view of a novel notebook computer heat dissipation structure disclosed in an embodiment of the present utility model;

[0015] Figure 2 A three-dimensional diagram of a novel notebook computer heat dissipation structure disclosed in an embodiment of the present utility model;

[0016] Figure 3 A top view of a novel notebook computer heat dissipation structure disclosed in an embodiment of the present utility model;

[0017] Figure 4 This is a rear view of a novel notebook computer heat dissipation structure disclosed in an embodiment of the present utility model;

[0018] Figure 5 This is a front view of a novel notebook computer heat dissipation structure disclosed in an embodiment of the present utility model;

[0019] Figure 6 This is a left side view of a novel notebook computer heat dissipation structure disclosed in an embodiment of the present utility model;

[0020] Figure 7 This is an exploded view of a GPU stepped fin in a novel notebook computer heat dissipation structure disclosed in an embodiment of the present utility model;

[0021] Figure 8 A three-dimensional diagram of a single fin A in a novel notebook computer heat dissipation structure disclosed in an embodiment of the present utility model;

[0022] Figure 9 A three-dimensional diagram of a single fin B in a novel notebook computer heat dissipation structure disclosed in an embodiment of the present utility model;

[0023] Figure 10 This is a three-dimensional diagram of a C-shaped single fin in a novel notebook computer heat dissipation structure disclosed in an embodiment of the present utility model.

[0024] The numbers in the figure represent the corresponding component names:

[0025] 1. CPU stepped fin 11. Rectangular notch 2. CPU stamping spring clip riveted assembly 3. CPU fan 4. GPU stepped fin 41. Stepped notch 5. GPU die-cast copper block assembly 6. GPU fan 7. Heat pipe assembly 8. A single fin 80. A segment 81. A rectangular notch 9. B single fin 90. B segment 91. B rectangular notch 10. C single fin 100. C segment 101. C rectangular notch DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] The present invention will be further described in detail below with reference to the embodiments and specific implementation methods.

[0028] Example

[0029] like Figure 1-6As shown, a novel notebook computer heat dissipation structure includes a CPU step-type fin 1, a CPU stamping part shrapnel riveted assembly 2, a CPU fan 3, a GPU step-type fin 4, a GPU die-cast copper block assembly 5 and a GPU fan 6; the CPU stamping part shrapnel riveted assembly 2 is fixed to the lower middle portion of the left side of the heat pipe assembly 7, the CPU step-type fin 1 is arranged behind the left side of the CPU stamping part shrapnel riveted assembly 2, and the left end of the heat pipe assembly 7 is clamped in the rectangular notch 11 of the CPU step-type fin 1, and the CPU fan 3 is arranged in front of the CPU step-type fin 1; the GPU die-cast copper block assembly 5 is fixed to the lower middle portion of the right side of the heat pipe assembly 7, the GPU step-type fin 4 is arranged behind the right side of the GPU die-cast copper block assembly 5, and the right end of the heat pipe assembly 7 is clamped in the step-type notch 41 of the GPU step-type fin 4, and the GPU fan 6 is arranged in front of the GPU step-type fin 4;

[0030] The CPU step-type fin 1 is formed by stacking and fixing a plurality of single fins with the same notch size in sequence, and after the plurality of single fins with the same notch size are stacked and fixed in sequence, a rectangular notch 11 is formed in the middle of the CPU step-type fin 1, and the shape of the rectangular notch 11 is adapted to the left end of the heat pipe assembly 7; the GPU step-type fin 4 is formed by stacking and fixing a plurality of single fins with different notch sizes in sequence, and the single fins with the same notch size are stacked and fastened together, and after the plurality of single fins with different notch sizes are stacked and fastened in sequence, a step-type notch 41 is formed in the middle of the GPU step-type fin 4, and the shape of the step-type notch 41 is adapted to the right end of the heat pipe assembly 7.

[0031] like Figure 7-10 As shown, the CPU step-type fin 1 is composed of a plurality of A single-piece fins 8 with a rectangular notch A 81 opened in the middle of the upper side, which are stacked and buckled together; the GPU step-type fin 4 is composed of three or more A single-piece fins 8 with a rectangular notch A 81 opened in the middle of the upper side, B single-piece fins 9 with a rectangular notch B 91 and C single-piece fins 10 with a rectangular notch C 101, which are stacked and buckled together, and here all A single-piece fins 8 are buckled together to form an A segment 80, all B single-piece fins 9 are buckled together to form a B segment 90, and all C single-piece fins 10 are buckled together to form a C segment 100.

[0032] At the same time, the main body dimensions of the A single-piece fin 8, the B single-piece fin 9, and the C single-piece fin 10 are the same. The width of the A rectangular notch 81 is smaller than the width of the B rectangular notch 91, and the width of the B rectangular notch 91 is smaller than the width of the C rectangular notch 101. The A segment 80 formed by the snap-fitting of the A single-piece fin 8, the B segment 90 formed by the snap-fitting of all the B single-piece fins 9, and the C segment 100 formed by the snap-fitting of all the C single-piece fins 10 are connected in sequence. As a result, after the snap-fitting is completed, steps are formed between the A segment 80 and the B segment 90, and between the B segment 90 and the C segment 100 to facilitate the placement of the heat pipe assembly 7.

[0033] In addition, the surfaces of the CPU step-type fins 1 and the GPU step-type fins 4 are treated with nickel to form a nickel anti-rust layer, so as to provide them with anti-rust function and improve their durability.

[0034] In actual use, when the CPU fan 3 and GPU fan 6 are turned on, the cooling air blown by the CPU fan 3 and GPU fan 6 will remove the heat generated by the heat pipe assembly 7 from the surface of segment A 80, segment B 90, and segment C 100. Compared with the original single-body non-segmented heat dissipation structure, this inherently increases the heat dissipation area exposed to the cooling air, which is beneficial for heat dissipation. At the same time, a small amount of cooling air will also penetrate the slits between the single-piece fin A 8, the single-piece fin B 9, and the single-piece fin C 10, which is equivalent to helping to remove the heat generated by the heat pipe assembly 7 from the interior of segment A 80, segment B 90, and segment C 100, thereby further improving the heat dissipation capacity of the heat pipe assembly 7.

[0035] In this example, the utility model is designed with a CPU step-type fin 1, a CPU stamping part spring riveted assembly 2, a CPU fan 3, a GPU step-type fin 4, a GPU die-cast copper block assembly 5 and a GPU fan 6; the CPU step-type fin 1 is formed by stacking and fixing a plurality of A single-piece fins 8 with the same notch size in sequence, and after the plurality of A single-piece fins 8 with the same notch size are stacked in sequence, a rectangular notch 11 is formed in the middle of the CPU step-type fin 1, and the shape of the rectangular notch 11 is adapted to the left end of the heat pipe assembly 7; the GPU step-type fin 1 is formed by stacking a plurality of A single-piece fins 8 with the same notch size in sequence. The stepped fins 4 are formed by stacking and fastening three or more different types of single-piece fins A 8, B single-piece fins 9, and C single-piece fins 10, each with a different notch size. The single-piece fins A 8, B single-piece fins 9, and C single-piece fins 10 with the same notch size are stacked and fastened together. After the multiple types of single-piece fins A 8, B single-piece fins 9, and C single-piece fins 10 with different notch sizes are stacked and fastened together, a stepped notch 41 is formed in the middle of the GPU stepped fin 4. The shape of the stepped notch 41 is compatible with the right end of the heat pipe assembly 7. The CPU stepped fins 1 and GPU stepped fins 4 are designed to increase their heat dissipation area by utilizing limited space. A new air outlet structure is designed at the step to allow air to blow out smoothly, reduce fan wind resistance, and increase heat dissipation efficiency. This solves the problem of poor heat dissipation caused by the heat dissipation fins being too short due to the reduced structural space, resulting in a smaller and smaller heat dissipation area. It also avoids the problem of increased wind resistance and reduced heat dissipation efficiency caused by the fan being blocked by the heat pipe and the fins being too short. Thus the purpose of novel design, reasonable structure and good application effect is achieved.

[0036] The above is only a preferred embodiment of a novel notebook computer heat dissipation structure of the present invention. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the creative concept of the present invention, and these all fall within the scope of protection of the present invention.

Claims

1. A new notebook computer heat dissipation structure, characterized in that: The heat pipe assembly comprises a CPU stepped fin, a CPU stamping part spring-loaded riveted assembly, a CPU fan, a GPU stepped fin, a GPU die-cast copper block assembly, and a GPU fan; the CPU stamping part spring-loaded riveted assembly is fixed to the lower middle portion of the left side of the heat pipe assembly, the CPU stepped fin is arranged behind the left side of the CPU stamping part spring-loaded riveted assembly, and the left end of the heat pipe assembly is clamped in the rectangular notch of the CPU stepped fin, and the CPU fan is arranged in front of the CPU stepped fin; the GPU die-cast copper block assembly is fixed to the lower middle portion of the right side of the heat pipe assembly, the GPU stepped fin is arranged behind the right side of the GPU die-cast copper block assembly, and the right end of the heat pipe assembly is clamped in the stepped notch of the GPU stepped fin, and the GPU fan is arranged in front of the GPU stepped fin; The CPU step-type fin is formed by stacking and fixing a plurality of single fins with the same notch size in sequence, and after the plurality of single fins with the same notch size are stacked and fixed in sequence, a rectangular notch is formed in the middle of the CPU step-type fin, and the shape of the rectangular notch is adapted to the left end of the heat pipe assembly; the GPU step-type fin is formed by stacking and buckling a plurality of single fins with different notch sizes in sequence, and the single fins with the same notch size are stacked and buckled together, and after the plurality of single fins with different notch sizes are stacked and buckled in sequence, a step-type notch is formed in the middle of the GPU step-type fin, and the shape of the step-type notch is adapted to the right end of the heat pipe assembly.

2. The novel notebook computer heat dissipation structure according to claim 1, characterized in that: The CPU step-type fin is composed of a plurality of A single fins with a rectangular notch A in the middle of the upper side, which are stacked and buckled together; the GPU step-type fin is composed of a plurality of A single fins with a rectangular notch A in the middle of the upper side, B single fins with a rectangular notch B, and C single fins with a rectangular notch C, which are stacked and buckled together, and here all A single fins are buckled together to form section A, all B single fins are buckled together to form section B, and all C single fins are buckled together to form section C.

3. The novel notebook computer heat dissipation structure according to claim 2, characterized in that: The main body dimensions of the single fin A, the single fin B, and the single fin C are the same. The width of the rectangular notch A is smaller than that of the rectangular notch B, and the width of the rectangular notch B is smaller than that of the rectangular notch C.

4. The novel notebook computer heat dissipation structure according to claim 3, characterized in that: The segment A formed by buckling the A single fin, the segment B formed by buckling all the B single fins, and the segment C formed by buckling all the C single fins are connected in sequence.

5. The novel notebook computer heat dissipation structure according to claim 4, characterized in that: The surfaces of the CPU step-type fins and the GPU step-type fins are treated with nickel to form a nickel anti-rust layer.

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