Substrate, printed antenna and mobile terminal equipment

Abstract

The utility model provides a substrate, a printed antenna and a mobile terminal device, the substrate is applied to the printed antenna of the terminal device, the substrate comprises a first surface and a second surface, the substrate is provided with a through hole, and the through hole is connected with the first surface and the second surface; the through holes comprise a first through hole and a second through hole which are communicated with each other, the first through hole shrinks from the first surface or the second surface to the direction of the second through hole, and one end of the second through hole is connected and communicated with one end of the first through hole in a stepped manner. According to the substrate, the overall waterproof performance of a product can be effectively improved, the overall quality of the substrate can be improved, the appearance attractiveness of the product is effectively improved, the overall service life of the product is prolonged, and the safety performance of the product is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of communications, and in particular to a substrate, a printed antenna and a mobile terminal. Background Art

[0002] With the continuous development of 5G base station construction, the frequency bands supported by communication terminals are also expanding. Today, mobile phones and watches are commonly used mobile terminal products. With the continuous advancement of technology, wearable devices will inevitably use 5G communication technology. This requires increasing the number of antennas in wearable devices. For example, the space in a watch is limited, and the antenna bandwidth is also restricted by space, which limits the frequency band covered by the antenna, making it difficult to achieve the antenna's bandwidth radiation. Printed antennas are often used on wearable devices. With the rapid development of wireless communication technology and the increasing awareness of safety, wearable electronic products have become an indispensable part of daily life. However, the low waterproof rating of most conventional electronic products poses certain risks to the lifespan and safety of electronic products. In addition, when processing printed antennas, when drilling holes in thicker substrates, the small size of the hole mold may not be able to successfully cut the hole in one go. On thinner substrates, the hole mold may not fit properly, resulting in poor hole quality and affecting the product's appearance.

[0003] In view of this, the present invention is indeed necessary to provide a new type of substrate to solve the above problems. Utility Model Content

[0004] The purpose of the present invention is to provide a substrate that can not only effectively improve the overall waterproof performance of the product, but also improve the overall quality of the substrate, effectively improve the appearance of the product, and increase the overall service life and safety performance of the product.

[0005] In order to solve the above technical problems, the present invention provides a substrate, which is used on a printed antenna of a terminal device. The substrate includes a first surface and a second surface, and a through hole is opened in the substrate, and the through hole connects the first surface and the second surface; the through hole includes a first through hole and a second through hole that are interconnected, and the first through hole shrinks from the first surface or the second surface toward the second through hole, and one end of the second through hole is connected and connected with one end of the first through hole in a stepped manner.

[0006] As a further improvement of the present invention, the first through hole and the second through hole are designed to be integrally formed, the first through hole is conical in shape, and the second through hole is cylindrical in shape.

[0007] As a further improvement of the present invention, the aperture of the first through hole located on the surface of the substrate is circular, the cross-section of the hole wall of the first through hole is trumpet-shaped, the hole wall of the first through hole is symmetrical about the center of the circle of the aperture, and the hole wall of the first through hole approaches and shrinks toward the center of the circle in the horizontal direction.

[0008] As a further improvement of the present invention, the cross section of the hole wall of the second through hole is rectangular or shrinks in a direction away from the first through hole.

[0009] As a further improvement of the present invention, one end of the first through hole close to the second through hole is circular, and the inner diameter of the port is the first diameter.

[0010] As a further improvement of the present invention, the second through hole is arranged in a circular shape at one end close to the first through hole, and the inner diameter of the port is the second diameter.

[0011] As a further improvement of the present invention, the second diameter is smaller than the first diameter.

[0012] As a further improvement of the present invention, the ratio of the height of the first through hole to the height of the second through hole is 4:1.

[0013] The purpose of the present invention is to provide a printed antenna to be applied to the above substrate.

[0014] In order to solve the above technical problems, the utility model provides a printed antenna, which is arranged on the above substrate.

[0015] The purpose of the present utility model is to provide a mobile terminal device to apply the above substrate.

[0016] In order to solve the above technical problems, the present invention provides a mobile terminal device, wherein the mobile terminal includes the above substrate.

[0017] The present invention provides a substrate for use in a printed antenna of a terminal device. The substrate comprises a first surface and a second surface, with a through-hole formed in the substrate, the through-hole connecting the first and second surfaces. The through-hole comprises a first through-hole and a second through-hole that are interconnected, the first through-hole narrowing from the first surface or the second surface toward the second through-hole, and one end of the second through-hole is connected to and stepped with one end of the first through-hole. The substrate of the present invention not only effectively improves the overall waterproof performance of the product, but also enhances the overall quality of the substrate, effectively improving the product's aesthetic appearance, and increasing the overall product lifespan and safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1It is a structural schematic diagram of the substrate of the present utility model.

[0019] Figure 2 for Figure 1 Schematic diagram of the structure of the through hole in detail A.

[0020] Figure 3 This is a structural schematic diagram of another embodiment of the substrate of the present invention.

[0021] The descriptions of the reference numerals are as follows:

[0022] First surface 1 , second surface 3 , through hole 2 , substrate 4 , first through hole 21 , second through hole 22 . DETAILED DESCRIPTION

[0023] The following is a detailed description of the substrate 4 proposed in the present invention, with reference to the accompanying drawings and specific embodiments. It should be noted that the drawings are highly simplified and not precisely scaled, serving only to facilitate and clearly illustrate the embodiments of the present invention. Furthermore, the structures shown in the drawings are often portions of the actual structure. In particular, different drawings may utilize different scales, depending on the emphasis they require.

[0024] The present invention provides a substrate 4 that is suitable for a printed antenna, that is, the printed antenna is arranged on the substrate 4, and the substrate 4 on which the printed antenna is printed is applied to a mobile terminal device, such as a watch in a wearable device.

[0025] The substrate 4 of the present invention is mainly used in the printed antenna of the terminal device. The substrate 4 includes a first surface 1 and a second surface 3. A through hole 2 is opened in the substrate 4, and the through hole 2 connects the first surface 1 and the second surface 3; the through hole 2 includes a first through hole 21 and a second through hole 22 that are interconnected. The first through hole 21 shrinks from the first surface 1 or the second surface 3 toward the second through hole 22, and one end of the second through hole 22 is steppedly connected and connected to one end of the first through hole 21.

[0026] With such a configuration, the substrate 4 of the present invention can not only effectively improve the overall waterproof performance of the product, but also improve the overall quality of the substrate 4, effectively improve the appearance of the product, and increase the overall service life and safety performance of the product.

[0027] Specifically, the setting of the through hole 2 on the substrate 4 can not only optimize the laying of the conductive silver paste of the printed antenna, but also improve the overall quality of the substrate 4 when the substrate 4 is opened, effectively improving the appearance of the overall printed antenna product based on the substrate 4, and one end of the second through hole 22 is connected and connected to one end of the first through hole 21 in a stepped manner, that is, the bottom of the first through hole 21 is stepped and connected to the second hole wall to form a right angle, which improves the overall waterproof performance of the product, thereby improving the overall service life and safety performance of the product.

[0028] Furthermore, when applying the conductive silver paste layer on the first side 1 and second side 3 of the substrate 4 for printing antennas on mobile terminal devices, the first side 1 of the substrate 4 is generally printed first, followed by printing on the second side 3 of the substrate 4, and then filling the through-holes 2 with the silver paste. In actual operation, it is inevitable that some excess silver paste will be applied to the first side 1 or second side 3 of the substrate 4 when applying the conductive silver paste. In this case, the through-holes 2 can both provide electrical connection between the first side 1 and the second side 3 of the substrate 4 and also carry more silver paste on both sides, optimizing the flatness of both the inside and outside surfaces.

[0029] Furthermore, the first through hole and the second through hole are integrally formed, with the first through hole 21 being conical and the second through hole 22 being cylindrical. The aperture of the first through hole 21 on the surface of the substrate 4 is circular, and the cross-section of the hole wall of the first through hole 21 is in the shape of a curved trumpet. The hole wall of the first through hole 21 is symmetrical about the center of the circle of the aperture, and the hole wall of the first through hole 21 horizontally approaches and converges toward the center of the circle; the cross-section of the hole wall of the second through hole 22 is rectangular or converges away from the first through hole.

[0030] With such a configuration, when the conductive silver paste is poured into the first through hole 21, the contact area between the conductive silver paste and the through hole 2 can be increased, and the silver paste will not break after drying; the hole wall of the first through hole 21 is configured as a curved surface, and the hole wall of the first through hole 21 is symmetrical about the center of the circle of the aperture, and the hole wall of the first through hole 21 approaches and shrinks toward the center of the circle in the horizontal direction. This not only increases the contact area between the through hole and the conductive silver paste, but also makes it possible to uniformly fill the conductive silver paste into the first through hole 21 when the conductive silver paste is poured into the first through hole 21, thereby avoiding the conductive silver paste being accelerated when poured into the through hole 2 under the action of gravity, thereby making it difficult for the silver paste to adhere to the hole wall of the first through hole 21, and being deposited at the bottom end of the through hole 2.

[0031] Furthermore, the end of the first through hole 21 adjacent to the second through hole 22 is circular, with the inner diameter of the port being a first diameter D1; the end of the second through hole 22 adjacent to the first through hole 21 is circular, with the inner diameter of the port being a second diameter D2. The second diameter D2 is smaller than the first diameter D1. Preferably, the ratio of the first diameter D1 to the second diameter D2 is in the range of [3.1, 3.5]. Furthermore, the first diameter D1 is in the range of 0.5 mm to 0.7 mm, and the second diameter D2 is in the range of 0.1 mm to 0.3 mm.

[0032] In practical applications, depending on the thickness of substrate 4 and the size of the punching die, the ratio of the height of the first through-hole to the height of the second through-hole is in the range of [4.1, 4.5]. Specifically, the height of second through-hole 22 is in the range of 0.2mm-0.3mm. To reduce the production process of substrate 4 and simplify the complexity of creating through-hole 2 on substrate 4, a punching die is used to create first through-hole 21 in substrate 4 in a single operation. When using the punching die, the die will wear on the surface of substrate 4. Therefore, the height of the punching die is selected to be smaller than the height of substrate 4 to prevent wear on the surface of substrate 4.

[0033] Preferably, the second through hole 22 of the present invention is laser-perforated. Laser perforation can form the second through hole 22 into a cylindrical shape with a smaller diameter. Laser perforation forms the second through hole 22, which is connected to the first through hole 21. A height of 0.2 mm to 0.3 mm is the optimal thickness for laser perforation.

[0034] This allows the end of the second through hole 22 closest to the first through hole 21 to also be circular, with the inner diameter of this end being a second diameter D2, which is smaller than the first diameter D1. This allows one end of the second through hole 22 to connect with one end of the first through hole 21 in a stepped manner. In other words, the connection between the first through hole 21 and the second through hole 22 is stepped. This arrangement not only reduces the apparent aperture size of one side of the substrate 4, improving the overall appearance, but also provides a waterproofing effect.

[0035] It should be noted that after processing the second through hole 22, the substrate 4 needs to be cleaned of plastic shavings at the inner and outer connecting points to avoid affecting the printing of the conductive silver paste circuit. The conductive silver paste in the present invention can be a PDS or LDS conductive silver paste.

[0036] Preferably, substrate 4 is made of plastic, typically PC, PA, or PA+glass fiber plastic particles, molded using a plastics process. The printed PDS circuit surface must maintain a minimum thickness of 0.8mm. To prevent deformation of substrate 4 during the baking process of printed PDS or LDS circuits, deformation of substrate 4 must be controlled within a range of 0.05-0.1mm to avoid fractures in the circuit layer. In practical applications, the provision of second through-holes 22 can minimize deformation of substrate 4.

[0037] The first through hole 21 of the substrate 4 is formed using a punching die, and the second through hole 22 is formed by laser perforation or mechanical drilling. The aperture of the second through hole 22, i.e., the second diameter D2, is controlled within the range of 0.1 mm to 0.3 mm to avoid excessive apertures, which can cause surface dents and other undesirable appearance issues during post-baking after the conductive silver paste is printed on the circuit layer.

[0038] Furthermore, the roughness of the hole wall of the first through-hole 21 must meet VD118-VD21. If the roughness is too low, it will affect the adhesion of the conductive silver paste circuit printed in the first through-hole 21 and fail to meet the conventional industry standard of greater than 4B. At the same time, the stepped connection between the second through-hole 22 and the first through-hole 21 must be a smooth stepped connection. That is, after the second through-hole 22 is formed, the plastic burrs at the stepped connection need to be removed to prevent the printed circuit layer from breaking.

[0039] Of course, in the present invention, the second through hole 22 can also be set in other shapes, as long as the second diameter is smaller than the first diameter. This can also avoid the problem of surface depression and other poor appearance problems that may occur during the baking process after the conductive silver paste printed circuit with a larger aperture is broken, and can also reduce the damage to the surface of the substrate 4 caused by the opening mold.

[0040] When the thickness of the substrate 4 of the present invention is too large, a double-cone structure design can be adopted. That is, a first through-hole 21 with the same structure is opened on both the first side 1 and the second side 3 of the substrate 4 using a hole-opening mold to form a double-cone structure. The size of the two first through-holes 21 is determined by the thickness of the substrate 4. A second through-hole 22 is opened between the two first through-holes 21, and the inner diameter of the second through-hole 22, i.e., the second diameter, is smaller than the inner diameter of one end of the first through-hole 21, i.e., the first diameter. This can reduce damage to the substrate 4 caused by the impact force during the opening. Secondly, the second through-hole 22 can also effectively improve the overall waterproof performance of the product, that is, effectively improve the product's aesthetic appearance, and also increase the overall product life and safety performance.

[0041] Generally, if the thickness of the substrate 4 is within the range of 0.8mm-1.2mm, a single-cone structure design can be used. If the thickness of the substrate 4 is greater than 1.2mm, a double-cone structure design can be used. Conductive silver paste is applied to both the first side 1 and the second side 3 of the substrate 4. The thickness of the silver paste is controlled to be 10um-20um. Some of the excess conductive silver paste can enter the through-holes. The through-holes are then filled with conductive silver paste and then sent for baking.

[0042] The present invention provides a substrate 4 for use in a printed antenna of a terminal device. The substrate 4 includes a first surface 1 and a second surface 3. A through hole is formed in the substrate 4, connecting the first surface 1 and the second surface 3. The through hole includes a first through hole 21 and a second through hole 22 that are interconnected. The first through hole 21 tapers from the first surface 1 or the second surface 3 toward the second through hole 22, and one end of the second through hole 22 is connected to and communicates with one end of the first through hole 21 in a stepped manner. The substrate 4 of the present invention not only effectively improves the overall waterproof performance of the product, but also enhances the overall quality of the substrate 4, effectively improving the product's aesthetics, and increasing the product's overall service life and safety.

[0043] It should be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other. In addition, the different parts between the various embodiments can also be used in combination with each other, and this utility model does not limit this.

[0044] The above description is only a description of the preferred embodiment of the present invention and does not limit the scope of the present invention. Any changes and modifications made by ordinary technicians in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A substrate used in a printed antenna of a terminal device, characterized by: The substrate includes a first surface and a second surface arranged opposite to each other, and a through hole is opened in the substrate, and the through hole connects the first surface and the second surface; the through hole includes a first through hole and a second through hole that are connected to each other, and the first through hole shrinks from the first surface or the second surface toward the second through hole, and one end of the second through hole is connected to and connected with one end of the first through hole in a stepped manner.

2. The substrate according to claim 1, wherein: The first through hole and the second through hole are integrally formed, the first through hole is conical, and the second through hole is cylindrical.

3. The substrate according to claim 2, wherein: The aperture of the first through hole located on the surface of the substrate is circular, the cross-section of the hole wall of the first through hole is trumpet-shaped, the hole wall of the first through hole is symmetrical about the center of the circle of the aperture, and the hole wall of the first through hole approaches and shrinks toward the center of the circle in the horizontal direction.

4. The substrate according to claim 3, wherein: The cross section of the hole wall of the second through hole is rectangular or shrinks in a direction away from the first through hole.

5. The substrate according to claim 4, wherein: A port of the first through hole close to the second through hole is arranged in a circular shape, and the inner diameter of the port is a first diameter.

6. The substrate according to claim 5, wherein: A port of the second through hole close to the first through hole is arranged in a circular shape, and the inner diameter of the port is a second diameter.

7. The substrate according to claim 6, wherein: The second diameter is smaller than the first diameter.

8. The substrate according to claim 7, wherein: The ratio of the height of the first through hole to the height of the second through hole is in the range of [4.1, 4.5].

9. A printed antenna, characterized in that: The printed antenna is provided on the substrate according to any one of claims 1 to 8.

10. A mobile terminal device, characterized in that: The mobile terminal comprises the substrate according to any one of claims 1 to 8.

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