Intensive bus duct

By introducing a heat conducting plate and a heat dissipating fin group structure into the bus duct, the problem of poor heat dissipation of the bus duct is solved, and more efficient heat conduction and heat dissipation effects are achieved.

CN223321765UActive Publication Date: 2025-09-09徐武忠
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Patent Information

Application Number
CN202422724963.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-08
Publication Date
2025-09-09
Estimated Expiration
2034-11-08

AI Technical Summary

Technical Problem

The existing dense bus duct has poor heat dissipation effect, and heat is easily accumulated, resulting in unsatisfactory heat dissipation effect.

Method used

The heat conduction plate and heat dissipation fin group structure are adopted to transfer the heat of the bus duct to the heat dissipation fin group through the heat conduction plate, and the heat dissipation fan is used to discharge the heat from the air outlet to avoid heat accumulation.

Benefits of technology

The heat conduction area and heat dissipation efficiency are improved, which effectively avoids the accumulation of heat in the bus duct body and improves the heat dissipation effect.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an intensive bus duct, which comprises a bus duct body and two heat dissipation mechanisms respectively arranged on two sides of the bus duct body, fixing plates are arranged at the top and the bottom of the bus duct body, mounting grooves are formed between the fixing plates and two side walls of the bus duct body, and the heat dissipation mechanisms are mounted in the mounting grooves. The heat dissipation mechanism comprises a heat conduction base, a plurality of insertion grooves are formed in the surface of one side of the heat conduction base, the heat conduction plates are inserted into the insertion grooves correspondingly, a plurality of heat dissipation fin sets are arranged on the other side of the heat conduction base, heat dissipation fans are arranged on the heat dissipation fin sets correspondingly, and a shell is arranged on the heat conduction base. Pressing plates are arranged at the top and the bottom of the two sides of the shell, buckles are arranged on the surfaces of the sides, close to the fixing plate, of the pressing plates, clamping grooves are formed in the four corners of the fixing plate, and the buckles are embedded into the clamping grooves. According to the utility model, the heat conduction effect on the bus duct body is effectively improved, so that the heat dissipation effect of the heat dissipation fan on the bus duct body is better.
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Description

Technical Field

[0001] The utility model relates to the technical field of bus ducts, in particular to a dense bus duct. Background Art

[0002] The dense bus duct is a distribution device that efficiently transmits current. It uses copper or aluminum bars as conductors, and the casing is made of high-quality metal materials. It has a compact structure and a high level of protection.

[0003] For example, Chinese patent publication No. CN218335226U discloses a dense bus duct, including a bus duct; the bus duct is composed of a fixed plate, a metal bar and a fixed frame, and heat dissipation mechanisms are symmetrically arranged on both sides of the fixed frame; the heat dissipation mechanism includes a mounting plate, an array of heat dissipation frames are fixedly connected to the inner side of the mounting plate, limiting grooves are symmetrically provided on both sides of the mounting plate, directional columns are symmetrically fixedly connected to the inner side of the limiting grooves, movable plates are symmetrically slidably connected to the directional columns on both sides, a support spring is provided between the two movable plates, and a limiting bolt is fixedly connected to one side of the movable plate. In the utility model, a directional column is fixedly connected in the limiting groove, the directional column is slidably connected to the movable plate, and a support spring is fixedly connected between the movable plates. The support spring elastically drives the movable plate to move in a directional manner, so that the limiting bolt fixedly connected on one side of the movable plate is engaged with the fixed frame, thereby realizing the disassembly and installation of the heat dissipation structure, and facilitating the cleaning of the heat dissipation mechanism. The device has a simple structure and strong applicability, and is worthy of wide promotion.

[0004] However, the heat dissipation strips in the patent are arrayed with a number of rectangular grooves, and a number of heat dissipation fans are respectively arranged in the number of rectangular grooves. The heat dissipation fans and the heat dissipation strips are arranged at staggered intervals. Therefore, when the heat dissipation fans are running, the heat on the heat dissipation strips at the air inlet end will be absorbed and blown to the heat dissipation strips at the air outlet end, resulting in not only the failure to achieve the purpose of rapid heat dissipation, but also the accumulation of heat on the heat dissipation strips, and then the accumulation of heat on both sides of the bus duct, resulting in poor heat dissipation effect.

[0005] Therefore, the applicant has made a useful design and found a solution to the above problem. The technical solution to be introduced below was produced in this context. Utility Model Content

[0006] The utility model provides a dense bus duct to solve the problems raised in the above background technology.

[0007] To achieve the above objectives, the present invention provides the following technical solutions:

[0008] A dense bus duct, comprising a bus duct body, and two heat dissipation mechanisms respectively arranged on both sides of the bus duct body, the bus duct body is provided with a fixing plate at the top and bottom, the fixing plate and the two side walls of the bus duct body are formed, the heat dissipation mechanism is installed in the mounting groove, the inner wall of the mounting groove is provided with a plurality of heat conducting plates, the heat dissipation mechanism includes a heat conducting seat, a plurality of slots are opened on one side surface of the heat conducting seat, a plurality of heat conducting plates are respectively inserted into the plurality of slots, a plurality of heat conducting fin groups are provided on the other side of the heat conducting seat, a plurality of heat dissipation fin groups are provided with a heat dissipation fan, a shell is provided on the heat conducting seat, a pressure plate is provided on the top and bottom of both sides of the shell, a buckle is provided on the surface of the pressure plate close to the fixing plate, a slot is provided at the four corners of the fixing plate, and the buckle is embedded in the slot.

[0009] Preferably, the heat dissipation fin group is composed of a number of heat dissipation fins arranged at equal intervals, and the air inlet end of the heat dissipation fan is in contact with the number of heat dissipation fins.

[0010] Preferably, air inlets are provided on both sides of the shell, and a surface of the shell facing away from the bus duct body is provided with a plurality of air outlets, and the plurality of air outlets are respectively opposite to the air outlet ends of a plurality of heat dissipation fans.

[0011] Preferably, the surface of the heat conducting plate and the inner wall of the slot are both coated with thermal grease, and the surface of the heat conducting plate and the inner wall of the slot are tightly fitted.

[0012] Preferably, a chamfer is provided on one side corner of the clip close to the bus duct body.

[0013] Beneficial effects

[0014] The above one or more technical solutions in the dense bus duct provided by the embodiment of the utility model have at least one of the following technical effects:

[0015] The utility model adopts the above technical solution, and is provided with a plurality of heat-conducting plates, which conduct the heat of the bus duct body out. The heat-conducting plates are inserted into the slots, which can effectively increase the heat conduction area, thereby improving the heat conduction effect. The heat is conducted to the plurality of heat-dissipating fin groups on the heat-dissipating seat through the heat-dissipating plate, and the heat on the heat-dissipating fin group is absorbed through the air inlet end of the heat-dissipating fan and discharged through the air outlet end. Since the air outlet end of the heat-dissipating fan is far away from the bus duct body, the heat can be blown in a direction away from the bus duct body, thereby avoiding heat accumulation and further improving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the utility model;

[0017] Figure 2This is a schematic diagram of the bus duct structure of the utility model;

[0018] Figure 3 This is a schematic diagram of the exploded structure of the heat dissipation mechanism of the utility model;

[0019] The corresponding relationship between the illustration labels and component names in the figure is as follows:

[0020] 1. Bus duct body; 2. Heat dissipation mechanism; 3. Fixing plate; 4. Mounting slot; 5. Heat conduction plate; 6. Heat conduction seat; 7. Slot; 8. Heat dissipation fin assembly; 9. Cooling fan; 10. Housing; 11. Pressure plate; 12. Clip; 13. Slot; 14. Air inlet; 15. Air outlet. DETAILED DESCRIPTION

[0021] The following will clearly and completely describe the technical solutions of the present invention in conjunction with the embodiments. Obviously, the embodiments described are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by the terms "up", "down", "left" and "right" are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0023] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0024] like Figure 1-3 As shown, it is a structural schematic diagram of a dense bus duct in a preferred embodiment of the present invention;

[0025] In this embodiment, it includes a bus duct body 1 and two heat dissipation mechanisms 2 respectively arranged on both sides of the bus duct body 1, the bus duct body 1 is provided with a fixing plate 3 at the top and bottom, and a mounting groove 4 is formed between the fixing plate 3 and the two side walls of the bus duct body 1, the heat dissipation mechanism 2 is installed in the mounting groove 4, and the inner wall of the mounting groove 4 is provided with a plurality of heat conducting plates 5, and the plurality of heat conducting plates 5 are arranged at equal intervals. The heat conducting plates 5 and the two side walls of the bus duct body 1 are an integrated structure, and the heat conducting plates 5 are made of aluminum. The heat dissipation mechanism 2 includes a heat conducting seat 6, and a plurality of slots 7 are opened on one side surface of the heat conducting seat 6. The plurality of heat conducting plates 5 are respectively inserted into the plurality of slots 7. Through this structure, the heat conduction area is effectively increased, so that the heat conduction effect is improved. The other side of the heat conducting seat 6 is integrated The heat dissipation mechanism 2 is provided with a plurality of heat dissipation fin groups 8, the heat conducting seat 6 and the plurality of heat dissipation fin groups 8 are made of copper, and a heat dissipation fan 9 is provided on the plurality of heat dissipation fin groups 8, and a shell 10 is provided on the heat conducting seat 6. The top and bottom of both sides of the shell 10 are provided with pressure plates 11, and the surface of the pressure plate 11 close to the side of the fixed plate 3 is provided with a clip 12, and the four corners of the fixed plate 3 are provided with a slot 13, and the clip 12 is embedded in the slot 13. The installation between the heat dissipation mechanism and the bus duct body is realized through this structure, and the embedded structure of the clip 12 and the slot 13 facilitates the disassembly of the heat dissipation mechanism 2 for cleaning. During disassembly, the pressure plate 11 is pressed to deform the pressure plate 11, so that the clip 12 is pulled out from the slot 13, and the heat dissipation mechanism 2 can be removed from the mounting slot 4.

[0026] In this embodiment, the heat sink fin group 8 is composed of a number of heat sink fins arranged at equal intervals. The air inlet end of the heat sink fan 9 is in contact with the heat sink fins. The air inlet end of the heat sink fan 9 absorbs the temperature on the surface of the heat sink fins and discharges it from the air outlet end.

[0027] In this embodiment, air inlets 14 are provided on both sides of the shell 10, and a plurality of air outlets 15 are provided on the surface of the shell 10 facing away from the bus duct body 1. The plurality of air outlets 15 are respectively opposite to the air outlet ends of the plurality of cooling fans 9. The air outlet end of the cooling fan 9 discharges heat through the air outlet 15, and the outside cold air enters through the air inlet 14. When the air inlet end of the cooling fan 9 absorbs the heat from the surface of the cooling fins, the outside cold air is also absorbed through the air inlet 14, so that the cold air passes through the surface of the cooling fins, thereby accelerating the heat dissipation speed, and the cooling fan 9 blows the heat away from the bus duct body 1.

[0028] In this embodiment, the surface of the heat conducting plate 5 and the inner wall of the slot 7 are coated with thermal grease, and the surface of the heat conducting plate 5 and the inner wall of the slot 7 are tightly fitted, so that the heat conduction effect is better.

[0029] In this embodiment, a chamfer is provided on one side corner of the buckle 12 close to the bus duct body 1 , and the chamfer structure makes it easier for the buckle 12 to be inserted into the slot 13 .

[0030] The utility model provides a dense bus duct, and its installation method, connection method or setting method are all common mechanical methods, and can be implemented as long as it can achieve its beneficial effects.

[0031] Technologies not described in detail in the present invention are all well-known technologies. Those skilled in the art can easily implement the present invention based on understanding this specification, and the contents shown in the drawings are part of this specification.

[0032] The above content is a further detailed description of the present invention in combination with specific implementation methods. It cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, they can make several simple deductions or substitutions without departing from the concept of the present invention, which should be regarded as falling within the scope of protection determined by the claims submitted for the present invention.

Claims

1. A compact bus duct, comprising a bus duct body (1), and two heat dissipation mechanisms (2) respectively arranged on both sides of the bus duct body (1), characterized in that: The bus duct body (1) is provided with a fixing plate (3) at the top and bottom, and a mounting groove (4) is formed between the fixing plate (3) and the two side walls of the bus duct body (1). The heat dissipation mechanism (2) is installed in the mounting groove (4), and the inner wall of the mounting groove (4) is provided with a plurality of heat conduction plates (5). The heat dissipation mechanism (2) includes a heat conduction seat (6), and a plurality of slots (7) are provided on one side surface of the heat conduction seat (6). The plurality of heat conduction plates (5) are respectively inserted into the plurality of slots (7). A plurality of heat dissipation fin groups (8) are provided on the other side of the heat-conducting seat (6), and a heat dissipation fan (9) is provided on each of the plurality of heat dissipation fin groups (8). A shell (10) is provided on the heat-conducting seat (6), and pressure plates (11) are provided on the top and bottom of both sides of the shell (10). A buckle (12) is provided on the surface of one side of the pressure plate (11) close to the fixing plate (3), and a slot (13) is provided at each of the four corners of the fixing plate (3), and the buckle (12) is embedded in the slot (13).

2. The intensive bus duct according to claim 1, characterized in that: The heat dissipation fin group (8) is composed of a plurality of heat dissipation fins arranged at equal intervals, and the air inlet end of the heat dissipation fan (9) is fitted with the plurality of heat dissipation fins.

3. The intensive bus duct according to claim 1, characterized in that: Air inlets (14) are provided on both sides of the shell (10), and a plurality of air outlets (15) are provided on a surface of the shell (10) facing away from the bus duct body (1), and the plurality of air outlets (15) are respectively opposite to the air outlet ends of the plurality of cooling fans (9).

4. The intensive bus duct according to claim 1, characterized in that: The surface of the heat conducting plate (5) and the inner wall of the slot (7) are both coated with thermal grease, and the surface of the heat conducting plate (5) and the inner wall of the slot (7) are tightly fitted.

5. The intensive bus duct according to claim 1, characterized in that: The buckle (12) is provided with a chamfer at a corner on one side close to the bus duct body (1).

Citation Information

Patent Citations

  • Intensive bus duct

    CN218335226U