Automatic uncovering module for double-layer carrier

Abstract

The utility model discloses an automatic uncovering module for a double-layer carrier, which comprises a liftable workbench, and the workbench is provided with a rack for placing the double-layer carrier; a lower-layer fixing mechanism, an upper-layer jacking mechanism and a product adsorption mechanism are arranged on the rack, the lower-layer fixing mechanism comprises clamping driving units and a clamping part which are symmetrically arranged on the two sides, and the left clamping driving unit and the right clamping driving unit drive the clamping part to move towards the middle so as to clamp the lower-layer carrier; the upper-layer jacking mechanism comprises jacking driving units and jacking parts, the jacking driving units are symmetrically arranged on the two sides, and the jacking driving units drive the jacking parts to penetrate through the jacking avoiding holes of the lower-layer carrier and then abut against the lower surface of the upper-layer carrier, and the upper-layer carrier is jacked upwards. According to the scheme, the upper-layer carrier and the lower-layer carrier in the double-layer carrier are opened and closed, the automatic cover opening and closing module is applied to an automatic production line, the production efficiency is improved, and damage to the double-layer carrier and the flexible circuit board is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of automated production of flexible circuit boards, and in particular to an automatic cover opening module for a double-layer carrier used in the SMT industry. Background Art

[0002] FPC, the full name of which is Flexible Printed Circuit, or FPC for short, is a circuit board made of a flexible substrate that can be bent, rolled, and folded freely. It can meet the design needs of smaller and higher-density installations, and also helps reduce assembly processes and enhance reliability.

[0003] During the production of flexible circuit boards, double-sided production is often required. To reduce repeated loading of products during double-sided production, the carrier is often designed as a double-layer model. The upper and lower layers of the carrier are magnetically bonded together. During production, the flexible circuit board is placed in the middle of the double-layer carrier. After production of side A is completed, it can be directly flipped to side B for use. This reduces the number of times the product is repeatedly loaded onto the carrier and reduces the risk of product damage. For double-layer carriers, during the automatic loading process of the machine, the upper and lower layers of the carrier must first be separated, and the products are placed into the carrier one by one, and then the upper layer of the carrier is returned to press the products.

[0004] When studying the existing technology and equipment for separating and closing double-layer carriers, it was found that the existing technology has at least the following problems:

[0005] 1. Since the upper and lower layers of the carrier need to clamp the flexible circuit board, a large suction force is required between the upper and lower layers of the carrier. Conventional separation methods will cause the carrier to deform due to excessive force when separating the upper and lower layers of the carrier, thereby damaging the carrier and also the risk of damaging the flexible circuit board on the carrier.

[0006] 2. After the upper and lower layers of the carrier are separated, the position of the flexible circuit board may change, which will affect the production of subsequent processes.

[0007] In view of this, how to solve the problems of the existing equipment that cause the double-layer carrier to deform and the position of the flexible circuit board to change when the double-layer carrier is separated and closed has become the subject to be studied and solved by the present invention. Utility Model Content

[0008] The utility model provides an automatic cover opening module for a double-layer carrier, which aims to solve the problems of existing equipment causing deformation of the carrier and change in position of the flexible circuit board when the double-layer carrier is separated and closed.

[0009] To achieve the above objectives, the present invention proposes an automatic cover opening module for a double-layer carrier, which is used to open the upper and lower layers of the double-layer carrier. The innovations of the module are:

[0010] The automatic opening and closing cover module includes a liftable workbench with a stand for placing double-layer carriers; the stand is provided with a lower fixing mechanism, an upper lifting mechanism and a product adsorption mechanism.

[0011] The lower-layer fixing mechanism includes a clamping drive unit and a clamping part symmetrically arranged on both sides. The clamping drive unit is positioned and connected to the workbench, and the output end of the clamping drive unit is connected to the clamping part. A plurality of clamping parts are provided on the clamping part. When the double-layer mold is placed on the workbench, the clamping parts pass through the clamping avoidance holes of the lower-layer carrier, and the left and right clamping drive units drive the clamping parts to move toward the middle to clamp the lower-layer carrier.

[0012] The upper jacking mechanism includes a jacking drive unit and a jacking part symmetrically arranged on both sides. The jacking drive unit is positioned and connected to the workbench, and the output end of the jacking drive unit is connected to the jacking part. A plurality of jacking parts are provided on the jacking part. After the lower fixing mechanism clamps the lower carrier, the jacking drive unit drives the jacking parts to pass through the jacking avoidance hole of the lower carrier and then abut against the lower surface of the upper carrier, thereby lifting the upper carrier upward.

[0013] The product adsorption mechanism includes multiple adsorption parts. When the double-layer mold is placed on the workbench, the adsorption parts pass through the adsorption avoidance holes of the lower carrier, and the adsorption parts abut / adsorb in the air against the lower surface of the flexible circuit board in the double-layer carrier.

[0014] The relevant contents of this utility model are explained as follows:

[0015] 1. In the above technical solution of the present invention, in order to solve the problems of existing equipment causing deformation of the carrier and change of the position of the flexible circuit board when the double-layer carrier is separated and closed, an innovative double-layer carrier automatic opening module of the present invention is designed, and a lower-layer fixing mechanism, an upper-layer lifting mechanism and a product adsorption mechanism are arranged on the workbench of the double-layer carrier automatic opening module, and the lower-layer carrier is provided with a clamping avoidance hole, a lifting avoidance hole and an adsorption avoidance hole. When the double-layer mold is placed on the workbench, the clamping parts of the lower-layer fixing mechanism pass through the clamping avoidance hole of the lower-layer carrier, and the left and right clamping drive units drive the clamping parts to move toward the middle to clamp the lower-layer carrier, so that the lower-layer carrier can be firmly positioned; after the lower-layer fixing mechanism clamps the lower-layer carrier, the lifting drive unit drives multiple lifting parts to pass through the lower-layer carrier. After the jacking avoidance hole is lifted, it abuts against the lower surface of the upper carrier and lifts the upper carrier upward. The joint lifting action of the multiple lifting parts prevents the upper carrier from deforming, thereby realizing the separation of the upper carrier and the lower carrier. After separation, the upper carrier can be taken away and the flexible circuit board product can be placed on the lower carrier. The adsorption part of the product adsorption mechanism passes through the adsorption avoidance hole of the lower carrier, and the adsorption part abuts / adsorbs in the air with the lower surface of the flexible circuit board in the lower carrier, so that in the process of closing the upper carrier, the flexible circuit board in the lower carrier can be adsorbed and does not change its position; in this way, the opening and closing operations of the upper and lower carriers in the double-layer carrier are completed. During the opening process, the lower carrier can be firmly positioned, and during the closing process of the upper carrier, the flexible circuit board in the lower carrier can be adsorbed and does not change its position.

[0016] 2. In the above technical solution, the double-layer carrier is moved from the X direction to the top of the workbench by an external streamline. The workbench is connected to a lifting mechanism, and the lifting mechanism drives the workbench to move up and down along the Z direction, so that the double-layer carrier automatic opening module can be better applied to the flexible circuit board automatic production line, making the layout of the double-layer carrier automatic opening module reasonable and the structure compact.

[0017] 3. In the above technical solution, the upper surface of the workbench is provided with a clamping slide rail extending along the X direction, the clamping drive unit and the front and rear sides of the clamping part are symmetrically arranged on the clamping slide rail, the clamping part includes a clamping plate whose length extends along the Y direction, and a plurality of the clamping members are fixedly arranged above the clamping plate.

[0018] 4. In the above technical solution, the clamping member includes a first clamping block and a second clamping block. The first clamping block is established in the Z direction and fixed to the clamping plate, and the second clamping block is established in the X direction and fixed to the first clamping block. The first clamping block acts on the side of the lower carrier, and the second clamping block acts on the upper surface of the lower carrier. The structure of this clamping member makes the clamping and positioning of the lower carrier more secure, so that the double-layer carrier can overcome the larger suction force when separating.

[0019] 5. In the above technical solution, the lower surface of the second clamping block is provided with a conical surface, which is inclined upward toward the middle. Due to the conical surface design, the clamping parts on both sides can have a good transition when approaching the middle to clamp the lower carrier, further avoiding damage to the lower carrier.

[0020] 6. In the above technical solution, the workbench is provided with a guide rod established along the Z direction, the guide rod is sleeved on the guide linear bearing, the lifting part includes a lifting plate whose length extends along the Y direction, the telescopic shaft of the lifting drive unit is connected to the lifting plate, and the lifting plate is guided and connected to the guide rod, and a plurality of the lifting parts are fixedly arranged above the lifting plate. The structure of the upper lifting mechanism designed in this way can provide a more stable, reliable, fast and precise lifting operation, which can make the upper carrier separated faster and more accurately without damaging the upper carrier.

[0021] 7. In the above technical solution, the lifting mechanism includes a lifting bracket, a lifting drive motor, a lifting slide rail, and a buffer limiter. The lifting drive motor and the buffer limiter are installed on the lifting bracket, and the workbench is installed on the lifting slide rail. The lifting slide rail is cooperatively connected with the lifting drive motor. With this structure, the double-layer carrier is moved from the X direction to the top of the workbench by the external streamline, and then the lifting mechanism drives the workbench to move in the Z direction to lift the double-layer carrier first. At this time, the clamping part of the lower-layer fixing mechanism passes through the clamping avoidance hole of the lower-layer carrier.

[0022] 8. In the above technical solution, the adsorption part is an adsorption air nozzle to avoid damaging the flexible circuit board.

[0023] 9. In the above technical solution, the clamping drive unit and the lifting drive unit both use cylinders, and the power source is an air source, which can be the same source as the adsorption air nozzle, and the setting is simple, convenient and reliable.

[0024] 10. In this application, unless otherwise expressly specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood broadly. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise expressly limited. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0025] 11. In the description of this application, it should be noted that the terms "upper", "lower", "inner", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limiting the protection content of this application.

[0026] 12. In the description of this application, it should be noted that if words such as "first" and "second" are used in this document to limit components, those skilled in the art should know that the use of words such as "first" and "second" is only for the convenience of describing this application and simplifying the description. Unless otherwise stated, the above words have no special meaning.

[0027] Due to the application of the above scheme, the utility model has the following advantages and effects compared with the prior art:

[0028] 1. The above-mentioned scheme of the present invention aims to solve the problems of existing equipment that cause deformation of the carrier and change of the position of the flexible circuit board when the double-layer carrier is separated and closed, and innovatively designs the double-layer carrier automatic opening module of the present invention. The workbench of the double-layer carrier automatic opening module is provided with a lower-layer fixing mechanism, an upper-layer lifting mechanism and a product adsorption mechanism. The lower-layer carrier is provided with a clamping avoidance hole, a lifting avoidance hole and an adsorption avoidance hole. When the double-layer mold is placed on the workbench, the clamping parts of the lower-layer fixing mechanism pass through the clamping avoidance holes of the lower-layer carrier, and the left and right clamping drive units drive the clamping parts to move toward the middle to clamp the lower-layer carrier, so that the lower-layer carrier can be firmly positioned.

[0029] 2. After the lower fixing mechanism clamps the lower carrier, the lifting drive unit drives the plurality of lifting members to pass through the lifting avoidance holes of the lower carrier and then abut against the lower surface of the upper carrier, thereby lifting the upper carrier upward. The joint lifting action of the plurality of lifting members prevents the upper carrier from being deformed, thereby realizing the separation of the upper carrier and the lower carrier. After separation, the upper carrier can be removed and the flexible circuit board product can be placed on the lower carrier. The adsorption part of the product adsorption mechanism passes through the adsorption avoidance holes of the lower carrier, and the adsorption part abuts against / adsorbs in the air with the lower surface of the flexible circuit board in the lower carrier, so that during the process of closing the upper carrier, the flexible circuit board in the lower carrier can be adsorbed and does not change its position.

[0030] 3. This allows the upper and lower layers of a double-layer carrier to be opened and closed. During the opening process, the lower layer is securely positioned, and during the closing process, the flexible circuit board in the lower layer is attracted and held in place. This automatic cover module, when used in automated production lines, improves production efficiency and prevents damage to the double-layer carrier and flexible circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a three-dimensional schematic diagram of the automatic cover opening module of a double-layer carrier according to an embodiment of the present utility model;

[0032] Figure 2 This is a front view of the automatic cover opening module for a double-layer carrier according to an embodiment of the present utility model;

[0033] Figure 3 This is a three-dimensional schematic diagram of the automatic cover opening module of a double-layer carrier according to an embodiment of the utility model (in the jacking state);

[0034] Figure 4 This is a front view of the automatic cover opening module of a double-layer carrier according to an embodiment of the present utility model (in the lifted state);

[0035] Figure 5 This is a three-dimensional schematic diagram of the lower fixing mechanism in the embodiment of the present utility model;

[0036] Figure 6 This is a top view of the lower fixing mechanism in an embodiment of the present utility model;

[0037] Figure 7 This is a schematic diagram of the lower fixing mechanism clamping the lower carrier in an embodiment of the present utility model;

[0038] Figure 8 This is a schematic diagram of a clamping member in an embodiment of the present utility model;

[0039] Figure 9This is a three-dimensional schematic diagram of the upper lifting mechanism in the embodiment of the present utility model lifting the upper carrier;

[0040] Figure 10 This is a left view of the upper lifting mechanism in the embodiment of the present utility model when lifting the upper carrier;

[0041] Figure 11 This is a front view of the upper lifting mechanism in the embodiment of the present utility model when lifting the upper carrier;

[0042] Figure 12 This is a three-dimensional schematic diagram of the product adsorption mechanism in the embodiment of the present utility model;

[0043] Figure 13 It is a left view of the product adsorption mechanism in the embodiment of the present utility model.

[0044] The various parts of the above drawings are shown as follows:

[0045] 1. Workbench;

[0046] 11. Stand; 12. Clamping rail; 13. Guide rod; 14. Guide linear bearing;

[0047] 2. Lower fixing mechanism;

[0048] 21. Clamping drive unit;

[0049] 22. Clamping portion; 221. Clamping member; 2211. First clamping block; 2212. Second clamping block; 22121. Conical surface;

[0050] 222, clamping plate;

[0051] 3. Upper lifting mechanism;

[0052] 31. Lifting drive unit;

[0053] 32. Lifting part; 321. Lifting member; 322. Lifting plate;

[0054] 4. Product adsorption mechanism; 41. Adsorption unit;

[0055] 5. Lifting mechanism;

[0056] 51. Lifting bracket; 52. Lifting drive motor; 53. Lifting slide rail; 54. Buffer limiter;

[0057] 9. Double-decker carrier;

[0058] 91. Upper vehicle; 92. Lower vehicle. DETAILED DESCRIPTION

[0059] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0060] The present invention aims to solve the problems of existing equipment such as deformation of the carrier and change of the position of the flexible circuit board when the double-layer carrier 9 is separated and closed, and innovatively designs the double-layer carrier automatic opening module of the present invention to achieve the purpose of opening the upper carrier 91 and the lower carrier 92 in the double-layer carrier 9.

[0061] like Figures 1 to 13 As shown, an embodiment of the utility model proposes an automatic lid opening module for a double-layer carrier, which is used to open the upper carrier 91 and the lower carrier 92 in the double-layer carrier 9. The automatic lid opening and closing module includes a liftable workbench 1, and the workbench 1 has a stand 11 for placing the double-layer carrier 9; the stand 11 is provided with a lower fixing mechanism 2, an upper lifting mechanism 3 and a product adsorption mechanism 4.

[0062] The lower-layer fixing mechanism 2 includes a clamping drive unit 21 and a clamping part 22 symmetrically arranged on both sides. The clamping drive unit 21 is positioned and connected to the workbench 1. The output end of the clamping drive unit 21 is connected to the clamping part 22. A plurality of clamping members 221 are provided on the clamping part 22. When the double-layer mold is placed on the workbench 1, the clamping member 221 passes through the clamping avoidance hole of the lower-layer carrier 92, and the left and right clamping drive units 21 drive the clamping member 221 to move toward the middle to clamp the lower-layer carrier 92.

[0063] The upper jacking mechanism 3 includes a jacking drive unit 31 and a jacking part 32 symmetrically arranged on both sides. The jacking drive unit 31 is positioned and connected to the workbench 1. The output end of the jacking drive unit 31 is connected to the jacking part 32. A plurality of jacking parts 321 are provided on the jacking part 32. After the lower fixing mechanism 2 clamps the lower carrier 92, the jacking drive unit 31 drives the jacking parts 321 to pass through the jacking avoidance hole of the lower carrier 92 and then abut against the lower surface of the upper carrier 91, thereby lifting the upper carrier 91 upward.

[0064] The product adsorption mechanism 4 includes multiple adsorption parts 41. When the double-layer mold is placed on the workbench 1, the adsorption parts 41 pass through the adsorption avoidance holes of the lower carrier 92, and the adsorption parts 41 abut / adsorb in the air against the lower surface of the flexible circuit board in the double-layer carrier 9.

[0065] Through the implementation of the above-mentioned embodiment of the present invention, in this equipment, a lower-layer fixing mechanism 2, an upper-layer lifting mechanism 3 and a product adsorption mechanism 4 are provided on the workbench 1, and a clamping avoidance hole, a lifting avoidance hole and an adsorption avoidance hole are provided on the lower-layer carrier 92. When the double-layer mold is placed on the workbench 1, the clamping member 221 of the lower-layer fixing mechanism 2 passes through the clamping avoidance hole of the lower-layer carrier 92, and the left and right clamping drive units 21 drive the clamping member 221 to move toward the middle to clamp the lower-layer carrier 92, so that the lower-layer carrier 92 can be firmly positioned; after the lower-layer fixing mechanism 2 clamps the lower-layer carrier 92, the lifting drive unit 31 drives multiple lifting members 321 to pass through the lifting avoidance hole of the lower-layer carrier 92 and abut against the lower surface of the upper-layer carrier 91, and lift the upper-layer carrier 91 upward, and multiple lifting members 321 are driven to pass through the lifting avoidance hole of the lower-layer carrier 92. The joint lifting action of parts 321 prevents the upper carrier 91 from deforming, thereby realizing the separation of the upper carrier 91 and the lower carrier 92. After separation, the upper carrier 91 can be removed, and the flexible circuit board product can be placed on the lower carrier 92. The adsorption part 41 of the product adsorption mechanism 4 passes through the adsorption avoidance hole of the lower carrier 92, and the adsorption part 41 abuts / adsorbs the lower surface of the flexible circuit board in the lower carrier 92 in the air, so that in the process of closing the upper carrier 91, the flexible circuit board in the lower carrier 92 can be adsorbed and will not change its position; thereby completing the opening and closing operations of the upper carrier 91 and the lower carrier 92 in the double-layer carrier 9, and the lower carrier 92 can be firmly positioned during the opening process, and the flexible circuit board in the lower carrier 92 can be adsorbed and will not change its position during the closing process of the upper carrier 91.

[0066] like Figure 1 In the XYZ coordinate system shown in FIG. 1 , in another embodiment of the present invention, the double-layer carrier 9 is moved from the X direction to the top of the workbench 1 by an external streamline, and the workbench 1 is connected to a lifting mechanism 5, which drives the workbench 1 to move up and down along the Z direction, so that the double-layer carrier automatic opening module can be better applied to the flexible circuit board automatic production line, so that the layout of the double-layer carrier automatic opening module is reasonable and the structure is compact.

[0067] Furthermore, the lifting mechanism 5 includes a lifting bracket 51, a lifting drive motor 52, a lifting slide rail 53, and a buffer limiter 54. The lifting drive motor 52 and the buffer limiter 54 are installed on the lifting bracket 51, and the workbench 1 is installed on the lifting slide rail 53. The lifting slide rail 53 is cooperated and connected with the lifting drive motor 52. With this structure, the double-layer carrier 9 is moved from the X direction to the top of the workbench 1 by the external streamline, and then the lifting mechanism 5 drives the workbench 1 to move in the Z direction to lift the double-layer carrier 9 first. At this time, the clamping member 221 of the lower-layer fixing mechanism 2 passes through the clamping avoidance hole of the lower-layer carrier 92.

[0068] Specifically, the upper surface of the workbench 1 is provided with a clamping slide rail 12 extending along the X direction, and the clamping drive unit 21 and the clamping part 22 are symmetrically arranged on the front and rear sides of the clamping slide rail 12. The clamping part 22 includes a clamping plate 222 whose length extends along the Y direction, and a plurality of the clamping members 221 are fixedly arranged above the clamping plate 222.

[0069] In another embodiment of the present invention, the clamping member 221 includes a first clamping block 2211 and a second clamping block 2212. The first clamping block 2211 is established in the Z direction and fixed to the clamping plate 222, and the second clamping block 2212 is established in the X direction and fixed to the first clamping block 2211. The first clamping block 2211 acts on the side of the lower carrier 92, and the second clamping block 2212 acts on the upper surface of the lower carrier 92. The structure of the clamping member 221 makes the clamping and positioning of the lower carrier 92 more secure, so that the double-layer carrier 9 can overcome the larger suction force when separated.

[0070] Specifically, the lower surface of the second clamping block 2212 is provided with a conical surface 22121, and the conical surface 22121 is inclined upward toward the middle. Due to the design of the conical surface 22121, the clamping parts 221 on both sides can have a good transition when approaching the middle to clamp the lower carrier 92, further avoiding damage to the lower carrier 92.

[0071] In another embodiment of the present invention, the clamping member 221 includes a first clamping block 2211 and a second clamping block 2212. The first clamping block 2211 is established in the Z direction and fixed to the clamping plate 222, and the second clamping block 2212 is established in the X direction and fixed to the first clamping block 2211. The first clamping block 2211 acts on the side of the lower carrier 92, and the second clamping block 2212 acts on the upper surface of the lower carrier 92.

[0072] In another embodiment of the present invention, the workbench 1 is provided with a guide rod 13 established along the Z direction, the guide rod 13 is sleeved on the guide linear bearing 14, the lifting portion 32 includes a lifting plate 322 whose length extends along the Y direction, the telescopic shaft of the lifting drive unit 31 is connected to the lifting plate 322, and the lifting plate 322 is guided and connected to the guide rod 13, and a plurality of the lifting members 321 are fixedly arranged above the lifting plate 322. The structure of the upper lifting mechanism 3 designed in this way can provide a more stable, reliable, fast and precise lifting operation, which can make the upper carrier 91 separated faster and more accurately without damaging the upper carrier 91.

[0073] In another embodiment of the present invention, the adsorption portion 41 is a suction nozzle to avoid damaging the flexible circuit board. Specifically, the clamping drive unit 21 and the lifting drive unit 31 are both cylinders, and the power source is an air source, which can be the same as the adsorption nozzle, making the installation simple, convenient and reliable.

[0074] The solution of the utility model is described below with a detailed embodiment.

[0075] In this detailed embodiment, a double-layer carrier automatic opening module is proposed, which is used to open the upper carrier 91 and the lower carrier 92 in the double-layer carrier 9. The lower carrier 92 has clamping avoidance holes, jacking avoidance holes and adsorption avoidance holes, and various hole positions are also set correspondingly on the upper carrier 91.

[0076] The double-layer carrier automatic opening module includes a workbench 1 that is driven by a lifting mechanism 5 to move up and down along the Z direction. The workbench 1 has a stand 11 for placing the double-layer carrier 9, and the stand 11 is provided with a lower fixing mechanism 2, an upper lifting mechanism 3 and a product adsorption mechanism 4; the upper surface of the workbench 1 is provided with a clamping slide 12 extending along the X direction, and the clamping drive unit 21 and the clamping part 22 of the lower fixing mechanism 2 are symmetrically arranged on the clamping slide 12 on the front and back sides. The clamping part 22 includes a clamping plate 222 with a length extending along the Y direction. A plurality of the clamping members 221 are fixed in a row. Arranged above the clamping plate 222, the clamping member 221 includes a first clamping block 2211 and a second clamping block 2212. The first clamping block 2211 is established in the Z direction and fixed to the clamping plate 222, and the second clamping block 2212 is established in the X direction and fixed to the first clamping block 2211. The first clamping block 2211 acts on the side of the lower carrier 92, and the second clamping block 2212 acts on the upper surface of the lower carrier 92. The lower surface of the second clamping block 2212 is provided with a conical surface 22121, and the conical surface 22121 is inclined upward toward the middle. The workbench 1 is provided with a guide rod 13 extending along the Z direction. The guide rod 13 is sleeved on a guide linear bearing 14. The lifting portion 32 includes a lifting plate 322 extending in the Y direction. The telescopic shaft of the lifting drive unit 31 is connected to the lifting plate 322, which is in a guide connection with the guide rod 13. A plurality of lifting members 321 are fixedly arranged above the lifting plate 322. The product adsorption mechanism 4 includes a plurality of adsorption portions 41. When the double-layer mold is placed on the workbench 1, the adsorption portions 41 pass through the adsorption avoidance holes of the lower carrier 92, and the adsorption portions 41 abut / adsorb in the air against the lower surface of the flexible circuit board in the lower carrier 92.

[0077] The detailed working process of the present invention can be referred to as follows:

[0078] 1. The double-layer carrier 9 flows in from the front station, and the lifting mechanism 5 drives the workbench 1 to lift the double-layer carrier 9 first.

[0079] 2. The clamping member 221 of the lower fixing mechanism 2 passes through the clamping avoidance hole of the lower carrier 92. The left and right clamping drive units 21 drive the clamping member 221 to move toward the middle to clamp the lower carrier 92 and fix the lower carrier 92 (see Figure 1 、 Figure 2 and Figure 7 ).

[0080] 3. The lifting drive unit 31 drives the lifting member 321 to pass through the lifting avoidance hole of the lower carrier 92 and abut against the lower surface of the upper carrier 91, and lift the upper carrier 91 upward to separate the upper carrier 91 from the lower carrier 92 (see Figure 3 、 Figure 4 and Figure 9 、 Figure 10 、 Figure 11 ).

[0081] 4. After separation, the upper carrier 91 can be removed, and the product adsorption module can work to adsorb the product while the product is placed.

[0082] 5. After the products are placed, the upper carrier 91 is put back, and the upper lifting mechanism 3 is lowered to realize the reset of the upper carrier 91 and the lower carrier 92.

[0083] 6. The lower fixing mechanism 2 opens to release the fixation of the lower carrier 92. The lifting mechanism 5 drives the workbench 1, and the double-layer carrier 9 flows out.

[0084] It should also be noted that in the embodiments of the present invention, the control of each module and mechanism belongs to the existing technology, and those skilled in the art are aware of their principles and structures. These technologies are not the focus of the present invention, so this part will not be described in detail here.

[0085] The above embodiments are intended only to illustrate the technical concepts and features of the present invention. Their purpose is to enable those familiar with the art to understand the contents of the present invention and implement them accordingly. They are not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications based on the spirit of the present invention are intended to be included in the scope of protection of the present invention.

Claims

1. A double-layer carrier automatic cover opening module, used for opening an upper carrier (91) and a lower carrier (92) in a double-layer carrier (9), characterized in that: The automatic opening and closing cover module comprises a liftable workbench (1), the workbench (1) having a stand (11) for placing a double-layer carrier (9), and the stand (11) is provided with a lower layer fixing mechanism (2), an upper layer lifting mechanism (3) and a product adsorption mechanism (4); The lower layer fixing mechanism (2) comprises a clamping drive unit (21) and a clamping portion (22) symmetrically arranged on both sides, the clamping drive unit (21) is positioned and connected to the workbench (1), the output end of the clamping drive unit (21) is connected to the clamping portion (22), and a plurality of clamping members (221) are provided on the clamping portion (22). When the double-layer mold is placed on the workbench (1), the clamping members (221) pass through the clamping avoidance holes of the lower layer carrier (92), and the left and right clamping drive units (21) drive the clamping members (221) to move toward the middle to clamp the lower layer carrier (92); The upper lifting mechanism (3) comprises a lifting drive unit (31) and a lifting part (32) symmetrically arranged on both sides. The lifting drive unit (31) is positioned and connected to the workbench (1). The output end of the lifting drive unit (31) is connected to the lifting part (32). A plurality of lifting members (321) are provided on the lifting part (32). After the lower fixing mechanism (2) clamps the lower carrier (92), the lifting drive unit (31) drives the lifting members (321) to pass through the lifting avoidance holes of the lower carrier (92) and then abut against the lower surface of the upper carrier (91), thereby lifting the upper carrier (91) upward. The product adsorption mechanism (4) includes a plurality of adsorption parts (41). When the double-layer mold is placed on the workbench (1), the adsorption parts (41) pass through the adsorption avoidance holes of the lower carrier (92), and the adsorption parts (41) abut against / adsorb in the air the lower surface of the flexible circuit board in the lower carrier (92).

2. The double-layer carrier automatic cover opening module according to claim 1, characterized in that: The double-layer carrier (9) is moved from the X direction to the top of the workbench (1) by an external streamline. The workbench (1) is connected to a lifting mechanism (5), and the lifting mechanism (5) drives the workbench (1) to move up and down along the Z direction.

3. The double-layer carrier automatic cover opening module according to claim 2, characterized in that: The upper surface of the workbench (1) is provided with a clamping slide rail (12) extending along the X direction, the clamping drive unit (21) and the clamping part (22) are symmetrically arranged on the front and rear sides of the clamping slide rail (12), the clamping part (22) includes a clamping plate (222) whose length extends along the Y direction, and a plurality of clamping members (221) are fixedly arranged above the clamping plate (222).

4. The double-layer carrier automatic cover opening module according to claim 3, characterized in that: The clamping member (221) includes a first clamping block (2211) and a second clamping block (2212), wherein the first clamping block (2211) is set up in the Z direction and fixed to the clamping plate (222), and the second clamping block (2212) is set up in the X direction and fixed to the first clamping block (2211), and the first clamping block (2211) acts on the side of the lower carrier (92), and the second clamping block (2212) acts on the upper surface of the lower carrier (92).

5. The double-layer carrier automatic cover opening module according to claim 4, characterized in that: The lower surface of the second clamping block (2212) is provided with a conical surface (22121), and the conical surface (22121) is inclined upward toward the middle.

6. The double-layer carrier automatic cover opening module according to claim 2, characterized in that: The workbench (1) is provided with a guide rod (13) set up along the Z direction, the guide rod (13) is sleeved on the guide linear bearing (14), the lifting part (32) includes a lifting plate (322) whose length extends along the Y direction, the telescopic shaft of the lifting drive unit (31) is connected to the lifting plate (322), the lifting plate (322) is connected to the guide rod (13), and a plurality of lifting members (321) are fixedly arranged above the lifting plate (322).

7. The double-layer carrier automatic cover opening module according to claim 2, characterized in that: The lifting mechanism (5) comprises a lifting bracket (51), a lifting drive motor (52), a lifting slide rail (53), and a buffer stopper (54); the lifting drive motor (52) and the buffer stopper (54) are installed on the lifting bracket (51); the workbench (1) is installed on the lifting slide rail (53); and the lifting slide rail (53) is cooperatively connected with the lifting drive motor (52).

8. The double-layer carrier automatic cover opening module according to claim 1, characterized in that: The adsorption portion (41) is an adsorption air nozzle.

9. The double-layer carrier automatic cover opening module according to claim 1, characterized in that: The clamping drive unit (21) and the lifting drive unit (31) both use cylinders.

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