Shielding box and display screen
By introducing a heat-conducting frame into the shielding box and coordinating the heat conduction with the cover, the electromagnetic leakage and heat dissipation problems of the display signal processing board are solved, effective heat transfer and electromagnetic shielding are achieved, and the stable operation of the board is ensured.
Patent Information
- Application Number
- CN202422137341.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-30
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2034-08-30
AI Technical Summary
The signal processing board of the display screen has problems with electromagnetic leakage and poor heat dissipation when in use, which affects normal operation and is susceptible to external electromagnetic interference.
A shielding box is designed, which includes a box body, a cover body and a thermal conductive frame. The thermal conductive frame cooperates with the board and the cover body to conduct heat. The heat is transferred to the cover body through the thermal conductive frame and dissipated to the outside world to avoid heat accumulation.
It effectively solves the problem of poor heat dissipation of the shielding box, reduces the temperature of the control chip, and ensures the normal operation and anti-electromagnetic interference capability of the board.
Smart Images

Figure CN223322346U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of shielding devices, in particular to a shielding box and a display screen. Background Art
[0002] When the signal processing board of the display screen is in use, there is a problem of electromagnetic leakage, which will affect the normal operation of other boards. At the same time, the signal processing board should also be able to avoid being affected by external electromagnetic interference.
[0003] In the related art, a control chip is set in the shielding box. When the control chip is working, it will generate heat. The shielding box is a relatively closed structure. As a result, the heat generated by the control chip when working can only be conducted to the shielding box through the air in the shielding box, which may cause the heat to accumulate in the shielding box and cannot be dissipated. Utility Model Content
[0004] The main purpose of the utility model is to provide a shielding box and a display screen, so as to solve the problem of poor heat dissipation effect of the shielding box in the related art.
[0005] In order to achieve the above-mentioned purpose, according to the first aspect of the utility model, a shielding box is provided, including: a box body; a first board card, which is arranged in the box body; a cover body, which is covered on the top of the box body; and a heat-conducting frame, which is arranged in the box body, the first side of the heat-conducting frame is in heat-conducting cooperation with the first board card, and the second side of the heat-conducting frame is in abutment with the cover body.
[0006] Furthermore, the first board includes a first control chip, the heat conduction frame includes a first connecting plate and a first heat conduction plate arranged on the first connecting plate, the first connecting plate is connected to the cover, and the first heat conduction plate is thermally coordinated with the first control chip.
[0007] Furthermore, the heat-conducting frame further includes a heat-conducting pad, the top of the heat-conducting pad is in abutment with the first heat-conducting plate, and the bottom of the heat-conducting pad is in abutment with the first control chip.
[0008] Furthermore, the heat conducting frame further includes a second heat conducting plate, the first connecting plate is connected between the first heat conducting plate and the second heat conducting plate, and the second heat conducting plate is arranged on the cover.
[0009] Furthermore, the box body includes a bottom plate and an enclosure arranged above the bottom plate, an installation space is formed between the bottom plate and the enclosure, the first board is arranged in the installation space, the cover body is arranged above the enclosure, the heat conduction frame is located in the installation space, and at least part of the structure of the bottom plate protrudes from the enclosure and forms a third heat conduction plate.
[0010] Furthermore, the shielding box also includes a mounting plate, the first board is arranged on the mounting plate, a first preset interval is provided between the side wall of the first board and the surrounding plate, and a second preset interval is provided between the first board and the mounting plate.
[0011] Furthermore, the box body is made of metal, and the shielding box also includes a support member, a first end of the support member is connected to the first board, the mounting plate is connected to the middle of the support member, and the second end of the support member is located between the mounting plate and the bottom of the mounting space.
[0012] Furthermore, the thickness of the enclosure is greater than or equal to 1 mm and less than or equal to 3 mm.
[0013] According to a second aspect of the present invention, a display screen is provided, comprising a frame, a display screen body arranged on the frame, and a shielding box, wherein the shielding box is the above-mentioned shielding box.
[0014] According to the third aspect of the present invention, a display screen is provided, comprising a frame, a display screen body arranged on the frame, and a shielding box, wherein the shielding box is the above-mentioned shielding box, and the shielding box is arranged in the frame. The display screen also includes a second board card arranged in the frame, the second board card is electrically connected to the display screen body, the second board card includes a second control chip, and the second control chip is in abutment with the third heat conduction plate.
[0015] According to the technical solution of the present invention, a first board is provided in the box body. The top cover of the box body is provided with a cover body. A heat-conducting frame is provided in the box body, and the first side of the heat-conducting frame cooperates with the first board for heat conduction, and the second side of the heat-conducting frame abuts against the cover body. Through the above-mentioned arrangement, the cover body and the box body can protect the first board and the heat-conducting frame. The heat-conducting frame can transfer the heat generated during the operation of the first board to the cover body, and then the heat can be conducted to the external environment through the cover body, thereby preventing heat from accumulating in the box body and affecting the normal operation of the first board. Therefore, the technical solution of the present application effectively solves the problem of poor heat dissipation effect of the shielding box in the related art. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The drawings constituting part of this application are provided to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are provided to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:
[0017] Figure 1 A schematic diagram of the three-dimensional structure of an embodiment of a shielding box according to the present utility model is shown;
[0018] Figure 2 Shown Figure 1 Schematic diagram of the exploded structure of the shielding box;
[0019] Figure 3 Shown Figure 1 A schematic cross-sectional view of a shielding box;
[0020] Figure 4 Shown Figure 1 Schematic diagram of the three-dimensional structure of the connection between the first board, the mounting plate and the support member of the shielding box.
[0021] The above drawings include the following reference numerals:
[0022] 10. Box body; 11. Bottom plate; 111. Third heat conduction plate; 12. Enclosure; 13. Installation space; 20. First board; 21. First control chip; 30. Cover; 40. Heat conduction frame; 41. First connecting plate; 42. First heat conduction plate; 43. Second heat conduction plate; 50. Mounting plate; 60. Support member. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is in no way intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0024] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.
[0025] Unless otherwise specifically stated, the relative arrangement of the parts and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to actual proportional relationships. The technology, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be considered as part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, and therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.
[0026] like Figure 1 and Figure 2As shown, the shielding box of this embodiment includes: a box body 10, a first board 20, a cover 30, and a thermally conductive frame 40. The first board 20 is disposed within the box body 10. The cover 30 is disposed on the top of the box body 10. The thermally conductive frame 40 is disposed within the box body 10. A first side of the thermally conductive frame 40 thermally cooperates with the first board 20, and a second side of the thermally conductive frame 40 abuts against the cover 30.
[0027] Applying the technical solution of this embodiment, a first board 20 is provided in the box body 10. The top cover of the box body 10 is provided with a cover body 30. A heat-conducting frame 40 is provided in the box body 10, and the first side of the heat-conducting frame 40 is in thermal cooperation with the first board 20, and the second side of the heat-conducting frame 40 is in abutment with the cover body 30. Through the above-mentioned arrangement, the cover body 30 and the box body 10 can protect the first board 20 and the heat-conducting frame 40. The heat-conducting frame 40 can transfer the heat generated during the operation of the first board 20 to the cover body 30, and then the heat can be conducted to the external environment through the cover body 30, thereby preventing heat from accumulating in the box body 10 and affecting the normal operation of the first board 20. Therefore, the technical solution of this embodiment effectively solves the problem of poor heat dissipation effect of the shielding box in the related art.
[0028] It should be noted that the shielding box in this embodiment is a signal shielding box.
[0029] like Figure 3 and Figure 4 As shown, in this embodiment, the first board 20 includes a first control chip 21, and the heat conduction frame 40 includes a first connecting plate 41 and a first heat conduction plate 42 disposed on the first connecting plate 41. The first connecting plate 41 is connected to the cover 30, and the first heat conduction plate 42 cooperates with the first control chip 21 for thermal conductivity. The first heat conduction plate 42 can conduct heat generated during operation of the first control chip 21 to the first connecting plate 41, and the first connecting plate 41 can conduct heat to the cover 30. The heat can then be conducted to the external environment through the cover 30. In other words, the heat generated during operation of the first control chip 21 can be transferred to the environment, preventing heat from accumulating within the box body 10 and affecting the normal operation of the first control chip 21.
[0030] like Figure 2 and Figure 3 As shown, in this embodiment, the heat transfer frame 40 further includes a heat transfer pad, the top of which abuts against the first heat transfer plate 42, and the bottom of which abuts against the first control chip 21. The provision of the heat transfer pad can compensate for the height difference between the first heat transfer plate 42 and the first control chip 21. This allows the heat generated by the first control chip 21 during operation to be more effectively transferred to the first heat transfer plate 42 via the heat transfer pad, thereby improving the stability of the first control chip 21 during long-term operation.
[0031] It should be noted that the distance between the first heat conducting plate 42 and the first control chip 21 is between 0 and 1 mm, and can be 0 mm, 0.3 mm, 0.5 mm, 0.7 mm, or 1 mm. Specifically, in this embodiment, the distance between the first heat conducting plate 42 and the first control chip 21 is 0.3 mm. When the distance between the first heat conducting plate 42 and the first control chip 21 is 0 mm, no heat transfer pad is provided.
[0032] like Figure 3 As shown, in this embodiment, the heat conducting frame 40 further includes a second heat conducting plate 43, the first connecting plate 41 is connected between the first heat conducting plate 42 and the second heat conducting plate 43, and the second heat conducting plate 43 is disposed on the cover 30. The provision of the second heat conducting plate 43 increases the contact area between the heat conducting frame 40 and the cover 30, thereby enabling the heat conducted by the first heat conducting plate 42 to be more effectively transferred to the cover 30 via the second heat conducting plate 43.
[0033] It should be noted that the first heat conducting plate 42, the first connecting plate 41, and the second heat conducting plate 43 form a U-shape. After the heat conducting frame 40 is formed by sheet metal bending, the second heat conducting plate 43 is laser welded to the side of the cover 30 facing the box body 10. The shielding box also includes a third board, which includes multiple heat conducting frames 40. The third board includes a third control chip and a fourth control chip. A heat conducting frame 40 is also provided between the third control chip and the cover 30, and a heat conducting frame 40 is also provided between the fourth control chip and the cover 30. The center of the fourth control chip, the center of the third control chip, and the center of the first control chip are arranged in a triangle. Of course, in other embodiments, the third board may also include multiple fifth control chips, each of which also has a heat conducting frame provided between it and the cover 30. Multiple fifth control chips can perform different functions. The shielding box also includes a fourth board. The first board is a distribution card, the third board is a 2K video card, and the fourth board is an optoelectronic card. The first board is electrically connected to the third board, and the first board is electrically connected to the fourth board. The first board, the third board and the fourth board can realize the signal processing function.
[0034] like Figure 1 and Figure 2As shown, in this embodiment, the box body 10 includes a base plate 11 and an enclosure 12 disposed above the base plate 11. An installation space 13 is formed between the base plate 11 and the enclosure 12. The first board 20 is disposed in the installation space 13. The cover 30 is disposed above the enclosure 12. The heat conduction frame 40 is located in the installation space 13. At least part of the structure of the base plate 11 protrudes from the enclosure 12 and forms a third heat conduction plate 111. The provision of the installation space 13 enables the first board 20 and the heat conduction frame 40 to be disposed within the box body 10. The third heat conduction plate 111 is located outside the enclosure 12, which increases the contact area between the box body 10 and the external environment, thereby allowing the heat generated by the first control chip 21 during operation to be more effectively transferred to the external environment.
[0035] It should be noted that the enclosure 12 includes a first vertical plate, a second vertical plate, a third vertical plate, a fourth vertical plate, a fifth vertical plate, a sixth vertical plate, a seventh vertical plate, an eighth vertical plate, a ninth vertical plate, a tenth vertical plate, an eleventh vertical plate, and a twelfth vertical plate connected in sequence. The first end of the twelfth vertical plate is connected to the first end of the eleventh vertical plate, and the second end of the twelfth vertical plate is connected to the first end of the first vertical plate. Preferably, the enclosure 12 is arranged perpendicular to the base plate 11, the first vertical plate, the third vertical plate, the fifth vertical plate, the seventh vertical plate, the ninth vertical plate, and the eleventh vertical plate are arranged parallel to each other, the second vertical plate, the fourth vertical plate, the sixth vertical plate, the eighth vertical plate, the tenth vertical plate, and the twelfth vertical plate are arranged parallel to each other, and the first vertical plate is arranged perpendicular to the second vertical plate. The distance between the first vertical plate and the fifth vertical plate is greater than the distance between the third vertical plate and the fifth vertical plate, the third vertical plate and the eleventh vertical plate are in the same vertical plane, the fifth vertical plate and the ninth vertical plate are in the same vertical plane, and the distance between the seventh vertical plate and the third vertical plate is less than the distance between the third vertical plate and the fifth vertical plate, that is, the first vertical plate protrudes toward the outside of the installation space 13, and the seventh vertical plate is recessed toward the inside of the installation space 13.
[0036] Specifically, the third control chip is located between the first control chip and the fourth vertical plate. The third control chip is located between the fourth control chip and the third vertical plate. The third heat conducting plate 111 includes a first sub-heat conducting plate and a second sub-heat conducting plate. The first sub-heat conducting plate is connected to the second vertical plate and / or the third vertical plate, and the second sub-heat conducting plate is connected to the eleventh vertical plate and / or the twelfth vertical plate.
[0037] In this embodiment, the first sub-heat conducting plate is connected to both the second and third vertical plates, and the second sub-heat conducting plate is connected to both the eleventh and twelfth vertical plates. Both the first and second sub-heat conducting plates are connected to the bottom plate by laser welding.
[0038] like Figures 2 to 4As shown, in this embodiment, the box body 10 is made of metal, and the shielding box further includes a mounting plate 50. The first board 20 is mounted on the mounting plate 50. A first predetermined spacing is defined between the sidewalls of the first board 20 and the enclosure 12, and a second predetermined spacing is defined between the first board 20 and the mounting plate 50. This arrangement prevents direct contact between the first board 20 and the box body 10, thereby preventing short circuits during operation of the first board 20. The metal material of the box body 10 shields electromagnetic signals generated by the first board 20 during operation within the box body 10.
[0039] Preferably, the first preset interval is greater than 0 and less than 5 mm to facilitate installation of the first board 20. Specifically, the first preset interval can be 1 mm, 2 mm, 3 mm, 4 mm, or 5 mm. In this embodiment, the first preset interval is 3 mm. The second preset interval is between 3 mm and 8 mm. Specifically, the second preset interval can be 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, or 8 mm. In this embodiment, the second preset interval is 6 mm. A third preset interval is provided between the mounting plate 50 and the base plate 11. The third preset interval is between 2 mm and 6 mm. Specifically, the third preset interval can be 2 mm, 3 mm, 4 mm, 5 mm, or 6 mm. In this embodiment, the third preset interval is 4 mm.
[0040] It should be noted that a mounting post is provided on the side of the base plate facing the cover body, and the mounting post is made of aluminum alloy. The mounting post includes multiple, multiple first mounting holes are provided on the mounting plate, and the multiple first mounting holes are arranged in a one-to-one correspondence with the multiple mounting posts, and the first mounting holes and the mounting posts are connected by rivet nuts. The material of the box body 10 can be aluminum alloy, copper alloy or iron alloy, of course, it can also be other materials. The mounting plate 50 is a PCB board. By providing the mounting plate 50, it is possible to avoid the first board 20 from contacting the base plate 11 on the side facing the base plate 11, thereby avoiding the solder joints of the components on the first board 20 from contacting the base plate, that is, avoiding the situation of a short circuit. The mounting post prevents the mounting plate 50 from directly contacting the base plate 11 on the side facing the base plate 11, thereby avoiding the solder joints of the components on the mounting plate 50 from contacting the base plate 11, that is, avoiding the situation of a short circuit.
[0041] like Figure 4 As shown, in this embodiment, the shielding box further includes a support member 60, a first end of the support member 60 being connected to the first board 20, the mounting plate 50 being connected to the middle portion of the support member 60, and a second end of the support member 60 being located between the mounting plate 50 and the bottom of the mounting space 13. The support member 60 can also connect the mounting plate 50 and the first board 20, and the mounting plate 50 is connected to the middle portion of the support member 60, so that a second preset interval can be provided between the mounting plate 50 and the first board 20.
[0042] It should be noted that the mounting plate 50 is provided with multiple second mounting holes. The mounting plate 50 has a mounting area and a connection area. The mounting area is disposed within the connection area, with multiple first mounting holes spaced apart within the mounting area, and multiple second mounting holes spaced apart within the connection area. There are multiple support members 60, each corresponding to the multiple second mounting holes. The support members 60 are copper pillars. The copper pillars are threadedly connected to the second mounting holes. A copper layer is disposed within the mounting holes, and the copper pillars contact the copper layer, thereby grounding the first board 20.
[0043] like Figure 2 As shown, in this embodiment, the thickness of the enclosure 12 is greater than or equal to 1 mm and less than or equal to 3 mm. The thickness of the enclosure 12 is greater than or equal to 1 mm and less than or equal to 3 mm, making the overall weight of the box body 10 lighter and facilitating the installation and use of the shielding box.
[0044] Specifically, the thickness of the enclosure 12 can be 1 mm, 1.5 mm, 2 mm, 2.5 mm or 3 mm. Preferably, in this embodiment, the thickness of the enclosure 12 is 1.5 mm, so that the thickness of the enclosure 12 is relatively small. The thickness of the bottom plate 11 is the same as that of the enclosure 12, which facilitates the production of the box body 10. It should be noted that when the thickness of the enclosure 12 is between 2 mm and 3 mm, the box body 10 can be produced by mechanical processing. When the thickness of the enclosure 12 is between 1 mm and 2 mm, the box body 10 can be produced by laser cutting, bending and laser welding.
[0045] The shielding box of this embodiment not only shields electromagnetic leakage but also transfers heat generated by the first control chip 21 to the outside air. This prevents heat accumulation in the first control chip 21 within the high-protection screen due to prolonged operation, which could lead to overheating and shutdown of the first control chip 21. By using the shielding box of this embodiment, the maximum temperature of the first control chip 21 can be reduced from over 100°C to 74°C, ensuring its normal operation.
[0046] like Figures 1 to 4 As shown, the display screen of this embodiment includes a frame, a display screen body disposed on the frame, and a shielding box disposed within the frame, wherein the shielding box is the aforementioned shielding box. When the aforementioned shielding box is in use, the heat-conducting frame 40 can conduct heat generated during operation of the first board 20 to the outside of the box body 10 via the cover 30, thereby preventing heat from accumulating within the box body 10 and affecting the normal operation of the board. A display screen with the aforementioned shielding box also has the aforementioned advantages. The frame can support the display screen body and the shielding box.
[0047] like Figures 1 to 4As shown, another embodiment of a display screen includes a frame, a display screen body mounted on the frame, and a shielding box mounted within the frame. The shielding box is the aforementioned shielding box, mounted within the frame. The display screen also includes a second board mounted within the frame, electrically connected to the display screen body. The second board includes a second control chip, which abuts against a third heat conducting plate 111. When the aforementioned shielding box is in use, the heat conducting frame 40 conducts heat generated by the first board 20 during operation to the exterior of the box body 10 via the cover 30, preventing heat from accumulating within the box body 10 and affecting the normal operation of the board. A display screen equipped with the aforementioned shielding box also has the aforementioned advantages. The frame supports the display screen body and the shielding box. Heat from the shielding box can be conducted to the frame, which can then be transferred through the frame to the air, exchanging heat with the air through convection. The frame supports the display screen body and the shielding box. The third heat conducting plate 111 conducts heat generated by the second control chip during operation, preventing heat from accumulating and affecting the normal operation of the second control chip.
[0048] It should be noted that the second control chip is thermally coordinated with the first sub-heat conducting plate. The second board is the control card for the display screen body. The second board also includes a sixth control chip, which is spaced apart from the second control chip and thermally coordinated with the second sub-heat conducting plate. The first control chip 21, the second control chip, the third control chip, the fourth control chip, the fifth control chip, and the sixth control chip are all FPGA chips. A first thermal pad is provided between the second control chip and the first sub-heat conducting plate, and a second thermal pad is provided between the sixth control chip and the second sub-heat conducting plate. The distance between the first sub-heat conducting plate and the second control chip is between 0 and 2 mm, specifically, it can be 0 mm, 0.5 mm, 1.5 mm, or 2 mm. In this embodiment, the distance between the first sub-heat conducting plate and the second control chip is 1 mm. The distance between the second sub-heat conducting plate and the sixth control chip is between 0 and 2 mm, specifically, it can be 0 mm, 0.5 mm, 1.5 mm, or 2 mm. In this embodiment, the distance between the second sub-heat conducting plate and the sixth control chip is 1 mm.
[0049] In the description of the present invention, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.
[0050] For ease of description, spatially relative terms such as "above," "on the upper surface of," "on top of," etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is inverted, a device described as "above" or "on top of" other devices or structures would then be positioned as "below" or "below" the other devices or structures. Thus, the exemplary term "above" can include both the orientations of "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used herein should be interpreted accordingly.
[0051] In addition, it should be noted that the use of words such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above words have no special meaning and therefore cannot be understood as limiting the scope of protection of this utility model.
[0052] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.
Claims
1. A shielding box, characterized in that: include: Box body (10); A first board (20) is arranged in the box body (10); A cover (30) is provided on the top of the box body (10); A heat-conducting frame (40), wherein the heat-conducting frame (40) is arranged in the box body (10), a first side of the heat-conducting frame (40) is heat-conductingly matched with the first board (20), and a second side of the heat-conducting frame (40) is abutted against the cover body (30).
2. The shielding box according to claim 1, wherein: The first board (20) includes a first control chip (21), the heat-conducting frame (40) includes a first connecting plate (41) and a first heat-conducting plate (42) arranged on the first connecting plate (41), the first connecting plate (41) is connected to the cover (30), and the first heat-conducting plate (42) is thermally coordinated with the first control chip (21).
3. The shielding box according to claim 2, characterized in that: The heat-conducting frame (40) further comprises a heat-conducting pad, the top of which is in abutment with the first heat-conducting plate (42), and the bottom of which is in abutment with the first control chip (21).
4. The shielding box according to claim 2, characterized in that: The heat conducting frame (40) further includes a second heat conducting plate (43), the first connecting plate (41) is connected between the first heat conducting plate (42) and the second heat conducting plate (43), and the second heat conducting plate (43) is arranged on the cover (30).
5. The shielding box according to any one of claims 1 to 4, characterized in that: The box body (10) includes a base plate (11) and a surrounding plate (12) arranged above the base plate (11); an installation space (13) is formed between the base plate (11) and the surrounding plate (12); the first board (20) is arranged in the installation space (13); the cover body (30) is arranged above the surrounding plate (12); the heat conduction frame (40) is located in the installation space (13); at least part of the structure of the base plate (11) protrudes from the surrounding plate (12) and forms a third heat conduction plate (111).
6. The shielding box according to claim 5, characterized in that: The box body (10) is made of metal, and the shielding box further comprises a mounting plate (50). The first board (20) is arranged on the mounting plate (50), and a first preset interval is provided between the side wall of the first board (20) and the enclosure (12), and a second preset interval is provided between the first board (20) and the mounting plate (50).
7. The shielding box according to claim 6, characterized in that: The shielding box also includes a support member (60), a first end of the support member (60) is connected to the first board (20), the mounting plate (50) is connected to the middle of the support member (60), and the second end of the support member (60) is located between the mounting plate (50) and the bottom of the mounting space (13).
8. The shielding box according to claim 5, characterized in that: The thickness of the enclosure plate (12) is greater than or equal to 1 mm and less than or equal to 3 mm.
9. A display screen comprising a frame, a display screen body arranged on the frame, and a shielding box arranged in the frame, characterized in that: The shielding box is the shielding box according to any one of claims 1 to 8.
10. A display screen comprising a frame, a display screen body arranged on the frame, and a shielding box arranged in the frame, characterized in that: The shielding box is the shielding box according to claim 5, and the shielding box is arranged in the frame. The display screen also includes a second board card arranged in the frame, the second board card is electrically connected to the display screen body, and the second board card includes a second control chip, and the second control chip is in abutment with the third heat conduction plate (111).