Display module packaging structure and display device

Abstract

The utility model discloses a display module packaging structure and a display device. The packaging structure comprises an array substrate; a display module; the wiring layer is electrically connected with the display module; the wiring layer comprises at least one wiring sparse area and at least one wiring dense area, and the spacing distance between adjacent signal lines in the wiring sparse area is greater than the spacing distance between adjacent signal lines in the wiring dense area; the at least one heat absorption wire is arranged in the wiring sparse area of the wiring layer and is insulated from the signal wire; the packaging layer is located on the side, away from the array substrate, of the wiring layer and covers the wiring layer; and the light-transmitting cover plate is located at one side, far away from the wiring layer, of the packaging layer. According to the utility model, the overall strength of the display module packaging structure is improved, and the yield is improved.

Description

Technical Field

[0001] The utility model relates to the field of display technology, and in particular to a display module packaging structure and a display device. Background Art

[0002] The wiring of the display module substrate is complex, especially the terminal area of ​​the display module. The terminal area of ​​the display module brings together various signal lines. Signal lines with different wiring densities have different effects on the sintering effect of the glass glue, which will cause the overall strength of the display module to deteriorate. Utility Model Content

[0003] The utility model provides a display module packaging structure and a display device, so as to improve the overall strength of the display module packaging structure and increase the yield rate.

[0004] According to one aspect of the present invention, a display module packaging structure is provided, the display module packaging structure comprising:

[0005] an array substrate;

[0006] A display module is located on one side of the array substrate;

[0007] A wiring layer is provided on one side of the array substrate and on one side of the display module and is electrically connected to the display module; the wiring layer includes a plurality of signal lines; the wiring layer includes at least one sparse wiring area and at least one dense wiring area, and the spacing between adjacent signal lines in the sparse wiring area is greater than the spacing between adjacent signal lines in the dense wiring area;

[0008] At least one heat-absorbing trace, which is arranged in a sparsely-wired area of ​​the wiring layer and is insulated from the signal line;

[0009] an encapsulation layer, the encapsulation layer being located on a side of the wiring layer away from the array substrate and covering the wiring layer;

[0010] The light-transmitting cover plate is located on a side of the packaging layer away from the wiring layer.

[0011] Furthermore, in the sparsely wired area, n heat-absorbing traces of a first width are arranged between two adjacent signal lines; or, in the sparsely wired area, m heat-absorbing traces of a second width are arranged between two adjacent signal lines; or, in the sparsely wired area, both heat-absorbing traces of a first width and heat-absorbing traces of a second width are arranged between two adjacent signal lines; n is less than m, and the values ​​of n and m include integers greater than or equal to 1.

[0012] Furthermore, the value of n is 1 and the value of m is 2.

[0013] Furthermore, in the sparsely wired area, the orthographic projection area of ​​the heat absorbing wires and the signal wires on the array substrate is a first orthographic projection area;

[0014] In the wiring-intensive area, the orthographic projection area of ​​the signal line on the array substrate is the second orthographic projection area;

[0015] The first orthographic projection area and the second orthographic projection area are equal.

[0016] Furthermore, the width of the heat-absorbing trace is equal to the width of the signal trace;

[0017] In the sparsely wired area, a first spacing between a heat absorbing trace and a signal trace is equal to a second spacing between two adjacent heat absorbing traces.

[0018] Furthermore, the first spacing is equal to a third spacing between two adjacent signal lines in the densely wired area.

[0019] Furthermore, a plurality of heat absorbing traces are arranged between adjacent signal traces in the sparsely wired area, and the spacing between two adjacent heat absorbing traces is equal.

[0020] Furthermore, the light-transmitting cover plate includes a transparent cover plate.

[0021] Furthermore, the heat absorbing trace is a metal heat absorbing trace.

[0022] According to another aspect of the present invention, a display device is provided, which includes the display module packaging structure described in any of the above embodiments.

[0023] Compared with the prior art in which the packaging layer is directly sintered, the display module packaging structure designed in the embodiment of the utility model is that the heat-absorbing routing is arranged in the sparse wiring area of ​​the wiring layer, which increases the coverage area of ​​the routing in the sparse wiring area, thereby increasing the heat absorption effect in the sparse wiring area, making the melting effect of the packaging layer in the dense wiring area and the melting effect of the packaging layer in the sparse wiring area tend to be the same, thereby improving the overall strength of the display module packaging structure and improving the yield.

[0024] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1This is a schematic diagram of a display module provided according to the prior art;

[0027] Figure 2 yes Figure 1 A magnified view of the center pin press-fit area;

[0028] Figure 3 This is a structural diagram of a display module packaging structure provided according to an embodiment of the present utility model;

[0029] Figure 4 This is a partially enlarged schematic diagram of a wiring layer provided according to an embodiment of the present utility model;

[0030] Figure 5 It is a partial enlarged schematic diagram of another wiring layer provided according to an embodiment of the present utility model;

[0031] Figure 6 This is a partially enlarged schematic diagram of another wiring layer provided according to an embodiment of the present utility model;

[0032] Figure 7 It is a partially enlarged schematic diagram of another wiring layer provided according to an embodiment of the present utility model. DETAILED DESCRIPTION

[0033] In order to help those skilled in the art better understand the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0034] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0035] Figure 1 This is a schematic diagram of a display module provided according to the prior art. Figure 2 yes Figure 1 Enlarged view of the pin press-fit area, see Figure 1 and Figure 2 , Figure 2 yes Figure 1 An enlarged cross-sectional view of the Out Lead Bonding (OLB) area 100 shows that in the prior art, the packaging structure of a display module includes an array substrate, a display module, a wiring layer, a packaging layer, and a translucent cover. The wiring layer includes at least one sparsely wired area 31 and at least one densely wired area 32. The spacing distance between adjacent signal lines 311 in the sparsely wired area 31 is greater than the spacing distance between adjacent signal lines 311 in the densely wired area 32. During the melting process of the packaging layer, the melting width of the packaging layer in the densely wired area 32 is greater than the melting width of the packaging layer in the sparsely wired area 31, thereby resulting in poor overall strength of the display module packaging structure.

[0036] In order to solve the above technical problems, the present invention provides a display module packaging structure. Figure 3 1 is a schematic structural diagram of a display module packaging structure provided according to an embodiment of the present utility model. Figure 4 This is a partial enlarged schematic diagram of a wiring layer provided according to an embodiment of the present utility model, referring to Figure 3-Figure 4 , the display module packaging structure includes:

[0037] array substrate 1;

[0038] Display module 2, which is located on one side of the array substrate 1;

[0039] The wiring layer 3 is disposed on one side of the array substrate 1 and on one side of the display module 2 and is electrically connected to the display module 2. The wiring layer 3 includes a plurality of signal lines 311. The wiring layer 3 includes at least one sparsely wired area 31 and at least one densely wired area 32. The spacing between adjacent signal lines 311 in the sparsely wired area 31 is greater than the spacing between adjacent signal lines 311 in the densely wired area 32.

[0040] At least one heat absorbing trace 312 , the heat absorbing trace 312 being arranged in the sparsely wired area 31 of the wiring layer 3 and being insulated from the signal trace 311 ;

[0041] The packaging layer 4 is located on a side of the wiring layer 3 away from the array substrate 1 and covers the wiring layer 3;

[0042] The light-transmitting cover plate 5 is located on a side of the packaging layer 4 away from the wiring layer.

[0043] Among them, at least one can be understood as one or more. For example, the wiring layer 3 includes one or more sparsely wired areas 31 and one or more densely wired areas 32 , and the display module packaging structure includes one or more heat absorption traces 312 .

[0044] Specifically, during the packaging of the display module packaging structure, a laser probe is required to irradiate the packaging layer 4 with a laser of a preset wavelength through the transparent cover plate 5 to melt the packaging layer 4, wherein the packaging layer 4 may be glass glue so that the packaging layer 4 is bonded to the array substrate 1. During the melting process of the packaging layer 4, the signal lines 311 in the wiring layer 3 can reflect the laser of the preset wavelength irradiated by the laser probe to the transparent cover plate 5, and then reflect the laser of the preset wavelength to the packaging layer 4 again through the transparent cover plate 5, thereby increasing the utilization rate of the laser and thus improving the melting effect of the packaging layer 4; at the same time, the signal lines 311 in the wiring layer 3 can absorb a portion of the heat of the laser, thereby effectively improving the melting effect of the packaging layer 4. However, since the wiring layer 31 includes at least one sparse wiring area 31 and at least one dense wiring area 32, the spacing distance between adjacent signal lines 311 in the sparse wiring area 31 is greater than the spacing distance between adjacent signal lines 311 in the dense wiring area 32, thereby making the heat absorption effect of the multiple signal lines 311 in the sparse wiring area 31 weaker than the heat absorption effect of the multiple signal lines 311 in the dense wiring area 32. Thermal effect, and thus the melting effect of the packaging layer 4 in the wiring dense area 32 is better than the melting effect of the packaging layer 4 in the wiring sparse area 31. For example, in the prior art, the technical solution of not setting the heat-absorbing trace 312 in the wiring sparse area 31 makes the melting width of the packaging layer 4 in the wiring dense area 32 400μm, and the melting width of the packaging layer 4 in the wiring sparse area 31 is 300μm. The technical solution provided by the embodiment of the utility model sets the heat-absorbing trace 312 in the wiring sparse area 31 of the wiring layer 3, so that the heat-absorbing trace 312 can be a metal heat-absorbing trace, which can increase the coverage area of ​​the trace in the wiring sparse area 31, thereby increasing the heat absorption effect in the wiring sparse area 31, and making the melting effect of the packaging layer 4 in the wiring dense area 32 and the melting effect of the packaging layer 4 in the wiring sparse area 31 tend to be the same.

[0045] Compared with the prior art in which the packaging layer 4 is directly sintered, the display module packaging structure designed in the embodiment of the present invention has a heat-absorbing trace 312 arranged in the sparse wiring area 31 of the wiring layer 3, which increases the coverage area of ​​the trace in the sparse wiring area 31, thereby increasing the heat absorption effect in the sparse wiring area 31, making the melting effect of the packaging layer 4 in the dense wiring area 32 and the melting effect of the packaging layer 4 in the sparse wiring area 31 tend to be the same, thereby improving the overall strength of the display module packaging structure and improving the yield.

[0046] Further, such as Figure 4As shown, in the sparsely wired area 31, n heat-absorbing wires 312 of the first width are arranged between two adjacent signal wires 311; or, Figure 5 This is a partial enlarged schematic diagram of another wiring layer provided according to an embodiment of the present utility model, referring to Figure 5 In the sparsely wired area 31 , m heat-absorbing traces 312 of the second width are provided between two adjacent signal lines 311 ; or Figure 6 This is a partial enlarged schematic diagram of another wiring layer provided according to an embodiment of the present utility model, referring to Figure 6 In the sparsely wired area 31 , a heat absorbing trace 312 of a first width and a heat absorbing trace 312 of a second width are simultaneously set between two adjacent signal lines 311 ; n is less than m, and the values ​​of n and m include integers greater than or equal to 1.

[0047] Specifically, this embodiment designs three different solutions for arranging the heat-absorbing traces 312 in the sparsely wired area 31 .

[0048] Further, such as Figure 4 As shown, the value of n is 1, such as Figure 5 As shown, the value of m is 2.

[0049] Specifically, in the wiring sparse area 31, a heat absorption trace 312 of a first width is arranged between two adjacent signal lines 311; or in the wiring sparse area 31, two heat absorption traces 312 of a second width are arranged between two adjacent signal lines 311. The first width is greater than the second width, which can reduce the number of heat absorption traces 312, thereby making the manufacturing process of the wiring layer 3 simpler and improving the production efficiency of the display module packaging structure.

[0050] Further, such as Figure 4 As shown, in the sparsely wired area 31 , the orthographic projection area of ​​the heat absorbing wire 312 and the signal wire 311 on the array substrate is a first orthographic projection area;

[0051] In the wiring dense area 32, the orthographic projection area of ​​the signal line 311 on the array substrate is a second orthographic projection area;

[0052] The first orthographic projection area and the second orthographic projection area are equal.

[0053] Specifically, the orthographic projection area of ​​the heat-absorbing routing 312 and the signal line 311 in the sparse wiring area 31 is equal to the orthographic projection area of ​​the signal line 311 on the array substrate in the dense wiring area 32. While increasing the coverage area of ​​the routing in the sparse wiring area 31 and the heat absorption effect of the routing in the sparse wiring area 31, the melting effect of the packaging layer in the dense wiring area 32 can be made the same as the melting effect of the packaging layer in the sparse wiring area 31, that is, the melting width of the packaging layer in the dense wiring area 32 is equal to the melting width of the packaging layer in the sparse wiring area 31, thereby further improving the overall strength of the display module packaging structure and improving the yield.

[0054] Further, Figure 7 This is a partial enlarged schematic diagram of another wiring layer provided according to an embodiment of the present utility model, referring to Figure 7 , the width of the heat absorption trace 312 is equal to the width of the signal trace 311;

[0055] In the sparsely wired area 31 , a first distance between the heat absorbing trace 312 and the signal trace 311 is equal to a second distance between two adjacent heat absorbing traces 312 .

[0056] Specifically, the width of the heat-absorbing trace 312 is set to be equal to the width of the signal line 311, and in the wiring sparse area 31, the first spacing between the heat-absorbing trace 312 and the signal line 311 is set to be equal to the second spacing between two adjacent heat-absorbing traces 312. This can make the coverage of the heat-absorbing trace 312 in the wiring sparse area 31 more uniform, and thus make the heat absorption of the heat-absorbing trace 312 in the wiring sparse area 31 more uniform, thereby improving the melting effect of the packaging layer in the wiring sparse area 31.

[0057] For further reference, Figure 7 The first spacing is equal to the third spacing between two adjacent signal lines 311 in the wiring dense area 32 .

[0058] Specifically, the first spacing is set to be equal to the third spacing between two adjacent signal lines 311 in the wiring dense area 32, that is, the first spacing, the second spacing and the third spacing are exactly the same, thereby ensuring that the intervals between each routing in the wiring layer are equal, that is, the coverage of the routing in the wiring layer is more uniform, and the heat absorption of the routing in the wiring layer is more uniform, so that the melting effect of the packaging layer in the wiring dense area 32 is the same as the melting effect of the packaging layer in the wiring sparse area 31, that is, the melting width of the packaging layer in the wiring dense area 32 is equal to the melting width of the packaging layer in the wiring sparse area 31, further improving the overall strength of the display module packaging structure and improving the yield.

[0059] For further reference, Figure 5A plurality of heat absorbing traces 312 are arranged between adjacent signal traces 311 in the sparsely wired area 31 , and the spacing between two adjacent heat absorbing traces 312 is equal.

[0060] Specifically, between adjacent signal lines 311 in the sparsely wired area 31 , equal distances are set between two adjacent heat absorbing traces 312 , which can increase the heat absorption uniformity of the heat absorbing traces 312 and thereby improve the uniformity of sintering of the packaging layer glue.

[0061] For further reference, Figure 3 The transparent cover plate 5 includes a transparent cover plate. The transparent cover plate 5 is used to transmit the laser, so that the laser probe irradiates the encapsulation layer 4 with a laser of a preset wavelength through the transparent cover plate 5 to melt the encapsulation layer 4. Exemplarily, the transparent cover plate 5 can be a glass cover plate.

[0062] For further reference, Figure 4 The heat absorbing trace 312 is a metal heat absorbing trace. The metal heat absorbing trace can be made on the same layer as the signal trace 311. When the signal trace 311 is completed, the heat absorbing trace 312 is also completed, which simplifies the preparation process and reduces the preparation cost.

[0063] The present invention provides a display device comprising the display module packaging structure described in any of the above embodiments. The display device provided by the present invention comprises the display module packaging structure described in any of the above technical solutions, and thus has the beneficial effects of the above display module packaging structure, which will not be described in detail here.

[0064] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in this utility model can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of this utility model can be achieved. This is not limited herein.

[0065] The above specific embodiments do not limit the scope of protection of this utility model. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model shall be included within the scope of protection of this utility model.

Claims

1. A display module packaging structure, characterized in that: include: array substrate; a display module, the display module being located on one side of the array substrate; a wiring layer, the wiring layer being disposed on one side of the array substrate and located on one side of the display module and being electrically connected to the display module; the wiring layer comprising a plurality of signal lines; the wiring layer comprising at least one sparse wiring area and at least one dense wiring area, wherein the spacing between adjacent signal lines in the sparse wiring area is greater than the spacing between adjacent signal lines in the dense wiring area; at least one heat-absorbing trace, the heat-absorbing trace being arranged in a sparsely-spaced area of ​​the wiring layer and being insulated from the signal line; an encapsulation layer, the encapsulation layer being located on a side of the wiring layer away from the array substrate and covering the wiring layer; A light-transmitting cover plate is located on a side of the packaging layer away from the wiring layer.

2. The display module packaging structure according to claim 1, wherein: In the sparsely wired area, n heat-absorbing traces of the first width are arranged between two adjacent signal lines; or, in the sparsely wired area, m heat-absorbing traces of the second width are arranged between two adjacent signal lines; or, in the sparsely wired area, both heat-absorbing traces of the first width and heat-absorbing traces of the second width are arranged between two adjacent signal lines; n is less than m, and the values ​​of n and m include integers greater than or equal to 1.

3. The display module packaging structure according to claim 2, wherein: The value of n is 1, and the value of m is 2.

4. The display module packaging structure according to claim 1, wherein: In the sparsely wired area, the orthographic projection area of ​​the heat absorbing trace and the signal line on the array substrate is a first orthographic projection area; In the wiring-intensive area, the orthographic projection area of ​​the signal line on the array substrate is a second orthographic projection area; The first orthographic projection area and the second orthographic projection area are equal.

5. The display module packaging structure according to claim 4, wherein: The width of the heat absorption trace is equal to the width of the signal trace; In the sparsely wired area, a first spacing between the heat absorbing trace and the signal trace is equal to a second spacing between two adjacent heat absorbing traces.

6. The display module packaging structure according to claim 5, wherein: The first spacing is equal to a third spacing between two adjacent signal lines in the densely wired area.

7. The display module packaging structure according to claim 1, wherein: A plurality of heat absorbing traces are arranged between adjacent signal traces in the sparsely wired area, and the spacing between two adjacent heat absorbing traces is equal.

8. The display module packaging structure according to claim 1, wherein: The light-transmitting cover plate includes a transparent cover plate.

9. The display module packaging structure according to claim 1, wherein: The heat absorbing wiring is a metal heat absorbing wiring.

10. A display device, characterized in that: The display module packaging structure comprises any one of claims 1-9.

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