Dedusting device for semiconductor wafer processing

Abstract

The utility model relates to a dust removal device for semiconductor wafer processing, which comprises a device body, the device body comprises a dust removal pipeline, the top opening of the dust removal pipeline is an air outlet, the lower half part of one side of the dust removal pipeline is provided with an air inlet pipe, and the dust removal pipeline comprises a bottom pipe and a top pipe. A plurality of mounting pipes are arranged between the bottom pipe and the top pipe, and a filter screen is mounted at an inner hole of each mounting pipe; the bottom pipe is detachably connected with the adjacent mounting pipe, the two adjacent mounting pipes are detachably connected, and the top pipe is detachably connected with the adjacent mounting pipe; the top pipe and the bottom pipe are jointly provided with a lifting assembly, and the lifting assembly changes the distance between the top pipe and the bottom pipe. The utility model relates to the technical field of dust removal devices. The wafer polishing device has the effects of simplifying the step of replacing the filter screen and improving the wafer polishing operation efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of dust removal devices, in particular to a dust removal device for semiconductor wafer processing. Background Art

[0002] At present, sandblasting is an indispensable process in the production of diode semiconductor rectifier chips. It uses high-pressure air to drive corundum to treat the surface of the chip. The hardness of corundum is higher than that of silicon glass on the chip surface. The corundum dust is formed into a dust fluid through high-pressure air, and is sprayed through special pipes and nozzles to act on the surface of the chip. The phosphorus silicon glass and borosilicate glass on the surface of the chip are removed by surface grinding.

[0003] Existing dust removal pipes are equipped with multiple layers of filters. When operators need to replace filters, especially those in the middle layer, they must remove the filter, install the new filter, and then install the remaining filters. This method of replacing filters is cumbersome and time-consuming, reducing the efficiency of wafer polishing operations. Utility Model Content

[0004] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a dust removal device for semiconductor wafer processing, which simplifies the steps of replacing the filter and improves the efficiency of the wafer polishing operation.

[0005] The above technical objectives of the present invention are achieved through the following technical solutions:

[0006] A dust removal device for semiconductor wafer processing includes a device body, the device body including a dust removal pipeline, the top opening of the dust removal pipeline is an air outlet, the lower half of one side of the dust removal pipeline is provided with an air inlet pipe, the dust removal pipeline includes a bottom pipe and a top pipe, a plurality of mounting pipes are provided between the bottom pipe and the top pipe, and a filter is installed at the inner hole of each mounting pipe;

[0007] The bottom pipe and the adjacent mounting pipe, the two adjacent mounting pipes, and the top pipe and the adjacent mounting pipe are all detachably connected;

[0008] The top pipe and the bottom pipe are both provided with a lifting assembly, and the lifting assembly changes the distance between the top pipe and the bottom pipe.

[0009] In a preferred embodiment, the present invention can be further configured as follows: four arc-shaped grooves are evenly formed on the top of each of the mounting tubes and the top of the bottom tube;

[0010] Four arc-shaped plates are evenly arranged on the bottom of each mounting tube and the bottom of the top tube;

[0011] The jacking pipe is connected to the adjacent mounting pipe by a plurality of bolts;

[0012] Two adjacent mounting pipes are connected by a plurality of bolts;

[0013] The bottom pipe is connected to the adjacent mounting pipe via a plurality of bolts.

[0014] In a preferred example, the present invention can be further configured as follows: the lifting assembly includes a bottom plate and a top plate;

[0015] The bottom plate is arranged on the lower half of the outer circumference of the bottom tube;

[0016] The top plate is arranged on the upper half of the outer circumference of the top tube;

[0017] Two telescoping devices are symmetrically arranged on the top of the bottom plate, and one end of the telescopic rods in the two telescoping devices is fixed to the bottom of the top plate.

[0018] In a preferred example, the present invention may be further configured as follows: a guide portion is provided between the top plate and the bottom plate;

[0019] The guide part comprises a guide tube, one end of which is fixed on the top of the bottom plate, a guide rod is slidably passed through the guide tube, and the other end of the guide rod is fixed to the bottom of the top plate.

[0020] In a preferred example, the present invention can be further configured as follows: a spray assembly is provided on the top of the top pipe;

[0021] The spray assembly includes a water pipe, which is arranged on the top of the top pipe through a mounting frame. A spray head is provided at one end of the water pipe, and the spray head is located in the top pipe and directly above the filter screen.

[0022] In summary, the present invention has at least one of the following beneficial technical effects:

[0023] 1. By dividing the dust removal pipeline into a bottom pipe, a top pipe and several installation pipes, each installation pipe is installed with a filter, and a lifting assembly is set on the device body. When one of the filters needs to be replaced, only the corresponding installation pipe needs to be taken, which simplifies the filter replacement steps and improves the efficiency of wafer polishing operations.

[0024] 2. By providing a guide portion between the top plate and the bottom plate, the movement direction of the jacking pipe is further restricted to prevent the jacking pipe from rotating during the movement. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the overall half-section structure of this embodiment;

[0026] Figure 2yes Figure 1 A schematic diagram of the structure of the middle mounting tube when viewed from above;

[0027] Figure 3 yes Figure 1 A schematic diagram of the top view of the midsole tube;

[0028] Figure 4 yes Figure 1 Enlarged structural diagram at point A in the middle.

[0029] In the figure, 1. device body; 11. dust removal pipeline; 12. air inlet pipe; 111. bottom pipe; 112. top pipe; 113. mounting pipe; 13. filter; 2. lifting assembly; 3. arc groove; 31. arc plate; 21. bottom plate; 22. top plate; 23. telescopic device; 4. conduit; 41. guide rod; 5. spray assembly; 51. water pipe; 52. spray head. DETAILED DESCRIPTION

[0030] The present invention will be described in further detail below with reference to the accompanying drawings.

[0031] Example:

[0032] Reference Figure 1-Figure 4 As shown, the dust removal device for semiconductor wafer processing disclosed in the present invention includes a device body 1. The device body 1 includes a dust removal pipeline 11. The dust removal pipeline 11 includes a bottom pipe 111 and a top pipe 112.

[0033] The top opening of the top pipe 112 is an air outlet. An air inlet pipe 12 is provided at the lower half of one side of the bottom pipe 111 .

[0034] A spray assembly 5 is installed at the top of the top pipe 112. The spray assembly 5 includes a water pipe 51. The water pipe 51 is mounted on the top of the top pipe 112 via a mounting bracket. A spray head 52 is installed at one end of the water pipe 51, and the spray head 52 is located inside the top pipe 112. The other end of the water pipe 51 is connected to the water supply system.

[0035] A plurality of mounting tubes 113 are provided between the bottom tube 111 and the top tube 112. A filter screen 13 is installed at the inner hole of each mounting tube 113. The spray head 52 is located directly above the filter screen 13. In this embodiment, there are four mounting tubes 113.

[0036] As the dust removal pipeline 11 goes from bottom to top, the apertures of the filter screen 13 become larger and larger.

[0037] The bottom pipe 111 and the adjacent mounting pipe 113 , the two adjacent mounting pipes 113 , and the top pipe 112 and the adjacent mounting pipe 113 are all detachably connected.

[0038] Four arc-shaped grooves 3 are evenly formed on the top of each mounting tube 113 and the top of the bottom tube 111 .

[0039] Four arc-shaped plates 31 are evenly disposed on the bottom of each mounting tube 113 and the bottom of the top tube 112 .

[0040] The shape of the arc plate 31 matches the shape of the arc groove 3. The top pipe 112 is connected to the adjacent mounting pipe 113 by a plurality of bolts.

[0041] Two adjacent mounting tubes 113 are connected by a plurality of bolts. The bottom tube 111 is connected to the adjacent mounting tubes 113 by a plurality of bolts.

[0042] A lifting assembly 2 is mounted on both the top tube 112 and the bottom tube 111. This assembly adjusts the distance between the top tube 112 and the bottom tube 111. The lifting assembly 2 comprises a bottom plate 21 and a top plate 22. The bottom plate 21 is positioned on the lower half of the outer circumference of the bottom tube 111. The top plate 22 is positioned on the upper half of the outer circumference of the top tube 112. Two telescoping devices 23 are symmetrically mounted on the top of the bottom plate 21. One end of the telescoping rods in each telescoping device 23 is fixed to the bottom of the top plate 22.

[0043] A guide portion is provided between the top plate 22 and the bottom plate 21. The guide portion includes a guide tube 4, one end of which is fixed to the top of the bottom plate 21, and a guide rod 41 is slidably provided on the guide tube 4, and the other end of the guide rod 41 is fixed to the bottom of the top plate 22.

[0044] The implementation principle of the above embodiment is:

[0045] When the operator needs to replace one of the filter screen 13, the operator first takes out the bolts of the mounting pipe 113 on which this filter screen 13 is installed.

[0046] The operator then connects the power supply and activates the two retractors 23. The program controls the simultaneous activation of the two retractors 23, thereby driving the jacking pipe 112 to move upward. The jacking pipe 112 moves upward along with the mounting pipe 113, which has not been bolted.

[0047] When the top pipe 112 moves upward to a certain distance, the two retractors 23 stop working. The filter screen 13 that the operator needs to replace is connected to the corresponding installation pipe 113 and taken out together.

[0048] Next, the old filter screen 13 in the installation tube 113 is taken out and a new filter screen 13 is installed.

[0049] After the filter screen 13 is installed, the installation pipe 113 is re-placed to the installation position, and the installation pipe 113 and the adjacent installation pipe 113 are first locked with bolts.

[0050] Then connect the power supply and start the two retractors 23, which drive the top pipe 112 to move downward, so that the newly installed mounting pipe 113 contacts the adjacent mounting pipe 113 or the top pipe 112. The two retractors 23 stop working.

[0051] Finally, the operator fixes the mounting pipe 113 with bolts.

[0052] The embodiments of this specific implementation method are all preferred embodiments of the present utility model, and are not intended to limit the scope of protection of the present utility model. Therefore, any equivalent changes made based on the structure, shape, and principle of the present utility model should be included in the scope of protection of the present utility model.

Claims

1. A dust removal device for semiconductor wafer processing, comprising a device body (1), the device body (1) comprising a dust removal pipeline (11), the top opening of the dust removal pipeline (11) being an air outlet, and an air inlet pipe (12) being provided on the lower half of one side of the dust removal pipeline (11), characterized in that: The dust removal pipeline (11) comprises a bottom pipe (111) and a top pipe (112), a plurality of mounting pipes (113) are provided between the bottom pipe (111) and the top pipe (112), and a filter screen (13) is installed at the inner hole of each mounting pipe (113); The bottom tube (111) and the adjacent mounting tube (113), two adjacent mounting tubes (113), and the top tube (112) and the adjacent mounting tube (113) are all detachably connected; A lifting assembly (2) is provided on both the top pipe (112) and the bottom pipe (111), and the lifting assembly (2) changes the distance between the top pipe (112) and the bottom pipe (111).

2. A dust removal device for semiconductor wafer processing according to claim 1, characterized in that: Four arc-shaped grooves (3) are evenly formed on the top of each mounting tube (113) and the top of the bottom tube (111); Four arc-shaped plates (31) are evenly arranged on the bottom of each mounting tube (113) and the bottom of the top tube (112); The top pipe (112) is connected to the adjacent mounting pipe (113) via a plurality of bolts; Two adjacent mounting pipes (113) are connected by a plurality of bolts; The bottom tube (111) is connected to the adjacent mounting tube (113) via a plurality of bolts.

3. A dust removal device for semiconductor wafer processing according to claim 2, characterized in that: The lifting assembly (2) comprises a bottom plate (21) and a top plate (22); The bottom plate (21) is arranged on the lower half of the outer circumference of the bottom tube (111); The top plate (22) is arranged on the upper half of the outer circumference of the top tube (112); Two telescoping devices (23) are symmetrically arranged on the top of the bottom plate (21), and one end of the telescopic rods in the two telescoping devices (23) is fixed to the bottom of the top plate (22).

4. A dust removal device for semiconductor wafer processing according to claim 3, characterized in that: A guide portion is provided between the top plate (22) and the bottom plate (21); The guide portion comprises a guide tube (4), one end of which is fixed to the top of the bottom plate (21), a guide rod (41) is slidably provided on the guide tube (4), and the other end of the guide rod (41) is fixed to the bottom of the top plate (22).

5. A dust removal device for semiconductor wafer processing according to claim 4, characterized in that: A spray assembly (5) is provided on the top of the top pipe (112); The spray assembly (5) comprises a water pipe (51), the water pipe (51) being arranged on the top of the top pipe (112) via a mounting frame, a spray head (52) being arranged at one end of the water pipe (51), the spray head (52) being located inside the top pipe (112), and the spray head (52) being located directly above the filter screen (13).

Images