Automatic liquid adding device for electroplating tank

Abstract

The utility model discloses an automatic liquid adding device for an electroplating bath, and relates to the field of electroplating equipment. The automatic liquid adding device of the electroplating pool comprises an electroplating liquid circulating filtering piece and an automatic liquid adding control piece, a movable electrode is attached to a positive electrode to control an electromagnetic three-way valve to be communicated with a water return pipe, and the movable electrode is attached to a reverse electrode to control the electromagnetic three-way valve to be communicated with a water supplementing pipe. According to the automatic liquid adding device for the electroplating pool, when the liquid level of electroplating liquid is normal, the electromagnetic three-way valve keeps the water inlet pipe communicated with the water return pipe, when the liquid level descends to a certain height, the movable electrode moves downwards to make contact with the reverse electrode, the electroplating liquid is poured into the electroplating pool, the floating piece ascends, and finally the movable electrode makes contact with the positive electrode again; the electroplating liquid is accurately added according to the liquid level and the water level, meanwhile, pipelines do not need to be arranged again, the electroplating liquid circulating filtering system and the electroplating liquid circulating filtering system share the same pipeline system, and the equipment and maintenance cost is lower.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating equipment, in particular to an automatic liquid adding device for an electroplating pool. Background Art

[0002] An electroplating tank is a device used to perform surface metal coating on metal or non-metal parts. The electroplating process is completed by pouring plating liquid into the tank and immersing the workpiece in the plating liquid. The metal ions adhere to the surface of the workpiece through ionization. In actual use, as the number of electroplated workpieces increases, the plating liquid will gradually be consumed. Therefore, during operation, it is necessary to add plating liquid according to the height of the plating liquid level inside the electroplating tank.

[0003] However, in the existing technical solutions, manual timed addition is adopted, and the addition process is cumbersome and easy to forget, and the consumption of electroplating liquid per unit time is not exactly the same and there are differences. On the other hand, a liquid level sensor is used to monitor the liquid level height, and the filling is stopped and started when the liquid level is higher or lower than the threshold. The control is more precise, but it is necessary to design pipelines and control programs for the liquid addition system, and the equipment cost and maintenance cost are high. For this purpose, an automatic liquid addition device for an electroplating pool is provided to solve the above problems. Utility Model Content

[0004] In response to the deficiencies of the prior art, the utility model provides an automatic liquid adding device for an electroplating pool, which solves the problem of high equipment and maintenance costs when manual addition is not accurate enough and a liquid level sensor is used to design a liquid adding system in the existing electroplating pool liquid adding scheme.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: an automatic liquid adding device for an electroplating pool, comprising:

[0006] The electroplating liquid circulation filter comprises a circulation pump and an electromagnetic three-way valve installed at the input end of the circulation pump, the two input ends of the electromagnetic three-way valve are respectively installed with a return pipe and a water supply pipe, and the water supply pipe is installed with a filter box;

[0007] An automatic liquid-adding control component includes a floating component and a lifting rod installed on the floating component. A movable electrode is fixedly provided at the end of the lifting rod. A positive electrode is provided on the top of the movable electrode. A reverse electrode is provided on the bottom of the movable electrode. The movable electrode and the positive electrode are in contact with each other to control the electromagnetic three-way valve to be connected to the return pipe. The movable electrode and the reverse electrode are in contact with each other to control the electromagnetic three-way valve to be connected to the water supply pipe.

[0008] Preferably, a water inlet pipe is fixedly provided at the output end of the circulation pump, and the other end of the water inlet pipe is far away from the return pipe.

[0009] Preferably, connecting wires are installed between the electromagnetic three-way valve and the positive electrode, the movable electrode and the reversal electrode.

[0010] Preferably, positioning shafts are movably inserted into both ends of the floating member, and a connecting sleeve is installed between the top of the floating member and the lifting rod.

[0011] Preferably, an anti-slip block is fixedly provided at the bottom end of the lifting rod, and the anti-slip block is slidably connected in the connecting sleeve.

[0012] Preferably, a retaining ring is fixedly provided on the outer surface of the upper end of the lifting rod, and the retaining ring is directly opposite to the top end of the connecting sleeve.

[0013] Preferably, the automatic liquid adding control component further includes an electric control compartment, the positive electrode and the reverse electrode are fixedly arranged at the upper and lower ends inside the electric control compartment respectively, and the end of the lifting rod away from the anti-slip block is movably inserted into the electric control compartment.

[0014] Preferably, the inside of the forward electrode and the reverse electrode are both wrapped with a strong magnetic block, and the strong magnetic block is fixed to the movable electrode by magnetic attraction.

[0015] The utility model discloses an automatic liquid adding device for an electroplating pool, which has the following beneficial effects: the device adds an electromagnetic three-way valve to the electroplating liquid circulation filter of the electroplating pool, and at the same time installs an automatic liquid adding control component on the side wall of the electroplating pool. When the electroplating liquid is at a normal liquid level, the movable electrode and the positive electrode are attracted to each other. At this time, the electromagnetic three-way valve keeps the water inlet pipe and the water return pipe connected. At this time, a circulation pump is used to circulate the electroplating liquid inside the electroplating pool to filter impurities. During the consumption of the electroplating liquid, as the liquid level drops, the floating component moves downward, and under the action of gravity, the movable electrode and the positive electrode are attracted to each other. The positive electrodes are separated, and the movable electrode falls rapidly and contacts the reverse electrode. At this time, the electromagnetic three-way valve is controlled to rotate so that the water supply pipe is connected to the water inlet pipe. At this time, the plating liquid is poured into the electroplating tank, and the floating part rises, and finally the movable electrode contacts the positive electrode again. At this time, the electromagnetic three-way valve is rotated again, so that the water inlet pipe is connected to the return pipe. At this time, the liquid addition is stopped to realize the circulation of the plating liquid, so that the plating liquid can be accurately added according to the liquid level. At the same time, there is no need to rearrange the pipeline, and the same pipeline system is shared with the plating liquid circulation and filtration system, which has lower equipment and maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 This is a schematic diagram of the overall outer surface structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the overall inner structure of the utility model;

[0019] Figure 3 This is a schematic diagram of the structure of the electroplating liquid circulation filter of the utility model;

[0020] Figure 4 This is a schematic diagram of the structure of the automatic liquid adding control component of the utility model.

[0021] In the figure: 1. Plating liquid circulation filter; 11. Circulation pump; 12. Water inlet pipe; 13. Return pipe; 14. Solenoid three-way valve; 15. Connecting wire; 16. Water supply pipe; 17. Filter box; 2. Automatic liquid adding control component; 21. Power control compartment; 22. Lifting rod; 23. Connecting sleeve; 24. Floating component; 25. Positioning shaft; 26. Retaining ring; 27. Strong magnetic block; 28. Movable electrode; 29. ​​Positive electrode; 210. Reversing electrode; 211. Anti-drop block. DETAILED DESCRIPTION

[0022] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0023] The embodiment of the present application solves the problem of high equipment and maintenance costs when the liquid adding system is designed using a liquid level sensor and manual addition is not accurate enough in the existing electroplating pool liquid adding solution by providing an automatic liquid adding device for the electroplating pool.

[0024] In order to better understand the above technical solution, the above technical solution will be described in detail below with reference to the accompanying drawings and specific implementation methods.

[0025] The embodiment of the utility model discloses an automatic liquid adding device for an electroplating pool.

[0026] According to the attached Figure 1-4 As shown, including;

[0027] The electroplating liquid circulation filter 1 includes a circulation pump 11 and an electromagnetic three-way valve 14 installed at the input end of the circulation pump 11. The two input ends of the electromagnetic three-way valve 14 are respectively installed with a return pipe 13 and a water supply pipe 16. The water supply pipe 16 is installed with a filter box 17.

[0028] Automatic liquid adding control component 2, the automatic liquid adding control component 2 includes a floating component 24, and a lifting rod 22 installed on the floating component 24, a movable electrode 28 is fixedly provided at the end of the lifting rod 22, a positive electrode 29 is provided on the top of the movable electrode 28, and a reversing electrode 210 is provided on the bottom of the movable electrode 28, the movable electrode 28 and the positive electrode 29 are attached to control the electromagnetic three-way valve 14 to be connected with the return pipe 13, and the movable electrode 28 and the reversing electrode 210 are attached to control the electromagnetic three-way valve 14 to be connected with the water supply pipe 16.

[0029] An inlet pipe 12 is fixedly provided at the output end of the circulation pump 11 , and the other end of the inlet pipe 12 is away from the return pipe 13 .

[0030] By adding an electromagnetic three-way valve 14 to the plating solution circulation filter 1 of the electroplating tank and installing an automatic liquid addition control component 2 on the side wall of the electroplating tank, when the electroplating solution level is normal, the movable electrode 28 and the positive electrode 29 are attracted to each other. At this time, the electromagnetic three-way valve 14 keeps the water inlet pipe 12 and the water return pipe 13 connected. At this time, the circulation pump 11 is used to circulate the electroplating solution inside the electroplating tank to filter impurities;

[0031] During the consumption of the electroplating solution, as the liquid level drops, the floating member 24 moves downward, and under the action of gravity, the movable electrode 28 separates from the positive electrode 29. At the same time, the movable electrode 28 falls rapidly and contacts the reversal electrode 210. At this time, the electromagnetic three-way valve 14 is controlled to rotate so that the water supply pipe 16 is connected to the water inlet pipe 12. At this time, the electroplating solution is poured into the electroplating tank, and the floating member 24 rises, and finally the movable electrode 28 contacts the positive electrode 29 again. At this time, the electromagnetic three-way valve 14 rotates again, so that the water inlet pipe 12 is connected to the return pipe 13. At this time, the liquid addition is stopped to realize the circulation of the electroplating solution, thereby realizing the precise addition of electroplating solution according to the liquid level. At the same time, there is no need to rearrange the pipeline, and the same pipeline system is shared with the electroplating solution circulation and filtration system, which has lower equipment and maintenance costs.

[0032] A connecting wire 15 is installed between the electromagnetic three-way valve 14 and the positive electrode 29, the movable electrode 28 and the reversing electrode 210, which together constitute a control circuit. The electromagnetic three-way valve 14 adopts a two-in-one-out mode: when the positive electrode 29 contacts the movable electrode 28, the electromagnetic valve coil is energized, the first inlet is opened, and the second inlet is closed. At this time, the water inlet pipe 12 is connected to the return pipe 13 to circulate water inside the electroplating pool; when the reversing electrode 210 contacts the movable electrode 28, the coil is de-energized, the first inlet is closed, and the second inlet is opened. At this time, the water supply pipe 16 is connected to the water inlet pipe 12 for fluid replenishment.

[0033] The two ends of the floating member 24 are internally connected with positioning shafts 25 to ensure that the floating member 24 can move up and down accurately.

[0034] A connecting sleeve 23 is installed between the top of the floating member 24 and the lifting rod 22, and an anti-slip block 211 is fixedly provided at the bottom end of the lifting rod 22. The anti-slip block 211 is slidably connected to the connecting sleeve 23, and a retaining ring 26 is fixedly provided on the outer surface of the upper end of the lifting rod 22. The retaining ring 26 is directly opposite to the top of the connecting sleeve 23. The distance between the anti-slip block 211 and the retaining ring 26 corresponds to the height difference between the lowest threshold value of the liquid level and the highest threshold value of the liquid level. Within this height difference range, the electroplating work can operate normally without replenishing liquid; when the liquid level drops, the floating member 24 drives the connecting sleeve 23 to drop, and when the top of the connecting sleeve 23 contacts the anti-slip block 211, the lowest liquid level threshold is reached. At this time The liquid level continues to drop, and under the action of gravity, the floating member 24 will pull the lifting rod 22 downward, so that the movable electrode 28 is separated from the positive electrode 29. At this time, the movable electrode 28 and the lifting rod 22 automatically fall, so that the movable electrode 28 contacts the reversal electrode 210. At this time, the retaining ring 26 contacts the top of the connecting sleeve 23. At this time, the electromagnetic three-way valve 14 connects the water supply pipe 16 and the water inlet pipe 12, and begins to replenish the plating solution into the electroplating pool. As the liquid level of the electroplating solution rises, the buoyancy of the floating member 24 is used to lift the movable electrode 28 and the lifting rod 22 upward. When the movable electrode 28 contacts the positive electrode 29, the liquid replenishment is stopped, so that the liquid level is kept within a certain threshold.

[0035] The automatic liquid adding control component 2 also includes an electric control compartment 21 , in which the positive electrode 29 and the reverse electrode 210 are fixedly arranged at the upper and lower ends of the electric control compartment 21 , and the end of the lifting rod 22 away from the anti-slip block 211 is movably inserted into the electric control compartment 21 .

[0036] The inside of the positive electrode 29 and the reversing electrode 210 are both wrapped with a strong magnetic block 27, which is magnetically fixed to the movable electrode 28. When the positive electrode 29 and the movable electrode 28 are adsorbed, the gravity of the lifting rod 22 can be overcome, so that the lifting rod 22 can maintain contact with the positive electrode 29 during the downward movement of the connecting sleeve 23, thereby avoiding frequent starting and stopping of the electromagnetic three-way valve 14.

[0037] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements are intended to fall within the scope of the present invention. The scope of protection claimed in this invention is defined by the appended claims and their equivalents.

Claims

1. An automatic liquid adding device for an electroplating pool, characterized in that: include; An electroplating liquid circulation filter element (1) comprises a circulation pump (11) and an electromagnetic three-way valve (14) installed at the input end of the circulation pump (11), wherein two input ends of the electromagnetic three-way valve (14) are respectively installed with a return pipe (13) and a water supply pipe (16), and a filter box (17) is installed on the water supply pipe (16); An automatic liquid-adding control component (2) includes a floating component (24) and a lifting rod (22) mounted on the floating component (24); a movable electrode (28) is fixedly provided at the end of the lifting rod (22); a positive electrode (29) is provided at the top of the movable electrode (28); a reversing electrode (210) is provided at the bottom of the movable electrode (28); the movable electrode (28) and the positive electrode (29) are in contact with each other to control the electromagnetic three-way valve (14) to be connected to the return pipe (13); and the movable electrode (28) and the reversing electrode (210) are in contact with each other to control the electromagnetic three-way valve (14) to be connected to the water supply pipe (16).

2. The automatic liquid adding device for electroplating bath according to claim 1, characterized in that: A water inlet pipe (12) is fixedly provided at the output end of the circulation pump (11), and the other end of the water inlet pipe (12) is far away from the return pipe (13).

3. The automatic liquid adding device for electroplating bath according to claim 1, characterized in that: Connecting wires (15) are installed between the electromagnetic three-way valve (14) and the positive electrode (29), the movable electrode (28) and the reversal electrode (210).

4. The automatic liquid adding device for electroplating bath according to claim 1, characterized in that: Positioning shafts (25) are movably inserted into the two ends of the floating member (24), and a connecting sleeve (23) is installed between the top of the floating member (24) and the lifting rod (22).

5. The automatic liquid adding device for electroplating bath according to claim 4, characterized in that: An anti-slip block (211) is fixedly provided at the bottom end of the lifting rod (22), and the anti-slip block (211) is slidably connected in the connecting sleeve (23).

6. The automatic liquid adding device for electroplating bath according to claim 5, characterized in that: A retaining ring (26) is fixedly provided on the outer surface of the upper end of the lifting rod (22), and the retaining ring (26) is directly opposite to the top end of the connecting sleeve (23).

7. The automatic liquid adding device for electroplating bath according to claim 5, characterized in that: The automatic liquid-adding control component (2) further comprises an electric control compartment (21), wherein the positive electrode (29) and the reverse electrode (210) are fixedly arranged at the upper and lower ends of the electric control compartment (21), respectively, and the end of the lifting rod (22) away from the anti-slip block (211) is movably inserted into the electric control compartment (21).

8. The automatic liquid adding device for electroplating bath according to claim 5, characterized in that: The inside of the positive electrode (29) and the reverse electrode (210) are both wrapped with a strong magnetic block (27), and the strong magnetic block (27) is fixed to the movable electrode (28) by magnetic attraction.

Images