Rotary wafer drying machine

Abstract

The utility model is applicable to the technical field of wafer processing, and provides a rotary wafer dryer, which comprises a dryer body, a drying cavity is arranged at the top end of the dryer body, a turntable is arranged in the drying cavity, a placing mechanism is arranged in the turntable, a case cavity is arranged on the dryer body below the drying cavity, and a rotating shaft is arranged in the case cavity. A rotating mechanism is arranged at the top end of the machine box cavity, and a nitrogen heating mechanism is installed on the side, located on the rotating mechanism, of the machine box cavity. The rotary disc is driven to rotate through the bottom rotating mechanism, moisture on silicon wafers can be rapidly thrown out through cooperation with the placement mechanism, the drying efficiency is greatly improved, the nitrogen heating mechanism is arranged, nitrogen can remove oxygen from the drying environment, and therefore the oxidation reaction on the surfaces of the silicon wafers is reduced, and the rotary type wafer drying machine is simple in structure and convenient to operate. The wafer drying device is simple in structure and convenient to operate, can efficiently and uniformly dry wafers, reduces energy consumption and risks of secondary pollution, and improves drying efficiency and product quality.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a rotary wafer drying machine. Background Art

[0002] A wafer refers to a silicon wafer used to make silicon semiconductor circuits, and its raw material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod is formed into a silicon wafer, also known as a wafer. Domestic wafer production lines are mainly 8-inch and 12-inch, and the main processing methods for wafers are sheet processing and batch processing, that is, processing one or more wafers at the same time. As semiconductor feature sizes become smaller and smaller, processing and measurement equipment become more and more advanced, resulting in new data characteristics in wafer processing. At the same time, the reduction in feature size increases the impact of the number of particles in the air on the quality and reliability of the wafer after processing. As cleanliness improves, new data characteristics also appear in the number of particles.

[0003] In the semiconductor manufacturing process, the cleanliness of the wafer surface is crucial to chip performance. Traditional wafer drying methods suffer from low efficiency and the introduction of secondary contamination, failing to meet the high efficiency and cleanliness requirements of the modern semiconductor industry. Utility Model Content

[0004] This utility model provides a rotary wafer dryer designed to address the critical issue of wafer surface cleanliness during semiconductor manufacturing, which is crucial for chip performance. Traditional wafer drying methods suffer from low efficiency and the introduction of secondary contamination, failing to meet the high efficiency and cleanliness requirements of the modern semiconductor industry.

[0005] The utility model is implemented as follows: a rotary wafer drying machine includes a body, a drying chamber is opened at the top of the body, a turntable is installed in the drying chamber, a placement mechanism is provided in the turntable, a chassis chamber is opened below the body, a rotating mechanism is provided at the top of the chassis chamber, and a nitrogen heating mechanism is installed on one side of the rotating mechanism in the chassis chamber.

[0006] Preferably, the placement mechanism is provided with several groups, and the several groups of placement mechanisms are sequentially arranged along the top of the turntable at intervals. The placement mechanism includes: a vertical frame, the bottom of the vertical frame is fixedly connected to the turntable, a placement frame is installed in the vertical frame, the placement frame is rotatably connected to the vertical frame through a rotating shaft, a handle is provided on the top of the placement frame, and through holes are provided on the side walls of the vertical frame and the placement frame.

[0007] The beneficial effect of adopting the above further solution is that when the turntable rotates, the water on the silicon wafer will be quickly thrown out under the centrifugal effect, which greatly improves the drying efficiency.

[0008] Preferably, the rotating mechanism includes: a motor frame, which is fixedly mounted on the top of the chassis cavity, a rotating motor is mounted on the motor frame, the output end of the rotating motor passes through the top of the chassis cavity and extends into the drying cavity, and the output end of the rotating motor is fixedly connected to the turntable.

[0009] The beneficial effect of adopting the above further solution is: it is used to dry the moisture of the silicon wafers on the placement mechanism 3 and improve the drying efficiency.

[0010] Preferably, the nitrogen heating mechanism includes: a nitrogen tank, which is installed in the chassis cavity, a heater installed on one side of the nitrogen tank, the nitrogen tank is fixedly connected to the air inlet end of the heater through a pipe, the output end of the heater is connected to a heating pipe, and one end of the heating pipe passes through the top of the chassis cavity and extends into the drying cavity.

[0011] The beneficial effect of adopting the above further solution is: drying the silicon wafer and preventing the silicon wafer from being oxidized and affecting the quality of the silicon wafer.

[0012] Preferably, a cover is provided on the top of the machine body, and a sealing ring is provided on the cover. The sealing ring and the top of the turntable correspond to each other and are adapted to each other.

[0013] The beneficial effect of adopting the above further solution is: sealing the top of the drying chamber to ensure its drying efficiency.

[0014] Preferably, an exhaust pipe is provided on the machine body, and one end of the exhaust pipe extends into the drying chamber.

[0015] The beneficial effect of adopting the above further solution is that it is used to discharge the water vapor in the drying chamber.

[0016] Preferably, a PLC controller is installed on the side wall of the machine body.

[0017] The beneficial effect of adopting the above further solution is that the device is controlled to operate normally through the PLC controller 10 .

[0018] Preferably, a door is provided on the machine body.

[0019] The beneficial effect of adopting the above further solution is that it facilitates the protection of the internal structure.

[0020] Compared with the existing technology, the beneficial effects of the present invention are as follows: the present invention is a rotary wafer dryer, which drives the turntable to rotate through the bottom rotating mechanism, and cooperates with the placement mechanism to quickly throw away the moisture on the silicon wafer, greatly improving the drying efficiency. By providing a nitrogen heating mechanism, nitrogen can exclude oxygen from the drying environment, thereby reducing the oxidation reaction on the surface of the silicon wafer. This rotary wafer dryer has a simple structure and is easy to operate. It can dry the wafers efficiently and evenly, while reducing energy consumption and reducing the risk of secondary pollution, thereby improving drying efficiency and product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural diagram of the utility model;

[0022] Figure 2 for Figure 1 A schematic diagram of the structure enlargement at point A;

[0023] Figure 3 for Figure 1 Schematic diagram of the top view structure;

[0024] Figure 4 for Figure 3 Schematic diagram of the drying chamber in the middle of the machine (excluding the turntable and placement mechanism);

[0025] Figure 5 for Figure 1 (without the box door) front view structural diagram;

[0026] Figure 6 for Figure 5 A side structural diagram of

[0027] Figure 7 for Figure 5 Another side view of the structural diagram.

[0028] In the figure: 1. Machine body; 2. Turntable; 3. Placement mechanism; 31. Vertical frame; 32. Placement frame; 33. Rotating shaft; 34. Handle; 4. Rotation mechanism; 41. Motor frame; 42. Rotating motor; 5. Nitrogen heating mechanism; 51. Nitrogen tank; 52. Heater; 53. Heating tube; 6. Machine cover; 7. Sealing ring; 8. Exhaust pipe; 9. Box door; 10. PLC controller. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0030] See also Figure 1-7The utility model provides a technical solution of a rotary wafer dryer: a rotary wafer dryer, comprising a body 1, a drying chamber is opened at the top of the body 1, a turntable 2 is installed in the drying chamber, a placing mechanism 3 is arranged in the turntable 2, a chassis chamber is opened below the body 1, a rotating mechanism 4 is arranged at the top of the chassis chamber, and a nitrogen heating mechanism 5 is installed on one side of the rotating mechanism 4 in the chassis chamber.

[0031] In this embodiment, a turntable 2 is provided in the drying chamber, and a placement mechanism 3 is provided on the turntable 2 for holding silicon wafers. The placement mechanism 3 can effectively accommodate silicon wafers, and the turntable 2 is driven to rotate by the bottom rotating mechanism 4. In conjunction with the placement mechanism 3, the moisture on the silicon wafers can be quickly thrown out, which greatly improves the drying efficiency. By providing a nitrogen heating mechanism 5, nitrogen can exclude oxygen from the drying environment, thereby reducing the oxidation reaction on the surface of the silicon wafer. This rotary wafer dryer has a simple structure and is easy to operate. It can dry the wafers efficiently and evenly, while reducing energy consumption and reducing the risk of secondary pollution, thereby improving drying efficiency and product quality.

[0032] Furthermore, the placement mechanism 3 is provided with several groups, and the several groups of placement mechanisms 3 are sequentially arranged at intervals along the top of the turntable 2. The placement mechanism 3 includes: a vertical frame 31, the bottom of the vertical frame 31 is fixedly connected to the turntable 2, a placement frame 32 is installed in the vertical frame 31, the placement frame 32 is rotatably connected to the vertical frame 31 through a rotating shaft 33, and a handle 34 is provided on the top of the placement frame 32, and through holes are provided on the side walls of the vertical frame 31 and the placement frame 32.

[0033] In this embodiment, several groups of placement mechanisms 3 are provided on the turntable 2, and the silicon wafers are placed in the placement mechanisms 3 to cooperate with the drying operation, wherein one group of placement mechanisms 3 includes: a vertical frame 31, wherein the vertical frame 31 is a C-shaped outer frame, and a placement frame 32 is rotatably connected to the vertical frame 31 through a rotating shaft 33, wherein the placement frame 32 has an opening on the inner side. When the silicon wafers need to be placed and stored, the placement frame 32 can be rotated by the handle 34 at the top of the placement frame 32 so that the opening of the placement frame 32 faces upward, which is convenient for placing and storing the silicon wafers. The side walls of the vertical frame 31 and the placement frame 32 are provided with several through holes. When the turntable 2 rotates, the moisture on the silicon wafers will be quickly thrown out under the centrifugal action, which greatly improves the drying efficiency.

[0034] Typically; the rotating mechanism 4 includes: a motor frame 41, the motor frame 41 is fixedly mounted on the top of the chassis cavity, a rotating motor 42 is mounted on the motor frame 41, the output end of the rotating motor 42 passes through the top of the chassis cavity and extends into the drying chamber, and the output end of the rotating motor 42 is fixedly connected to the turntable 2.

[0035] In this embodiment, a rotating mechanism 4 is provided to drive the turntable 2 to rotate, so as to dry the moisture of the silicon wafers on the placement mechanism 3 and improve the drying efficiency. The rotating mechanism 4 includes: a motor frame 41, wherein a rotating motor 42 is installed on the top of the chassis through the motor frame 41, and the output end of the rotating motor 42 passes through the top of the chassis and is rotatably connected to the turntable 2, and the turntable 2 is driven to rotate by the rotating motor 42.

[0036] Specifically, the nitrogen heating mechanism 5 includes: a nitrogen tank 51, which is installed in the chassis cavity, and a heater 52 is installed on one side of the nitrogen tank 51. The nitrogen tank 51 is fixedly connected to the air inlet end of the heater 52 through a pipe, and the output end of the heater 52 is connected to a heating pipe 53, and one end of the heating pipe 53 passes through the top of the chassis cavity and extends into the drying cavity.

[0037] In this embodiment, a nitrogen heating mechanism 5 is provided to heat the drying chamber with nitrogen gas. During the nitrogen drying process, the nitrogen removes oxygen from the drying environment, thereby reducing oxidation reactions on the silicon wafer surface. Silicon wafers are susceptible to oxidation reactions in humid environments due to the presence of oxygen, leading to corrosion, discoloration, and other problems. The use of nitrogen effectively avoids these problems. The nitrogen heating mechanism 5 includes a nitrogen tank 51 for storing nitrogen. The nitrogen in the nitrogen tank 51 is heated by a heater 52 and then discharged into the drying chamber through a heating pipe 32, drying the silicon wafers while preventing oxidation and affecting their quality.

[0038] In addition, a cover 6 is provided at the top of the body 1, and a sealing ring 7 is provided on the cover 6. The sealing ring 7 corresponds to the top position of the turntable 2 and fits with each other.

[0039] In this embodiment, a cover 6 is provided on the top of the machine body 1 to cover the drying chamber, and a sealing ring 7 is provided on the top of the drying chamber to seal the top of the drying chamber, thereby ensuring the drying efficiency.

[0040] In addition, an exhaust pipe 8 is provided on the body 1, and one end of the exhaust pipe 8 extends into the drying chamber.

[0041] In this embodiment, the water vapor in the drying chamber can be discharged by providing an exhaust pipe 8 .

[0042] Furthermore, a door 9 is provided on the machine body 1.

[0043] In this embodiment, the door 9 is provided to facilitate opening and unlocking the interior of the machine body 1, thereby facilitating protection of the internal structure.

[0044] It should be noted that a PLC controller 10 is installed on the side wall of the machine body 1.

[0045] In this embodiment, a PLC controller 10 is provided, wherein the electrical structures in each mechanism are electrically connected to the PLC controller 10 , and the device is controlled by the PLC controller 10 to operate normally.

[0046] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A rotary wafer drying machine, characterized in that: The invention comprises a machine body (1), a drying chamber is provided at the top of the machine body (1), a turntable (2) is installed in the drying chamber, a placement mechanism (3) is provided in the turntable (2), a cabinet chamber is provided below the machine body (1), a rotating mechanism (4) is provided at the top of the cabinet chamber, and a nitrogen heating mechanism (5) is installed on one side of the rotating mechanism (4) in the cabinet chamber.

2. The rotary wafer drying machine according to claim 1, characterized in that: The placing mechanism (3) is provided with a plurality of groups, and the plurality of placing mechanisms (3) are sequentially arranged at intervals along the top of the turntable (2). The placing mechanism (3) comprises: a vertical frame (31), the bottom of the vertical frame (31) is fixedly connected to the turntable (2), a placing frame (32) is installed in the vertical frame (31), the placing frame (32) is rotatably connected to the vertical frame (31) through a rotating shaft (33), a handle (34) is provided at the top of the placing frame (32), and through holes are provided on the side walls of the vertical frame (31) and the placing frame (32).

3. The rotary wafer drying machine according to claim 1, characterized in that: The rotating mechanism (4) comprises a motor frame (41), the motor frame (41) being fixedly mounted on the top of the chassis cavity, a rotating motor (42) being mounted on the motor frame (41), an output end of the rotating motor (42) passing through the top of the chassis cavity and extending into the drying cavity, and the output end of the rotating motor (42) being fixedly connected to the turntable (2).

4. The rotary wafer drying machine according to claim 1, characterized in that: The nitrogen heating mechanism (5) comprises: a nitrogen tank (51), the nitrogen tank (51) being installed in the chassis cavity, a heater (52) being installed on one side of the nitrogen tank (51), the nitrogen tank (51) being fixedly connected to the air inlet end of the heater (52) through a pipeline, the output end of the heater (52) being connected to a heating pipe (53), one end of the heating pipe (53) passing through the top end of the chassis cavity and extending into the drying cavity.

5. The rotary wafer drying machine according to claim 1, characterized in that: A cover (6) is provided at the top of the machine body (1), and a sealing ring (7) is provided on the cover (6). The sealing ring (7) and the top of the turntable (2) correspond to each other and are adapted to each other.

6. The rotary wafer drying machine according to claim 1, characterized in that: An exhaust pipe (8) is provided on the machine body (1), and one end of the exhaust pipe (8) extends into the drying chamber.

7. The rotary wafer drying machine according to claim 1, characterized in that: A PLC controller (10) is installed on the side wall of the machine body (1).

8. The rotary wafer drying machine according to claim 1, characterized in that: The machine body (1) is provided with a box door (9).

Images