Sample loading device for wire stress test and test system
By designing a sample loading device for wire stress testing and utilizing the sub-plate and arc-shaped groove structure of the inlay, the problem of inaccurate wire mechanical property testing in the existing technology is solved, accurate testing under different curvatures is achieved, and a new toughness evaluation index is provided.
Patent Information
- Application Number
- CN202421958391.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-13
- Publication Date
- 2025-09-12
- Estimated Expiration
- 2034-08-13
AI Technical Summary
The prior art lacks an effective sample loading device for wire stress testing, resulting in inaccurate mechanical property testing of drawn wires.
A sample loading device for wire stress testing is designed, including an inlay and a testing system. The inlay consists of a first sub-plate and a second sub-plate. Multiple arc-shaped grooves are provided on the sub-plates. The arc-shaped grooves are connected one by one, and notches are formed at the corners of the sub-plates. The curvature of the wire can be changed by adjusting the rotation and movement of the sub-plates, so that mechanical properties tests can be performed under different curvatures.
It realizes the precise mechanical property test of wire under different curvatures, provides a new toughness evaluation index, and improves the accuracy and reliability of the test.
Smart Images
Figure CN223332813U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of wire stress testing, and in particular to a sample loading device and a testing system for wire stress testing. Background Art
[0002] Drawn wire has a wide range of applications. For example, steel wire, with its combination of high strength and good flexibility, is a key material in industries such as aviation, long-span bridges, and the nuclear industry. Tungsten wire, on the other hand, is an important material for the production of various lighting filaments, cathode ray tube filaments, vapor deposition heaters, thermocouples, electrodes and contact devices, and high-temperature heating elements. The mechanical properties of drawn wire (such as toughness, bendability, and winding performance) are important quality evaluation indicators for its application.
[0003] After the drawn wire is prepared, it needs to be installed on the sample loading tool and its mechanical properties need to be tested using testing equipment. Utility Model Content
[0004] The present invention provides a sample loading device and a testing system for wire stress testing. This solves the problem of the prior art that a sample loading device for wire stress testing is urgently needed. The technical solution is as follows:
[0005] In one aspect, a sample loading device for wire material stress testing is provided, wherein the sample loading device for wire material stress testing is used to mount wire material, and the sample loading device for wire material stress testing comprises:
[0006] an inlay, the inlay comprising a first sub-plate and a second sub-plate arranged side by side;
[0007] One side of the first sub-plate has a plurality of first arc-shaped grooves arranged in an array along a first target direction, and one side of the second sub-plate has a plurality of second arc-shaped grooves arranged in an array along a second target direction. A notch is provided between a corner portion of one end of the first sub-plate close to the second sub-plate and a corner portion of the second sub-plate close to one end of the first sub-plate. Each of the first arc-shaped grooves has a first opening at one end close to the notch, and each of the second arc-shaped grooves has a second opening at one end close to the notch. Both the first opening and the second opening are connected to the notch. The first target direction is parallel to the long side direction of the first sub-plate, and the second target direction is parallel to the long side direction of the second sub-plate.
[0008] In which, the multiple first arc-shaped grooves and the multiple second arc-shaped grooves are connected one-to-one, the curvatures of the multiple first arc-shaped grooves are different, the curvatures of the multiple second arc-shaped grooves are different, and the curvature of each first arc-shaped groove is the same as the curvature of the corresponding second arc-shaped groove, at least part of the wire is fixed in a group of interconnected first arc-shaped grooves and second arc-shaped grooves, and part of the wire is exposed from the notch.
[0009] Optionally, the first sub-board and the second sub-board are separately provided, a corner of the first sub-board facing the second sub-board has a first inclined surface, and a corner of the second sub-board facing the first sub-board has a second inclined surface, the notch can be formed between the first inclined surface and the second inclined surface, the first opening is located on the first inclined surface, and the second opening is located on the second inclined surface;
[0010] In which, the first sub-plate can be rotated by a first angle relative to the second sub-plate along a first rotation direction, and the second sub-plate can be rotated by a second angle relative to the first sub-plate along a second rotation direction, the first angle and the second angle are equal, and the first rotation direction and the second rotation direction are opposite; and / or, the first sub-plate can be moved by a first distance relative to the second sub-plate along a first movement direction, and the second sub-plate can be moved by a second distance relative to the first sub-plate along a second movement direction, the first distance and the second distance are equal, and the first movement direction and the second movement direction are opposite.
[0011] Optionally, the first sub-board has a group of first fixing holes, and the second sub-board has a group of second fixing holes;
[0012] The sample loading device for wire stress testing further includes: a gusset plate and at least two fixing members, the gusset plate being located on the back side of the first sub-plate and the back side of the second sub-plate, the gusset plate having a plurality of groups of first connection holes corresponding to a group of the first fixing holes, and a plurality of groups of second connection holes corresponding to a group of the second fixing holes, the arrangement direction of the plurality of groups of first connection holes being parallel to the first movement direction, and the arrangement direction of the plurality of groups of second connection holes being parallel to the second movement direction;
[0013] Among them, after a group of the first connection holes are aligned with a group of the first fixing holes, one of the fixing members sequentially passes through a group of the first connection holes and a group of the first fixing holes to be connected to the gusset plate and the first sub-plate; after a group of the second connection holes are aligned with a group of the second fixing holes, another of the fixing members sequentially passes through a group of the second connection holes and a group of the second fixing holes to be connected to the gusset plate and the second sub-plate.
[0014] Optionally, the multiple groups of first connection holes are distributed at equal intervals, and the multiple groups of second connection holes are distributed at equal intervals.
[0015] Optionally, a group of the first fixing holes includes two adjacent first fixing holes, and a group of the second fixing holes includes two adjacent second fixing holes;
[0016] Each group of the first connection holes includes: a first central connection hole, and a plurality of first edge connection holes distributed around the first central connection hole; each group of the second connection holes includes: a second central connection hole, and a plurality of second edge connection holes distributed around the second central connection hole;
[0017] The two first fixing holes correspond to one first central connecting hole and one first edge connecting hole; the two second fixing holes correspond to one second central connecting hole and one second edge connecting hole.
[0018] Optionally, the angles between the two outermost first edge connection holes among the multiple first edge connection holes and the lines connecting the first center connection holes are right angles; the angles between the two outermost second edge connection holes among the multiple second edge connection holes and the lines connecting the second center connection holes are right angles.
[0019] Optionally, the inlay further comprises: a plurality of first inserts fixed on one side of the first sub-board and arranged in an array along the first target direction, and a plurality of second inserts fixed on one side of the second sub-board and arranged in an array along the second target direction, wherein the plurality of first inserts correspond to the plurality of second inserts in a one-to-one manner, the first inserts have a first slot, and the second inserts have a second slot;
[0020] The opening of the first slot and the opening of the second slot are oriented in the same direction and both face the notch, and the two ends of the wire are respectively inserted into a corresponding first slot of the first insert and a corresponding second slot of the second insert.
[0021] Optionally, the number of the plurality of first insertion tubes is the same as the number of the plurality of first arc-shaped grooves, and the number of the plurality of second insertion tubes is the same as the number of the plurality of second arc-shaped grooves.
[0022] Optionally, the sample loading device for wire stress testing further includes: a base, one side of the base having a plug-in slot, and the end of the insert facing away from the notch can be plugged into the plug-in slot.
[0023] In another aspect, a testing system is provided, comprising:
[0024] A testing device and a sample loading device for wire stress testing, wherein the sample loading device for wire stress testing is fixed on the carrier of the testing device, and the sample loading device for wire stress testing is any of the sample loading devices for wire stress testing described above.
[0025] The beneficial effects of the technical solutions provided in the embodiments of the present application include at least:
[0026] A sample loading device for wire stress testing may include: an inlay, wherein a first sub-plate and a second sub-plate are arranged in the inlay in the sample loading device, wherein the first sub-plate is provided with a plurality of first arc-shaped grooves arranged in an array, and the second sub-plate is provided with a plurality of second arc-shaped grooves, wherein the plurality of first arc-shaped grooves are connected to the plurality of second arc-shaped grooves in a one-to-one correspondence, and a notch is provided between the corners of the first sub-plate and the corners of the second sub-plate. In this way, an operator can place a wire into a set of interconnected first arc-shaped grooves and second arc-shaped grooves and fix them, so that the wire can obtain a curvature substantially the same as the curvature of the first arc-shaped groove and the second arc-shaped groove, and a test point can be determined on the portion of the wire exposed from the notch, so that some mechanical properties of the wire under this curvature can be determined. In addition, since the curvatures of the multiple groups of first arc-shaped grooves and second arc-shaped grooves are different, different curvatures can be obtained when the wire is placed in different groups of first arc-shaped grooves and second arc-shaped grooves, thereby performing measurements of the wire under different curvatures. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.
[0028] Figure 1 This is a front view of a sample loading device for wire stress testing provided in an embodiment of the present application;
[0029] Figure 2 yes Figure 1 An axonometric view of a sample loading device for wire stress testing is shown;
[0030] Figure 3 This is an exploded schematic diagram of a sample loading device provided in an embodiment of the present application;
[0031] Figure 4 yes Figure 3 An axonometric view of the sample loading device is shown;
[0032] Figure 5 is an exploded schematic diagram of another sample loading device provided in an embodiment of the present application;
[0033] Figure 6 yes Figure 5 An axonometric view of the sample loading device is shown;
[0034] Figure 7 This is an exploded schematic diagram of another sample loading device provided in an embodiment of the present application;
[0035] Figure 8 yes Figure 7 An axonometric view of the sample loading device is shown;
[0036] Figure 9 This is an exploded schematic diagram of another sample loading device provided in an embodiment of the present application;
[0037] Figure 10 yes Figure 9 An axonometric view of the sample loading device is shown;
[0038] Figure 11 is an exploded schematic diagram of a sample loading device provided in another embodiment of the present application;
[0039] Figure 12 yes Figure 11 An axonometric view of the sample loading device is shown;
[0040] Figure 13 is an exploded schematic diagram of another sample loading device provided in another embodiment of the present application;
[0041] Figure 14 This is an exploded schematic diagram of another sample loading device provided in another embodiment of the present application;
[0042] Figure 15 yes Figure 14 An axonometric view of the sample loading device is shown.
[0043] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION
[0044] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.
[0045] The embodiment of the present application provides a test system, which may include: a test device and a sample loading device for wire stress testing, the sample loading device for wire stress testing can be used to install the wire to be tested, and the sample loading device for wire stress testing can be fixed on the carrier in the test device, and the relevant mechanical properties of the wire to be tested are tested by the test device. For example, the test device can be combined with X-ray diffraction (XRD) stress test to quickly characterize the toughness of the wire, and can provide a new toughness evaluation index to more accurately judge the quality of the wire. XRD stress testing is a method of measuring the surface stress of a material using X-ray diffraction technology. The XRD method is used to analyze the stress in the bending process of the drawn wire, which can be decomposed in three directions, namely radial, axial and tangential (or circumferential), and the force is a three-dimensional stress state. Brittle fracture is caused by the axial stress (tensile stress component) of the applied stress, and ductile fracture is caused by the shear stress component. Therefore, the measured stress component can be used as an evaluation benchmark for the toughness of the wire. Here, a wire with a smaller diameter may be installed on a sample loading device for wire stress testing and then tested on a testing device. The diameter of the wire may be 0.038±0.003mm≤φ≤0.39±0.03mm.
[0046] Please refer to Figure 1 and Figure 2 , Figure 1 This is a front view of a sample loading device for wire stress testing provided in an embodiment of the present application. Figure 2 yes Figure 1 The sample loading device for wire material stress testing is shown in an axonometric view. The sample loading device for wire material stress testing can be used to install wire material, and the sample loading device for wire material stress testing can include: an insert 100, which can include a first sub-plate 101 and a second sub-plate 102 arranged side by side.
[0047] One side of the first sub-plate 101 may have a plurality of first arcuate grooves 101a arranged in an array along a first target direction f1, and one side of the second sub-plate 102 may have a plurality of second arcuate grooves 102a arranged in an array along a second target direction f2. Here, one side of the first sub-plate 101 and one side of the second sub-plate 102 may be flush. A notch a1 may be defined between a corner of the first sub-plate 101 near the second sub-plate 102 and a corner of the second sub-plate 102 near the first sub-plate 101. Each first arcuate groove 101a may have a first opening b1 at its end near the notch a1, and each second arcuate groove 102a may have a second opening b2 at its end near the notch a1. Both the first opening b1 and the second opening b2 may communicate with the notch a1. The first target direction f1 may be parallel to the long side of the first sub-plate 101, and the second target direction f2 may be parallel to the long side of the second sub-plate 102.
[0048] Wherein, a plurality of first arc grooves 101a in the first sub-plate 101 and a plurality of second arc grooves 102a in the second sub-plate 102 can be communicated one by one, and the curvature of a plurality of first arc grooves 101a is all different, and the curvature of a plurality of second arc grooves 102a is also all different, and the curvature of each first arc groove 101a can be the same as the curvature of the corresponding second arc groove 102a. At least part of the wire A can be fixed in a group of interconnected first arc grooves 101a and second arc grooves 102a, and the part in the wire A can be exposed by notch a1. Here, the point to be measured of the wire A can be determined from the part exposed from notch a1 in the wire A.
[0049] In an embodiment of the present application, a first sub-plate 101 and a second sub-plate 102 are provided in an inlay 100 in a sample loading device, a plurality of first arcuate grooves 101a arranged in an array are provided on the first sub-plate 101, and a plurality of second arcuate grooves 102a are provided on the second sub-plate 102. The plurality of first arcuate grooves 101a are connected to the plurality of second arcuate grooves 102a in a one-to-one correspondence, and a notch a1 is provided between the corner of the first sub-plate 101 and the corner of the second sub-plate 102. In this way, the operator can place the wire A into a set of interconnected first arcuate grooves 101a and second arcuate grooves 102a and fix them, that is, the wire A can obtain a curvature that is substantially the same as the curvature of the first arcuate groove 101a and the second arcuate groove 102a, and the test point can be determined on the portion of the wire A exposed from the notch a1, so that some mechanical properties of the wire A under this curvature can be determined. In addition, since the curvatures of the multiple groups of first arcuate grooves 101a and second arcuate grooves 102a are different, different curvatures can be obtained when the wire A is placed in different groups of first arcuate grooves 101a and second arcuate grooves 102a, and the wire A can be measured at different curvatures.
[0050] In summary, the present application embodiment provides a sample loading device for wire stress testing, which may include: an inlay, a first sub-plate and a second sub-plate are provided in the inlay in the sample loading device, a plurality of first arc grooves arranged in an array are provided on the first sub-plate, a plurality of second arc grooves are provided on the second sub-plate, a plurality of first arc grooves are connected to a plurality of second arc grooves in a one-to-one correspondence, and a gap is provided between the corner of the first sub-plate and the corner of the second sub-plate. In this way, the operator can place the wire into a group of interconnected first arc grooves and second arc grooves and fix them, that is, the wire can obtain a curvature substantially the same as the curvature of the first arc groove and the second arc groove, and the test point can be determined on the part exposed from the gap in the wire, so that some mechanical properties of the wire under the curvature can be determined. In addition, since the curvature of the multiple groups of first arc grooves and second arc grooves is different, different curvatures can be obtained when the wire is placed in different groups of first arc grooves and second arc grooves, and then the wire is measured under different curvatures.
[0051] Optional, please refer to Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 and Figure 12 , Figure 3 is an exploded schematic diagram of a sample loading device provided in an embodiment of the present application, Figure 4 yes Figure 3 An axonometric view of the sample loading device is shown, Figure 5 is an exploded schematic diagram of another sample loading device provided in an embodiment of the present application, Figure 6 yes Figure 5 An axonometric view of the sample loading device is shown, Figure 7 This is an exploded schematic diagram of another sample loading device provided in an embodiment of the present application. Figure 8 yes Figure 7 An axonometric view of the sample loading device is shown, Figure 9 This is an exploded schematic diagram of another sample loading device provided in an embodiment of the present application. Figure 10 yes Figure 9 An axonometric view of the sample loading device is shown, Figure 11 This is an exploded schematic diagram of a sample loading device provided in another embodiment of the present application. Figure 12 yes Figure 11An axonometric view of the sample loading device is shown. The first sub-plate 101 and the second sub-plate 102 in the inlay 100 can be separately arranged. The corner of the first sub-plate 101 facing the second sub-plate 102 can have a first inclined surface c1, and the corner of the second sub-plate 102 facing the first sub-plate 101 can have a second inclined surface c2. A gap a1 can be formed between the first inclined surface c1 and the second inclined surface c2, and the first opening b1 in each first arcuate groove 101a can be located on the first inclined surface c1, and the second opening b2 in each second arcuate groove 102a can be located on the second inclined surface c2. Here, there can be a certain distance between the first inclined surface c1 and the second inclined surface c2, so that a gap a1 is formed between the corner of the first sub-plate 101 and the corner of the second sub-plate 102. The first sub-plate 101 can rotate relative to the second sub-plate 102 along a first rotational direction by a first angle, and the second sub-plate 102 can rotate relative to the first sub-plate 101 along a second rotational direction by a second angle. The first angle and the second angle can be equal, and the first rotational direction and the second rotational direction can be opposite. Furthermore, / or, the first sub-plate 101 can move relative to the second sub-plate 102 along a first movement direction f3 by a first distance, and the second sub-plate 102 can move relative to the first sub-plate 101 along a second movement direction f4 by a second distance. The first distance and the second distance can be equal, and the first movement direction f3 and the second movement direction f4 can be opposite.
[0052] For example, in an optional implementation, the first sub-plate 101 can rotate a first angle relative to the second sub-plate 102 along a first rotation direction, and the second sub-plate 102 can rotate a second angle relative to the first sub-plate 101 along a second rotation direction. The first angle and the second angle can be equal, and the first rotation direction and the second rotation direction can be opposite. In this case, by separating the first sub-plate 101 and the second sub-plate 102, and allowing the first sub-plate 101 and the second sub-plate 102 to rotate a certain angle in opposite directions, the degree of curvature of each group of first arc-shaped grooves 101a and second arc-shaped grooves 102a can be flexibly changed, which can be further used to change the degree of curvature of the wire A placed in this group of first arc-shaped grooves 101a and second arc-shaped grooves 102a. In another optional implementation, the first sub-plate 101 can move a first distance relative to the second sub-plate 102 along the first movement direction f3, and the second sub-plate 102 can move a second distance relative to the first sub-plate 101 along the second movement direction f4, and the first distance and the second distance can be equal, and the first movement direction f3 and the second movement direction f4 can be opposite. In yet another optional implementation, the first sub-plate 101 can rotate a first angle relative to the second sub-plate 102 along the first rotation direction, and the second sub-plate 102 can rotate a second angle relative to the first sub-plate 101 along the second rotation direction, and the first angle and the second angle can be equal, and the first rotation direction and the second rotation direction can be opposite. Furthermore, the first sub-plate 101 can move a first distance relative to the second sub-plate 102 along the first movement direction, and the second sub-plate 102 can move a second distance relative to the first sub-plate 101 along the second movement direction, and the first distance and the second distance can be equal, and the first movement direction f3 and the second movement direction f4 can be opposite.
[0053] It should be noted that, in other possible implementations, the first sub-plate 101 and the second sub-plate 102 in the inlay 100 may be fixedly connected or may be an integral structure.
[0054] In the examples of this application, please refer to Figures 3 to 12 、 Figure 13 , Figure 13It is an exploded schematic diagram of another sample loading device provided by another embodiment of the present application. The first sub-plate 101 may have a set of first fixing holes 101b, and the second sub-plate 102 may have a set of second fixing holes 102b. The sample loading device for wire stress testing may also include: a gusset plate 200 and two fixing members (not shown in the figure), the gusset plate 200 may be located on the back side of the first sub-plate 101 and the back side of the second sub-plate 102, here, the back side of the first sub-plate 101 may be the side opposite to the side of the first sub-plate 101 where the first arc-shaped groove 101a is provided, and the back side of the second sub-plate 102 may be the side opposite to the side of the second sub-plate 102 where the second arc-shaped groove 102a is provided. The pinch plate 200 may have multiple groups of first connection holes k1 corresponding to the set of first fixing holes 101b, and multiple groups of second connection holes k2 corresponding to the set of second fixing holes 102b. The multiple groups of first connection holes k1 may be arranged in a direction parallel to the first movement direction f3 of the first sub-plate 101, and the multiple groups of second connection holes k2 may be arranged in a direction parallel to the second movement direction f4 of the second sub-plate 102. After the set of first connection holes k1 in the pinch plate 200 is aligned with the set of first fixing holes 101b in the first sub-plate 101, a fixing member may be sequentially passed through the set of first connection holes k1 and the set of first fixing holes 101b to be fastened to the pinch plate 200 and the first sub-plate 101. After the set of second connection holes k2 in the pinch plate 200 is aligned with the set of second fixing holes 102b in the second sub-plate 102, another fixing member may be sequentially passed through the set of first connection holes k2 and the set of second fixing holes 102b to be fastened to the pinch plate 200 and the second sub-plate 102. It should be noted that, when the first sub-plate 101 and the second sub-plate 102 in the inlay 100 are fixedly connected or are an integral structure, the pinch plate 200 may not be used for connection.
[0055] In this case, by providing a pinch plate 200 and two fixings in the sample loading device for wire stress testing, the first sub-plate 101 is moved so that the first fixing hole 101b on the first sub-plate 101 can be aligned with a different first connection hole k1, and the second sub-plate 102 is moved so that the second fixing hole 102b on the second sub-plate 102 can be aligned with a different second connection hole k2, that is, the movement distance and rotation angle of the first sub-plate 101 and the second sub-plate 102 can be adjusted. Then, one fixing is used to fix the first sub-plate 101 and the pinch plate 200, and the other fixing is used to fix the second sub-plate 102 and the pinch plate 200. At the same time, the first connection hole k1 and the second connection hole k2 on the pinch plate 200 can serve as a calibration for the movement distance and / or rotation angle of the two sub-plates, thereby conveniently determining the movement distance and / or rotation angle of the first sub-plate 101 and the second sub-plate 102. For example, at least one of the first fixing hole 101b and the first connecting hole k1 may be a threaded hole, and the fixing member may be a screw; at least one of the second fixing hole 102b and the second connecting hole k2 may be a threaded hole, and the fixing member may be a screw.
[0056] In this application, if Figure 13 As shown, the multiple groups of first connection holes k1 in the gusset plate 200 can be distributed at equal intervals, and the multiple groups of second connection holes k2 in the gusset plate 200 can be distributed at equal intervals. Here, the distance between each two adjacent groups of first connection holes k1 in the gusset plate 200 can be equal to the distance between each two adjacent groups of second connection holes k2 in the gusset plate 200.
[0057] Optional, please refer to Figures 3 to 13 、 Figure 14 , Figure 14 This is an exploded schematic diagram of another sample loading device provided by another embodiment of the present application. A group of first fixing holes 101b in the first sub-plate 101 may include two adjacent first fixing holes 101b, and a group of second fixing holes 102b in the second sub-plate 102 may include two adjacent second fixing holes. Each group of first connection holes k1 in the pinch plate 200 may include: a first central connection hole k11, and a plurality of first edge connection holes k12 distributed around the first central connection hole k11. Each group of second connection holes k2 in the pinch plate 200 may include: a second central connection hole k21, and a plurality of second edge connection holes k22 distributed around the second central connection hole k21. The two first fixing holes 101b in the first sub-plate 101 may correspond to one first central connection hole k11 and one first edge connection hole k12 in the group of first connection holes k1. The two second fixing holes 102b in the second sub-plate 102 may correspond to one second central connection hole k21 and one second edge connection hole k22 in the group of second connection holes k2.
[0058] For example, when the two first fixing holes 101b of the first sub-plate 101 are aligned with a first central connection hole k11 and a different first edge connection hole k12 within the same group of the pinch plate 200, the first sub-plate 101 can be rotated at different angles. Similarly, when the two second fixing holes 102b of the second sub-plate 102 are aligned with a second central connection hole k21 and a different second edge connection hole k22 within the same group of the pinch plate 200, the second sub-plate 102 can be rotated at different angles. When the two first fixing holes 101b of the first sub-plate 101 are aligned with a first central connection hole k11 and a first edge connection hole k12 within different groups of the pinch plate 200, the first sub-plate 101 can be moved by different distances. Similarly, when the two second fixing holes 102b of the second sub-plate 102 are aligned with a second central connection hole k21 and a second edge connection hole k22 within different groups of the pinch plate 200, the second sub-plate 102 can be moved by different distances.
[0059] In the embodiments of this application, Figure 14 As shown, the angles between the outermost two first edge connection holes k12 of the plurality of first edge connection holes k12 in each group of first connection holes k1 in the pinch plate 200 and the lines connecting the first center connection hole k11 can be right angles. The angles between the outermost two second edge connection holes k22 of the plurality of second edge connection holes k22 in each group of second connection holes k2 in the pinch plate 200 and the lines connecting the second center connection hole k21 can also be right angles. This allows the first sub-plate 101 to be connected to the pinch plate 200 after rotating at any angle within the range of 0 to 90 degrees, and the second sub-plate 102 to be connected to the pinch plate 200 after rotating at any angle within the range of 0 to 90 degrees.
[0060] Optional, please refer to Figure 14 and Figure 15 , Figure 15 yes Figure 14The isometric view of the sample loading device is shown. The inlay 100 may also include: a plurality of first inserts 103 fixed on one side of the first sub-plate 101 and arranged in an array along the first target direction f1, and a plurality of second inserts 104 fixed on one side of the second sub-plate 102 and arranged in an array along the second target direction f2. The plurality of first inserts 103 and the plurality of second inserts 104 may correspond one to one. The first insert 103 may have a first slot 103a, and the second insert 104 may have a second slot 104a. The opening of the first slot 103a of the first insert 103 and the opening of the second slot 104a of the second insert 104 may be oriented in the same direction and may both be oriented toward the gap a1 between the first sub-plate 101 and the second sub-plate 102. The two ends of the filament A may be distributed and inserted into a group of corresponding first slots 103a of the first insert 103 and second slots 104a of the second insert 104. It should be noted that the first insert 103 and the first arc-shaped groove 101a are located on the same side of the first sub-plate 101, and the second insert 104 and the second arc-shaped groove 102a are located on the same side of the second sub-plate 102. In this case, by also providing the first insert 103 fixedly connected to the first sub-plate 101 and the second insert 104 fixedly connected to the second sub-plate 102 in the inlay 100, the two ends of the wire A can be directly inserted into a set of corresponding first slots 103a of the first insert 103 and second slots 104a of the second insert 104, respectively, so that the wire A is in a natural bending state, and the mechanical properties of the wire A in the natural bending state can be tested. It should be noted that a set of corresponding first inserts 103 and second inserts 104 are only used to limit the distance between the two ends of the wire A. It should also be noted that at this time, the wire A does not need to be placed in the first arc-shaped groove 101a and the second arc-shaped groove 102a.
[0061] In the embodiments of this application, Figure 14 and Figure 15 As shown, the number of the plurality of first inserts 103 can be the same as the number of the plurality of first arcuate grooves 101a, and the number of the plurality of second inserts 104 can be the same as the number of the plurality of second arcuate grooves 102a. As shown in the figure, the number of first arcuate grooves 101a can be seven, the number of first inserts 103 can be seven; the number of second arcuate grooves 102a can be seven, and the number of second inserts 104 can be seven.
[0062] Optional, such as Figure 14 and Figure 15As shown, the sample loading device for wire stress testing may further include a base 300, one side of which may have a slot 301. The end of the inlay 100 facing away from the notch a1 can be inserted into the slot 301 of the base 300. In this case, both sub-plates in the inlay 100 can be inserted into the slot 301 of the base 300, thereby enabling vertical measurement of the wire A. It should be noted that when horizontal measurement is required, the two sub-plates in the inlay 100 do not need to be inserted into the slot 301 of the base 300.
[0063] In summary, the present application embodiment provides a sample loading device for wire stress testing, which may include: an inlay, a first sub-plate and a second sub-plate are provided in the inlay in the sample loading device, a plurality of first arc grooves arranged in an array are provided on the first sub-plate, a plurality of second arc grooves are provided on the second sub-plate, a plurality of first arc grooves are connected to a plurality of second arc grooves in a one-to-one correspondence, and a gap is provided between the corner of the first sub-plate and the corner of the second sub-plate. In this way, the operator can place the wire into a group of interconnected first arc grooves and second arc grooves and fix them, that is, the wire can obtain a curvature substantially the same as the curvature of the first arc groove and the second arc groove, and the test point can be determined on the part exposed from the gap in the wire, so that some mechanical properties of the wire under the curvature can be determined. In addition, since the curvature of the multiple groups of first arc grooves and second arc grooves is different, different curvatures can be obtained when the wire is placed in different groups of first arc grooves and second arc grooves, and then the wire is measured under different curvatures.
[0064] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it may be the only layer between the two layers or elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.
[0065] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless expressly limited otherwise.
[0066] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.
Claims
1. A sample loading device for wire stress testing, characterized in that: The sample loading device for wire stress testing is used for mounting wire, and includes: an inlay, wherein the inlay includes a first sub-plate and a second sub-plate arranged side by side; One side of the first sub-plate has a plurality of first arc-shaped grooves arranged in an array along a first target direction, and one side of the second sub-plate has a plurality of second arc-shaped grooves arranged in an array along a second target direction. A notch is provided between a corner portion of one end of the first sub-plate close to the second sub-plate and a corner portion of the second sub-plate close to one end of the first sub-plate. Each of the first arc-shaped grooves has a first opening at one end close to the notch, and each of the second arc-shaped grooves has a second opening at one end close to the notch. Both the first opening and the second opening are connected to the notch. The first target direction is parallel to the long side direction of the first sub-plate, and the second target direction is parallel to the long side direction of the second sub-plate. In which, the multiple first arc-shaped grooves and the multiple second arc-shaped grooves are connected one-to-one, the curvatures of the multiple first arc-shaped grooves are different, the curvatures of the multiple second arc-shaped grooves are different, and the curvature of each first arc-shaped groove is the same as the curvature of the corresponding second arc-shaped groove, at least part of the wire is fixed in a group of interconnected first arc-shaped grooves and second arc-shaped grooves, and part of the wire is exposed from the notch.
2. The sample loading device for wire stress testing according to claim 1, characterized in that: The first sub-board and the second sub-board are separately provided, the first sub-board has a first inclined surface at a corner facing the second sub-board, and the second sub-board has a second inclined surface at a corner facing the first sub-board, the notch is formed between the first inclined surface and the second inclined surface, the first opening is located on the first inclined surface, and the second opening is located on the second inclined surface; In which, the first sub-plate can be rotated by a first angle relative to the second sub-plate along a first rotation direction, and the second sub-plate can be rotated by a second angle relative to the first sub-plate along a second rotation direction, the first angle and the second angle are equal, and the first rotation direction and the second rotation direction are opposite; and / or, the first sub-plate can be moved by a first distance relative to the second sub-plate along a first movement direction, and the second sub-plate can be moved by a second distance relative to the first sub-plate along a second movement direction, the first distance and the second distance are equal, and the first movement direction and the second movement direction are opposite.
3. The sample loading device for wire stress testing according to claim 2, characterized in that: The first sub-plate has a set of first fixing holes, and the second sub-plate has a set of second fixing holes; The sample loading device for wire stress testing further includes: a gusset plate and at least two fixing members, the gusset plate being located on the back side of the first sub-plate and the back side of the second sub-plate, the gusset plate having a plurality of groups of first connection holes corresponding to a group of the first fixing holes, and a plurality of groups of second connection holes corresponding to a group of the second fixing holes, the arrangement direction of the plurality of groups of first connection holes being parallel to the first movement direction, and the arrangement direction of the plurality of groups of second connection holes being parallel to the second movement direction; Among them, after a group of the first connection holes are aligned with a group of the first fixing holes, one of the fixing members sequentially passes through a group of the first connection holes and a group of the first fixing holes to be connected to the gusset plate and the first sub-plate; after a group of the second connection holes are aligned with a group of the second fixing holes, another of the fixing members sequentially passes through a group of the second connection holes and a group of the second fixing holes to be connected to the gusset plate and the second sub-plate.
4. The sample loading device for wire stress testing according to claim 3, characterized in that: The multiple groups of first connection holes are distributed at equal intervals, and the multiple groups of second connection holes are distributed at equal intervals.
5. The sample loading device for wire stress testing according to claim 3, characterized in that: A group of the first fixing holes includes two adjacent first fixing holes, and a group of the second fixing holes includes two adjacent second fixing holes; Each group of the first connection holes includes: a first central connection hole, and a plurality of first edge connection holes distributed around the first central connection hole; each group of the second connection holes includes: a second central connection hole, and a plurality of second edge connection holes distributed around the second central connection hole; The two first fixing holes correspond to one first central connecting hole and one first edge connecting hole; the two second fixing holes correspond to one second central connecting hole and one second edge connecting hole.
6. The sample loading device for wire stress testing according to claim 5, characterized in that: The angles between the outermost two first edge connection holes among the multiple first edge connection holes and the lines connecting the first center connection hole are right angles; the angles between the outermost two second edge connection holes among the multiple second edge connection holes and the lines connecting the second center connection hole are right angles.
7. The sample loading device for wire stress testing according to any one of claims 1 to 6, characterized in that: The inlay further comprises: a plurality of first inserts fixed on one side of the first sub-board and arranged in an array along the first target direction; and a plurality of second inserts fixed on one side of the second sub-board and arranged in an array along the second target direction, wherein the plurality of first inserts correspond to the plurality of second inserts in a one-to-one manner, the first inserts have a first slot, and the second inserts have a second slot; The opening of the first slot and the opening of the second slot are oriented in the same direction and both face the notch, and the two ends of the wire are respectively inserted into a corresponding first slot of the first insert and a corresponding second slot of the second insert.
8. The sample loading device for wire stress testing according to claim 7, characterized in that: The number of the plurality of first inserting tubes is the same as the number of the plurality of first arc-shaped grooves, and the number of the plurality of second inserting tubes is the same as the number of the plurality of second arc-shaped grooves.
9. The sample loading device for wire stress testing according to any one of claims 1 to 6, characterized in that: The sample loading device for wire stress testing further comprises: a base, one side of the base is provided with a plug-in slot, and the end of the inlay facing away from the notch can be plugged into the plug-in slot.
10. A testing system, characterized in that: include: A testing device and a sample loading device for wire stress testing, wherein the sample loading device for wire stress testing is fixed on a carrier of the testing device, and the sample loading device for wire stress testing is the sample loading device for wire stress testing according to any one of claims 1 to 9.