Package structure

Abstract

The utility model discloses a packaging structure. The packaging structure comprises a bottom plate; the shell is positioned on the bottom plate; the substrate is located on the bottom plate, an integrated circuit is arranged on the substrate, and the substrate is located in the shell; the packaging body is filled in the shell and at least covers the substrate and the integrated circuit on the substrate, and the back surface of the substrate is exposed from the lower surface of the packaging body and is connected with the bottom plate through the interconnection layer; the shell is located on the bottom plate and wraps the side wall of the encapsulation body, the cover plate is located on the encapsulation body, and the cover plate is embedded into the shell; connecting structures are arranged on the inner side walls of the two opposite sides in the shell and connected with the shell and the cover plate. And a groove is further formed in the contact part of the inner side wall of at least part of the shell and the packaging body. According to the packaging structure, the contact area of the shell and the packaging body is increased, and the connection strength is improved; through the design of the grooves, the invasion path of external gas is prolonged, the anti-vulcanization effect is enhanced, the packaging structure is suitable for severe application scenes such as offshore wind power, papermaking, mining and rubber, and the reliability of the packaging structure is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging, and more specifically, to a packaging structure. Background Art

[0002] With advances in power electronics technology, power modules are rapidly developing. The complex application scenarios of power modules also place higher demands on their packaging. In industrial applications such as offshore wind power, papermaking, mining, and rubber, reliability verification tests of semiconductor packaging structures have shown that hydrogen sulfide gas produced by sulfur-containing substances in these applications can corrode the copper in the power module, forming dendritic copper sulfide crystals, which can cause short-circuit failure of the power module.

[0003] Therefore, how to design a highly reliable packaging structure that can effectively enhance anti-sulfurization capabilities is an urgent problem that needs to be solved at this stage. Utility Model Content

[0004] In view of this, the purpose of the present invention is to provide a packaging structure to enhance the anti-sulfurization capability to adapt to harsh application scenarios such as offshore wind power, papermaking, mining, rubber, etc., and to improve the reliability of the packaging structure.

[0005] The utility model provides a packaging structure, comprising: a bottom plate; a shell located on the bottom plate; a substrate located on the bottom plate, an integrated circuit being arranged on the substrate, and the substrate being located in the shell; an encapsulation body, the encapsulation body being filled in the shell and covering at least the substrate and the integrated circuit on the substrate, the back surface of the substrate being exposed from the lower surface of the encapsulation body and being connected to the bottom plate via an interconnection layer.

[0006] The above-mentioned packaging structure also includes: a cover plate, located on the enclosure, the cover plate is embedded in the outer shell and located on the enclosure paper; the inner side walls on the opposite sides of the outer shell are provided with a connecting structure, the connecting structure connects the outer shell and the cover plate; the connecting structure connects the cover plate and the outer shell together.

[0007] Optionally, the connection structure is a buckle, the cover plate has a bayonet corresponding to the buckle, and the buckle connects the shells together through the bayonet on the cover plate.

[0008] In the above packaging structure, at least a portion of the inner sidewall of the shell and the contact portion of the enclosure are further provided with a groove.

[0009] Optionally, the cross-section of the groove includes any one of an arc shape, a semicircular shape, and a polygonal shape, and the groove extends laterally along the inner side wall of the shell.

[0010] Optionally, the groove comprises a plurality of grooves, and the plurality of grooves are respectively located at different heights on the inner side wall of the shell.

[0011] Optionally, the cross-sectional shapes of the multiple grooves are the same or different, and the multiple grooves are parallel to each other.

[0012] Optionally, the depth of the groove is no more than 70% of the thickness of the shell.

[0013] Optionally, the top surface of the encapsulation body is not lower than the root of the connection structure.

[0014] Optionally, a baffle is provided on the inner side wall of the shell at a position corresponding to the connection structure.

[0015] Optionally, the baffle and the housing are an integral structure.

[0016] Optionally, at least a portion of the inner sidewall of the shell in contact with the enclosure is further provided with a groove, and the groove is staggered with the baffle.

[0017] Optionally, the substrate is a copper-clad ceramic substrate.

[0018] Optionally, the housing is located on the base plate via the interconnection layer.

[0019] Optionally, the integrated circuit includes at least one of an IGBT, an FRD, a MOSFET, and a driver chip.

[0020] Optionally, a connection terminal of the integrated circuit is further included which is perpendicular to the substrate, the cover plate has a through hole corresponding to the connection terminal, and at least a portion of the top of the connection terminal passes through the through hole of the cover plate.

[0021] Optionally, the encapsulation body is one of a silicone gel layer, a liquid epoxy resin layer, a laminate of epoxy resin and silicone gel, or a plastic encapsulation body.

[0022] Optionally, the base plate is a heat dissipation base plate.

[0023] Optionally, heat dissipation fins are provided on the lower surface of the base plate.

[0024] This packaging structure is not only compact, but also increases the contact area (interconnection area) between the shell and the enclosure, reducing the risk of delamination and increasing the connection strength. The groove design on the inner wall of the shell prolongs the path for external gas invasion, thereby enhancing the anti-sulfurization effect. Furthermore, the groove can also compensate for the cooling shrinkage of the enclosure during the formation process of the enclosure (including but not limited to glue pouring, injection molding, etc.), so that the enclosure has a structure embedded in the groove, further enhancing the connection strength and reducing the risk of delamination. In the case where the top surface of the enclosure is higher than the root of the buckle (connection structure), a baffle is also provided for the buckle to avoid the problem of insufficient filling of the gap between the buckle and the shell by the encapsulation material due to surface tension. The packaging structure provided by the utility model has an excellent anti-sulfurization effect and can be better applied to harsh application scenarios such as offshore wind power, papermaking, mining, rubber, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings.

[0026] Figure 1 A cross-sectional view showing the packaging structure of the first embodiment of the present invention;

[0027] Figure 2 A schematic diagram showing the packaging structure of the first embodiment of the present invention;

[0028] Figure 3 A cross-sectional view showing a packaging structure of a second embodiment of the present invention;

[0029] Figure 4 A cross-sectional view showing a packaging structure of a third embodiment of the present invention;

[0030] Figure 5 A cross-sectional view showing a packaging structure according to a fourth embodiment of the present invention;

[0031] Figure 6 A schematic diagram showing a packaging structure of a fourth embodiment of the present invention;

[0032] Figure 7 A cross-sectional view showing a packaging structure of a fifth embodiment of the present invention;

[0033] Figure 8 A schematic diagram showing a packaging structure of a fifth embodiment of the present invention. DETAILED DESCRIPTION

[0034] Various embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. In each of the accompanying drawings, identical elements are represented by identical or similar reference numerals. For the sake of clarity, the various parts in the accompanying drawings are not drawn to scale.

[0035] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0036] Figure 1 A cross-sectional view of the packaging structure of the first embodiment of the present invention is shown; the packaging structure includes a bottom plate 110, an interconnection layer 120, a shell 130, a substrate 140, an encapsulation body 150 and a cover plate 160, wherein the bottom plate 110 is made of a metal material such as aluminum, and the bottom plate 110 can be used as a heat sink. The lower surface of the bottom plate 110 is provided with fins to increase the heat dissipation area. The shell 130 and the substrate 140 are both located on the upper surface of the bottom plate 110. In order to enhance the connection strength, the upper surface of the bottom plate 110 is further provided with an interconnection layer 120. The size of the interconnection layer 120 is matched with the upper surface of the bottom plate 110, and the shell 130 and The substrate 140 is located on the interconnection layer 120, and the shell 130 includes, for example, multiple side walls to form a closed annular structure. The shell 130 is arranged around the substrate 140; specifically, the shell 130 is, for example, rectangular, including opposite first and second side walls, and opposite third and fourth side walls. The substrate 140 is located in the shell 130, and the substrate 140 is, for example, a copper-clad ceramic substrate. The upper and lower surfaces of the substrate 140 both have a copper conductive layer. An integrated circuit 141 is also provided on the upper surface of the substrate 140. The integrated circuit 141 includes, for example, an IGBT, an FRD, a MOSFET, a driver chip, etc. The encapsulation body 150 is filled in the shell 130, and the encapsulation body 150 covers the substrate 140, the integrated circuit 141 and the related bonding wires of the integrated circuit 141 and / or the substrate 140. A cover plate 160 is also arranged above the encapsulation body 150. The cover plate 160 is matched with the shell 130, for example, and the cover plate 160 is embedded in the shell 130. Specifically, the inner side surfaces of at least two opposite side walls of the shell 130 are provided with buckles 131, and the cover plate 160 has a bayonet that matches the buckle 131. The cover plate 160 is fixedly connected to the shell 130 by the cooperation between the buckle 131 and the bayonet. In the packaging structure of the first embodiment, the connection between the cover plate 160 and the shell 130 is achieved by snapping, and the enclosure 150 also fills the cavity surrounded by the cover plate 160, the shell 130 and the base plate 110, thereby increasing the contact area (interconnection area) between the shell 130 and the enclosure 150, increasing the connection strength, reducing the risk of delamination, reducing the risk of external gas damaging the substrate 140 along the gas intrusion path indicated by the arrow in the figure, and improving the reliability of devices using the packaging structure.

[0037] The encapsulation body 150 may, for example, include multiple encapsulation layer structures, or may be formed from only one encapsulation material. For example, the encapsulation body 150 may be formed using silicone gel potting, liquid epoxy resin potting, or epoxy resin and silicone gel layer potting. Of course, the encapsulation body 150 may also be formed using methods such as injection molding.

[0038] In order to clearly illustrate the structure of the buckle 131 and the base plate 140, Figure 2 The cover plate 160 and the encapsulation body 150 are omitted. Figure 2 As shown, the buckle 131 is, for example, arranged on the inner wall of the shell 130, and the clamping part at the top thereof is, for example, higher than the shell 130. A plurality of integrated circuits 141 are, for example, arranged on the substrate 140. Different base islands of the substrate 140, integrated circuits 141 and integrated circuits 141, and integrated circuits 141 and the substrate 140 are connected, for example, by bonding wires 142. Furthermore, the packaging structure is, for example, a packaging structure of a power module, and a connecting terminal 143 of the integrated circuit perpendicular to the substrate 140 is also provided on the packaging structure. Accordingly, a through hole corresponding to the connecting terminal 143 is provided on the cover plate 160, and the top of the connecting terminal 143 at least partially passes through the through hole of the cover plate 160.

[0039] Figure 3 A cross-sectional view of the packaging structure of the second embodiment of the present invention is shown; the packaging structure of the second embodiment is Figure 1 The packaging structure of the first embodiment shown is similar, except that in the packaging structure of the second embodiment, a groove 132 is provided on the inner side wall of the shell 130. To ensure the strength of the shell 130, the depth of the groove 132 does not exceed 70% of the shell thickness. By providing the groove 132, the gas intrusion path indicated by the arrow is significantly longer than that of the first embodiment. Figure 3 The cross-section of the middle groove 132 is rectangular, but it can also be curved, semicircular, polygonal, or other shapes as needed. This groove 132 not only extends the path for gas intrusion but also compensates for the volume shrinkage of the encapsulation 150 during its formation (including but not limited to methods such as potting and injection molding). This allows the encapsulation 150 to be embedded in the groove, further enhancing the connection strength and reducing the risk of delamination.

[0040] Figure 4 A cross-sectional view of the packaging structure of the third embodiment of the present invention is shown. The packaging structure of the third embodiment is similar to that of the second embodiment, except that, in the packaging structure of the third embodiment, two grooves 132 are provided on the same side wall of the housing 130. The two grooves are parallel to each other and located at different heights of the side wall of the housing 130. The cross-sections of the two grooves 132 are, for example, rectangular. Compared to the second embodiment, increasing the number of grooves 132 further extends the intrusion path of external gas, thereby enhancing the anti-sulfurization effect of the packaging structure. Of course, more grooves can be provided as needed, and the cross-sectional shapes of the different grooves can be the same or different. A combination of multiple grooves can achieve a better anti-sulfurization effect.

[0041] Figure 5A cross-sectional view of the packaging structure of the fourth embodiment of the present invention is shown; the fourth embodiment is similar to the first embodiment, except that in the fourth embodiment, a baffle 133 is provided at a position corresponding to the shell 130 and the buckle 131, the top surface of the encapsulation body 150 is higher than the root of the buckle 131, and the gap between the longitudinal portion of the buckle 131 and the inner side wall of the shell 130 is small. In the process of forming the encapsulation body 150 by the encapsulation material, the area near the buckle 131 is insufficiently filled in the gap between the buckle 131 and the shell 130 due to the effect of surface tension, such as Figure 6 As shown, the baffle 133 is, for example, disposed around the buckle 131. By isolating the buckle 131 from the enclosure 150 by the baffle 133, the aforementioned problem can be effectively avoided, and the risk of delamination can be reduced. The baffle 133 is, for example, an integral structure with the housing 130. The baffle 133 can also reduce the amount of encapsulating material used to form the enclosure 150, thereby reducing costs.

[0042] Figure 7 and Figure 8 The following are a cross-sectional view and a schematic diagram of the packaging structure of the fifth embodiment of the present invention. The packaging structure of the fifth embodiment is different from that of the fourth embodiment in that, on the basis of the fourth embodiment, a groove 132 is further provided at the contact point between the inner side wall of the shell 130 and the encapsulation body 150. The groove 132 extends laterally along the inner side wall of the shell 130, so that the intrusion path of external gas is extended as a whole on the inner side of the side wall of the shell 130. Figure 8 As shown, groove 132 is staggered from baffle 133. When groove 132 and baffle 133 are located at the same height on the sidewall of outer shell 130, groove 132 is interrupted at baffle 133 to prevent groove 132 from interfering with baffle 133. Of course, groove 132 can also be positioned lower than baffle 133 and staggered longitudinally from baffle 133. Furthermore, depending on needs and practical circumstances, groove 132 can be provided on the inner sides of all sidewalls of outer shell 130, or only on the inner sides of some sidewalls. Grooves 132 can extend laterally in a straight line, or in other patterns such as a wavy line. Of course, grooves 132 can also be provided in segments.

[0043] This packaging structure is not only compact in structure, but also increases the contact area (interconnection area) between the shell and the enclosure, reduces the risk of delamination, and increases the connection strength; through the groove design on the inner wall of the shell, the path for external gas invasion is extended, thereby enhancing the anti-sulfurization effect. Furthermore, the groove can also compensate for the cooling shrinkage of the enclosure during the formation process of the enclosure (including but not limited to glue filling, injection molding, etc.), so that the enclosure has a structure embedded in the groove, further enhancing the connection strength and reducing the risk of delamination. In the case where the top surface of the enclosure is higher than the root of the buckle, a baffle is also provided for the buckle to avoid the problem of insufficient filling of the gap between the buckle and the shell by the encapsulation material due to the influence of surface tension. The packaging structure provided by the utility model has an excellent anti-sulfurization effect and can be better applied in harsh application scenarios such as offshore wind power, papermaking, mining, rubber, etc.

[0044] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or device comprising the element.

[0045] While embodiments of the present invention have been described above, these embodiments do not exhaustively describe all details, nor do they limit the present invention to the specific embodiments described. Obviously, numerous modifications and variations are possible based on the above description. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better utilize the present invention and its modifications. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A packaging structure, characterized in that: include: base plate; a housing, located on the bottom plate; a substrate, located on the bottom plate, on which an integrated circuit is arranged, and located in the housing; An encapsulation body is filled in the shell and covers at least the substrate and the integrated circuit on the substrate. The back surface of the substrate is exposed from the lower surface of the encapsulation body and is connected to the bottom plate through an interconnection layer.

2. The packaging structure according to claim 1, wherein: Also includes: a cover plate, located on the envelope, the cover plate being embedded in the shell and located on the envelope paper; The inner side walls on two opposite sides of the shell are provided with connecting structures, and the connecting structures connect the shell and the cover plate; The connecting structure connects the cover plate and the housing together.

3. The packaging structure according to claim 2, wherein: The connection structure is a buckle, the cover plate has a bayonet corresponding to the buckle, and the buckle connects the shells together through the bayonet on the cover plate.

4. The packaging structure according to claim 1, wherein: A groove is further provided at the contact point between at least a portion of the inner side wall of the shell and the enclosure.

5. The packaging structure according to claim 4, wherein: The cross section of the groove includes any one of an arc shape, a semicircular shape, and a polygonal shape, and the groove extends laterally along the inner side wall of the shell.

6. The packaging structure according to claim 4, wherein: There are multiple grooves, and the multiple grooves are respectively located at different heights of the inner side wall of the shell.

7. The packaging structure according to claim 6, wherein: The cross-sectional shapes of the plurality of grooves are the same or different, and the plurality of grooves are parallel to each other.

8. The packaging structure according to claim 4, wherein: The depth of the groove is no more than 70% of the thickness of the shell.

9. The packaging structure according to claim 2, wherein: The top surface of the encapsulation body is not lower than the root of the connection structure.

10. The packaging structure according to claim 9, wherein: A baffle is provided on the inner side wall of the shell at a position corresponding to the connecting structure.

11. The packaging structure according to claim 10, wherein: The baffle and the shell are an integrated structure.

12. The packaging structure according to claim 11, wherein: At least a portion of the inner sidewall of the shell is further provided with a groove at the contact point with the enclosure, and the groove is staggered with the baffle.

13. The packaging structure according to claim 1, wherein: The substrate is a copper-clad ceramic substrate.

14. The packaging structure according to claim 1, wherein: The housing is located on the bottom plate via the interconnection layer.

15. The packaging structure according to claim 1, wherein: The integrated circuit includes at least one of an IGBT, an FRD, a MOSFET, and a driver chip.

16. The packaging structure according to claim 2, wherein: The integrated circuit further comprises a connection terminal perpendicular to the substrate, the cover plate has a through hole corresponding to the connection terminal, and at least a portion of the top of the connection terminal passes through the through hole of the cover plate.

17. The packaging structure according to claim 1, wherein: The encapsulation body is one of a silicone gel layer, a liquid epoxy resin layer, a laminate of epoxy resin and silicone gel, or a plastic encapsulation body.

18. The packaging structure according to claim 1, wherein: The bottom plate is a heat dissipation bottom plate.

19. The packaging structure according to claim 1, wherein: The lower surface of the base plate is provided with heat dissipation fins.

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