Electronic package
By using a combination of bridge chips and wiring structures in optical communication semiconductor packages, electrical connections between electronic components and optical engines are achieved, solving the problem of long electrical signal transmission paths, improving data transmission efficiency and reducing power consumption.
Patent Information
- Application Number
- CN202422430824.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-09-30
- Filing Date
- 2024-10-09
- Publication Date
- 2025-09-12
- Estimated Expiration
- 2034-10-09
AI Technical Summary
The electrical signal transmission path in existing optical communication semiconductor packages is too long, resulting in increased data transmission loss and power consumption, and cannot meet the rapidly growing data transmission needs in the future.
A combination of a bridge chip, a wiring structure, electronic components and an optical engine is used to achieve electrical connection between the electronic components and the optical engine through the bridge chip, shorten the electrical signal transmission path, and form conductive columns and line structures on the cladding layer and the wiring structure to support the electrical connection.
Effectively shorten the electrical signal transmission path, reduce data transmission loss and power consumption, and improve data transmission efficiency.
Smart Images
Figure CN223333792U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to a semiconductor device, and more particularly to an electronic package with an optical engine. Background Art
[0002] With the booming electronics industry, electronic products are increasingly becoming more multifunctional and high-performance. The application of fifth-generation (5G) communication technology has expanded to various fields, including the Internet of Things (IoT), Industrial Internet of Things (IIoT), cloud computing, artificial intelligence (AI), autonomous vehicles, and healthcare. With the expansion of these applications, a vast amount of data is generated, requiring efficient transmission, computation, and storage. The surge in demand for data transmission is driving the industry to replace electricity with light as the data transmission medium, thereby increasing transmission capacity, efficiency, and distance, while reducing energy consumption.
[0003] See also Figure 1 FIG1 is a schematic cross-sectional view of a conventional semiconductor package 1 for optical communications. The semiconductor package 1 includes a circuit board 10, a substrate 11, a semiconductor chip 12, and an optical transceiver module 13 disposed on the circuit board 10. The semiconductor chip 12 is mounted on the substrate 11, and the optical transceiver module 13 is mounted on the circuit board and connected to an optical fiber 14.
[0004] However, in the aforementioned optical communication semiconductor package 1, the semiconductor chip 12 needs to pass through the substrate 11 and the circuit board 10 to transmit electrical signals to the optical transceiver module 13, resulting in an excessively long electrical signal transmission path, causing data transmission loss and increased power consumption.
[0005] See also Figure 2 To solve the aforementioned problem, the industry has developed another semiconductor package 2 for optical communication. It mainly places a semiconductor chip 22 and an optical device 23 for connecting to an optical fiber 24 on a substrate 21. The substrate 21 is then placed on a circuit board 20. The optical device 23 can transmit electrical signals to the semiconductor chip 22 through the substrate 21, thereby simplifying the path of electrical signal transmission.
[0006] However, regardless of the above Figure 1 and Figure 2 The problem of the electrical signal transmission path of semiconductor packages is still too long, which cannot meet the rapid and substantial growth of data transmission needs in future technologies and products.
[0007] Therefore, how to overcome the above-mentioned problems of the prior art has become a topic that needs to be solved urgently. Utility Model Content
[0008] In view of the various defects of the above-mentioned prior art, the present application provides an electronic package, including: a bridge chip; a wiring structure, arranged on the bridge chip; an electronic component, arranged on the wiring structure; and an optical engine, arranged on the wiring structure, so that the electronic component and the optical engine are electrically connected to each other through the bridge chip, wherein the optical engine includes a packaging structure, a semiconductor component arranged in the packaging structure, and an optical chip module connected to the packaging structure.
[0009] The present application also provides a method for manufacturing an electronic package, comprising: providing a bridge chip having a wiring structure formed thereon; and arranging an electronic component and an optical engine on the wiring structure so that the electronic component and the optical engine are electrically connected to each other through the bridge chip, wherein the optical engine includes a packaging structure, a semiconductor component arranged in the packaging structure, and an optical chip module connected to the packaging structure.
[0010] The aforementioned electronic package and its manufacturing method further include placing the bridge chip on the first carrier, and forming a covering layer on the first carrier to cover the bridge chip.
[0011] The aforementioned electronic package and its manufacturing method further include forming a plurality of conductive pillars on the first carrier, and allowing the coating layer to cover the plurality of conductive pillars.
[0012] The aforementioned electronic package and its manufacturing method further include forming the wiring structure on the covering layer, and electrically connecting the wiring structure to the bridge chip.
[0013] The aforementioned electronic package and its manufacturing method further include disposing one side of the wiring structure on a second carrier, removing the first carrier to expose the covering layer, and then forming a circuit structure on the covering layer.
[0014] The aforementioned electronic package and its manufacturing method further include disposing one side of the circuit structure on a third carrier, and removing the second carrier to expose the wiring structure.
[0015] The aforementioned electronic package and its manufacturing method further include arranging the electronic component and the optical engine on the wiring structure, and electrically connecting the electronic component and the optical engine to the wiring structure.
[0016] The aforementioned electronic package and its manufacturing method further include forming a packaging layer on the wiring structure to cover the electronic component and the optical engine, and partially exposing the optical engine from the packaging layer.
[0017] The aforementioned electronic package and its manufacturing method further include removing the third carrier and placing the bridge chip on a substrate.
[0018] The aforementioned electronic package and its manufacturing method further include placing the substrate on a circuit board.
[0019] In the aforementioned electronic package and its manufacturing method, the optical engine is connected to an optical fiber. As can be seen from the above, the electronic package and its manufacturing method of the present application mainly include a bridge chip on one side of the wiring structure and an electronic component and an optical engine on the other side. The bridge chip, electronic component, and optical engine are electrically connected to the wiring structure, and the electronic component and the optical engine are electrically connected to each other through the bridge chip, thereby shortening the electrical transmission path and reducing data transmission loss and power consumption. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 The figure is a cross-sectional view of a conventional semiconductor package used in optical communications.
[0021] Figure 2 It is a cross-sectional schematic diagram of another conventional semiconductor package used for optical communication.
[0022] Figures 3A to 3G Schematic cross-sectional view of the electronic package and its manufacturing method of the present application.
[0023] Figure 4 Schematic cross-sectional view of the optical engine of the electronic package of the present application.
[0024] Main component symbols
[0025] 1,2 Semiconductor packages
[0026] 10,20 circuit boards
[0027] 11,21 base plate
[0028] 12,22 Semiconductor Chips
[0029] 13 Optical transceiver module
[0030] 14,24 fiber
[0031] 23 Optical Devices
[0032] 3 Electronic packaging
[0033] 301 first bearing member
[0034] 302 second bearing member
[0035] 303 third bearing member
[0036] 304 conductive metal layer
[0037] 305 conductive column
[0038] 31 bridge chip
[0039] 31a Active surface
[0040] 31b Non-active surface
[0041] 310 conductive bumps
[0042] 32 cladding
[0043] 33 Wiring Structure
[0044] 34 Line structure
[0045] 340 conductive elements
[0046] 35 Electronic components
[0047] 36 Optical Engine
[0048] 360 package structure
[0049] 361 Semiconductor Components
[0050] 362 optical chip module
[0051] 371 Underfill
[0052] 372 Encapsulation Layer
[0053] 38 substrate
[0054] 380 solder balls
[0055] 39 Circuit Board
[0056] 40 optical fibers. DETAILED DESCRIPTION
[0057] The following describes the implementation of the present application through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.
[0058] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of this application. Therefore, they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed in this application without affecting the efficacy and purpose that can be achieved by this application. At the same time, terms such as "upper", "first", "second", "third", "one", etc. quoted in this specification are only for the convenience of description and are not used to limit the scope of the implementation of this application. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of this application without substantially changing the technical content.
[0059] See also Figures 3A to 3G , which is a cross-sectional schematic diagram of the electronic package and its manufacturing method of the present application.
[0060] like Figure 3A As shown, a conductive metal layer 304 is formed on the first carrier 301 , and a plurality of conductive pillars 305 are formed on the conductive metal layer 304 and at least one bridge chip 31 is connected thereto.
[0061] The bridge chip 31 has an active surface 31 a and an inactive surface 31 b opposite to each other. The inactive surface 31 b of the bridge chip 31 is mounted on the first carrier 301 via an adhesive layer, and a plurality of conductive bumps 310 are formed on the active surface 31 a.
[0062] In one embodiment, the first carrier 301 is, for example, glass; the conductive metal layer 304 is, for example, a Ti (titanium) / copper (Cu) metal layer; the material forming the conductive column 305 can be copper or other metals; the bridge chip 31 is, for example, a fan-out embedded bridge (FOEB) chip.
[0063] In addition, a release layer may be disposed between the first carrier 301 and the conductive metal layer 304 to facilitate subsequent removal of the first carrier 301 .
[0064] like Figure 3B As shown, a covering layer 32 covering the plurality of conductive pillars 305 and the bridge chip 31 is formed on the first carrier 301 .
[0065] Furthermore, the cladding layer 32 may be thinned so that one end of the plurality of conductive pillars 305 and one end of the plurality of conductive bumps 310 are exposed outside the cladding layer 32 .
[0066] In one embodiment, the coating layer 32 is made of an insulating material, such as polyimide (PI), epoxy resin, or a packaging material. The coating layer can be formed by molding, lamination, or coating.
[0067] like Figure 3C As shown, a wiring structure 33 is formed on the cladding layer 32, and the wiring structure 33 is electrically connected to the bridge chip 31 (a plurality of conductive bumps 310) and a plurality of conductive pillars 305. The wiring structure 33 is, for example, a redistribution layer (RDL) structure.
[0068] like Figure 3D As shown, one side of the wiring structure 33 is set on the second carrier 302, and the first carrier 301 and the conductive metal layer 304 are removed to expose the other end of the cladding layer 32 and the multiple conductive pillars 305, and then a circuit structure 34 is formed on the cladding layer 32, and the circuit structure 34 is electrically connected to the multiple conductive pillars 305.
[0069] Then, a plurality of conductive elements 340 are disposed on the circuit structure 34 . The plurality of conductive elements 340 are, for example, solder balls.
[0070] like Figure 3E As shown, one side of the circuit structure 34 and the plurality of conductive elements 340 is disposed on the third carrier 303 , and the second carrier 302 is removed to expose the wiring structure 33 .
[0071] Then, an electronic component 35 and an optical engine 36 are set on the wiring structure 33, and the electronic component 35 and the optical engine 36 are electrically connected to the wiring structure 33, so that the electronic component 35 and the optical engine 36 can be electrically connected to each other through the bridge chip 31, wherein the optical engine 36 protrudes from the side of the cladding layer 32 and the wiring structure 33 for subsequent connection of optical fibers.
[0072] The electronic component 35 may be an active component such as a switch chip, a system-on-chip (SOC), a high-bandwidth memory (HBM) chip, or other functional chip, or a passive component such as a resistor, capacitor, or inductor. The electronic component 35 may be electrically connected to the wiring structure 33 in a flip-chip manner via a plurality of conductive bumps such as solder bumps, copper bumps, or other conductive bumps.
[0073] Please also refer to Figure 4The optical engine 36 includes a package structure 360, a semiconductor device 361 disposed within the package structure 360, and an optical chip module 362 mounted on the package structure 360. The package structure 360 is, for example, a fan-out package-on-package (FO-PoP) structure. The semiconductor device 361 is, for example, an electronic integrated circuit (EIC). The optical chip module 362 (PIC module) includes, for example, a coupler, an optical chip, a total internal reflection mirror, and a fiber array unit (FAU). The optical engine 36 can be electrically connected to the wiring structure 33 via a plurality of conductive bumps, such as solder bumps or copper bumps.
[0074] A bottom filler 371 may be formed between the electronic component 35 and the optical engine 36 and the wiring structure 33, and a packaging layer 372 may be formed on the wiring structure 33 to cover the electronic component 35 and the optical engine 36, with a portion of the optical engine 36 exposed outside the packaging layer 372 for subsequent connection to optical fibers.
[0075] like Figure 3F As shown, the third carrier 303 is removed to obtain the electronic package 3 of the present application. Alternatively, the electronic package 3 can be placed on one side of a substrate 38 via a plurality of conductive elements 340 , and a plurality of solder balls 380 can be implanted on the other side of the substrate 38 .
[0076] like Figure 3G As shown, the electronic package 3 can also be placed on an external device such as a circuit board 39 via the substrate 38 and a plurality of solder balls 380 , and the optical engine 36 can be connected to the optical fiber 40 .
[0077] Through the above-mentioned process, the present application also provides an electronic package 3, including: a bridge chip 31; a wiring structure 33, arranged on the bridge chip 31; an electronic component 35, arranged on the wiring structure 33; and an optical engine 36, arranged on the wiring structure 33, so that the electronic component 35 and the optical engine 36 are electrically connected to each other through the bridge chip 31, wherein the optical engine 36 includes a packaging structure 360, a semiconductor component 361 arranged in the packaging structure 360, and an optical chip module 362 connected to the packaging structure 360.
[0078] The electronic package 3 further includes a circuit structure 34 for the bridge chip 31 to be disposed thereon; a plurality of conductive pillars 305 disposed on the circuit structure 34; and a coating layer 32 formed on the circuit structure 34 and coating the bridge chip 31 and the plurality of conductive pillars 305, wherein the wiring structure 33 is formed on the coating layer 32.
[0079] The electronic package 3 further includes a substrate 38 for the bridge chip 31 (circuit structure 34 ) to be mounted thereon, wherein the circuit structure 34 can be electrically connected to the substrate 38 via a plurality of conductive elements 340 .
[0080] The electronic package 3 further includes a circuit board 39 for the substrate 38 to be mounted on. The substrate 38 can be electrically connected to the circuit board 39 via a plurality of solder balls 380 , and the optical engine 36 can be connected to the optical fiber 40 .
[0081] In summary, the electronic package and its manufacturing method of the present application mainly provide a bridge chip on one side of the wiring structure and an electronic component and an optical engine on the other side, and the bridge chip, electronic component and optical engine are electrically connected to the wiring structure, so that the electronic component and the optical engine can be electrically connected to each other through the bridge chip, thereby shortening the path of electrical transmission and reducing the loss and power consumption of data transmission.
[0082] The above embodiments are intended only to illustrate the principles and effects of this application and are not intended to limit this application. Persons skilled in the art may modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application shall be as set forth in the claims.
Claims
1. An electronic package, characterized in that: include: Bridge chip; a wiring structure provided on the bridge chip; electronic components, disposed on the wiring structure; as well as An optical engine is disposed on the wiring structure so that the electronic component and the optical engine are electrically connected to each other through the bridge chip. The optical engine includes a packaging structure, a semiconductor component disposed in the packaging structure, and an optical chip module connected to the packaging structure.
2. The electronic package according to claim 1, wherein The electronic package also includes a circuit structure on which the bridge chip is arranged.
3. The electronic package according to claim 2, wherein: The electronic package also includes a plurality of conductive pillars arranged on the circuit structure.
4. The electronic package according to claim 2, wherein: The electronic package further includes a covering layer formed on the circuit structure to cover the bridge chip.
5. The electronic package according to claim 4, wherein: The wiring structure is formed on the cladding layer and is electrically connected to the bridge chip.
6. The electronic package according to claim 1, wherein: The electronic package also includes a substrate on which the bridge chip is mounted.
7. The electronic package according to claim 6, wherein: The electronic package also includes a circuit board on which the substrate is mounted.
8. The electronic package according to claim 1, wherein: The electronic package also includes a packaging layer formed on the wiring structure to cover the electronic element and the optical engine, and a portion of the optical engine is exposed outside the packaging layer.
9. The electronic package according to claim 1, wherein: The optical engine is connected to the optical fiber.