Heat dissipation structure and sound box

Abstract

The utility model discloses a heat radiation structure and a sound box, the heat radiation structure comprises a housing, a sealing cover, a master controller and a heat radiation assembly, and the housing is provided with an accommodation space; the sealing cover is installed in the containing space and divides the containing space into a first bin and a second bin spaced from the first bin, a window is formed in the sealing cover in a penetrating mode, one end of the window is communicated with the first bin, and the other end of the window is communicated with the second bin; the main controller comprises a main board used for being connected with an external power supply and at least one IC chip fixed on the main board, the main board is installed on the shell, and the main board and the IC chip are both located in the first chamber; the heat dissipation assembly comprises heat conduction silica gel and a radiator, the heat conduction silica gel is located in the first bin and coats the IC chip, one end of the radiator is connected with the heat conduction silica gel, and the other end of the radiator is located in the window. Heat of the radiator can be directly released into the second bin, excessive heat is prevented from being located in the first bin, heat dissipation of the radiator is more direct, and the heat dissipation efficiency is higher.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation structures of electronic products, in particular to a heat dissipation structure and a speaker. Background Art

[0002] The main controller of speaker products on the market today generally includes a motherboard and an IC chip installed on the motherboard. The main controller is fixed to the inner wall of the speaker shell. In order to reduce the temperature of the main controller, the heat dissipation method usually adopted is to first stick a piece of relatively soft thermal conductive silicone on the IC chip, then lock the radiator to the thermal conductive silicone, and finally lock the sealing cover to form a protective space to protect the main controller and the radiator together.

[0003] However, after the radiator absorbs the heat from the IC chip, it will release it into the protective space. Only a small amount of heat will be released into the external sound cavity through the wire holes on the sealing cover, and most of the heat will continue to remain in the protective space. This will make the heat dissipation of the main controller indirect and the heat dissipation efficiency very low. Utility Model Content

[0004] The purpose of the utility model is to provide a heat dissipation structure and a speaker to solve the technical problem that the sealing cover and the outer shell of the existing speaker form a protective space, the radiator absorbs the heat from the IC chip and releases it into the protective space, only a small amount of heat is released into the external sound cavity through the wire holes on the sealing cover, and most of the heat continues to remain in the protective space, which makes the heat dissipation of the main controller indirect and the heat dissipation efficiency very low.

[0005] The utility model provides a heat dissipation structure, comprising:

[0006] a housing, wherein the housing is provided with a receiving space;

[0007] a sealing cover, the sealing cover being installed in the accommodating space and dividing the accommodating space into a first chamber and a second chamber spaced apart from the first chamber, the sealing cover being provided with a window, one end of the window being in communication with the first chamber and the other end of the window being in communication with the second chamber;

[0008] a main controller, the main controller comprising a mainboard for connecting to an external power supply and at least one IC chip fixed to the mainboard, the mainboard being mounted on the housing, the mainboard and the IC chip being both located in the first compartment;

[0009] The heat dissipation component includes thermally conductive silicone and a radiator. The thermally conductive silicone is located in the first chamber and coated on the IC chip. One end of the radiator is connected to the thermally conductive silicone and the other end is located in the window.

[0010] Furthermore, the radiator includes a heat dissipation base and a plurality of heat dissipation fins. The heat dissipation base is located in the first chamber. The heat dissipation base is connected to the thermal conductive silicone. Each of the heat dissipation fins is protruded from a side of the heat dissipation base away from the thermal conductive silicone. Each of the heat dissipation fins is located in the window.

[0011] Furthermore, the heat dissipation base is "T"-shaped, and the heat dissipation base includes a top plate and a support plate protruding from the bottom of the top plate. The heat dissipation fins are protruding from the side of the top plate away from the support plate, and the support plate is connected to the thermal conductive silicone.

[0012] Furthermore, the heat dissipation structure also includes an annular rubber pad located in the first chamber, the annular rubber pad is clamped between the heat dissipation base and the sealing cover, one end of the heat dissipation fin is connected to the heat dissipation base, and the other end passes through the annular rubber pad and is located in the window.

[0013] Furthermore, the heat dissipation structure further includes a plurality of first fasteners, the sealing cover is further provided with a plurality of first through-holes, the heat dissipation base is provided with a plurality of first threaded holes, and the first fasteners pass through the first through-holes and are connected to the first threaded holes.

[0014] Furthermore, the sealing cover is further provided with a groove communicating with the second chamber, and the first through-hole and the window both extend through the bottom wall of the groove to the inner wall of the first chamber.

[0015] Furthermore, the heat dissipation structure further includes at least one speaker and at least one wire, the housing further includes at least one first embedding hole communicating with the second chamber, the sealing cover further includes at least one wire hole, one end of the wire hole communicating with the first chamber and the other end communicating with the second chamber, the speaker is mounted on the first embedding hole, one end of the wire is connected to the speaker, and the other end passes through the wire hole and is connected to the main controller; and / or,

[0016] The heat dissipation structure further includes a passive sound basin, and the housing is further provided with a second embedding hole communicating with the second chamber, and the passive sound basin is mounted on the second embedding hole.

[0017] Furthermore, the outer shell includes an upper cover body and a lower cover body, the lower cover body includes a bottom shell, an annular enclosure and a boss, the upper cover body is connected to the bottom shell and encloses the bottom shell to form the accommodating space, the annular enclosure and the boss are both protruding from the inner wall of the bottom shell, the sealing cover is connected to the annular enclosure, the sealing cover, the annular enclosure and a part of the bottom shell enclose to form the first chamber, the upper cover body, the sealing cover, the annular enclosure and another part of the bottom shell enclose to form the second chamber, the boss is located in the first chamber, and the main controller is installed on the boss.

[0018] Furthermore, the heat dissipation structure also includes a plurality of second fasteners, the sealing cover is also provided with a plurality of second through-holes, the lower cover body also includes a plurality of studs protruding from the inner wall of the bottom shell, the studs are provided with second threaded holes, and the second fasteners pass through the second through-holes and are connected to the second threaded holes.

[0019] The utility model also provides a speaker, comprising the heat dissipation structure as described above.

[0020] Compared with the prior art, the beneficial effects of the present invention are:

[0021] The sealing cover of the utility model divides the accommodating space of the shell into a first chamber and a second chamber. The main controller is installed in the first chamber. A window is opened on the sealing cover. One end of the radiator is connected to the IC chip of the main controller through thermal conductive silicone, and the other end of the radiator is located in the window. This can prevent foreign objects from damaging the main controller and the heat dissipation component. At the same time, the heat of the radiator can be directly released into the second chamber, avoiding excessive heat from being retained in the first chamber, so that the heat dissipation of the radiator is more direct and the heat dissipation efficiency is higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 The structure of the speaker provided by the embodiment of the utility model is shown as follows Figure 1 ;

[0023] Figure 2 for Figure 1 Exploded diagram;

[0024] Figure 3 for Figure 1 sectional view of

[0025] Figure 4 A schematic diagram of the structure of the speaker provided by an embodiment of the present invention after removing the upper cover and the speaker;

[0026] Figure 5 for Figure 4 Exploded diagram;

[0027] Figure 6A schematic diagram of the structure of the main controller and wire combination provided by an embodiment of the present utility model;

[0028] Figure 7 A schematic structural diagram of a radiator provided in an embodiment of the present utility model;

[0029] Figure 8 A schematic diagram of the structure of the lower cover and the power cord after being combined according to an embodiment of the present utility model;

[0030] Figure 9 A schematic structural diagram of a sealing cover provided in an embodiment of the present utility model;

[0031] Figure 10 The structure of the speaker provided by the embodiment of the utility model is shown as follows Figure 2 .

[0032] In the picture:

[0033] 10. Housing; 11. Accommodation space; 111. First chamber; 112. Second chamber; 12. First embedding hole; 13. Second embedding hole; 14. Upper cover; 15. Lower cover; 151. Bottom shell; 152. Annular plate; 153. Boss; 1531. Third threaded hole; 154. Stud; 1541. Second threaded hole; 16. Opening; 20. Sealing cover; 21. Window; 22. First through-hole; 23. Groove; 24. Wire hole; 25. Second through-hole; 30. Main controller; 31. Main Board; 32. IC chip; 33. Third perforation; 40. Heat dissipation component; 41. Thermal conductive silicone; 42. Radiator; 421. Heat dissipation base; 4211. Top plate; 4212. Support plate; 4213. First threaded hole; 422. Heat dissipation fin; 50. Ring rubber pad; 60. First fastener; 70. Speaker; 80. Wire; 90. Passive sound basin; 100. Second fastener; 200. Buffer pad; 300. Sealing pad; 400. Third fastener; 500. Power cord; 600. Socket. DETAILED DESCRIPTION

[0034] Below, the present invention is further described in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0035] See also Figures 1 to 7As shown, an embodiment of the present invention discloses a heat dissipation structure, which is mainly used in speakers. The heat dissipation structure includes a shell 10, a sealing cover 20, a main controller 30 and a heat dissipation assembly 40. The shell 10 is provided with a accommodating space 11; the sealing cover 20 is installed in the accommodating space 11, and the sealing cover 20 divides the accommodating space 11 into a first chamber 111 and a second chamber 112 separated from the first chamber 111. The first chamber 111 and the second chamber 112 are not directly connected. A window 21 is provided through the sealing cover 20, one end of the window 21 is connected to the first chamber 111, and the other end is connected to the second chamber 112. The volume of the first chamber 111 is smaller than that of the second chamber 112.

[0036] The main controller 30 includes a motherboard 31 for connecting to an external power source and at least one IC chip 32 fixed to the motherboard 31. The motherboard 31 is mounted on the inner wall of the housing 10. There are two IC chips 32, and both the motherboard 31 and the IC chip 32 are located in the first chamber 111. The heat dissipation component 40 includes a thermally conductive silicone rubber 41 and a heat sink 42. The thermally conductive silicone rubber 41 is located in the first chamber 111 and is coated on the IC chip 32. One end of the heat sink 42 is connected to the thermally conductive silicone rubber 41 and the other end is located in the window 21. The heat of the heat sink 42 can be directly released into the second chamber 112, making the heat dissipation of the heat sink 42 more direct and more efficient. Of course, in order to prevent the heat sink 42 from loosening from the thermally conductive silicone rubber 41, the heat sink 42 can also be fixed to the motherboard 31 with a clamp as in computer assembly.

[0037] In this embodiment, the radiator 42 includes a heat dissipation base 421 and a plurality of heat dissipation fins 422. The heat dissipation base 421 is located in the first chamber 111. The heat dissipation base 421 is connected to the thermal conductive silicone 41. The plurality of heat dissipation fins 422 are spaced apart and arranged side by side. Each heat dissipation fin 422 is protruded from the side of the heat dissipation base 421 away from the thermal conductive silicone 41. Each heat dissipation fin 422 is located in the window 21. The heat in the main controller 30 can be transferred to the heat dissipation fin 422 in turn through the thermal conductive silicone 41 and the heat dissipation base 421.

[0038] In some embodiments, the heat dissipation base 421 is a "T"-shaped structure. The heat dissipation base 421 includes a top plate 4211 and a support plate 4212 protruding from the bottom of the top plate 4211. The heat dissipation fins 422 protrude from the side of the top plate 4211 away from the support plate 4212. The support plate 4212 is connected to the thermal conductive silicone 41. This structure of the heat dissipation base 421 can reduce the weight of the radiator 42 and reduce the probability of the radiator 42 falling off the thermal conductive silicone 41 during use.

[0039] The heat dissipation structure also includes an annular rubber pad 50 located in the first chamber 111. The annular rubber pad 50 is clamped between the heat dissipation base 421 and the sealing cover 20. One end of the heat dissipation fin 422 is connected to the heat dissipation base 421, and the other end passes through the annular rubber pad 50 and is located in the window 21 to increase the buffering force between the sealing cover 20 and the radiator 42 to avoid damage to the main controller 30.

[0040] Please see further Figures 2 to 10 The heat dissipation structure also includes a plurality of first fasteners 60, the sealing cover 20 is further provided with a plurality of first through-holes 22, and the heat dissipation base 421 is provided with a plurality of first threaded holes 4213. The first fasteners 60 pass through the first through-holes 22 and are connected with the first threaded holes 4213, thereby fixing the radiator 42 on the sealing cover 20. The first fasteners 60 are screws.

[0041] The sealing cover 20 is also provided with a groove 23 connected to the second chamber 112. The bottom wall of the groove 23 is a planar structure. The first perforation 22 and the window 21 extend from the bottom wall of the groove 23 to the inner wall of the first chamber 111, so as to facilitate the processing of the first perforation 22 and the window 21 during the production process of the sealing cover 20.

[0042] The heat dissipation structure also includes at least one speaker 70 and at least one wire 80. The housing 10 is also provided with at least one first embedded hole 12 connected to the second chamber 112. The sealing cover 20 is also provided with at least one wire hole 24. One end of the wire hole 24 is connected to the first chamber 111 and the other end is connected to the second chamber 112. The speaker 70 is installed on the first embedded hole 12, one end of the wire 80 is connected to the speaker 70, and the other end passes through the corresponding wire hole 24 and is connected to the main controller 30, thereby fixing the speaker 70 on the housing 10. The second chamber 112 can be used as a sound cavity, and the wire 80 can be snapped into the main controller 30.

[0043] The heat dissipation structure also includes a passive sound cone 90. The housing 10 is further provided with a second embedding hole 13 communicating with the second chamber 112. The passive sound cone 90 is mounted on the second embedding hole 13 to enhance the bass effect of the speaker.

[0044] In this embodiment, the shell 10 includes an upper cover body 14 and a lower cover body 15. The upper cover body 14 and the lower cover body 15 are both hemispherical. The lower cover body 15 includes a bottom shell 151, an annular enclosure 152 and a boss 153. The upper cover body 14 is connected to the bottom shell 151 and encloses the bottom shell 151 to form the said accommodating space 11. The annular enclosure 152 and the boss 153 are both protrudingly provided on the inner wall of the bottom shell 151. The sealing cover 20 is connected to the annular enclosure 152. The sealing cover 20, the annular enclosure 152 and a part of the bottom shell 151 enclose the said first chamber 111. The upper cover body 14, the sealing cover 20, the annular enclosure 152 and another part of the bottom shell 151 enclose the said second chamber 112. The boss 153 is located in the first chamber 111. The main controller 30 is installed on the boss 153 to facilitate fixing the main controller 30 on the lower cover body 15.

[0045] The heat dissipation structure also includes a plurality of second fasteners 100, the sealing cover 20 is also provided with a plurality of second through-holes 25, the lower cover 15 also includes a plurality of studs 154 protruding from the inner wall of the bottom shell 151, the studs 154 are provided with second threaded holes 1541, and the second fasteners 100 pass through the second through-holes 25 and are connected to the second threaded holes 1541, thereby installing the sealing cover 20 on the inner wall of the accommodating space 11. The second fasteners 100 are screws.

[0046] The heat dissipation structure also includes a buffer pad 200 and a sealing pad 300. The buffer pad 200 and the sealing pad 300 are both annular structures. The buffer pad 200 is clamped between the main controller 30 and the boss 153 to enhance the buffering performance between the main controller 30 and the boss 153; the sealing pad 300 is clamped between the sealing cover 20 and the annular enclosure 152 to enhance the waterproof sealing and buffering performance between the sealing cover 20 and the annular enclosure 152.

[0047] The heat dissipation structure also includes multiple third fasteners 400, the main controller 30 is also provided with multiple third through-holes 33, and the boss 153 is provided with multiple third threaded holes 1531. The third fasteners 400 pass through the third through-holes 33 and are connected to the third threaded holes 1531, thereby installing the main controller 30 on the boss 153. The third fasteners 400 are screws.

[0048] In some embodiments, the heat dissipation structure also includes a power cord 500 and multiple sockets 600. The housing 10 is also provided with a through hole and multiple openings 16. The through hole and the opening 16 are both connected to the first chamber 111. One end of the power cord 500 is connected to the main controller 30, and the other end passes through the through hole for connection to an external power supply. The multiple sockets 600 are all electrically connected to the main controller 30, and each socket 600 is respectively located in each opening 16 to facilitate connection with external devices.

[0049] The utility model also discloses a sound box, comprising the heat dissipation structure as described above.

[0050] The installation of the heat dissipation structure includes the following steps:

[0051] Step S101: Assemble the main controller 30 and the heat dissipation assembly 40. First, apply thermal conductive silicone 41 on the IC chip 32 of the main controller 30, install the heat sink 42 on the thermal conductive silicone 41, and then install the annular rubber pad 50 on the heat sink 42.

[0052] Step S102: Fix the main controller 30 to the lower cover 15. Install the mainboard 31 of the main controller 30 in step S101 in the lower cover 15 of the housing 10 through the buffer pad 200. Pass the power cord 500 connected to the main controller 30 through the through hole of the lower cover 15. The sockets 600 connected to the main controller 30 are respectively located in the openings 16 of the lower cover 15. Then, install the sealing cover 20 on the lower cover 15 through the sealing gasket 300. The heat dissipation fins 422 of the radiator 42 are located in the windows 21 of the sealing cover 20.

[0053] Step S103: Fix the speaker 70 to the upper cover 14. First, install the speaker 70 in the first embedding hole 12 of the upper cover 14, and install the passive sound cone 90 in the second embedding hole 13 of the upper cover 14. Then, connect one end of the wire 80 to the speaker 70, and pass the other end through the corresponding wire hole 24 of the sealing cover 20 and connect it to the main controller 30 by plugging.

[0054] Step S104 , assembling the housing 10 , installing the upper cover 14 in step S103 on the lower cover 15 in step S102 , and completing the assembly.

[0055] To sum up, the sealing cover 20 of the present invention divides the accommodating space 11 of the shell 10 into a first chamber 111 and a second chamber 112. The main controller 30 is installed in the first chamber 111. A window 21 is provided on the sealing cover 20. One end of the radiator 42 is connected to the IC chip 32 of the main controller 30 through a thermally conductive silicone 41. The other end of the radiator 42 is located in the window 21. This can prevent foreign objects from damaging the main controller 30 and the heat dissipation component 40. At the same time, the heat of the radiator 42 can be directly released into the second chamber 112, avoiding excessive heat in the first chamber 111, so that the heat dissipation of the radiator 42 is more direct and the heat dissipation efficiency is higher.

[0056] The above embodiments are only preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and replacements made by technicians in this field on the basis of the present invention fall within the scope of protection required by the present invention.

Claims

1. A heat dissipation structure, characterized in that: include: a housing, wherein the housing is provided with a receiving space; a sealing cover, the sealing cover being installed in the accommodating space and dividing the accommodating space into a first chamber and a second chamber spaced apart from the first chamber, the sealing cover being provided with a window, one end of the window being in communication with the first chamber and the other end of the window being in communication with the second chamber; a main controller, the main controller comprising a mainboard for connecting to an external power supply and at least one IC chip fixed to the mainboard, the mainboard being mounted on the housing, the mainboard and the IC chip being both located in the first compartment; The heat dissipation component includes thermally conductive silicone and a radiator. The thermally conductive silicone is located in the first chamber and coated on the IC chip. One end of the radiator is connected to the thermally conductive silicone and the other end is located in the window.

2. The heat dissipation structure according to claim 1, wherein: The radiator includes a heat dissipation base and a plurality of heat dissipation fins. The heat dissipation base is located in the first chamber and is connected to the thermal conductive silicone. Each of the heat dissipation fins is protruded from a side of the heat dissipation base away from the thermal conductive silicone, and each of the heat dissipation fins is located in the window.

3. The heat dissipation structure according to claim 2, wherein: The heat dissipation base is "T"-shaped and includes a top plate and a support plate protruding from the bottom of the top plate. The heat dissipation fins are protruding from a side of the top plate away from the support plate, and the support plate is connected to the thermal conductive silicone.

4. The heat dissipation structure according to claim 2, wherein: The heat dissipation structure also includes an annular rubber pad located in the first chamber, which is clamped between the heat dissipation base and the sealing cover. One end of the heat dissipation fin is connected to the heat dissipation base, and the other end passes through the annular rubber pad and is located in the window.

5. The heat dissipation structure according to claim 2, wherein: The heat dissipation structure further includes a plurality of first fasteners, the sealing cover is further provided with a plurality of first through-holes, the heat dissipation base is provided with a plurality of first threaded holes, and the first fasteners pass through the first through-holes and are connected to the first threaded holes.

6. The heat dissipation structure according to claim 5, characterized in that: The sealing cover is further provided with a groove communicating with the second chamber, and the first through-hole and the window both extend through the bottom wall of the groove to the inner wall of the first chamber.

7. The heat dissipation structure according to claim 1, wherein: The heat dissipation structure further includes at least one speaker and at least one wire, the housing further includes at least one first embedding hole communicating with the second chamber, the sealing cover further includes at least one wire hole, one end of the wire hole communicating with the first chamber and the other end communicating with the second chamber, the speaker is mounted on the first embedding hole, one end of the wire is connected to the speaker, and the other end passes through the wire hole and is connected to the main controller; and / or, The heat dissipation structure further includes a passive sound basin, and the housing is further provided with a second embedding hole communicating with the second chamber, and the passive sound basin is mounted on the second embedding hole.

8. The heat dissipation structure according to claim 1, wherein: The outer shell includes an upper cover body and a lower cover body, the lower cover body includes a bottom shell, an annular enclosure and a boss, the upper cover body is connected to the bottom shell and encloses the bottom shell to form the accommodating space, the annular enclosure and the boss are both protruding from the inner wall of the bottom shell, the sealing cover is connected to the annular enclosure, the sealing cover, the annular enclosure and a part of the bottom shell enclose the first chamber, the upper cover body, the sealing cover, the annular enclosure and another part of the bottom shell enclose the second chamber, the boss is located in the first chamber, and the main controller is installed on the boss.

9. The heat dissipation structure according to claim 8, wherein: The heat dissipation structure also includes a plurality of second fasteners, the sealing cover is also provided with a plurality of second through-holes, the lower cover body also includes a plurality of studs protruding from the inner wall of the bottom shell, the studs are provided with second threaded holes, and the second fasteners pass through the second through-holes and are connected to the second threaded holes.

10. A speaker, characterized in that: The heat dissipation structure comprises the heat dissipation structure according to any one of claims 1 to 9.

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