Photosensitive film suitable for circuit board etching process

Abstract

The utility model discloses a photosensitive film suitable for a circuit board etching process, which comprises a photosensitive film body, an anti-sticking layer mounted at the lower end of the photosensitive film body and made of release paper, a protective layer mounted at the upper end of the photosensitive film body, the protective layer comprises a buffer layer and a bottom layer, the bottom layer is mounted at the lower end of the buffer layer, and the buffer layer is made of a polyethylene film. The bottom layer is made of a polyimide film, the shading layer is mounted at the upper end of the buffer layer and made of a black polyester film, and a plurality of buffer cavities are formed in the buffer layer. According to the photosensitive film, the wear resistance of the photosensitive film body is improved through the wear-resistant layer, sunlight is shielded through the shading layer, the photosensitive film body is prevented from being influenced by long-time irradiation of the sunlight, impact force is relieved through the buffer layer, and meanwhile damage to the photosensitive film body is reduced through buffering and damping of the buffer cavity.

Description

Technical Field

[0001] The utility model relates to the field of photosensitive films, in particular to a photosensitive film suitable for a circuit board etching process. Background Art

[0002] Photosensitive film, also known as film or film paper, is made from a transparent plastic film with a certain thickness of photosensitive emulsion coated on it. Photosensitive film is also commonly used in circuit board etching processes. To ensure the effectiveness of the photosensitive film, a protective film is often applied to the outer end surface of the film to protect it from external forces. However, the protective film structure on existing photosensitive films is relatively simple and does not provide sufficient protection. Therefore, those skilled in the art have provided a photosensitive film suitable for circuit board etching processes to address the problems raised in the above background art. Utility Model Content

[0003] In order to solve the above technical problems, the utility model provides a photosensitive film suitable for the circuit board etching process, including a photosensitive film body, an anti-sticking layer is installed at the lower end of the photosensitive film body, and the anti-sticking layer material is release paper. A protective layer is installed at the upper end of the photosensitive film body, and the protective layer includes a buffer layer and a bottom layer. The bottom layer is installed at the lower end of the buffer layer, and the buffer layer material is a polyethylene film. The bottom layer material is a polyimide film. A light-shielding layer is installed at the upper end of the buffer layer, and the light-shielding layer material is a black polyester film. Several buffer cavities are arranged inside the buffer layer.

[0004] Preferably, a plurality of drawstrings are installed at the left and right ends of the protective layer.

[0005] Preferably, a wear-resistant layer is installed on the upper end of the light-shielding layer, and the material of the wear-resistant layer is polyetherketone.

[0006] Preferably, half of the dry powder is placed inside the buffer cavity, and half of the air is placed inside the buffer cavity.

[0007] Technical effects and advantages of this utility model:

[0008] The utility model improves the wear resistance of the photosensitive film body through the wear-resistant layer, blocks sunlight through the shading layer to prevent the photosensitive film body from being affected by long-term sunlight, alleviates impact force through the buffer layer, and at the same time, buffers and reduces shock through the buffer cavity to reduce damage to the photosensitive film body. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a schematic diagram of the structure of this application;

[0010] Figure 2 It is a structural diagram of the protective layer of this application;

[0011] Figure 3 It is a structural diagram of the buffer layer of the present application;

[0012] In the figure: 1. Photosensitive film body; 2. Anti-sticking layer; 3. Protective layer; 31. Buffer layer; 311. Buffer cavity; 312. Dry powder; 32. Bottom layer; 33. Light-shielding layer; 34. Wear-resistant layer; 4. Draw tape. DETAILED DESCRIPTION

[0013] The present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for purposes of illustration and description and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention and to enable those skilled in the art to understand the present invention and design various embodiments with various modifications suitable for specific applications.

[0014] See also Figures 1 to 3 In this embodiment, a photosensitive film suitable for a circuit board etching process is provided, including a photosensitive film body 1, an anti-sticking layer 2 is installed at the lower end of the photosensitive film body 1, and the anti-sticking layer 2 is made of release paper. A protective layer 3 is installed at the upper end of the photosensitive film body 1, and a plurality of pull tapes 4 are installed at the left and right ends of the protective layer 3. The protective layer 3 includes a buffer layer 31 and a bottom layer 32. The bottom layer 32 is installed at the lower end of the buffer layer 31. The buffer layer 31 is made of a polyethylene film, and the bottom layer 32 is made of a polyimide film. A light-shielding layer 33 is installed at the upper end of the buffer layer 31. The light-shielding layer 33 is made of a black polyester film. A wear-resistant layer 34 is installed at the upper end of the light-shielding layer 33. The wear-resistant layer 34 is made of polyether ketone. A plurality of buffer cavities 311 are arranged inside the buffer layer 31. Half of the dry powder 312 is placed inside the buffer cavity 311, and half of the air is arranged inside the buffer cavity 311.

[0015] The working principle of the present invention is as follows: the wear resistance of the photosensitive film body 1 is improved by the wear-resistant layer 34, the sunlight is blocked by the light-shielding layer 33 to prevent the long-term exposure of sunlight to the photosensitive film body 1, the impact force is alleviated by the buffer layer 31 to protect the photosensitive film body 1, and at the same time, the impact is buffered and shock-absorbing by the buffer cavity 311. At the same time, the spread of flames is reduced by the dry powder 312, the anti-sticking layer 2 is torn off to fit the photosensitive film body 1 to the circuit board, and then the protective layer 3 is removed by the pull tape 4 to enable the photosensitive film body 1 to start working.

[0016] Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without making any creative efforts should fall within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described and explained in this utility model shall be implemented in accordance with conventional means in the field unless otherwise specified or limited.

Claims

1. A photosensitive film suitable for a circuit board etching process, comprising a photosensitive film body (1), characterized in that: The lower end of the photosensitive film body (1) is provided with an anti-sticking layer (2), the anti-sticking layer (2) being made of release paper; the upper end of the photosensitive film body (1) is provided with a protective layer (3), the protective layer (3) comprising a buffer layer (31) and a bottom layer (32); the lower end of the buffer layer (31) is provided with a bottom layer (32), the buffer layer (31) being made of a polyethylene film, the bottom layer (32) being made of a polyimide film; the upper end of the buffer layer (31) is provided with a light-shielding layer (33), the light-shielding layer (33) being made of a black polyester film; and a plurality of buffer cavities (311) are provided inside the buffer layer (31).

2. The photosensitive film suitable for circuit board etching process according to claim 1, characterized in that: A plurality of drawstrings (4) are installed at the left and right ends of the protective layer (3).

3. The photosensitive film suitable for circuit board etching process according to claim 1, characterized in that: A wear-resistant layer (34) is installed on the upper end of the light-shielding layer (33), and the material of the wear-resistant layer (34) is polyether ketone.

4. The photosensitive film suitable for circuit board etching process according to claim 1, characterized in that: Half of the dry powder (312) is placed inside the buffer cavity (311), and half of the air is placed inside the buffer cavity (311).

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