Curing process equipment

Abstract

The utility model discloses curing process equipment. The curing process equipment comprises a process cavity, wherein a wafer to be subjected to film curing is placed in the process cavity; the lamp box is positioned at the upper part in the process cavity, and an ultraviolet light source is arranged in the lamp box and is used for providing ultraviolet light for curing the film; one end of the ventilation pipeline is connected with the lamp box, and the other end is communicated with the outside; and the rotating motor is assembled at a joint of the outside of the lamp box and the ventilation pipeline and is used for driving the lamp box to rotatably irradiate the surface of the wafer below, so that the illumination intensity of each area of the surface of the wafer is uniform. Interference factors of intermediate transmission media such as a belt can be removed, the service life of curing process equipment is prolonged, and the accuracy and adjustability of curing illumination in the curing process are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a curing process equipment. Background Art

[0002] Thin film deposition is one of the three core steps in wafer manufacturing, and the technical parameters of the thin film directly affect chip performance.

[0003] After the dielectric material is deposited on the wafer surface through a deposition process, a UV curing process, such as UV thermal treatment (UVTP), can be used as a post-treatment process to treat the deposited film and improve its performance. For example, UV curing can remove porogens from the film to achieve an ultra-low dielectric constant (K). However, in the actual curing process, due to the uneven irradiation range, problems such as poor porogen removal in localized areas of the film and adverse effects on the oxide network cross-linking can still occur.

[0004] Currently, a rotatable lamp box assembly is used as a UV irradiation device in curing process equipment to rotate and irradiate during the curing process of the dielectric material layer film on the surface of the wafer. However, the rotating mechanism in the existing rotatable lamp box assembly uses a belt to rotate and drive the UV lamp box to rotate. With long-term use, the belt will affect the accuracy of the lamp box rotation due to its limited service life. In addition, there is a risk of breakage in the belt drive, which will directly affect the normal use of the equipment. Moreover, the current single rotating mechanism needs to drive the two lamp boxes to rotate at the same time. Therefore, it is impossible to individually adjust the rotation mode of the corresponding lamp box according to the process conditions in each process chamber, and the adjustability of UV curing is poor.

[0005] In order to solve the above-mentioned problems existing in the prior art, this field urgently needs a processing technology for the curing process, which can remove the interference factors of intermediate transmission media such as belts, extend the service life of the curing process equipment, and improve the accuracy and adjustability of the curing light during the curing process, thereby improving the uniformity of the light on the curing surface. Utility Model Content

[0006] The following is a brief summary of one or more aspects to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceivable aspects and is neither intended to identify key or critical elements of all aspects nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that will be provided later.

[0007] In order to overcome the above-mentioned defects of the prior art, the utility model provides a curing process equipment that can eliminate interference factors of intermediate transmission media such as belts, extend the service life of the curing process equipment, and improve the accuracy and adjustability of the curing light during the curing process, thereby improving the uniformity of light on the curing surface.

[0008] Specifically, the curing process equipment provided according to the first aspect of the present invention includes: a process chamber, inside which the wafer to be cured is placed; a light box, located above the process chamber, with an ultraviolet light source inside, for providing ultraviolet light for curing the film; a ventilation duct, one end of which is connected to the light box and the other end is connected to the outside; and a rotating motor, assembled at the interface with the ventilation duct on the outside of the light box, for driving the light box to rotate and irradiate the surface of the wafer below, so that the light intensity of each area on the wafer surface is uniform.

[0009] Furthermore, in some embodiments of the present invention, the rotating motor is an annular hollow cup motor, which is sleeved at the interface between the ventilation duct and the light box.

[0010] Furthermore, in some embodiments of the present invention, the rotating motor includes a stator winding and a rotor, wherein the stator winding is fixed on the outside, the rotor is located between the stator winding and the ventilation duct, and is connected to the light box via the ventilation duct, and the rotor rotates according to the current passed through the stator winding to drive the light box to rotate.

[0011] Furthermore, in some embodiments of the present invention, the light box includes a first group of reflectors, wherein the first group of reflectors are two arc-shaped reflectors, which are respectively arranged on both sides of the ultraviolet light source, forming a semi-enclosed reflective cover above the ultraviolet light source to reflect the ultraviolet light emitted from the ultraviolet light source to both sides and above it downward for the first time.

[0012] Furthermore, in some embodiments of the present invention, the light box includes a second set of reflectors, and the second set of reflectors is located on the reflection path of the ultraviolet light reflected for the first time, so as to reflect the ultraviolet light at least a second time.

[0013] Furthermore, in some embodiments of the present invention, the second group of reflectors includes two reflective combination mirrors formed by a folded combination of two sub-reflectors, wherein the upper sub-reflector in the reflective combination mirror on the first side reflects the reflected light from the first group of reflectors for a second time, and the light after the second reflection is received by the lower sub-reflector in the reflective combination mirror on the second side and reflected for a third time.

[0014] Furthermore, in some embodiments of the present invention, a convex structure is provided on the outside of the ventilation duct, and the ventilation duct is limited and fixed by snapping the convex structure into an external limiting groove.

[0015] Furthermore, in some embodiments of the present invention, it further includes: an encoder connected to the light box, for obtaining the rotation angle of the light box.

[0016] Furthermore, some embodiments of the present invention further include: a light detection device, which is arranged inside the process chamber and is used to detect the light intensity of each area on the surface of the wafer during the curing process of rotating irradiation of the light box.

[0017] Furthermore, in some embodiments of the present invention, it further includes: a transparent window located between the light box and the wafer in the process chamber, for isolating the light box and the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or characteristics may have the same or similar reference numerals.

[0019] Figure 1 A schematic structural diagram of a curing process device provided according to some embodiments of the present utility model is shown;

[0020] Figure 2 for Figure 1 A schematic diagram of the structure of the ventilation pipeline in the curing process equipment shown;

[0021] Figure 3 for Figure 1 A schematic top view of the light box and the rotating motor in the curing process equipment shown; and

[0022] Figure 4 A flow chart of a curing process method provided according to some embodiments of the present invention is shown.

[0023] Reference numerals:

[0024] 100 Curing process equipment;

[0025] 110 process chamber;

[0026] 120 light boxes;

[0027] 130 rotating electrical machines;

[0028] 131 stator winding;

[0029] 132 rotor;

[0030] 140 wafer trays;

[0031] 150 ventilation duct;

[0032] 151 convex structure;

[0033] 160 limiter;

[0034] 161 limit slot;

[0035] 162 sealing ring;

[0036] 200 wafers; and

[0037] Steps S410 to S450. DETAILED DESCRIPTION

[0038] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and functions of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this utility model are limited to this implementation. On the contrary, the purpose of introducing the utility model in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide an in-depth understanding of the present invention, the following description will contain many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0039] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0040] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood to refer to the orientations depicted in that section and the accompanying drawings. These relative terms are used solely for convenience of description and do not necessarily imply that the devices described herein must be manufactured or operated in a specific orientation. Therefore, they should not be construed as limiting the present invention.

[0041] It is understood that although the terms "first," "second," "third," etc. may be used herein to describe various components, regions, layers, and / or portions, these components, regions, layers, and / or portions should not be limited by these terms, and these terms are merely used to distinguish different components, regions, layers, and / or portions. Thus, a first component, region, layer, and / or portion discussed below may be referred to as a second component, region, layer, and / or portion without departing from some embodiments of the present invention.

[0042] As mentioned above, the rotating mechanism in existing rotatable light box assemblies uses a belt to drive the UV lamp box. Over time, the belt's limited service life can affect the accuracy of the lamp box's rotation. Furthermore, the belt drive presents a risk of breakage, which directly impacts the normal operation of the equipment. Furthermore, the current single rotating mechanism requires simultaneous rotation of both lamp boxes. Therefore, it's impossible to individually adjust the rotation of the corresponding lamp box based on the process conditions within each process chamber, resulting in poor adjustability for UV curing.

[0043] In order to solve the above-mentioned problems existing in the prior art, the utility model provides a curing process equipment, which can extend the service life of the curing process equipment and improve the accuracy and adjustability of the curing light during the curing process, thereby improving the light uniformity of the curing surface.

[0044] The following describes the operating principles of the aforementioned curing process equipment in conjunction with examples of several curing process methods. Those skilled in the art will appreciate that these examples of curing process methods are merely non-limiting embodiments of the present invention, intended to clearly demonstrate the main concepts of the present invention and provide specific solutions that facilitate implementation by the public. They are not intended to limit the full operating methods or functionality of the curing process equipment. Similarly, the curing process equipment is merely a non-limiting embodiment of the present invention and does not constitute a limitation on the implementation of the various steps in these curing process methods.

[0045] Please see Figure 1 , Figure 1 A schematic structural diagram of a curing process device provided according to some embodiments of the present utility model is shown.

[0046] like Figure 1As shown, in some embodiments of the present invention, the curing process equipment 100 may include a process chamber 110, within which a wafer 200 to be cured is placed. A wafer tray 140 for supporting the wafer 200 is also provided within the process chamber 110. Optionally, a wafer fixing component, a wafer heating component, etc. may be added to the wafer tray 140 according to process requirements. Furthermore, to increase equipment output, the curing process equipment 100 may include multiple process chambers 110 for simultaneously performing UV curing treatments on multiple wafers with different curing process requirements.

[0047] A light box 120 may be provided above the process chamber 110 of the curing process equipment 100. The light box 120 may contain an ultraviolet light source, such as an ultraviolet lamp, for providing ultraviolet light for curing the film.

[0048] Furthermore, the light box 120 may include at least one set of reflectors to increase the energy intensity irradiated onto the wafer 200 below. Specifically, the light box 120 may include a first set of reflectors. Optionally, the first set of reflectors may include two arc-shaped reflectors, one disposed on either side of the UV lamp, forming a semi-enclosed reflector cover above the UV lamp. This reflects the UV light emitted from the UV lamp to the sides and above downward for the first time, reflecting it onto the surface of the wafer 200, thereby improving the utilization rate of the UV light.

[0049] Preferably, a second set of reflectors can be provided between the first set of reflectors in the light box 120 and the wafer 200. Since the first set of reflectors has an arc-shaped reflective structure, some of the ultraviolet light reflected downward by the first set of reflectors will irradiate the outside of the wafer 200, resulting in some loss of ultraviolet light. Therefore, the second set of reflectors can be provided on the reflection path of the ultraviolet light reflected for the first time, so that the ultraviolet light is reflected at least a second time by the second set of reflectors, thereby further improving the utilization rate of the ultraviolet light.

[0050] Specifically, optionally, the second group of reflectors can be arranged relatively below the first group of reflectors. The second group of reflectors can include two reflective combination mirrors each formed by forming an angled combination of two sub-reflectors, wherein the upper sub-reflector in the reflective combination mirror on the first side can reflect the light reflected by the first group of reflectors for a second time, and the light after the second reflection can be received by the lower sub-reflector in the reflective combination mirror on the second side and reflected for a third time, thereby reflecting this portion of ultraviolet light onto the surface of the wafer 200, thereby minimizing the loss of ultraviolet light irradiated to the wafer 200.

[0051] Those skilled in the art will appreciate that the UV light reflection scheme comprising the first and second sets of reflectors in the light box 120 is merely a non-limiting embodiment of the present invention, intended to clearly demonstrate the main concept of the present invention and to provide a specific solution that is convenient for the public to implement, rather than to limit the scope of protection of the present invention. Alternatively, in other embodiments, those skilled in the art may also adopt other UV light reflection structures based on the concept of the present invention to reflect UV light, thereby achieving the same technical effect.

[0052] like Figure 1 As shown, the lamp box 120 may also be provided with a ventilation line 150 connected to the outside to promptly exhaust ozone from the lamp box 120 after the curing process is completed. Furthermore, the ventilation line 150 may also allow external cooling air to flow in to provide sufficient air flow to ensure the normal operation of any UV lamps and / or the associated power sources used for the lamps.

[0053] Further, see Figure 2 , Figure 2 for Figure 1 The schematic diagram of the structure of the ventilation pipeline in the curing process equipment is shown in FIG. Figure 2 As shown, optionally, in order to better fix the ventilation duct 150, a limiting portion 160 can be provided on the outside of the ventilation duct 150. Specifically, a convex structure 151 can be provided on the outside of the ventilation duct 150. By completely snapping the convex structure 151 of the ventilation duct 150 into the external auxiliary limiting groove 161, it can be ensured that the ventilation duct 150 has been installed in the correct position and is firmly positioned, and will not be displaced during the subsequent rotation of the light box 120. Preferably, a sealing ring 162 can also be provided between the convex structure 151 and the limiting groove 161 that is snap-fitted therewith to seal the ventilation duct 150.

[0054] Please continue as Figure 1 As shown, inside the process chamber 110, outside the light box 120, a rotary motor 130 may be included. The rotary motor 130 is connected to the light box 120 and is used to drive the light box 120 to rotate and irradiate the surface of the wafer 200. Compared with directly controlling the movement of the ultraviolet lamp, the light box 120 is controlled to rotate as a whole by the rotary motor 130. Since the light box 120 also includes an ultraviolet light reflection structure, the rotation of the light box 120 is adjusted as a whole, which can make the irradiation range of the ultraviolet light larger and the light intensity on the surface of the wafer 200 more uniform. In addition, if the rotary motor 130 is set inside the light box 120, it is not only troublesome to disassemble, but also because ozone has a high oxidizing property, the rotary motor 130 is easily oxidized and corroded. Therefore, the rotary motor 130 provided outside the light box 120 can protect the rotary motor 130 and effectively extend its equipment life.

[0055] Further, see Figure 3 , Figure 3 for Figure 1 A schematic top view of the light box and rotating motor in the curing process equipment shown.

[0056] like Figure 3 As shown, since the rotating motor 130 needs to be connected to the light box 120, the rotating motor 130 can preferably be a ring-shaped coreless motor. The coreless motor has a hollow structure in the middle and can be sleeved at the interface between the light box 120 and the ventilation duct 150, thereby saving installation space.

[0057] Specifically, if Figure 3 As shown, the rotating motor 130 may include a stator winding 131 and a rotor 132. The stator winding 131 may be fixed on the outside, while the rotor 132 is a permanent magnet located inside the stator winding 131 and connected to the light box 120 via a ventilation duct 150. The rotor 132 can rotate based on the current flowing through the stator winding 131. In the rotating motor 130, the strength and direction of the magnetic field generated by the stator winding 131 can be adjusted by adjusting the current flowing through the stator winding 131. For example, increasing the current can enhance the magnetic field strength, increase the driving force between the stator winding 131 and the rotor 132, and increase the torque and rotational speed of the rotor 132. Reducing the current weakens the magnetic field strength, reducing the driving force and the torque and speed of the rotor 132. By adjusting the magnitude and direction of the current entering the stator winding 131 in real time, the controller can accurately adjust the magnetic field of the stator winding 131, thereby controlling the motion state of the rotor 132. This precise control capability enables the rotor 132 to rotate according to the expected target rotation angle and target rotation speed, thereby achieving precise control of the rotational positioning.

[0058] In this embodiment, the coreless motor's weight and moment of inertia are significantly reduced, thereby reducing the mechanical energy loss of rotor 132. This structural change in rotor 132 significantly improves the motor's operating characteristics, resulting in not only outstanding energy savings but also more sensitive control and stable operation, making it a highly efficient energy conversion device.

[0059] Furthermore, in the above embodiment, the interference factors of intermediate transmission media such as belts are eliminated, and the working condition of the rotary motor 130 is adjusted by the rotation angle of the light box 120, so that the curing process is more accurate and the response speed is faster.

[0060] In addition, the curing process equipment 100 provided by the present invention may further include a controller. The controller may be used to implement each step of the curing process processing method provided by another aspect of the present invention.

[0061] Specifically, see Figure 4 , Figure 4 A flow chart of a curing process method provided according to some embodiments of the present invention is shown.

[0062] like Figure 4 As shown, in some embodiments of the present invention, the curing process processing method may include the following steps: First, step S410 may be performed: according to the curing process requirements in the process chambers of the curing process equipment, the preset rotation angle of the light box in each process chamber is determined.

[0063] In some preferred embodiments, to increase equipment throughput, the curing process equipment 100 may include multiple process chambers 110 for performing UV curing treatments on multiple wafers with different curing process requirements. For example, if the thin film on the surface of the wafer in the first process chamber 110 requires that the curing be completed as quickly as possible, the preset rotation speed of the light box 120 in the process chamber 110 may be set to a larger value to speed up the UV curing process. If the thin film on the surface of the wafer in the remaining process chambers 110 requires that a more uniform curing effect be achieved, the preset rotation speed of the light box 120 in the remaining process chambers 110 may be set to a smaller value to ensure that the UV light is evenly irradiated on all areas of the wafer.

[0064] According to the curing process requirements in each process chamber, the preset rotation angles of the light box 120 at multiple moments in the T time period can be set and calibrated as Wherein, m represents the number of the preset rotation angle of the light box at different times within the time T, m=1, 2, 3...t, and t is a positive integer.

[0065] Next, step S420 may be performed: obtaining the current rotation angle of the light box in each process chamber.

[0066] Optionally, each process chamber 110 in the curing process equipment 100 may further include an encoder. The encoder may be connected to the light box 120 to obtain the rotation angle of the light box 120 and transmit a signal indicating the rotation angle of the light box 120 to the controller. The encoder may obtain the actual rotation angle of the corresponding light box 120 via the actual rotation angle of the rotor 132 in the rotary motor 130.

[0067] Specifically, the encoder can achieve accurate monitoring and feedback of the actual rotation angle of the rotor 132 through a combination of a photoelectric conversion device and a code disk. During operation, the rotor 132 can be mounted with a code disk. The optical pattern or code lines on the code disk will change as the rotor 132 rotates. The photoelectric conversion device, such as a photodiode or photodetector, can be fixed to a fixed structure. By detecting the changes in the optical pattern or code lines on the code disk, the optical signal is converted into a corresponding electrical signal. These electrical signals are then processed by the circuit inside the encoder, converted into digital signals, and output to the controller. The processing module in the controller can receive and analyze these signals in real time, thereby understanding the current position and current rotation angle of the rotor 132.

[0068] The actual rotation angle of the light box 120 at multiple moments in the T time period can be obtained by the encoder and calibrated as Wherein, m represents the number of the actual rotation angle of the light box at different moments within the time T, m=1, 2, 3...t, and t is a positive integer.

[0069] Next, step S430 may be performed: determining a rotation deviation coefficient of each light box according to each current rotation angle and each preset rotation angle.

[0070] Specifically, the actual rotation angle can be and preset rotation angles Combined with the calculation formula of the deviation coefficient of the rotation angle, the rotation deviation coefficient R is determined adc , where the deviation coefficient of the rotation angle can be calculated as follows:

[0071]

[0072] in, is the actual rotation angle of the light box, is the preset rotation angle of the light box, m represents the number of the actual rotation angle of the light box and the preset rotation angle at different times in time T, m = 1, 2, 3..., t is a positive integer. In this embodiment, the rotation deviation coefficient R adc Refers to the difference between the actual rotation angle of the light box 120 and the preset rotation angle during the T time period. The greater the difference between the two, the greater the rotation deviation coefficient R adc The larger the value, the less accurate the rotation positioning of the light box 120 is, which will have a greater impact on the uniformity of light illumination for thin film curing on the wafer surface.

[0073] Next, step S440 may be performed: obtaining a comparison result between the rotation deviation coefficient of each light box and a deviation coefficient threshold range.

[0074] In some optional embodiments, the deviation coefficient threshold range can be set first. Then, the processing module in the controller can determine the rotation deviation coefficient R adc Is it within the deviation coefficient threshold range? If the rotation deviation coefficient falls within R adc If the deviation coefficient falls within the threshold range, the light box 120 does not experience inaccurate rotational positioning, and the current rotation angle of the light box 120 can be maintained and continue to rotate. Specifically, the controller does not change the amount of current flowing into the stator winding 131 of the rotating motor 130, thereby not changing the strength and direction of the magnetic field generated by the stator winding 131, and further, does not change the driving force between the stator winding 131 and the rotor 132. In other words, the torque and rotational speed of the rotor 132 are not adjusted.

[0075] If the rotation deviation coefficient R adc If the angle falls outside the deviation coefficient threshold range, that is, the light box 120 may be rotated and positioned inaccurately, it is determined that the current rotation angle of the light box 120 needs to be adjusted.

[0076] Next, step S450 may be performed: adjusting the rotation angle of each light box to a corresponding target rotation angle according to each comparison result, so as to make the light intensity on the wafer surface in each process chamber uniform.

[0077] Specifically, in some embodiments, any deviation coefficient threshold within the deviation coefficient threshold range can be selected as a reference coefficient, and then the difference between the deviation coefficient threshold and the rotation deviation coefficient is obtained. Based on the difference between the two, the target adjustment current can be determined.

[0078] Specifically, the controller adjusts the current flowing into the stator winding 131 of the rotating motor 130 to the target adjustment current, thereby changing the strength and direction of the magnetic field generated by the stator winding 131, and then changing the driving force between it and the rotor 132, that is, changing the torque and rotation speed of the rotor 132, so that the rotation angle of the light box 120 is adjusted to the target rotation angle.

[0079] Preferably, the median value within the deviation coefficient threshold range may be selected as the reference coefficient, which can extend the holding time of the rotation angle of the light box 120 after a single rotation angle adjustment.

[0080] Furthermore, in some optional embodiments of the present invention, the curing process apparatus 100 may further include a light detection device. The light detection device may be disposed within the process chamber 110 and configured to detect the light intensity of various areas on the surface of the wafer 200 in real time during the curing process in which the light box 120 performs rotational irradiation.

[0081] In addition, the curing process equipment 100 may optionally include a transparent window. The transparent window may be located between the light box 120 and the wafer 200 in the process chamber 110 to isolate the light box 120 from the wafer 200, thereby preventing particles falling from above due to the rotation of the light box 120 during the curing process of the wafer from contaminating the thin film on the surface of the wafer 200.

[0082] Although the above methods are illustrated and described as a series of acts for simplicity of explanation, it is to be understood and appreciated that these methods are not limited by the order of the acts, as some acts may occur in a different order and / or concurrently with other acts from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art according to one or more embodiments.

[0083] In summary, the present invention provides a curing process equipment, which can extend the service life of the curing process equipment and improve the accuracy and adjustability of the curing light during the curing process, thereby improving the light uniformity of the cured surface.

[0084] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A curing process equipment, characterized in that, include: A process chamber, in which the wafer to be cured is placed; a light box, located above the process chamber, and provided with an ultraviolet light source therein for providing ultraviolet light for curing the film; a ventilation pipe, one end of which is connected to the light box and the other end is connected to the outside; as well as A rotary motor is mounted on the outside of the light box at the interface with the ventilation duct, and is used to drive the light box to rotate and illuminate the surface of the wafer below, so that the light intensity of each area on the wafer surface is uniform.

2. The curing process equipment according to claim 1, characterized in that: The rotating motor is an annular hollow cup motor, which is sleeved at the interface between the ventilation duct and the light box.

3. The curing process equipment according to claim 2, characterized in that: The rotating motor includes a stator winding and a rotor, wherein the stator winding is fixed on the outside, the rotor is located between the stator winding and the ventilation duct, and is connected to the light box via the ventilation duct. The rotor rotates according to the current passed through the stator winding to drive the light box to rotate.

4. The curing process equipment according to claim 1, characterized in that: The light box includes a first group of reflectors, wherein the first group of reflectors is two arc-shaped reflectors, which are respectively arranged on both sides of the ultraviolet light source, forming a semi-enclosed reflective cover above the ultraviolet light source to reflect the ultraviolet light emitted from the ultraviolet light source to both sides and above it downward for the first time.

5. The curing process equipment according to claim 4, characterized in that: The light box includes a second group of reflectors, which are located on the reflection path of the ultraviolet light reflected for the first time and are used to reflect the ultraviolet light for at least a second time.

6. The curing process equipment according to claim 5, characterized in that: The second group of reflectors includes two reflective combination mirrors formed by two-sided sub-reflectors forming a folded angle combination. Among them, the sub-reflector located at the upper part of the reflection combination mirror on the first side reflects the reflected light through the first group of reflectors for a second time, and the light after the second reflection is received by the sub-reflector located at the lower part of the reflection combination mirror on the second side and reflected for a third time.

7. The curing process equipment according to claim 1, characterized in that: A convex structure is provided on the outer side of the ventilation pipeline, and the ventilation pipeline is limited and fixed by inserting the convex structure into the external limiting groove.

8. The curing process equipment according to claim 1, characterized in that: Also includes: An encoder is connected to the light box and is used to obtain the rotation angle of the light box.

9. The curing process equipment according to claim 1, characterized in that: Also includes: The light detection device is arranged inside the process chamber and is used to detect the light intensity of each area on the surface of the wafer during the curing process of the rotating irradiation of the light box.

10. The curing process equipment according to claim 1, characterized in that: Also includes: A transparent window is located between the light box and the wafer in the process chamber and is used to isolate the light box and the wafer.

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