Novel protective film die cutting upper waste discharge device

Through the new protective film die-cutting waste discharge device, the synergistic effect of connecting tape and transparent tape is used to solve the deformation problem of large-aperture protective film die-cutting process, realize automatic collection and efficient production, improve product quality and reduce costs.

CN223339581UActive Publication Date: 2025-09-16LANGFANG BEYOND OPTOELECTRONICS TECH CO LTD
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Patent Information

Application Number
CN202422841358.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-21
Publication Date
2025-09-16
Estimated Expiration
2034-11-21

AI Technical Summary

Technical Problem

In the prior art, when die-cutting a large-aperture protective film, the protective film body and the process carrier film are easily deformed due to the excessive size of the through-holes, affecting the subsequent die-cutting process and product size.

Method used

A new type of protective film die-cutting waste discharge device is adopted, which uses the synergistic effect of the connecting tape and transparent tape on the die roller to initially capture and adhere the hole waste, and provides cushioning through thick foam to prevent die-cutting deformation, and realizes automatic collection through the waste collection roller.

Benefits of technology

Effectively prevent the deformation of the protective film and the carrier film, improve the adhesion of waste materials, reduce product production costs, improve product yield, reduce die-cutting errors, and improve production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a novel protective film die cutting upper waste discharge device, and relates to the technical field of protective film die cutting, the novel protective film die cutting upper waste discharge device comprises two die rollers and limiting rollers, thick foam adheres to the outer side walls of the two die rollers, the two limiting rollers are symmetrically arranged above the die rollers, positioning sleeves are arranged on the outer surfaces of the limiting rollers in a surrounding mode, and the positioning sleeves are sleeved with the limiting rollers. An adhesive tape roller is arranged above one limiting roller; according to the device, a layer of connecting adhesive tape with proper viscidity is adhered to the interior of a cutter cavity, for punching product holes, of the die roller, hole waste generated in the die cutting process is preliminarily captured through the connecting adhesive tape, then the die roller is used for punching a protective film body and a manufacturing process bearing film, and the needed holes are formed; meanwhile, waste materials of the holes are adhered to the connecting adhesive tape in the cutter cavity, buffering is provided through the thick foam in the waste discharging process, deformation of the protective film in the die cutting process is prevented, the adhesion effect on the waste materials can be improved through the high flexibility of the thick foam, and the adhesive force of the waste materials is enhanced.
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Description

Technical Field

[0001] The utility model relates to the technical field of protective film die-cutting, in particular to a novel waste discharge device for protective film die-cutting. Background Art

[0002] Perforated protective film is a protective material widely used in the die-cutting industry. It typically has pre-die-cut holes of a specific shape to preserve specific areas on the surface covered by the film. The current industry approach to removing waste from perforated protective film involves laminating a layer of weak adhesive film beneath the protective film and process carrier film. A die is then used to punch holes through the protective film and process carrier film, allowing them to partially penetrate the weak adhesive film. The film is then removed and the waste from the two films is removed simultaneously.

[0003] However, the aforementioned waste removal process is generally suitable for products with smaller pore sizes. When using this process with products with larger pore sizes, after the weak adhesive film and pore waste are removed, the protective film and process carrier film are easily deformed due to the large through-holes in the protective film body and process carrier film, thus affecting the subsequent die-cutting process and product size. Therefore, those skilled in the art have provided a new waste removal device for protective film die-cutting to solve the problems raised in the above background technology. Utility Model Content

[0004] The purpose of the utility model is to provide a novel waste discharge device for die-cutting of protective films to solve the problems raised in the above background technology.

[0005] To achieve the above purpose, the present invention provides the following technical solutions:

[0006] A new type of protective film die-cutting waste discharge device includes two mold rollers and a limiting roller. Thick foam is adhered to the outer walls of the two mold rollers. Two limiting rollers are symmetrically arranged above the mold roller. Positioning sleeves are arranged around the outer surfaces of the limiting rollers. A tape roller is arranged above one limiting roller, and a waste collection roller is arranged above the other limiting roller.

[0007] As a further solution of the present invention: the thick foam is located in the punching knife cavity of the mold roller.

[0008] As a further solution of the present invention: a connecting tape is adhered to the outer surface of the thick foam, and an adhesive surface is provided on the side of the connecting tape away from the thick foam.

[0009] As a further solution of the present invention: a transparent tape is provided between the upper mold roller and the two limiting rollers.

[0010] As a further solution of the present invention: one end of the transparent tape is fixed on the waste collection roller, and the other end of the transparent tape is arranged on the tape roller in a loop.

[0011] As a further solution of the present invention: the adhesive surface of the transparent tape is close to the thick foam side.

[0012] As a further solution of the present invention, the adhesive surface of the transparent tape has a greater viscosity than the adhesive surface of the connecting tape.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] 1. This device adheres a layer of appropriately sticky connecting tape to the inside of the die cavity of the die roller where the product holes are punched. The connecting tape is used to initially capture the hole waste generated during the die-cutting process. The die roller is then used to punch the protective film body and the process carrier film to form the required holes. At the same time, the waste from these holes is adhered to the connecting tape in the die cavity. During the waste discharge process, thick foam is used to provide a buffer to prevent deformation of the protective film during the die-cutting process. The strong flexibility of the foam can also improve the adhesion effect and enhance the adhesion of the waste.

[0015] 2. This device uses a more sticky transparent tape to completely clean the hole waste on the mold roller, and uses the transparent tape to completely peel off and take away the hole waste attached to the preliminary tape. The device uses the synergistic effect of the transparent tape and the connecting tape to not only effectively adhere the waste, but also realize automatic collection through the waste collection roller, effectively avoiding the risk of deformation of the carrier film after the traditional waste discharge process, and the risk of deformation of the protective film body is also avoided, so that the carrier film always maintains its intact shape, which can effectively reduce product production costs and improve product yields. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the structure of a new type of waste discharge device for protective film die-cutting.

[0017] Figure 2 This is a three-dimensional diagram of a new type of waste discharge device for protective film die-cutting.

[0018] Figure 3 This is a three-dimensional view of the mold roller in a new type of protective film die-cutting waste discharge device.

[0019] Figure 4 This is a three-dimensional diagram of the limiting roller in a new type of protective film die-cutting waste discharge device.

[0020] In the figure: 1. Mold roller; 2. Thick foam; 3. Connecting tape; 4. Limiting roller; 5. Positioning sleeve; 6. Tape roller; 7. Transparent tape; 8. Waste collection roller. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention. Example 1

[0022] Reference Figure 1-3 This embodiment provides a new type of protective film die-cutting waste discharge device, including two mold rollers 1 and a limiting roller 4, characterized in that thick foam 2 is adhered to the outer walls of the two mold rollers 1, two limiting rollers 4 are symmetrically arranged above the mold roller 1, and a positioning sleeve 5 is arranged around the outer surface of the limiting roller 4. A tape roller 6 is arranged above one limiting roller 4, and a waste collection roller 8 is arranged above the other limiting roller 4.

[0023] The thick foam 2 is located in the punching knife cavity of the mold roller 1 , and a connecting tape 3 is adhered to the outer surface of the thick foam 2 , and a glue surface is provided on the side of the connecting tape 3 away from the thick foam 2 .

[0024] When this embodiment is in use, the device sticks a layer of connecting tape 3 with appropriate viscosity inside the knife cavity of the die roller 1 for punching the product hole, and uses the connecting tape 3 to preliminarily capture the hole waste generated in the die-cutting process, and then uses the die roller 1 to punch the protective film body and the process carrier film to form the required holes. At the same time, the waste from these holes is adhered to the connecting tape 1 in the knife cavity, and in the waste discharge process, the thick foam 2 is used to provide a buffer to prevent the deformation of the protective film during the die-cutting process. It can also improve the adhesion effect to the waste through its strong flexibility and enhance the adhesion of the waste. Example 2

[0025] Reference Figure 1-4 This embodiment is based on the previous embodiment, and is different from the previous embodiment in that a transparent tape 7 is provided between the upper mold roller 1 and the two limiting rollers 4, one end of the transparent tape 7 is fixed on the waste collection roller 8, and the other end of the transparent tape 7 is arranged around the tape roller 6, and the adhesive surface of the transparent tape 7 is close to the side of the thick foam 2, and the adhesive surface of the transparent tape 7 is more sticky than the adhesive surface of the connecting tape 3.

[0026] When the present embodiment is in use, after the waste material on the mold roller 1 is initially adhered by the connecting tape 3, the hole waste material on the mold roller 1 is comprehensively cleaned using a transparent tape 7 with stronger adhesion, and the hole waste material attached to the preliminary tape is completely peeled off and taken away by the transparent tape 7. The device can not only effectively adhere the waste material through the synergistic effect of the transparent tape 7 and the connecting tape 3, but also realize automatic collection through the waste collection roller, thereby reducing manual intervention and improving production efficiency. By using a combination of tapes with different adhesiveness, the adhesion and peeling of the waste material can be better controlled, the die-cutting error caused by waste retention can be reduced, and the quality of the die-cut products can be improved. The adhesion operation can be repeated to ensure that the hole waste material can be effectively cleaned after each die-cutting, to avoid deformation and to improve production efficiency. The risk of deformation of the carrier film after waste discharge in the traditional lower waste discharge process is effectively avoided, and the protective film body also avoids the risk of deformation, so that the carrier film always maintains its complete shape, which can effectively reduce the product production cost and improve the product yield.

[0027] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0028] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A novel protective film die-cutting waste discharge device, comprising two die rollers (1) and a limiting roller (4), characterized in that: Thick foam (2) is adhered to the outer side walls of the two mold rollers (1), two limiting rollers (4) are symmetrically arranged above the mold roller (1), and positioning sleeves (5) are arranged around the outer surfaces of the limiting rollers (4). A tape roller (6) is arranged above one limiting roller (4), and a waste collection roller (8) is arranged above the other limiting roller (4).

2. A novel waste discharge device for die-cutting protective film according to claim 1, characterized in that: The thick foam (2) is located in the punching knife cavity of the mold roller (1).

3. The novel waste discharge device for die-cutting protective film according to claim 1 is characterized in that: A connecting tape (3) is adhered to the outer surface of the thick foam (2), and an adhesive surface is provided on the side of the connecting tape (3) away from the thick foam (2).

4. The novel waste discharge device for die-cutting protective film according to claim 1 is characterized in that: A transparent tape (7) is provided between the upper mold roller (1) and the two limiting rollers (4).

5. The novel waste discharge device for protective film die cutting according to claim 4 is characterized in that: One end of the transparent tape (7) is fixed on the waste collection roller (8), and the other end of the transparent tape (7) is arranged around the tape roller (6).

6. The novel waste discharge device for protective film die cutting according to claim 4 is characterized in that: The adhesive surface of the transparent tape (7) is close to the side of the thick foam (2).

7. The novel waste discharge device for protective film die cutting according to claim 4 is characterized in that: The adhesive surface of the transparent adhesive tape (7) has greater viscosity than the adhesive surface of the connecting adhesive tape (3).