PI film laminating equipment

Abstract

The utility model discloses PI (Polyimide) film laminating equipment, belongs to the technical field of PI film laminating, and aims to solve the problems that a discharging roller is directly placed above a support frame, so that the discharging roller is easy to fall off, bubbles generated during laminating are difficult to discharge, and the laminating effect and the film forming quality are reduced. Comprising a workbench, a raw material mechanism, a heating assembly, a laminating mechanism and a winding assembly, the raw material mechanism, the heating assembly, the laminating mechanism and the winding assembly are sequentially arranged above the workbench from left to right, a fixing frame is fixedly connected to the left side of the upper portion of the workbench, and supporting plates are symmetrically and fixedly connected to the left side of the fixing frame; the rotating shafts are symmetrically and rotationally connected to the opposite faces of the supporting plates. Through the raw material mechanism, the used raw material roller can be quickly mounted and replaced, the working efficiency is improved, the mounting is stable, the stable operation of the raw material roller in the use process is ensured, and the use stability of the equipment is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of PI film lamination, and particularly relates to a PI film lamination device. Background Art

[0002] PI film, or polyimide film, is a polymer material with exceptional performance. Its growing application in high-tech fields such as semiconductors, electronics, automotive, medical devices, and aerospace offers broad opportunities for the development of the PI film industry. With continuous technological innovation and gradual cost reductions, the application areas of PI film are expected to expand further, and the market prospects are promising.

[0003] The prior art discloses a PI film laminating machine with patent announcement number CN211222100U. The above patent laminates the PI film and the heating resistor film by squeezing the first heating roller and the second heating roller during use. The first heating roller and the second heating roller convert electrical energy into heat energy and dissipate it, thereby greatly improving the lamination effect between the heating resistor film and the PI film. However, the following deficiencies still exist in actual use: From a practical point of view, the laminating machine lacks a fixing mechanism for the discharge roller. The discharge roller is directly placed above the support frame in the above utility model, which is prone to falling, resulting in the laminating machine being difficult to rotate stably during use, affecting the stability of the equipment. Moreover, when the equipment extrudes the two films through two heating rollers, it is difficult to discharge the bubbles generated during lamination, thereby reducing the lamination effect and the quality of the film.

[0004] Therefore, a PI film laminating device is needed to solve the problem in the prior art that the discharge roller is directly placed above the support frame, which is prone to falling and difficult to discharge bubbles generated during laminating, thereby reducing the laminating effect and film quality. Utility Model Content

[0005] The purpose of the present invention is to provide a PI film laminating device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a PI film laminating device, comprising a workbench, a raw material mechanism, a heating component, a laminating mechanism and a winding component, wherein the raw material mechanism, heating component, laminating mechanism and winding component are arranged above the workbench in sequence from left to right.

[0007] The raw material mechanism consists of a fixed frame, a support plate, a rotating shaft, a mounting block, an inverted U-shaped plate, a threaded rod, a positioning block, a raw material roller and a connecting block. The fixed frame is fixedly connected to the upper left side of the workbench, the support plate is symmetrically fixedly connected to the left side of the fixed frame, the rotating shaft is symmetrically rotatably connected to the opposite surface of the support plate, the mounting block is fixedly connected to the end of the rotating shaft away from the support plate, and a groove is provided on one side of the mounting block.

[0008] It should be noted in the scheme that the inverted U-shaped plate is symmetrically fixedly connected to the upper and lower sides of the mounting block, the threaded rod is threadedly connected to the upper and lower sides of the horizontal plate of the inverted U-shaped plate, and the positioning block is rotatably connected to the side of the threaded rod close to the groove, and the positioning block extends into the interior of the groove.

[0009] It is further worth mentioning that the connecting block is symmetrically fixedly connected to the two ends of the raw material roller, and the size of the connecting block is adapted to the groove. Positioning grooves are symmetrically opened on the upper and lower surfaces of the connecting block, and the positioning grooves are adapted to the size of the positioning block.

[0010] It should be further explained that the bonding mechanism is composed of a fixed plate, a bottom plate, an extrusion layer, a top plate, an electric push rod, a connecting plate, a connecting column, an upper plate and a spring. The fixed plate is symmetrically fixedly connected to the top of the workbench, the bottom plate is fixedly connected to the inner bottom of the two fixed plates, the top plate is fixedly connected to the inner top of the two fixed plates, the electric push rod is symmetrically fixedly connected to the bottom of the top plate, and the connecting plate is fixedly connected to the bottom of the electric push rod.

[0011] As a preferred embodiment, the connecting posts are symmetrically fixedly connected to the bottom of the connecting plate, the top surface of the upper plate is provided with a circular groove adapted to the connecting posts, and the connecting posts extend into the interior of the circular groove.

[0012] As a preferred embodiment, the spring is fixedly connected between the connecting plate and the upper plate, and the spring is sleeved on the outside of the connecting column.

[0013] As a preferred embodiment, extrusion layers are respectively provided on the opposite surfaces of the upper plate and the bottom plate.

[0014] Compared with the prior art, the PI film laminating device provided by the present invention comprises at least the following

[0015] Beneficial effects:

[0016] (1) Through the set raw material mechanism, the used raw material roller can be quickly installed and replaced, which improves work efficiency. The installation is stable, ensuring the stable operation of the raw material roller during use and improving the stability of the equipment.

[0017] (2) By setting up the bonding mechanism, the two extrusion layers are in close contact and extrusion, which can effectively expel the air between the PI film and the film, ensuring smoothness and absence of bubbles, thereby improving the overall bonding quality and product performance. It can also be applied to PI films of different thicknesses, thereby increasing the scope of application of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0019] Figure 2 It is a schematic diagram of the cross-sectional structure of the utility model;

[0020] Figure 3 This is a schematic diagram of the raw material mechanism structure of the present utility model;

[0021] Figure 4 It is a schematic structural diagram of the laminating mechanism of the present utility model.

[0022] In the figure: 1. workbench; 2. raw material mechanism; 3. heating component; 4. laminating mechanism; 5. winding component; 201. fixed frame; 202. support plate; 203. rotating shaft; 204. mounting block; 205. groove; 206. inverted U-shaped plate; 207. threaded rod; 208. positioning block; 209. raw material roller; 210. connecting block; 211. positioning groove; 401. fixed plate; 402. bottom plate; 403. extrusion layer; 404. top plate; 405. electric push rod; 406. connecting plate; 407. connecting column; 408. upper plate; 409. circular groove; 410. spring. DETAILED DESCRIPTION

[0023] The present invention will be further described below with reference to the embodiments.

[0024] See also Figure 1-4 The utility model provides a PI film laminating device, including a workbench 1, a raw material mechanism 2, a heating component 3, a laminating mechanism 4 and a winding component 5. The raw material mechanism 2, the heating component 3, the laminating mechanism 4 and the winding component 5 are arranged above the workbench 1 from left to right.

[0025] The raw material mechanism 2 consists of a fixed frame 201, a support plate 202, a rotating shaft 203, a mounting block 204, an inverted U-shaped plate 206, a threaded rod 207, a positioning block 208, a raw material roller 209 and a connecting block 210. The fixed frame 201 is fixedly connected to the upper left side of the workbench 1, the support plate 202 is symmetrically fixedly connected to the left side of the fixed frame 201, the rotating shaft 203 is symmetrically rotationally connected to the opposite surface of the support plate 202, the mounting block 204 is fixedly connected to the end of the rotating shaft 203 away from the support plate 202, and a groove 205 is provided on one side of the mounting block 204.

[0026] Further as Figure 1 、 Figure 2 and Figure 3 As shown, it is worth mentioning that the inverted U-shaped plate 206 is symmetrically fixedly connected to the upper and lower sides of the mounting block 204, the threaded rod 207 is threadedly connected to the upper and lower sides of the horizontal plate of the inverted U-shaped plate 206, and the positioning block 208 is rotatably connected to the side of the threaded rod 207 close to the groove 205, and the positioning block 208 extends into the interior of the groove 205.

[0027] Further as Figure 1 、 Figure 2 and Figure 3 As shown, it is worth mentioning that the connecting block 210 is symmetrically fixedly connected to the two ends of the raw material roller 209, and the size of the connecting block 210 is adapted to the groove 205. The upper and lower surfaces of the connecting block 210 are symmetrically provided with positioning grooves 211, and the positioning grooves 211 are adapted to the size of the positioning block 208.

[0028] According to the above working process, it can be known that: through the set raw material mechanism 2, the used raw material roller 209 can be quickly installed and replaced, thereby improving work efficiency, and the installation is stable, ensuring the stable operation of the raw material roller 209 during use, thereby improving the stability of the equipment.

[0029] Further as Figure 1 、 Figure 2 and Figure 4 As shown, it is worth mentioning that the bonding mechanism 4 is composed of a fixed plate 401, a bottom plate 402, an extrusion layer 403, a top plate 404, an electric push rod 405, a connecting plate 406, a connecting column 407, an upper plate 408 and a spring 410. The fixed plate 401 is symmetrically fixedly connected to the top of the workbench 1, the bottom plate 402 is fixedly connected to the inner bottom of the two fixed plates 401, the top plate 404 is fixedly connected to the inner top of the two fixed plates 401, the electric push rod 405 is symmetrically fixedly connected to the bottom of the top plate 404, and the connecting plate 406 is fixedly connected to the bottom of the electric push rod 405.

[0030] Further as Figure 1 、 Figure 2 and Figure 4 As shown, it is worth noting that the connecting post 407 is symmetrically fixedly connected to the bottom of the connecting plate 406, the top surface of the upper plate 408 is provided with a circular groove 409 adapted to the connecting post 407, and the connecting post 407 extends into the interior of the circular groove 409, and the spring 410 is fixedly connected between the connecting plate 406 and the upper plate 408, and the spring 410 is sleeved on the outside of the connecting post 407;

[0031] The electric push rod 405 is provided to push the connecting plate 406 downward, thereby driving the upper plate 408 below to move downward, so that the extrusion layer 403 between the upper plate 408 and the bottom plate 402 gradually comes into contact. The close contact between the two extrusion layers 403 and the gradually increasing pressure expel the air between the PI film and the material to be bonded, ensuring that the bonding surface is flat and free of bubbles. The compression force of the spring 410 helps maintain a stable extrusion pressure and also plays a role in buffering the reset.

[0032] Further as Figure 1 、 Figure 2 and Figure 4 As shown, it is worth noting that the upper plate 408 and the bottom plate 402 are respectively provided with an extrusion layer 403 on their opposite surfaces;

[0033] The extrusion layer 403 may be made of, but is not limited to, polytetrafluoroethylene (PTFE). PTFE is a well-known low-friction material with extremely high lubricity, often used in applications requiring reduced friction and wear. It may be used as part of the PI film extrusion layer to provide a smooth sliding surface.

[0034] This solution has the following working process: when in use, first slide the connecting block 210 into the inside of the groove 205, then rotate the threaded rods 207 on both sides to drive the inside of the two positioning grooves 211 to fix the installation of the connecting block 210, complete the installation of the raw material roller 209, and then drive the film or PI film outside the raw material roller 209 to rotate through the rotating shafts 203 at both ends. The film and PI film are heated and bonded by the heating component 3. The bonded film is squeezed between the bottom plate 402 and the upper plate 408 to squeeze out the bubbles generated between the bonded films. At the same time, the upper plate 408 will move upward and move inside the circular groove 409 through the connecting column 407, while squeezing the spring 410, ensuring the stability of the movement of the upper plate 408 while better squeezing the film bodies of different thicknesses passing between the upper plate 408 and the fixed plate 401, thereby improving the bonding effect and application range of the film. Finally, the film body with bubbles squeezed out is finally wrapped around the outside of the winding component 5, completing the overall bonding and winding process.

[0035] In summary: through the set raw material mechanism 2, the used raw material roller 209 can be quickly installed and replaced, which improves work efficiency, and the installation is stable, ensuring the stable operation of the raw material roller 209 during use, thereby improving the stability of the use of the equipment; through the set bonding mechanism 4, the two extrusion layers 403 are in close contact and extrusion, which can effectively discharge the air between the PI film and the film, ensuring flatness and no bubbles, thereby improving the overall bonding quality and product performance, and can be applied to PI films of different thicknesses, thereby improving the scope of application of the equipment.

Claims

1. A PI film laminating device, comprising a workbench (1), a raw material mechanism (2), a heating component (3), a laminating mechanism (4) and a winding component (5), characterized in that: The raw material mechanism (2), the heating component (3), the laminating mechanism (4), and the winding component (5) are sequentially arranged above the workbench (1) from left to right; The raw material mechanism (2) is composed of a fixed frame (201), a support plate (202), a rotating shaft (203), a mounting block (204), an inverted U-shaped plate (206), a threaded rod (207), a positioning block (208), a raw material roller (209) and a connecting block (210), wherein the fixed frame (201) is fixedly connected to the upper left side of the workbench (1), the support plate (202) is symmetrically fixedly connected to the left side of the fixed frame (201), the rotating shaft (203) is symmetrically rotationally connected to the opposite surface of the support plate (202), the mounting block (204) is fixedly connected to the end of the rotating shaft (203) away from the support plate (202), and a groove (205) is provided on one side of the mounting block (204).

2. The PI film laminating device according to claim 1, characterized in that: The inverted U-shaped plate (206) is symmetrically fixedly connected to the upper and lower sides of the mounting block (204), the threaded rod (207) is threadedly connected to the upper and lower sides of the transverse plate of the inverted U-shaped plate (206), and the positioning block (208) is rotatably connected to the side of the threaded rod (207) close to the groove (205), and the positioning block (208) extends into the interior of the groove (205).

3. The PI film laminating device according to claim 2, characterized in that: The connecting block (210) is symmetrically fixedly connected to the two ends of the raw material roller (209), and the size of the connecting block (210) is adapted to the groove (205). The upper and lower surfaces of the connecting block (210) are symmetrically provided with positioning grooves (211), and the positioning grooves (211) are adapted to the size of the positioning block (208).

4. The PI film laminating device according to claim 3, characterized in that: The laminating mechanism (4) is composed of a fixed plate (401), a bottom plate (402), an extrusion layer (403), a top plate (404), an electric push rod (405), a connecting plate (406), a connecting column (407), an upper plate (408) and a spring (410); the fixed plate (401) is symmetrically fixedly connected to the top of the workbench (1); the bottom plate (402) is fixedly connected to the inner bottom of the two fixed plates (401); the top plate (404) is fixedly connected to the inner top of the two fixed plates (401); the electric push rod (405) is symmetrically fixedly connected to the bottom of the top plate (404); and the connecting plate (406) is fixedly connected to the bottom of the electric push rod (405).

5. The PI film laminating device according to claim 4, characterized in that: The connecting column (407) is symmetrically fixedly connected to the bottom of the connecting plate (406), and the top surface of the upper plate (408) is provided with a circular groove (409) adapted to the connecting column (407), and the connecting column (407) extends into the interior of the circular groove (409).

6. The PI film laminating device according to claim 5, characterized in that: The spring (410) is fixedly connected between the connecting plate (406) and the upper plate (408), and the spring (410) is sleeved on the outside of the connecting column (407).

7. The PI film laminating device according to claim 6, characterized in that: The opposite surfaces of the upper plate (408) and the bottom plate (402) are respectively provided with extrusion layers (403).

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