High-precision embossing die and embossing equipment

Abstract

The utility model discloses a high-precision embossing die and embossing equipment, the embossing die comprises an embossing upper die, an embossing lower die and a guide assembly, the embossing upper die is provided with a first surface, the embossing lower die is provided with a second surface, the first surface and the second surface are oppositely arranged, the first surface is provided with an embossing platform, and the embossing platform is provided with an embossing groove. The second surface is provided with a matched embossing groove and a plurality of positioning pins, and the positioning pins are used for positioning the supporting card paper; and the guide assembly is connected between the embossing upper die and the embossing lower die and is used for guiding the ascending and descending of the embossing upper die. The embossing die provided by the utility model has better embossing precision, can avoid the condition that the embossing shape position is damaged or cracked, and is beneficial to improving the yield of the embossing process.

Description

Technical Field

[0001] The utility model relates to the technical field of embossing technology, in particular to a high-precision embossing die and embossing equipment. Background Art

[0002] Embossing is a specialized technique used in the surface finishing of printed materials. It uses an embossing die to mechanically apply pressure exceeding the elastic limit of the printed substrate, creating an artistic effect on the printed surface. Embossing can emphasize and highlight specific details of the design, lending the printed product a deeper soul. Different embossing dies are manufactured to suit different pattern effects, and these dies are durable.

[0003] The support paper for a certain product's envelope bags requires embossing. Because the older version is white and unprinted, the required precision is relatively low. During embossing, the support paper is placed in the embossing mold and positioned against the edge to meet the required precision. Furthermore, the older version is coated with a PP film. This film protects and increases the surface toughness of the support paper, making the embossed areas less susceptible to damage or cracking.

[0004] The current product, envelope bag support paper, has been updated. Compared to the old model, the new support paper not only eliminates the PP film but also adds a printed image in the embossed area, requiring extremely high precision. The existing embossing mold no longer meets the requirements. Specifically, the following are the problems: ① When using the old mold to emboss the new support paper, the embossed area (area) is prone to damage and cracking due to the lack of PP film, resulting in scrap. ② The embossed area has a printed image with a precision requirement of 0.1mm. Using the old mold's edge positioning method, it is very easy to emboss the printed image area, resulting in scrap. Utility Model Content

[0005] The purpose of this utility model is to provide a high-precision embossing mold and embossing equipment in order to solve the above-mentioned problems that occur in the embossing process of the new support paperboard. The mold has good embossing accuracy and can avoid damage or cracking of the embossed shape position, thereby improving the yield rate of the embossing process.

[0006] The utility model is achieved through the following technical solutions:

[0007] In the first aspect, the utility model provides a high-precision embossing mold, including an embossing upper mold, an embossing lower mold and a guide assembly, the embossing upper mold has a first surface, the embossing lower mold has a second surface, the first surface and the second surface are arranged opposite to each other, the first surface is provided with a embossing platform, the second surface is provided with a matching embossing groove, and the second surface is provided with a plurality of positioning pins, and the positioning pins are used to position the supporting paper jam; the guide assembly is connected between the embossing upper mold and the embossing lower mold, and is used to provide guidance for the lifting and lowering of the embossing upper mold.

[0008] As a preferred solution of the present invention, the guide assembly includes a front guide column and a rear guide column fixedly arranged on the embossing lower mold, the front guide column and the rear guide column are both perpendicular to the second surface, and the embossing upper mold forms a sliding connection with the front guide column and the rear guide column.

[0009] As a preferred solution of the present invention, the embossing upper die is fixedly provided with a plurality of guide sleeves adapted to the front guide pillar and the rear guide pillar.

[0010] As a preferred solution of the present invention, the length of the front guide post is smaller than the length of the rear guide post.

[0011] As a preferred solution of the present invention, the embossing upper die is provided with an upper die fixing plate, and the upper die fixing plate is located on the surface opposite to the first surface; the embossing lower die is provided with a lower die pad, and the lower die pad is located on the surface opposite to the second surface.

[0012] As a preferred solution of the present invention, the embossing lower die is provided with a material taking groove, the material taking groove is located on the second surface, and the material taking groove extends from the edge of the embossing lower die to the supporting paperboard covering area.

[0013] As a preferred solution of the present invention, the edges of the embossing platform and the embossing groove are provided with smooth transition fillets.

[0014] In the second aspect, the utility model provides an embossing device, comprising a frame and the high-precision embossing mold described in the first aspect, wherein the frame is provided with a workbench and a lifting mechanism, the embossing upper mold is connected to the lifting mechanism to drive the embossing upper mold to be pressed down and raised, and the embossing lower mold is installed on the workbench.

[0015] As a preferred solution of the present invention, the lifting mechanism includes a lifting cylinder and a mold connecting plate. The lifting cylinder is vertically arranged on the frame, the mold connecting plate is connected to the output end of the lifting cylinder, and the embossing upper mold is installed on the mold connecting plate.

[0016] As a preferred solution of the present invention, the lifting mechanism further includes a lifting guide rod vertically slidably arranged on the frame, and the lifting guide rod is connected to the mold connecting plate.

[0017] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0018] 1. The utility model provides a plurality of positioning pins on the embossing lower die, which can correspond to the plurality of holes on the supporting cardboard, thereby realizing accurate positioning of the supporting cardboard and ensuring that the product positioning accuracy meets 0.1mm. At the same time, when the supporting cardboard is placed upside down, the plurality of positioning pins cannot be inserted, thereby playing a fool-proof role.

[0019] 2. The utility model sets a guide assembly between the embossing upper die and the embossing lower die. The guide assembly includes a front guide post and a rear guide post, which is used to provide guidance for the lifting and lowering of the embossing upper die. When the embossing upper die is pressed downward to emboss, the guide post can only apply pressure vertically downward to prevent the embossing from being deflected.

[0020] 3. The utility model reduces edge sharpness by designing the edge positions of the embossing shapes on the upper and lower embossing dies to be arc-shaped, so that when the upper and lower dies are closed to emboss the supporting cardboard, the impact force exerted by the convex shape on the supporting cardboard is reduced instantaneously, thereby avoiding damage or cracking of the embossing shape positions. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, the following briefly introduces the drawings required for use in the examples. It should be understood that the following drawings only illustrate certain embodiments of the present invention and should not be considered as limiting the scope. A person of ordinary skill in the art can also derive other relevant drawings based on these drawings without inventive effort. In the drawings:

[0022] Figure 1 This is a three-dimensional diagram of the high-precision embossing mold in the utility model;

[0023] Figure 2 This is a schematic diagram of the embossing lower die in the present invention;

[0024] Figure 3 This is a schematic diagram of the embossing upper die in the present invention;

[0025] Figure 4 For this utility model Figure 3 The enlarged schematic diagram of the impact boss at position C in FIG.

[0026] Figure 5 It is a three-dimensional diagram of the embossing device in the present utility model;

[0027] Figure 6 This is a schematic diagram of the installation of the embossing mold in the present invention.

[0028] Markings and corresponding parts names in the accompanying drawings:

[0029] 1-embossing upper die, 11-embossing platform, 2-embossing lower die, 21-embossing groove, 22-locating pin, 23-material removal groove, 3-front guide column, 4-rear guide column, 5-upper die fixing plate, 6-lower die pad, 7-frame, 8-lifting mechanism, 81-lifting cylinder, 82-die connecting plate, 83-lifting guide rod, 9-operating interface, A-supporting paperboard, B-embossing die. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with embodiments and drawings. The schematic implementation methods of the present invention and their descriptions are only used to explain the present invention and are not intended to limit the present invention.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.

[0032] In the description of the embodiments of the present application, technical terms such as "first" and "second" are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features.

[0033] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0034] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists, A and B exist at the same time, and B exists. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0035] In the embodiments of this application, the same reference numerals represent the same components, and for the sake of brevity, detailed descriptions of the same components in different embodiments are omitted. It should be understood that the thickness, length, width, and other dimensions of the various components in the embodiments of this application, as well as the overall thickness, length, width, and other dimensions of the integrated device shown in the drawings are merely illustrative and should not constitute any limitation on this application.

[0036] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces), unless otherwise clearly and specifically defined.

[0037] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0038] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; internal connections between two components or interactions between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.

[0039] Example 1

[0040] Please refer to Figures 1 to 4 A high-precision embossing mold B provided in an embodiment of the present application includes an embossing upper mold 1, an embossing lower mold 2 and a guide assembly, wherein the embossing upper mold 1 has a first surface, and the embossing lower mold 2 has a second surface, the first surface and the second surface are arranged opposite to each other, the first surface is provided with a embossing platform 11, the second surface is provided with a matching embossing groove 21, and the second surface is provided with a plurality of positioning pins 22, and the positioning pins 22 are used to position the supporting cardboard A; the guide assembly is connected between the embossing upper mold 1 and the embossing lower mold 2, and is used to provide guidance for the lifting and lowering of the embossing upper mold 1.

[0041] The present application sets a plurality of positioning pins 22 on the embossing lower die 2, and a plurality of positioning holes are pre-punched on the supporting cardboard A. When embossing, the plurality of positioning holes of the supporting cardboard A are aligned with the plurality of positioning pins 22 on the embossing lower die 2. The plurality of positioning pins 22 cooperate with the plurality of holes on the supporting cardboard A to achieve precise positioning of the supporting cardboard A, ensuring that the product positioning accuracy meets 0.1mm. At the same time, when the supporting cardboard A is placed upside down, the plurality of positioning pins 22 cannot be inserted, thereby playing a fool-proof role. At the same time, by setting a guide component between the embossing upper die 1 and the embossing lower die 2, a guide can be provided for the lifting and lowering of the embossing upper die 1, so that when the embossing upper die 1 presses down to emboss, pressure can only be applied vertically downward to prevent the embossing from being offset.

[0042] Specifically, in the embodiment of the present application, three positioning pins 22 are provided on the embossing lower die 2. These three positioning pins 22 are distributed in a herringbone shape on the second surface. The height of the positioning pins 22 protruding from the second surface can be designed according to actual needs. Of course, other numbers of positioning pins 22, such as two or three positioning pins 22, can also be designed as needed.

[0043] According to some embodiments of the present application, the guide assembly includes a front guide post 3 and a rear guide post 4 fixedly disposed on the embossing lower die 2. The front guide post 3 and the rear guide post 4 are both perpendicular to the second surface, and the embossing upper die 1 is slidably connected to the front guide post 3 and the rear guide post 4. By providing the front guide post 3 and the rear guide post 4, when the embossing upper die 1 is pressed downward to emboss, the guide posts can only apply pressure vertically downward, thereby preventing the embossing from being displaced.

[0044] Specifically, when the embossing operator stands facing the embossing die B, the front guide post 3 is closer to the operator, while the rear guide post 4 is farther away. Two front guide posts 3 and two rear guide posts 4 are provided, each spaced apart in the left-right direction. During embossing, the embossing upper die 1 slides up and down along the front guide posts 3 and rear guide posts 4.

[0045] According to some embodiments of the present application, the embossing die 1 is fixedly provided with a plurality of guide sleeves adapted to the front guide posts 3 and the rear guide posts 4. Guide sleeves are embedded in the four corners of the embossing die 1, and the front guide posts 3 and the rear guide posts 4 are respectively inserted into the corresponding guide sleeves, which can improve the sliding accuracy of the embossing die 1.

[0046] According to some embodiments of the present application, the length of the front guide pin 3 is shorter than the length of the rear guide pin 4. Due to the shorter front guide pin 3, the upper die 1 for embossing has a limited vertical sliding travel. At the same time, when embossing different products, the front guide pin 3 can be replaced, and the rear guide pin 4 can have a certain universal range, thereby improving the interchangeability of mold parts.

[0047] According to some embodiments of the present application, the upper embossing die 1 is provided with an upper die fixing plate 5, which is located on a surface opposite to the first surface; and the lower embossing die 2 is provided with a lower die pad 6, which is located on a surface opposite to the second surface. The provision of the upper die fixing plate 5 and the lower die pad 6 facilitates the installation and connection of the upper embossing die 1 and the lower embossing die 2, thereby enabling the installation of the embossing die B on the embossing equipment.

[0048] According to some embodiments of the present application, the embossing lower die 2 is provided with a material removal groove 23. The material removal groove 23 is located on the second surface and extends from the edge of the embossing lower die 2 to within the coverage area of ​​the support paper A. By providing the material removal groove 23 on the embossing lower die 2, after embossing is completed, the operator can use the material removal groove 23 to lift the support paper A with their fingers, thereby facilitating the removal of the support paper A. The material removal groove 23 is located between the two leading guide posts 3, making it convenient for the operator to operate manually.

[0049] According to some embodiments of the present application, the edges of the embossing platform 11 and the embossing groove 21 are provided with smooth transition rounded corners. By designing the edges of the embossing shapes on the upper embossing die 1 and the lower embossing die 2 to be arc-shaped, the edge sharpness is reduced. When the upper and lower dies are closed to emboss the supporting cardboard A, the impact force exerted by the embossing shape on the supporting cardboard A is reduced, thereby preventing damage or cracking of the embossing shape. In this example, the embossing shape is a triangle.

[0050] According to some embodiments of the present application, the upper embossing die 1 is provided with two embossing platforms 11, and the lower embossing die 2 is correspondingly provided with two embossing grooves 21. This is equivalent to forming two embossing marks in one embossing operation, and the supporting cardboard A can be cut later, which is equivalent to completing the embossing process of two products in one operation.

[0051] Example 2

[0052] Please refer to Figures 5 and 6 A embossing device provided in an embodiment of the present application includes a frame 7 and the high-precision embossing mold B described in Example 1. A workbench and a lifting mechanism 8 are provided on the frame 7. The embossing upper mold 1 is connected to the lifting mechanism 8 to drive the embossing upper mold 1 to be pressed down and raised, and the embossing lower mold 2 is installed on the workbench.

[0053] According to some embodiments of the present application, the lifting mechanism 8 includes a lifting cylinder 81 and a mold connecting plate 82. The lifting cylinder 81 is vertically arranged on the frame 7. The mold connecting plate 82 is connected to the output end of the lifting cylinder 81. The embossing upper mold 1 is mounted on the mold connecting plate 82. Two lifting cylinders 81 are provided, symmetrically spaced along the left and right directions of the embossing mold B. The piston rods of the two lifting cylinders 81 are respectively connected to the two ends of the mold connecting plate 82.

[0054] According to some embodiments of the present application, the lifting mechanism 8 further includes lifting guide rods 83 vertically slidably mounted on the frame 7 and connected to the mold connecting plate 82. Two lifting guide rods 83 are provided, symmetrically spaced along the left and right sides of the embossing mold B. During the embossing operation, the lifting cylinder 81 drives the mold connecting plate 82 and the lifting guide rods 83 for synchronous up and down movement. The symmetrical arrangement of the two lifting guide rods 83 ensures smooth up and down movement of the mold connecting plate 82, thereby preventing the embossing upper mold 1 from becoming stuck between the front guide post 3 and the rear guide post 4.

[0055] The workflow of this application is as follows: ① The operator aligns the supporting cardboard A with positioning holes with the positioning pins 22 on the embossing lower die 2 and places it. The relative positions of the multiple positioning pins 22 are fixed to ensure that the product positioning accuracy meets 0.1mm. Since the hole positions of the supporting cardboard A correspond one-to-one with the positioning pins 22 of the embossing lower die 2, it has a fool-proof effect. If the supporting cardboard A is reversed, the positioning pins 22 on the embossing lower die 2 cannot be placed. ② After the supporting cardboard A is placed, the operator starts the equipment with both hands, and the lifting cylinder 81 extends downward, driving the embossing upper die 1 downward. During the downward movement of the embossing upper die 1, the front guide column 3 and the rear guide column 4 play a guiding role, so that the embossing upper die 1 can only apply pressure vertically downward. ③ The embossing is completed after the embossing upper die 1 moves downward and closes with the embossing lower die 2. The closing time can be set in the operation interface 9. ⑤ After the set closing time is reached, the lifting cylinder 81 retracts and drives the embossing upper die 1 to reset. At this time, the operator removes the supporting cardboard A to complete the product embossing.

[0056] The specific implementation methods described above further illustrate the purpose, technical solutions and beneficial effects of the utility model in detail. It should be understood that the above description is only a specific implementation method of the utility model and is not intended to limit the scope of protection of the utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the utility model should be included in the scope of protection of the utility model.

Claims

1. A high-precision embossing die, characterized in that: It includes an upper embossing mold, a lower embossing mold and a guide assembly, the upper embossing mold has a first surface, the lower embossing mold has a second surface, the first surface and the second surface are arranged opposite to each other, the first surface is provided with a embossing platform, the second surface is provided with a matching embossing groove, and the second surface is provided with multiple positioning pins, and the positioning pins are used to position the supporting paper jam; the guide assembly is connected between the upper embossing mold and the lower embossing mold, and is used to provide guidance for the lifting and lowering of the upper embossing mold.

2. The high-precision embossing mold according to claim 1, characterized in that: The guide assembly includes a front guide column and a rear guide column fixedly arranged on the embossing lower mold, the front guide column and the rear guide column are both perpendicular to the second surface, and the embossing upper mold forms a sliding connection with the front guide column and the rear guide column.

3. The high-precision embossing mold according to claim 2, characterized in that: The embossing upper die is fixedly provided with a plurality of guide sleeves adapted to the front guide pillar and the rear guide pillar.

4. The high-precision embossing mold according to claim 2, characterized in that: The length of the front guide post is smaller than the length of the rear guide post.

5. The high-precision embossing die according to claim 1, characterized in that: The embossing upper die is provided with an upper die fixing plate, and the upper die fixing plate is located on the surface opposite to the first surface; the embossing lower die is provided with a lower die pad, and the lower die pad is located on the surface opposite to the second surface.

6. The high-precision embossing die according to claim 1, characterized in that: The embossing lower die is provided with a material taking groove, the material taking groove is located on the second surface, and the material taking groove extends from the edge of the embossing lower die to the supporting paper jam covering area.

7. The high-precision embossing mold according to claim 1, characterized in that: The edges of the protruding platform and the protruding groove are provided with smooth transition fillets.

8. An embossing device, characterized in that: It comprises a frame and the high-precision embossing mold according to any one of claims 1 to 7, wherein a workbench and a lifting mechanism are provided on the frame, the embossing upper mold is connected to the lifting mechanism to drive the embossing upper mold to be pressed down and raised, and the embossing lower mold is installed on the workbench.

9. The embossing device according to claim 8, characterized in that The lifting mechanism includes a lifting cylinder and a mold connecting plate. The lifting cylinder is vertically arranged on the frame. The mold connecting plate is connected to the output end of the lifting cylinder. The embossing upper mold is installed on the mold connecting plate.

10. The embossing device according to claim 9, characterized in that The lifting mechanism further comprises a lifting guide rod which is vertically slidably arranged on the frame, and the lifting guide rod is connected to the mold connecting plate.

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