Bias structure of vacuum sample table and magnetron sputtering coating equipment

Abstract

The utility model discloses a bias structure of a vacuum sample stage and magnetron sputtering coating equipment, and relates to the technical field of vacuum magnetron sputtering coating, the bias structure of the vacuum sample stage comprises a rotating assembly, a power connection assembly and a fixing assembly, the rotating assembly is provided with a mounting table for mounting a substrate, and the rotating assembly can rotate and lift and can realize the processing process of the substrate; the power connection assembly comprises a conducting rod and a conducting block which are communicated with each other, the conducting rod is connected to the negative electrode of the radio-frequency power source, negative pressure of the radio-frequency power source is loaded on the conducting block, an alternating electric field can be formed on the lower surface of the substrate, and therefore plasma capable of bombarding the substrate can be generated, and cleaning and polishing of the substrate are achieved. The adhesive force of metal ions to the substrate is favorably improved; and the negative-pressure conductive block connected with the radio frequency power supply can further attract metal ions to be deposited on the surface of the substrate, so that the deposition efficiency is improved, and the product quality and the production efficiency are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of vacuum magnetron sputtering coating, in particular to a bias structure of a vacuum sample table and magnetron sputtering coating equipment. Background Art

[0002] In the prior art, the sputtering process in vacuum coating equipment involves placing a substrate in a vacuum chamber and applying a negative voltage to the cathode (i.e., target). Positively charged gas (process gas) atoms (ions) are attracted to the negatively charged target surface. The strong impact of the positive atoms on the negatively charged target causes them to be ejected from the target surface and deposited on the substrate, forming a very thin, atomically ordered film layer. Current coating processes suffer from poor adhesion of the film to the substrate surface, resulting in slow deposition rates and suboptimal product quality and production efficiency. Utility Model Content

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a bias structure of a vacuum sample stage and a magnetron sputtering coating device, which can improve operational convenience and detection efficiency.

[0004] The biasing structure of the vacuum sample stage according to the first embodiment of the present invention includes:

[0005] The rotating assembly comprises a mounting platform and a first mounting tube, wherein the mounting platform is placed at the end of the first mounting tube and is mounted with the substrate;

[0006] The power connection assembly includes a conductive rod and a conductive block that are connected to each other. The conductive block is located on the upper part of the mounting platform. The conductive rod is connected to the negative pole of the radio frequency power supply. The radial outer peripheral wall of the conductive rod is provided with an insulating sleeve.

[0007] The fixed component includes a fixedly installed second mounting tube and an insulating block, the conductive block is fixedly installed on the insulating block, the conductive rod is located in the second mounting tube, the rotating component can rotate around the axis of the second mounting tube, and the rotating component can be raised and lowered along the axis of the second mounting tube.

[0008] According to the bias structure of the vacuum sample table of the embodiment of the first aspect of the present utility model, there are at least the following beneficial effects: in this embodiment, the rotating component has a mounting table for mounting a substrate, and the rotating component can rotate and lift, and can realize the processing process of the substrate; the power connection component includes a conductive rod and a conductive block that are conductive to each other, and the conductive rod is connected to the negative pole of the radio frequency power supply. The negative pressure of the radio frequency power supply is loaded on the conductive block to form an alternating electric field on the lower surface of the substrate, thereby generating a plasma that can bombard the substrate, realizing cleaning and polishing of the substrate, and helping to improve the adhesion of metal ions to the substrate; the conductive block connected to the negative pressure of the radio frequency power supply can further attract metal ions to deposit on the substrate surface, improve deposition efficiency, and thus achieve improved product quality and production efficiency.

[0009] According to the embodiment of the first aspect of the present utility model, the power connection component is provided with an electrode and a terminal, the electrode is connected to the radio frequency power supply, the two ends of the terminal are respectively connected to the conductive rod and the electrode, and the outer periphery of the terminal is provided with an insulating protective sleeve.

[0010] According to an embodiment of the first aspect of the present invention, the fixing assembly is provided with an outer sleeve, which covers the outer circumference of the second mounting tube, and the outer sleeve is coaxially arranged with the second mounting tube.

[0011] According to the embodiment of the first aspect of the present invention, a movable seat is provided at one end of the first mounting tube away from the mounting platform. The movable seat can be lifted and rotated in the outer tube sleeve, so that the rotating assembly drives the substrate to lift and rotate.

[0012] According to the embodiment of the first aspect of the present invention, bearings are provided at both ends of the movable seat, a sliding sleeve is provided on the radial outer periphery of the bearing, and the radial outer wall of the sliding sleeve is movably fitted with the radial inner wall of the outer sleeve.

[0013] According to an embodiment of the first aspect of the present invention, an insulating frame is provided on the mounting platform, and the insulating frame has a receiving groove for accommodating the substrate.

[0014] According to the embodiment of the first aspect of the present utility model, the rotating assembly also includes a shell and a connecting bracket, the connecting bracket is connected to the end of the first mounting tube, the shell is fixed to the other end of the connecting bracket away from the first mounting tube, the shell is covered on the radial outer periphery of the conductive block, and the mounting platform is fixed to the shell.

[0015] According to the embodiment of the first aspect of the present invention, a rotating block is provided in the connecting bracket, and the connecting bracket can rotate relative to the rotating block. A slider is provided at the end of the second mounting tube, and the slider is slidably connected to the rotating block. When the rotating assembly is lifted or lowered, the rotating block can slide relative to the slider.

[0016] According to the embodiment of the first aspect of the present invention, the movable seat and the first mounting tube are both sleeved on the radial outer periphery of the second mounting tube, and there is a gap between the outer wall of the second mounting tube and the inner walls of the movable seat and the first mounting tube.

[0017] According to an embodiment of the second aspect of the present invention, a magnetron sputtering coating device is provided, comprising the bias structure of the vacuum sample stage described above.

[0018] The magnetron sputtering coating device according to the second embodiment of the present invention has at least the following beneficial effects:

[0019] Compared with the existing technology, the bias structure of the vacuum sample table of the magnetron sputtering coating equipment includes a rotating component, a power connection component and a fixed component. The rotating component is used to install the substrate. The power connection component includes a conductive block. The conductive rod is connected to the negative pole of the RF power supply. The negative pressure of the RF power supply is loaded on the conductive block to form an alternating electric field on the lower surface of the substrate, thereby generating plasma that can bombard the substrate, realize cleaning and polishing of the substrate, and help to improve the adhesion of metal ions to the substrate; the conductive block connected to the negative pressure of the RF power supply can further attract metal ions to deposit on the substrate surface, improve deposition efficiency, and thus improve product quality and production efficiency.

[0020] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0022] Figure 1 A three-dimensional view of the biasing structure of the vacuum sample stage in the embodiment of the first aspect of the present utility model;

[0023] Figure 2 A cross-sectional view of the biasing structure of the vacuum sample stage in the embodiment of the first aspect of the present utility model;

[0024] Figure 3 for Figure 2 A magnified view of center A;

[0025] Figure 4 for Figure 2 Magnified view of middle B;

[0026] Figure 5 for Figure 2 Magnified view of middle C;

[0027] Figure 6 for Figure 2 Magnified view of middle D;

[0028] Figure 7 It is a cross-sectional view of the rotating assembly in the embodiment of the first aspect of the present utility model.

[0029] Reference numerals:

[0030] Rotating assembly 100; first mounting tube 101; mounting platform 102; housing 103; connecting bracket 104; insulating frame 105; receiving groove 106; movable seat 107; bearing 109; sliding sleeve 110; rotating block 111; guide portion 112;

[0031] Power connection assembly 120; electrode 121; terminal 122; conductive block 123; insulating sleeve 124; conductive rod 125; protective cover 126;

[0032] Fixing assembly 130 ; second mounting tube 131 ; insulating block 132 ; outer tube sleeve 133 ; slider 134 ; limiting groove 135 . DETAILED DESCRIPTION

[0033] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0034] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0035] In the description of this utility model, "several" means one or more, "many" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and is not to be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0036] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0037] In the prior art, the sputtering process in vacuum coating equipment involves placing a substrate in a vacuum chamber and applying a negative voltage to the cathode (i.e., target). Positively charged gas (process gas) atoms (ions) are attracted to the negatively charged target surface. The strong impact of the positive atoms on the negatively charged target causes them to be ejected from the target surface and deposited on the substrate, forming a very thin, atomically ordered film layer. Current coating processes suffer from poor adhesion of the film to the substrate surface, resulting in slow deposition rates and suboptimal product quality and production efficiency.

[0038] To solve the above problems, refer to Figure 1 and Figure 2 In an embodiment of the first aspect of the present invention, a biasing structure of a vacuum sample stage is provided, comprising a rotating assembly 100, an electrical assembly 120 and a fixed assembly 130. It can be understood that the rotating assembly 100, the electrical assembly 120 and the fixed assembly 130 are all coaxially arranged, the fixed assembly 130 is coated on the radial outer periphery of the electrical assembly 120, and the rotating assembly 100 is coated on the outer periphery of the fixed assembly 130. The rotating assembly 100 has a mounting platform 102 for mounting a substrate, and the mounting platform 102 is located at the lower end of the rotating assembly 100. The rotating assembly 100 can rotate and lift relative to the fixed assembly 130, and can realize the feeding and withdrawing of the substrate during the processing of the substrate. The electrical assembly 120 includes a conductive rod 125 and a conductive block 123 that are electrically connected to each other, and the conductive rod 125 is connected to the negative pole of the radio frequency power supply. As will be understood, conductive block 123 is located above and in close proximity to the substrate. The negative voltage of the RF power supply applied to conductive block 123 creates an alternating electric field on the substrate's lower surface, generating plasma that bombards the substrate, cleaning and polishing the substrate and helping to improve the adhesion of metal ions to the substrate. Furthermore, the negative voltage of the RF power supply connected to conductive block 123 further attracts metal ions to deposit on the substrate surface, improving deposition efficiency and thereby enhancing product quality and production efficiency.

[0039] Specifically, refer to Figure 3The power connection assembly 120 is provided with an electrode 121 and a terminal 122. It is understood that the top of the power connection assembly 120 has a wire connected to the negative terminal of the RF power supply. The electrode 121 is connected to the wire and conducts electricity, connecting the electrode 121 to the RF power supply. Furthermore, the ends of the terminal 122 are respectively connected to a conductive rod 125 and the electrode 121, thereby connecting the conductive rod 125 to the negative voltage of the RF power supply. The terminal 122 is surrounded by an insulating protective sleeve 126 to prevent the generation of magnetic fields that may affect external components, or to prevent phenomena such as breakdown and abnormal conduction, thereby improving the stability of the electrical conduction. Furthermore, an insulating sleeve 124 is provided radially around the conductive rod 125 to prevent the conductive rod 125 from generating magnetic fields that may affect external components, or to prevent phenomena such as breakdown and abnormal conduction, thereby improving the stability of the electrical conduction. In this embodiment, the insulating sleeve and protective sleeve 126 are both made of PEEK (polyetheretherketone), which has excellent insulation stability and is conducive to improving the stability of the electrical conduction process. Furthermore, the ends of the insulating sleeve 124 respectively contact the terminal 122 and the conductive block 123, thereby preventing leakage or breakdown. It is understood that the conductive block 123 is connected to the lower end of the conductive rod 125. In this embodiment, the conductive block 123 and the conductive rod 125 are both made of copper, which is conducive to improving conductive efficiency.

[0040] Reference Figure 4 It is understood that the fixed assembly 130 is provided with an outer sleeve 133, which is covered on the outer circumference of the second mounting tube 131 and is coaxially arranged with the second mounting tube 131. The outer sleeve 133 has an inner cavity, and a movable seat 107 is provided at the end of the first mounting tube 101 away from the mounting table 102. The movable seat 107 is located in the inner cavity and can be lifted and rotated, so that the rotating assembly 100 drives the substrate to lift and rotate. Specifically, a plurality of magnet blocks are provided on the radial outer peripheral wall of the movable seat 107. It is understood that the movable seat 107 can be connected to a power supply, and different magnetic fields can be generated on the movable seat 107 through the control of the power supply, thereby realizing the lifting and rotating movements of the movable seat 107, so that the mounting table 102 can realize the movement of feeding and withdrawing materials.

[0041] Specifically, bearings 109 are provided at the upper and lower ends of the movable seat 107. The movable seat 107 can rotate around the axis of the bearing 109. A sliding sleeve 110 is provided on the radial outer periphery of the bearing 109. The radial outer wall of the sliding sleeve 110 is movably engaged with the radial inner wall of the outer tube sleeve 133. Therefore, while the movable seat 107 is rotated by the bearing 109, it can be raised and lowered in the outer tube sleeve 133 along the axial direction of the outer tube sleeve 133 under the guidance of the sliding sleeve 110.

[0042] Reference Figure 2 and Figure 5As will be understood, the rotating assembly 100 further includes a housing 103 and a connecting bracket 104. The connecting bracket 104 is connected to the end of the first mounting tube 101. The housing 103 is fixed to the other end of the connecting bracket 104 facing away from the first mounting tube 101. The housing 103 covers the radial outer periphery of the conductive block 123. The mounting platform 102 is fixed to the bottom end of the housing 103. Furthermore, an insulating frame 105 is provided on the mounting platform 102, and the insulating frame 105 has a receiving groove 106 for accommodating a substrate. As will be understood, the receiving groove 106 has a bottom wall for forming the substrate, and the other side of the receiving groove 106 opposite the bottom wall is the bottom outer wall of the conductive block 123. During loading, the mounting platform 102 is located in an initial position away from the conductive block 123. When a substrate is placed on the receiving groove 106, the mounting platform 102 rises to bring the substrate close to the conductive block 123, completing the feeding process. When the processing is completed and the material is removed, the mounting platform 102 descends to move the substrate away from the conductive block 123.

[0043] It can be understood that the movable seat 107 and the first mounting tube 101 are both mounted on the radial outer periphery of the second mounting tube 131, and there is a gap between the outer wall of the second mounting tube 131 and the inner wall of the movable seat 107 and the first mounting tube 101, so that the fixed component 130 and the rotating component 100 are installed independently to avoid motion interference.

[0044] Reference Figure 6 It is understood that a rotating block 111 is provided within the connecting bracket 104, and the connecting bracket 104 is capable of rotating relative to the rotating block 111. A slider 134 is provided at the end of the second mounting tube 131, and the slider 134 is slidably connected to the rotating block 111. When the rotating assembly 100 is raised or lowered, the rotating block 111 can slide relative to the slider 134, and when the rotating assembly 100 rotates, the connecting bracket 104 can rotate relative to the rotating block 111. Specifically, bearings 109 are provided at both the upper and lower ends of the rotating block 111. The radial outer walls of the bearings 109 press against the inner wall of the connecting bracket 104 to achieve relative rotation between the connecting bracket 104 and the rotating block 111.

[0045] Further, refer to Figure 7 A recessed limiting groove 135 is provided on the radial outer periphery of the slider 134, and the radial inner wall of the rotating block 111 has a guide portion 112 that can be inserted into the limiting groove 135. The two side walls of the guide portion 112 along the circumference of the slider 134 abut against the two side walls of the limiting groove 135, so that the slider 134 and the rotating block 111 do not rotate relative to each other, and the cooperation between the guide portion 112 and the limiting groove 135 can enable the rotating block 111 to move up and down stably relative to the slider 134.

[0046] In some embodiments, a guide portion 112 extending outward in a radial direction is provided on the outer periphery of the slider 134 , and a limiting groove 135 is provided in the inner wall of the rotating block 111 to achieve a guiding function for relative sliding between the two.

[0047] According to an embodiment of the second aspect of the present invention, a magnetron sputtering coating apparatus is provided, comprising the aforementioned bias structure for a vacuum sample stage. It will be appreciated that the magnetron sputtering coating apparatus possesses all the technical features of the bias structure for a vacuum sample stage, and thus, the magnetron sputtering coating apparatus also possesses all the beneficial effects of the bias structure for a vacuum sample stage.

[0048] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. The bias structure of the vacuum sample stage is characterized by: include: The rotating assembly comprises a mounting platform and a first mounting tube, wherein the mounting platform is placed at the end of the first mounting tube and is mounted with a substrate; A power connection assembly, comprising a conductive rod and a conductive block that are connected to each other, wherein the conductive block is located on the upper portion of the mounting platform, the conductive rod is connected to the negative electrode of the radio frequency power supply, and an insulating sleeve is sleeved on the radial outer peripheral wall of the conductive rod; The fixed component includes a fixedly installed second mounting tube and an insulating block, the conductive block is fixedly installed on the insulating block, the conductive rod is located in the second mounting tube, the rotating component can rotate around the axis of the second mounting tube, and the rotating component can be raised and lowered along the axis of the second mounting tube.

2. The biasing structure of the vacuum sample stage according to claim 1, characterized in that: The power connection assembly is provided with an electrode and a terminal. The electrode is connected to the radio frequency power supply. The two ends of the terminal are respectively connected to the conductive rod and the electrode. The outer periphery of the terminal is provided with an insulating protective sleeve.

3. The biasing structure of the vacuum sample stage according to claim 1, characterized in that: The fixing assembly is provided with an outer tube sleeve, the outer tube sleeve is covered on the outer circumference of the second mounting tube, and the outer tube sleeve is coaxially arranged with the second mounting tube.

4. The biasing structure of the vacuum sample stage according to claim 3, characterized in that: A movable seat is provided at one end of the first mounting tube away from the mounting platform. The movable seat can be lifted and rotated in the outer tube sleeve, so that the rotating assembly drives the substrate to be lifted and rotated.

5. The biasing structure of the vacuum sample stage according to claim 4, characterized in that: Bearings are provided at both ends of the movable seat, a sliding sleeve is provided on the radial outer periphery of the bearing, and the radial outer wall of the sliding sleeve is movably matched with the radial inner wall of the outer pipe sleeve.

6. The biasing structure of the vacuum sample stage according to claim 1, characterized in that: An insulating frame is provided on the mounting platform, and a receiving groove is provided on the insulating frame for receiving the substrate.

7. The biasing structure of the vacuum sample stage according to claim 1, characterized in that: The rotating assembly also includes a shell and a connecting bracket, the connecting bracket is connected to the end of the first mounting tube, the shell is fixed to the other end of the connecting bracket away from the first mounting tube, the shell covers the radial outer periphery of the conductive block, and the mounting platform is fixed to the shell.

8. The biasing structure of the vacuum sample stage according to claim 7, characterized in that: A rotating block is provided in the connecting bracket, and the connecting bracket can rotate relative to the rotating block. A slider is provided at the end of the second mounting tube, and the slider is slidably connected to the rotating block. When the rotating assembly is raised or lowered, the rotating block can slide relative to the slider.

9. The biasing structure of the vacuum sample stage according to claim 4, characterized in that: The movable seat and the first mounting tube are both sleeved on the radial outer periphery of the second mounting tube, and there is a gap between the outer wall of the second mounting tube and the inner walls of the movable seat and the first mounting tube.

10. Magnetron sputtering coating equipment, characterized in that, A biasing structure comprising the vacuum sample stage according to any one of claims 1 to 9.

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