Vapor deposition device

Abstract

The utility model provides a vapor deposition device, and relates to the field of sensing electrode manufacturing. The deposition device comprises a liquid storage tank, a first gas guide pipe, a reaction tank, a second gas guide pipe and a heating device, the liquid storage tank comprises a liquid storage tank shell, a first gas inlet and a first gas outlet, and a polymer monomer is arranged in the liquid storage tank shell; one end of the first air guide pipe is connected with the first air inlet, and the first air guide pipe can move up and down along the first air inlet; the other end of the first gas guide tube is communicated with a gas outlet of the carrier gas supply device; the reaction tank comprises a reaction tank shell and a storage rack arranged in the reaction tank shell, the storage rack comprises a storage frame and a storage plate, and the storage plate is used for placing a to-be-modified electrode slice; a second gas inlet is formed in the top of the reaction tank shell; a second gas outlet is formed in the bottom; one end of the second gas-guide tube is communicated with the first gas outlet, and the other end is communicated with the second gas inlet; the liquid storage tank and the reaction tank are arranged in the heating device, and the heating device is used for heating the liquid storage tank and the reaction tank so as to vaporize the polymer monomer.

Description

Technical Field

[0001] The present disclosure relates to the technical field of sensor electrode manufacturing, and in particular to a vapor deposition device. Background Art

[0002] With the development of science and technology, the demand for in vitro diagnostics, rapid detection and real-time monitoring technologies in biomedicine, environmental water quality, food safety and other fields is increasing. Usually, different nanomaterials are modified on the surface of screen-printed electrodes through chemical or physical methods to construct sensing platforms with different functions to meet different detection needs.

[0003] Conductive polymers (such as polythiophene) are widely used in biosensing systems, pressure sensing, and gas detection due to their mechanical flexibility, tunable conductivity, good biocompatibility, and processability. Currently, the construction of conductive polymer-based sensing platforms is generally divided into two categories: one is electrochemical polymerization on a screen-printed electrode, and the other is to first polymerize monomers and then coat them individually on the screen-printed electrode. These preparation methods are time-consuming and labor-intensive due to the need for individual operations.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute prior art known to ordinary technicians in the field. Utility Model Content

[0005] The present disclosure provides a vapor deposition device that can realize large-scale preparation of electrodes and improve production efficiency.

[0006] According to one aspect of the present disclosure, there is provided a vapor deposition apparatus comprising:

[0007] A liquid storage tank, comprising a liquid storage tank shell and a first air inlet and a first air outlet provided on the top of the liquid storage tank shell, wherein the liquid storage tank shell is provided with a polymer monomer liquid to be deposited;

[0008] a first air guide tube, one end of which extends into the liquid storage tank housing through the first air inlet, and the end of which is movable up and down along the first air inlet so that the end of the first air guide tube extends into the polymer monomer liquid to be deposited or is located above the polymer monomer liquid to be deposited; and the other end of the first air guide tube is connected to the gas outlet of the carrier gas supply device;

[0009] A reaction tank, comprising a reaction tank shell and a storage rack provided in the reaction tank shell, wherein the storage rack comprises a storage frame and a storage plate provided on the storage frame, wherein the storage plate is used to place the electrode sheet to be modified; a second air inlet is provided at the top of the reaction tank shell, and a second air outlet is provided at the bottom of the side wall of the reaction tank shell;

[0010] a second air duct, one end of which is connected to the first air outlet and the other end of which is connected to the second air inlet;

[0011] A heating device is provided in which the liquid storage tank and the reaction tank are arranged. The heating device is used to heat the liquid storage tank and the reaction tank to vaporize the polymer monomer liquid to be deposited and promote its polymerization on the electrode surface.

[0012] In an exemplary embodiment of the present disclosure, the storage frame includes a first fixed column, a second fixed column, a first height adjustment column, and a second height adjustment column distributed in a ring shape, the first fixed column and the second fixed column are distributed opposite each other, and the first height adjustment column and the second height adjustment column are distributed opposite each other; a first limiter is provided on the first height adjustment column, the first limiter is detachably connected to the first height adjustment column, and the first limiter can reciprocate along the first height adjustment column; a second limiter is provided on the second height adjustment column, the second limiter is detachably connected to the second height adjustment column, and the second limiter can reciprocate along the second height adjustment column;

[0013] The storage plate includes a central storage area and an edge area surrounding the central storage area; the edge area is provided with a plurality of circumferentially distributed snap-in holes, and the first fixing column, the second fixing column, the first height adjustment column and the second height adjustment column respectively pass through different snap-in holes; the surface of the edge area of ​​the storage plate close to the bottom surface of the reaction tank shell is in contact with the first limiting member and the second limiting member.

[0014] In an exemplary embodiment of the present disclosure, an external thread is provided on the outer periphery of the first height adjustment column, the first limiting piece is sleeved on the outer periphery of the first height adjustment column, and an internal thread is provided on the inner periphery of the first limiting piece, and the first limiting piece and the first height adjustment column are connected by the external thread and the internal thread; the external thread is provided on the outer periphery of the second height adjustment column, the second limiting piece is sleeved on the outer periphery of the second height adjustment column, and an internal thread is provided on the inner periphery of the second limiting piece, and the second limiting piece and the second height adjustment column are connected by the external thread and the internal thread.

[0015] In an exemplary embodiment of the present disclosure, there are multiple placing plates, and the multiple placing plates are distributed at intervals along the axial direction of the first fixed column; there are also multiple first limiting members and second limiting members, and the surface of the edge area of ​​each placing plate close to the bottom surface of the reaction tank shell is in contact with different first limiting members and different second limiting members.

[0016] In an exemplary embodiment of the present disclosure, the central storage area of ​​the storage board is a hollow structure.

[0017] In an exemplary embodiment of the present disclosure, the second air inlet is provided between the bottom surface of the reaction tank shell and the storage plate closest to the bottom surface of the reaction tank shell.

[0018] In an exemplary embodiment of the present disclosure, the first air duct is sealedly connected to the first air inlet; one end of the second air duct is sealedly connected to the first air outlet, and the other end is sealedly connected to the second air inlet.

[0019] In an exemplary embodiment of the present disclosure, the vapor deposition apparatus further includes:

[0020] The third air duct is sealed and connected to the second air outlet.

[0021] In an exemplary embodiment of the present disclosure, the vapor deposition apparatus further includes:

[0022] A flow meter is provided at the gas outlet of the carrier gas supply device.

[0023] In an exemplary embodiment of the present disclosure, the heating device is an oven.

[0024] The vapor deposition apparatus disclosed herein heats a liquid storage tank via a heating device, efficiently converting the polymer monomer liquid to be deposited stored in the storage tank into a vapor state. A first air duct is inserted into the polymer monomer liquid to be deposited, allowing carrier gas to be precisely introduced through the first air duct and mixed with the vapor. This design not only effectively dilutes the vapor but also ensures uniform mixing of the vapor and carrier gas, thereby improving the stability and controllability of vapor transmission. The mixed vapor and carrier gas are then guided into the reaction tank via a second air duct. Within the reaction tank, the vapor can be uniformly deposited on the surface of the electrode sheet to be modified, placed on a storage plate, forming a high-quality electrode layer with polymer modification. This design enables the simultaneous placement of multiple electrode sheets to be modified on the storage plate, allowing for the simultaneous processing of a large number of electrode sheets to be modified, significantly improving electrode preparation efficiency and achieving the goal of mass production. Furthermore, the well-designed second air outlet on the reaction tank housing ensures the smooth discharge of any remaining gases or byproducts after the reaction is complete, thereby maintaining a clean and stable environment within the reaction tank and providing a strong guarantee for a continuous and efficient electrode preparation process.

[0025] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification, are used to explain the principles of the present disclosure. Obviously, the drawings described below are only some embodiments of the present disclosure, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0027] Figure 1 Schematic diagram of a vapor deposition apparatus in an embodiment of the present disclosure.

[0028] Figure 2 2 is a perspective view of a vapor deposition apparatus in an embodiment of the present disclosure.

[0029] Figure 3 2 is a top view of the vapor deposition apparatus in an embodiment of the present disclosure.

[0030] Figure 4 Schematic diagram of the first sealing ring, the second sealing ring, the third sealing ring and the fourth sealing ring in the embodiment of the present disclosure.

[0031] Figure 5 Schematic diagram of a storage rack in an embodiment of the present disclosure.

[0032] In the figure: 1. liquid storage tank; 11. liquid storage tank shell; 12. first air inlet; 13. first air outlet; 2. reaction tank; 21. reaction tank shell; 22. second air inlet; 23. second air outlet; 24. storage frame; 241. first fixing column; 242. second fixing column; 243. first height adjustment column; 244. second height adjustment column; 245. first limiter; 246. second limiter; 25. storage plate; 251. central storage area; 252. edge area; 31. first air duct; 32. second air duct; 33. third air duct; 41. first sealing ring; 42. second sealing ring; 43. third sealing ring; 44. fourth sealing ring. DETAILED DESCRIPTION

[0033] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art. Like reference numerals in the figures represent like or similar structures, and thus their detailed description will be omitted.

[0034] Although relative terms such as "upper" and "lower" are used in this specification to describe the relationship of one illustrated component to another, these terms are used herein for convenience only, such as in accordance with the orientation of the illustrations in the accompanying drawings. It will be understood that if the illustrated device were flipped upside down, the component described as "upper" would become the component "lower." When a structure is referred to as "on" another structure, this may mean that the structure is integrally formed with the other structure, that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via the other structure.

[0035] The terms "a," "an," "the," and "said" are used to indicate the presence of one or more elements / components; the terms "including" and "having" are used to indicate an open-ended inclusiveness and mean that additional elements / components / etc. may be present in addition to the listed elements / components / etc. The terms "first," "second," and "third" are used merely as labels and do not limit the quantity of their objects.

[0036] The present disclosure provides a vapor deposition device, such as Figure 1 and Figure 2 As shown, the vapor deposition device may include a liquid storage tank 1, a first air duct 31, a reaction tank 2, a second air duct 32 and a heating device (not shown in the figure), wherein:

[0037] The liquid storage tank 1 includes a liquid storage tank shell 11 and a first air inlet 12 and a first air outlet 13 provided on the top of the liquid storage tank shell 11. The liquid storage tank shell 11 contains a polymer monomer liquid to be deposited.

[0038] One end of the first air guide tube 31 extends into the liquid storage tank housing 11 through the first air inlet 12, and the end of the first air guide tube 31 can move up and down along the first air inlet 12 so that the end of the first air guide tube 31 extends into the polymer monomer liquid to be deposited or is located above the polymer monomer liquid to be deposited; the other end of the first air guide tube 31 is connected to the outlet of the carrier gas supply device (not shown in the figure);

[0039] The reaction tank 2 includes a reaction tank shell 21 and a storage rack provided in the reaction tank shell 21. The storage rack includes a storage frame 24 and a storage plate 25 provided on the storage frame 24. The storage plate 25 is used to place the electrode sheet to be modified. A second air inlet 22 is provided at the top of the reaction tank shell 21, and a second air outlet 23 is provided at the bottom of the side wall of the reaction tank shell 21.

[0040] One end of the second air guide pipe 32 is connected to the first air outlet 13, and the other end is connected to the second air inlet 22;

[0041] The liquid storage tank 1 and the reaction tank 2 are arranged in a heating device, and the heating device is used to heat the liquid storage tank 1 and the reaction tank 2 to vaporize the polymer monomer liquid to be deposited.

[0042] The vapor deposition device disclosed in the present invention heats the liquid storage tank 1 by a heating device, and can efficiently convert the polymer monomer liquid to be deposited stored in the liquid storage tank 1 into a vapor state. The first air duct 31 can be inserted into the polymer monomer liquid to be deposited so as to move up and down, so that the carrier gas can be accurately introduced through the first air duct 31 and mixed with the steam. This design not only achieves effective dilution of the steam, but also ensures uniform mixing of the steam and the carrier gas, thereby improving the stability and controllability of the steam transmission. The mixed steam and carrier gas are guided into the reaction tank 2 through the second air duct 32. In the reaction tank 2, the steam can be uniformly deposited on the surface of the electrode sheet to be modified placed on the storage plate 25 to form a high-quality electrode layer with polymer modification. This design makes it possible to place multiple electrode sheets to be modified on the storage plate 25 at the same time, and thus to process a large number of electrode sheets to be modified at the same time, which significantly improves the preparation efficiency of the electrode and achieves the goal of mass production. In addition, the second gas outlet 23 on the reaction tank shell 21 is reasonably designed to ensure that the remaining gas or by-products after the reaction is completed are discharged smoothly, thereby maintaining a clean and stable environment inside the reaction tank 2, providing a strong guarantee for a continuous and efficient electrode preparation process.

[0043] The following is a detailed description of the various parts and details of the vapor deposition device disclosed in the present invention:

[0044] The liquid storage tank 1 may include a liquid storage tank shell 11, which is the main part of the liquid storage tank 1 and is responsible for carrying and storing the polymer monomer liquid to be deposited. The polymer monomer liquid to be deposited may be a polythiophene liquid or a diluted solution thereof. A first air inlet 12 and a first air outlet 13 are provided on the top of the liquid storage tank shell 11. The first air inlet 12 is used to introduce carrier gas into the liquid storage tank 1, and the first air outlet 13 is used to discharge steam and carrier gas in the liquid storage tank 1. The shape of the first air inlet 12 may be circular, elliptical, rectangular, polygonal or irregular, and the shape of the first air outlet 13 may be circular, elliptical, rectangular, polygonal or irregular, and the shapes of the first air inlet 12 and the first air outlet 13 are not specifically limited herein.

[0045] For example, the liquid storage tank shell 11 may include a bottom surface, side surfaces and a top surface, and the first air inlet 12 and the first air outlet 13 may both be located on the top surface. The bottom surface and the side surfaces are responsible for supporting and surrounding the polymer monomer liquid to be deposited to ensure that it does not leak; and the top surface serves as the opening portion of the liquid storage tank 1, and exchanges gas with the outside world through the first air inlet 12 and the first air outlet 13 thereon. The bottom surface, side surfaces and top surface of the liquid storage tank 1 can be an integrated structure; this design not only improves the overall strength and stability of the liquid storage tank 1, but also simplifies the processing and assembly process and reduces manufacturing costs. Since the liquid storage tank 1 needs to store and process the polymer monomer liquid to be deposited, its material must have good chemical corrosion resistance and sealing properties to ensure the purity and safety of the liquid. At the same time, in order to facilitate observation and monitoring of the situation inside the liquid storage tank 1, the material of the liquid storage tank 1 can be selected from transparent glass. The transparent glass not only has excellent transparency, which can clearly display the remaining liquid amount in the liquid storage tank 1 and the depth of the first air duct 31 inserted into the liquid storage tank 1, but also has good corrosion resistance and high temperature resistance, which can meet the use requirements of the liquid storage tank 1 in complex environments.

[0046] Please continue to see Figure 1-Figure 3 As shown, the first air duct 31 can be tubular and made of corrosion-resistant and high-temperature-resistant materials, such as plastic or glass. One end of the first air duct 31 extends into the liquid storage tank housing 11 through the first air inlet 12. The first air duct 31 can be sealed and connected to the first air inlet 12 to ensure air tightness. Figure 4 As shown, a first sealing ring 41 is sleeved around the outer periphery of the end of the first air duct 31 near the first air inlet 12. When the first air duct 31 is inserted into the first air inlet 12, the first sealing ring 41 can be at least partially located within the first air inlet 12 and sealably engage with the inner wall of the first air inlet 12. For example, the first sealing ring 41 can be a rubber ring. In some embodiments of the present disclosure, the end of the first air duct 31 near the liquid storage tank 1 can move up and down along the first air inlet 12, thereby controlling the depth of the first air duct 31 inserted into the liquid storage tank 1. When the first air duct 31 penetrates a short distance into the liquid storage tank 1, the end of the first air duct 31 near the liquid storage tank 1 is located above the surface of the polymer monomer liquid to be deposited. When the first air duct 31 penetrates a long distance into the liquid storage tank 1, the end of the first air duct 31 near the liquid storage tank 1 is located within the polymer monomer liquid to be deposited. The end of the first air duct 31 away from the liquid storage tank 1 can be connected to the gas outlet of the carrier gas supply device, and the carrier gas can be delivered into the liquid storage tank 1 through the carrier gas supply device. For example, the carrier gas can be nitrogen or argon.

[0047] In an exemplary embodiment of the present disclosure, the vapor deposition device of the present disclosure may also include a flow meter (not shown in the figure), which may be arranged at the gas outlet of the carrier gas supply device. The flow meter may detect the flow rate of the airflow delivered to the liquid storage tank 1 so as to control the concentration of the airflow subsequently entering the reaction tank 2.

[0048] The reaction tank 2 may include a reaction tank shell 21 and a storage rack located within the reaction tank shell 21. The reaction tank shell 21 may be made of corrosion-resistant and high-temperature resistant materials to ensure stability under various chemical reaction conditions. The top of the reaction tank shell 21 may be provided with a second air inlet 22, through which the gas or steam required for the electrode sheet to be modified may be introduced. The bottom of the side wall of the reaction tank shell 21 may be provided with a second air outlet 23, and natural or forced convection may be formed between the second air outlet 23 and the second air inlet 22 to optimize the gas distribution within the reaction tank 2, while facilitating the discharge of waste gas or excess gas generated by the reaction and maintaining pressure balance within the tank. The shape of the second air inlet 22 may be circular, elliptical, rectangular, polygonal or irregular, and the shape of the second air outlet 23 may be circular, elliptical, rectangular, polygonal or irregular, and the shapes of the second air inlet 22 and the second air outlet 23 are not specifically limited herein.

[0049] One end of the second air duct 32 can be connected to the first air outlet 13 on the liquid storage tank housing 11, and the other end can be connected to the second air inlet 22. The steam in the liquid storage tank 1 can be transported to the reaction tank housing 21 through the second air duct 32. In some embodiments of the present disclosure, the end of the second air duct 32 near the liquid storage tank 1 can be sealed and connected to the first air outlet 13, and at the same time, the end of the second air duct 32 near the reaction tank 2 can be sealed and connected to the second air inlet 22. Please continue to see Figure 4 As shown, a second sealing ring 42 is sleeved around the outer periphery of the end of the second air duct 32 near the liquid storage tank 1. When the end of the second air duct 32 near the liquid storage tank 1 is inserted into the first air outlet 13, at least a portion of the second sealing ring 42 can be located within the first air outlet 13 and sealably engage with the inner wall of the first air outlet 13. A third sealing ring 43 is sleeved around the outer periphery of the end of the second air duct 32 near the reaction tank 2. When the end of the second air duct 32 near the reaction tank 2 is inserted into the second air inlet 22, at least a portion of the third sealing ring 43 can be located within the second air inlet 22 and sealably engage with the inner wall of the second air inlet 22. For example, both the second sealing ring 42 and the third sealing ring 43 can be rubber rings.

[0050] The storage rack may include a storage frame 24 and a storage plate 25 mounted on the storage frame 24. The storage plate 25 may be made of glass or polytetrafluoroethylene and may be in the form of a plate or sheet. The storage plate 25 may have a flat surface for placing the electrode sheet to be modified. The electrode sheet to be modified may include the working electrode in the sensor. The working electrode may be provided with an oxidant. This oxidant can induce the polymer vapor transported from the liquid storage tank 1 to the reaction tank 2 to deposit on the surface of the working electrode and then polymerize, thereby forming the modified electrode sheet. The storage rack can simultaneously accommodate multiple electrode sheets to be modified, allowing for the simultaneous processing of a large number of electrode sheets to be modified, significantly improving electrode preparation efficiency and achieving the goal of mass production.

[0051] In an exemplary embodiment of the present disclosure, the height of the placement plate 25 is adjustable so that the placement plate 25 can accommodate electrodes to be modified at different heights. Figure 5 As shown, the storage frame 24 may include a first fixed column 241, a second fixed column 242, a first height adjustment column 243, and a second height adjustment column 244 distributed in a ring shape, wherein the first fixed column 241 and the second fixed column 242 are distributed directly opposite each other, and they provide a stable support base for the entire frame. The first height adjustment column 243 and the second height adjustment column 244 are also distributed directly opposite each other, but in addition to their supporting role, they also have the function of adjusting the height. It should be noted that the first fixed column 241, the second fixed column 242, the first height adjustment column 243, and the second height adjustment column 244 can be distributed in parallel and can all extend in a direction perpendicular to the bottom surface of the reaction tank shell 21.

[0052] A first stopper 245 is provided on the first height adjustment post 243. The first stopper 245 is detachably connected to the first height adjustment post 243, ensuring a secure connection while facilitating disassembly and maintenance when necessary. Furthermore, the first stopper 245 can reciprocate along the first height adjustment post 243 to adjust its height relative to the first height adjustment post 243.

[0053] For example, the outer periphery of the first height adjustment column 243 may be provided with an external thread, the first limiting member 245 may be sleeved on the outer periphery of the first height adjustment column 243, and the inner periphery of the first limiting member 245 is provided with an internal thread, and the first limiting member 245 and the first height adjustment column 243 are connected by external threads and internal threads.

[0054] Correspondingly, a second limiting member 246 is provided on the second height adjustment column 244. The connection method and movement characteristics of the second limiting member 246 to the second height adjustment column 244 are the same as those of the first limiting member 245. That is, the second limiting member 246 is detachably connected to the second height adjustment column 244 and can reciprocate along the second height adjustment column 244 to adjust the height of the second limiting member 246 on the second height adjustment column 244.

[0055] For example, the outer circumference of the second height adjustment column 244 may be provided with external threads, the second stopper 246 may be sleeved on the outer circumference of the second height adjustment column 244, and the inner circumference of the second stopper 246 may be provided with internal threads, and the second stopper 246 and the second height adjustment column 244 may be connected via the external threads and the internal threads. For example, the first height adjustment column 243 and the second height adjustment column 244 may both be screws, and the first stopper 245 and the second stopper 246 may both be nuts. Rotating the first stopper 245 or the second stopper 246 can adjust the height of the first stopper 245 on the first height adjustment column 243 or the height of the second stopper 246 on the second height adjustment column 244.

[0056] Please continue to see Figure 5 As shown, the storage plate 25 may include a central storage area 251 and an edge area 252. The central storage area 251 can be used to place the electrode to be modified. The edge area 252 may surround the central storage area 251 and is provided with a plurality of circumferentially evenly distributed snap-in holes (not shown). The snap-in holes may be through-holes extending through the edge area 252 of the storage plate 25 along its thickness. The plurality of snap-in holes may be evenly distributed circumferentially. The number of snap-in holes equals the total number of fixing posts and height adjustment posts. For example, the number of snap-in holes may be four. The first fixing post 241, the second fixing post 242, the first height adjustment post 243, and the second height adjustment post 244 may each be inserted through a corresponding snap-in hole. In other words, the storage plate 25 is mounted on the storage frame 24 formed by the first fixing post 241, the second fixing post 242, the first height adjustment post 243, and the second height adjustment post 244. At this time, the surface of the edge region 252 of the placement plate 25, which is close to the bottom surface of the reaction tank housing 21, contacts both the first stopper 245 and the second stopper 246. It should be noted that to maintain the surface of the placement plate 25 horizontal, the first stopper 245 and the second stopper 246 in contact with the same placement plate 25 are at equal heights.

[0057] In an exemplary embodiment of the present disclosure, there may be multiple placement plates 25, which may be spaced apart along the axial direction of the first fixing post 241. Multiple placement plates 25 may be used to simultaneously place a greater number of electrode sheets to be modified, facilitating large-scale batch production of electrodes and significantly improving electrode production efficiency.

[0058] When there are multiple placement plates 25, the number of first and second stoppers 245 and 246 can also be multiple. The surface of the edge region 252 of each placement plate 25 near the bottom of the reactor housing 21 contacts a different first stopper 245 and a different second stopper 246. In other words, each placement plate 25 can be independently secured by the first and second stoppers 245 and 246, enhancing system reliability.

[0059] In an exemplary embodiment of the present disclosure, the central storage area 251 of the storage plate 25 can be a hollow structure, and the steam entering from the top of the reaction tank 2 can flow downward through the hollow structure, so that each storage plate 25 can be evenly contacted with the steam, thereby ensuring the reaction effect of the storage plate 25 located below and improving product stability and reliability.

[0060] In an exemplary embodiment of the present disclosure, the second air inlet 22 can be arranged between the bottom surface of the reaction tank shell 21 and the storage plate 25 closest to the bottom surface of the reaction tank shell 21 to prevent the steam from being discharged without reacting with the electrode sheet to be modified on the storage plate 25 below due to the second air inlet 22 being too high, thereby ensuring the reliability and stability of products manufactured in the same batch.

[0061] In an exemplary embodiment of the present disclosure, the vapor deposition device of the present disclosure may further include a third air duct 33. The material of the third air duct 33 is the same as that of the first air duct 31 or the second air duct 32. The third air duct 33 may be sealed and connected to the second air outlet 23. For example, a fourth sealing ring 44 is provided between the third air duct 33 and the second air outlet 23. The seal can discharge the remaining gas or by-products and other tail gases after the reaction is completed through the third air duct 33, and the tail gas can be transported to the tail gas recovery device (not shown in the figure) through the third air duct 33.

[0062] The heating device can be used to heat the liquid storage tank 1 and the reaction tank 2 so that the reaction proceeds at the corresponding temperature, which helps to accelerate the reaction efficiency. For example, the liquid storage tank 1 and the reaction tank 2 can both be placed in the heating device, and the heating device can be used to heat the liquid storage tank 1 and the reaction tank 2 to vaporize the polymer monomer liquid to be deposited in the liquid storage tank 1. The heating temperature of the heating device is related to the physical and chemical properties of the polymer monomer liquid to be deposited. For example, when the polymer monomer liquid to be deposited is polythiophene, the heating temperature can be 90°C to 130°C. For example, the heating device can be an oven, and the cover of the oven can be provided with two connecting holes. The first air duct 31 can extend from one of the connecting holes and be connected to the carrier gas supply device located outside the oven, and the third air duct 33 can extend from the other connecting hole and be connected to the exhaust gas recovery device located outside the oven.

[0063] The following is a brief description of the working process of the vapor deposition device disclosed in the present invention:

[0064] The electrode sheet to be modified containing the oxidant is placed on the hollow storage plate 25. According to the thickness and number of the electrode sheet to be modified, the height of each first limiter 245 and each second limiter 246 is adjusted to ensure that different storage plates 25 are at a suitable height. Add the polymer monomer liquid to be deposited into the liquid storage tank 1, so that the reaction tank 2 and the liquid storage tank 1 are kept connected in the heating device (such as an oven) through the second air duct 32. The first air duct 31 is connected to the carrier gas supply device, which is monitored by a flow meter and adjusted to keep the air flow velocity of the carrier gas uniform. Before the temperature of the heating device rises to the reaction temperature, the end of the first air duct 31 near the liquid storage tank 1 and the end of the second air duct 32 near the liquid storage tank 1 are kept above the monomer liquid level. When the temperature rises to the reaction temperature, immediately adjust the end of the first air duct 31 near the liquid storage tank 1 to below the liquid level of the polymer monomer liquid to be deposited. At this time, the end of the second air duct 32 near the liquid storage tank The height of the end of tank 1 in the liquid storage tank 1 remains unchanged. Under the action of the heating temperature, the polymer monomer liquid to be deposited gradually vaporizes to form polymer vapor. The carrier gas (for example, nitrogen or argon) can carry the polymer vapor into the reaction tank 2. The vapor is deposited on the surface of the electrode sheet to be modified in the reaction tank 2 under the action of the oxidant on the surface of the electrode sheet to be modified, thereby forming a modified electrode. After the reaction is completed, the end of the first air duct 31 close to the liquid storage tank 1 is immediately restored to above the liquid level of the polymer monomer liquid to be deposited, and the air flow speed of the carrier gas is increased at the same time, so that the excess gas in the system can be blown out in time through the third air duct 33. After the reaction system cools down, the modified electrode is taken out.

[0065] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the appended claims.

Claims

1. A vapor deposition device, characterized in that include: A liquid storage tank, comprising a liquid storage tank shell and a first air inlet and a first air outlet provided on the top of the liquid storage tank shell, wherein the liquid storage tank shell is provided with a polymer monomer liquid to be deposited; a first air guide tube, one end of which extends into the liquid storage tank housing through the first air inlet, and the end of which is movable up and down along the first air inlet so that the end of the first air guide tube extends into the polymer monomer liquid to be deposited or is located above the polymer monomer liquid to be deposited; and the other end of the first air guide tube is connected to the gas outlet of the carrier gas supply device; A reaction tank, comprising a reaction tank shell and a storage rack provided in the reaction tank shell, wherein the storage rack comprises a storage frame and a storage plate provided on the storage frame, wherein the storage plate is used to place the electrode sheet to be modified; a second air inlet is provided at the top of the reaction tank shell, and a second air outlet is provided at the bottom of the side wall of the reaction tank shell; a second air duct, one end of which is connected to the first air outlet and the other end of which is connected to the second air inlet; A heating device is provided in which the liquid storage tank and the reaction tank are arranged. The heating device is used to heat the liquid storage tank and the reaction tank to vaporize the polymer monomer liquid to be deposited and promote its polymerization on the electrode surface.

2. The vapor deposition apparatus according to claim 1, wherein: The storage frame includes a first fixed column, a second fixed column, a first height adjustment column, and a second height adjustment column arranged in a ring shape, wherein the first fixed column is arranged opposite to the second fixed column, and the first height adjustment column is arranged opposite to the second height adjustment column; a first limiter is provided on the first height adjustment column, the first limiter is detachably connected to the first height adjustment column, and the first limiter can reciprocate along the first height adjustment column; a second limiter is provided on the second height adjustment column, the second limiter is detachably connected to the second height adjustment column, and the second limiter can reciprocate along the second height adjustment column; The storage plate includes a central storage area and an edge area surrounding the central storage area; the edge area is provided with a plurality of circumferentially distributed snap-in holes, and the first fixing column, the second fixing column, the first height adjustment column and the second height adjustment column respectively pass through different snap-in holes; the surface of the edge area of ​​the storage plate close to the bottom surface of the reaction tank shell is in contact with the first limiting member and the second limiting member.

3. The vapor deposition apparatus according to claim 2, wherein: The outer circumference of the first height adjustment column is provided with an external thread, the first limiting piece is sleeved on the outer circumference of the first height adjustment column, and the inner circumference of the first limiting piece is provided with an internal thread, and the first limiting piece and the first height adjustment column are connected by the external thread and the internal thread; the outer circumference of the second height adjustment column is provided with an external thread, the second limiting piece is sleeved on the outer circumference of the second height adjustment column, and the inner circumference of the second limiting piece is provided with an internal thread, and the second limiting piece and the second height adjustment column are connected by the external thread and the internal thread.

4. The vapor deposition apparatus according to claim 2, wherein: There are multiple placement plates, and the multiple placement plates are distributed at intervals along the axial direction of the first fixed column; there are also multiple first limiting members and second limiting members, and the surface of the edge area of ​​each placement plate close to the bottom surface of the reaction tank shell contacts different first limiting members and different second limiting members.

5. The vapor deposition apparatus according to claim 4, characterized in that: The central storage area of ​​the storage plate is a hollow structure.

6. The vapor deposition apparatus according to claim 4 or 5, characterized in that: The second air inlet is provided between the bottom surface of the reaction tank shell and the storage plate closest to the bottom surface of the reaction tank shell.

7. The vapor deposition apparatus according to claim 1, wherein: The first air duct is sealed to the first air inlet; one end of the second air duct is sealed to the first air outlet, and the other end is sealed to the second air inlet.

8. The vapor deposition apparatus according to claim 1, wherein: The vapor deposition device further comprises: The third air duct is sealed and connected to the second air outlet.

9. The vapor deposition apparatus according to claim 1, wherein: The vapor deposition device further comprises: A flow meter is provided at the gas outlet of the carrier gas supply device.

10. The vapor deposition apparatus according to claim 1, wherein: The heating device is an oven.

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