Test equipment
The combination of the base, clamping mechanism and servo pusher system solves the problem of loose adhesion between the heat dissipation cover and the chip, realizes accurate testing of the shear stress and tensile stress of the chip structure, reduces sample preparation time and labor costs, and improves the safety and accuracy of the test equipment.
Patent Information
- Application Number
- CN202422715545.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-07
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2034-11-07
AI Technical Summary
In the prior art, the heat dissipation cover is not tightly bonded to the chip, which causes the heat dissipation cover of the chip to easily fall off after packaging, and there is a lack of an effective shear stress inspection mold.
A testing device was designed, which included a base, a clamping mechanism and a servo pusher system. The substrate and heat dissipation cover of the chip structure were fixed by the clamping mechanism, and the pusher of the servo pusher system was inserted into the lower knife groove and moved to test the shear stress and tensile stress of the chip structure.
It achieves accurate testing of the shear stress and tensile stress of the chip structure, ensures stable clamping of the chip structure during the test, reduces sample preparation time and labor costs, and improves the safety and accuracy of the test equipment.
Smart Images
Figure CN223346712U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor technology, and in particular to a testing device. Background Art
[0002] Large-sized packaged chips often require a heatsink cover to dissipate heat from high-power chips. However, a loose bond between the cover and the chip can cause the cover to fall off after packaging, placing higher demands on the bond between the cover and the substrate. While molds for vertical relative tensile force testing are common on the market, few can inspect shear stress after the cover is attached. Utility Model Content
[0003] In view of this, the present application provides a testing device for testing the shear stress of a heat dissipation cover after bonding.
[0004] Specifically, this application is implemented through the following technical solutions:
[0005] In a first aspect, the present application provides a testing device for testing the shear force of a chip structure; the testing device comprises a base, a clamping mechanism for clamping the chip structure, and a servo pusher system; wherein,
[0006] The clamping mechanism is provided on the base, and includes a first clamping plate and a second clamping plate arranged opposite to each other; wherein the first clamping plate is used to fix the substrate side of the chip structure; and the second clamping plate is used to fix the heat dissipation cover side of the chip structure;
[0007] The servo pusher system includes a controller, a servo motor electrically connected to the controller, and a pusher driven by the servo motor;
[0008] The second splint is provided with a lower knife groove;
[0009] The controller is used to control the push knife to be inserted into and engaged with the lower knife groove when measuring the shear force of the chip structure;
[0010] The controller is also used to control the push knife to move along the first direction until the substrate and the heat dissipation cover of the chip structure are separated to test the shear stress of the chip structure; wherein the first direction is a direction within the plane where the base is located and perpendicular to the second direction; the second direction is a direction from the first clamping plate to the second clamping plate.
[0011] Optionally, the second clamping plate can be moved in a direction away from the first clamping plate or in a direction close to the first clamping plate to adjust the distance between the first clamping plate and the second clamping plate, so as to clamp chip structures of different sizes through the clamping mechanism to test the shear force of chip structures of different sizes.
[0012] Optionally, the controller is further configured to control the push knife to move along a second direction until the substrate and the heat dissipation cover are separated, so as to test the tensile stress of the chip structure.
[0013] Optionally, the substrate side of the chip structure is fixed to the first clamping plate by gluing;
[0014] and / or,
[0015] The heat dissipation cover side of the chip structure is fixed to the second clamping plate by gluing.
[0016] Optionally, the substrate side of the chip structure and the heat dissipation cover are bonded to the clamping structure by using a two-component epoxy resin adhesive.
[0017] Optionally, the controller is further configured to monitor the current of the servo motor when measuring the shear force of the chip structure, and determine the force exerted on the push knife based on the current and the corresponding relationship between the current and the driving force of the servo motor;
[0018] The controller is further configured to determine a current control stage based on the force applied to the push knife and a predetermined correspondence between the force and the control stage;
[0019] The controller is further configured to determine the control speed corresponding to the current control stage according to the current control stage and the pre-set correspondence between the control stage and the control speed, and control the movement of the push knife according to the control speed.
[0020] Optionally, different control stages correspond to different control speeds, and the later the control stage, the lower the control speed.
[0021] The testing equipment provided in the present application is equipped with a base, a clamping mechanism, and a servo pusher system, and further arranges a lower knife groove on the second clamping plate of the clamping mechanism, and arranges a pusher, a servo motor and a controller in the servo pusher system. In this way, the clamping mechanism can be used to clamp the chip structure, and the pusher can be controlled to insert and engage with the lower knife groove, and then the shear stress of the chip structure can be measured by controlling the movement of the pusher, so that the shear stress of the chip structure can be accurately tested.
[0022] In addition, the testing equipment provided in the present application, by adjusting the position of the second clamping plate, can not only enable the clamping mechanism to adapt to chip structures of different sizes and perform accurate shear force testing, but also ensure that the chip structure is stably clamped during the test, reducing the risk of damage to the chip structure.
[0023] Furthermore, the testing equipment provided in the present application can test the shear stress of the chip structure, and can also test the tensile stress of the chip structure. It can be compatible with tensile stress testing and shear stress testing by controlling the moving direction of the push knife, thereby minimizing sample preparation time and other labor costs.
[0024] Finally, the test equipment provided by the present application, when measuring the shear force of the chip structure, monitors the current of the servo motor, and determines the force exerted on the push knife based on the current and the corresponding relationship between the current and the driving force of the servo motor, and then determines the control stage based on the force exerted on the push knife, and determines the control speed based on the control stage. In this way, different control speeds can be used to control the movement of the push knife in different control stages, and precise motion control of the push knife can be achieved, which can not only make the work flow of the test equipment more smooth and orderly, but also ensure the safety of the push knife during movement. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 This is a front view of the first embodiment of the test equipment provided by this application;
[0026] Figure 2 A top view of the first embodiment of the test equipment provided in this application;
[0027] Figure 3 This is a schematic diagram showing the cooperation between the push knife and the lower knife groove according to an exemplary embodiment of the present application;
[0028] Description of reference numerals:
[0029] 2: Clamping mechanism;
[0030] 21: first splint;
[0031] 22: second splint;
[0032] 221: lower knife groove;
[0033] 3: Servo push knife system;
[0034] 31: controller;
[0035] 32: servo motor;
[0036] 33: Push knife;
[0037] 4: Chip structure;
[0038] 41: Substrate;
[0039] 42: Chip;
[0040] 43: heat dissipation cover;
[0041] 5: Glue. DETAILED DESCRIPTION
[0042] Exemplary embodiments are described in detail herein, with examples illustrated in the accompanying drawings. When the following description refers to the drawings, identical numerals in different drawings represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with this application.
[0043] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms "a," "the," and "the" used in this application are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more of the associated listed items.
[0044] It should be understood that although the terms first, second, third, etc. may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".
[0045] Specific embodiments are given below to introduce the technical solutions of the present application in detail.
[0046] Figure 1 This is a front view of the first embodiment of the test equipment provided by this application. Figure 2 This is a top view of the test equipment embodiment 1 provided in this application. Please also refer to Figure 1 and Figure 2 The test equipment provided in this embodiment includes a base (not shown in the figure), a clamping mechanism 2 for clamping a chip structure 4, and a servo pusher system 3; wherein,
[0047] The clamping mechanism 2 is provided on the base 1 and includes a first clamping plate 21 and a second clamping plate 22 arranged opposite to each other; wherein the first clamping plate 21 is used to fix the substrate side of the chip structure 4; and the second clamping plate 22 is used to fix the heat dissipation cover side of the chip structure 4;
[0048] The servo pusher system 3 includes a controller 31, a servo motor 32 electrically connected to the controller 31, and a pusher 33 driven by the servo motor 32;
[0049] The second clamping plate 22 is provided with a lower knife groove 221;
[0050] The controller 31 is used to control the push knife 33 to be inserted into and engaged with the lower knife groove 221 when measuring the shear force of the chip structure 4;
[0051] The controller 31 is further used to control the pusher 33 to move along the first direction until the substrate 41 and the heat dissipation cover 43 of the chip structure 4 are separated to test the shear stress of the chip structure 4; wherein the first direction is a direction in the plane where the base 1 is located and perpendicular to the second direction (the first direction is Figure 1 The second direction is perpendicular to the paper surface and points inwardly to the paper surface), and the second direction is the direction from the first clamping plate 21 to the second clamping plate 22.
[0052] For details, please refer to Figure 1 and Figure 2 The base 1 may be a metal base made of a metal material. In specific implementations, the base 1 may be made of a suitable metal material according to actual needs, and is not limited thereto. For example, in one embodiment, the base 1 may be made of stainless steel, aluminum alloy, or the like.
[0053] Furthermore, the first clamping plate 21 is fixed to the base 1, and the second clamping plate 22 is slidably mounted on the base 1. For example, in one embodiment, the first clamping plate 21 can be fixed to the base by screws or adhesive, and further, the second clamping plate 22 can be mounted on the base by slide rails, slideways, etc.
[0054] Specifically, the first and second clamping plates 21 and 22 can be made of metal. It should be noted that the materials used for the first and second clamping plates 21 and 22 are selected based on actual needs and are not limited herein. For example, in one embodiment, the first and second clamping plates 21 and 22 can also be made of stainless steel.
[0055] Furthermore, the clamping mechanism 2 is used to clamp the chip structure 4, referring to Figure 1 It can be understood that the chip structure 4 includes a substrate 41, a chip 42 arranged on the substrate 41, and a heat dissipation cover 43 covering the chip 42 and in contact with the substrate 41; the first clamping plate 21 is used to fix the substrate side of the chip structure 4, and the second clamping plate 22 is used to fix the heat dissipation cover side of the chip structure 4.
[0056] In a specific implementation, the substrate side of the chip structure 4 is fixed to the first clamping plate 21 by gluing, and the heat dissipation cover side of the chip structure 4 is fixed to the second clamping plate 22 by gluing.
[0057] It should be explained that the adhesive connection method can form a stable connection. By using adhesive to connect the substrate 41 and the first clamp 21, as well as the heat dissipation cover 43 and the second clamp 22, the substrate 41 and the heat dissipation cover 43 can be fixed on the clamp to reduce loosening or falling off caused by vibration, thereby improving the connection stability between the clamping structure 2 and the chip structure 4.
[0058] Furthermore, the type of adhesive 5 is selected according to actual needs and is not limited herein. For example, in one embodiment, the substrate side and the heat dissipation cover side of the chip structure 4 are bonded to the clamping structure by any of the following adhesives: ...
[0059] For further information, please refer to Figure 1 The servo pusher system 3 includes a controller 31 , a servo motor 32 electrically connected to the controller 31 , and a pusher 33 driven by the servo motor 32 .
[0060] It should be noted that in order to more accurately execute the commands issued by the controller 31, the controller 31 needs to be equipped with a servo motor 32. Furthermore, the choice of servo motor 32 is determined based on actual needs. Different types of servo motors 32 can adapt to different scenarios, and are not limited here. For example, in one possible implementation, a brushless servo motor can be selected for higher control accuracy.
[0061] Furthermore, a lower knife groove 221 is provided on the second clamping plate 22 . The lower knife groove 221 is used to place a push knife 33 , so as to facilitate subsequent testing of the shear stress and tensile stress of the chip structure 4 .
[0062] It should be noted that the shape of the lower blade groove 221 matches the shape of the push blade 33. The specific shapes of the lower blade groove 221 and the push blade 33 are set according to actual needs and are not limited to this in this embodiment. For example, in one embodiment, a cylindrical lower blade groove 221 and a cylindrical push blade 33 can be provided; for another example, a rectangular lower blade groove 221 and a rectangular push blade 33 can be provided.
[0063] The following is a brief introduction to the working principle of the test equipment provided in this application:
[0064] Figure 3 This is a schematic diagram showing the cooperation between the push knife and the lower knife groove according to an exemplary embodiment of the present application. Figure 3When measuring the shear force of the chip structure 4, the controller 31 controls the push knife 33 to be inserted into and engaged with the lower knife groove 221. Furthermore, after the push knife 33 is inserted into and engaged with the lower knife groove 221, the controller 31 controls the push knife 33 to move along a first direction until the substrate 41 of the chip structure 4 is separated from the heat dissipation cover 43, thereby testing the shear stress of the chip 42.
[0065] It should be noted that the first direction is a direction in the plane where the base 1 is located and perpendicular to the second direction; the second direction is a direction from the first clamping plate 21 to the second clamping plate 22. In other words, referring to Figure 1 , the first direction is perpendicular to the paper surface and points to the paper surface.
[0066] That is, the shear stress of the chip structure 4 can be tested according to the following method:
[0067] (1) Use high-strength glue 5 to fix the substrate 41 side to the first clamping plate 21;
[0068] (2) Use high-strength glue 5 to fix the heat dissipation cover 43 to the second clamping plate 22;
[0069] (3) Insert the push knife 33 into the lower knife groove 221 and use the servo motor 32 to drive the push knife 33 to move horizontally inward (perpendicular to the paper surface, pointing inward from the paper surface) until the base plate 41 and the heat dissipation cover 43 are pulled apart.
[0070] The test equipment provided in this embodiment is provided with a base, a clamping mechanism, and a servo pusher system, and further a lower knife groove is provided on the second clamping plate of the clamping mechanism, and a pusher, a servo motor and a controller are provided in the servo pusher system. In this way, the clamping mechanism can be used to clamp the chip structure, and the pusher can be controlled to insert and engage with the lower knife groove, and then the shear stress of the chip structure can be measured by controlling the movement of the pusher, so that the shear stress of the chip structure can be accurately tested.
[0071] Optionally, in a possible implementation, the second clamping plate 22 can also be moved in a direction away from the first clamping plate 21 or in a direction close to the first clamping plate 21 to adjust the distance between the first clamping plate 21 and the second clamping plate 22, so as to clamp chip structures 4 of different sizes through the clamping mechanism 2 to test the shear force of chip structures 4 of different sizes.
[0072] Specifically, the first clamping plate 21 is fixed on the base 1, and the position of the second clamping plate 22 can be changed. It can move away from the first clamping plate 21 or towards the first clamping plate 21 to adjust the distance between the first clamping plate 21 and the second clamping plate 22.
[0073] It should be noted that the testing equipment provided in this embodiment, by adjusting the position of the second clamping plate, can not only enable the clamping mechanism to adapt to chip structures of different sizes and perform accurate shear force testing, but also ensure that the chip structure is stably clamped during the test, reducing the risk of damage to the chip structure.
[0074] Optionally, in a possible implementation, the controller 31 is further configured to control the pusher 33 to move along the second direction until the substrate 41 and the heat dissipation cover 43 are separated, so as to test the tensile stress of the chip structure 4 .
[0075] For details, please refer to Figure 1 and Figure 3 When the tensile stress of the chip structure 4 needs to be tested, the pusher 33 can be controlled to move along the second direction to apply a horizontal rightward pulling force to the heat dissipation cover 43, pull the heat dissipation cover 43 and the substrate 41 apart, and test the tensile stress of the chip structure 4.
[0076] In other words, when testing tensile stress, the test can be performed as follows:
[0077] (1) Use high-strength glue 5 to fix the substrate 41 side to the first clamping plate 21;
[0078] (2) Use high-strength glue 5 to fix the heat dissipation cover 43 to the second clamping plate 22;
[0079] (3) The push knife 33 is controlled to move downward and engage with the lower knife groove 221 , and the servo motor 32 is used to drive the push knife 33 to move horizontally to the right until the substrate 41 and the heat dissipation cover 43 are pulled apart.
[0080] The testing equipment provided in this embodiment can test both the shear stress and the tensile stress of the chip structure. It can be compatible with tensile stress testing and shear stress testing by controlling the moving direction of the push knife, thereby minimizing sample preparation time and other labor costs.
[0081] Optionally, in a possible implementation, the controller 31 is further configured to monitor the current of the servo motor 32 when measuring the shear force of the chip structure, and determine the force exerted on the pusher 33 based on the current and the corresponding relationship between the current and the driving force of the servo motor;
[0082] The controller is further configured to determine the current control stage based on the force applied to the push blade 33 and a predetermined correspondence between the force and the control stage;
[0083] The controller 31 is further configured to determine the current control stage based on the force applied to the push blade 33 and a predetermined correspondence between the force and the control stage;
[0084] The controller 31 is further configured to determine the control speed corresponding to the current control stage according to the current control stage and the pre-set correspondence between the control stage and the control speed, and control the movement of the push knife 33 according to the control speed.
[0085] Specifically, when the shear force of the chip structure 4 needs to be measured, the push knife 33 is placed on the lower knife groove 221, and the push knife 33 is driven by the servo motor 32 to apply force to the push knife 33. The current of the servo motor 32 can be monitored using a current sensor.
[0086] After monitoring the current of the servo motor 32, the force exerted on the push knife can be determined based on the current and the corresponding relationship between the current and the driving force corresponding to the servo motor. It should be noted that different servo motors have different corresponding relationships between current and driving force, and the corresponding relationship between current and driving force can be determined based on the type of servo motor. For example, in one embodiment, the servo motor is a DC motor, and the relationship between the torque T of the servo motor and the current I is: T=Kt·I. Furthermore, the relationship between the torque T of the servo motor and the force F exerted on the push knife is: F=T / r; wherein Kt is the torque constant of the servo motor, and r is the effective radius of the push knife. In this way, based on this, the force exerted on the push knife can be calculated based on the current.
[0087] Furthermore, after the controller 31 determines the force exerted on the push knife 33 , the current control stage can be determined based on the force exerted on the push knife 33 and the corresponding relationship between the preset force and the control stage.
[0088] It should be noted that the corresponding relationship between the preset force and the control stage is set according to actual needs and is not limited in this embodiment.
[0089] Specifically, for a particular chip structure, the interval between 0 and the estimated shear force can be divided into multiple subintervals based on the estimated shear force of the chip structure, with each subinterval corresponding to a different control stage. For example, in one embodiment, the control stage corresponding to low force is set as the initial stage; the control stage corresponding to medium force is set as the intermediate stage; and the control stage corresponding to high force is set as the final stage.
[0090] Furthermore, after confirming the current control stage, the controller 31 determines the control speed corresponding to the current control stage according to the current control stage and the pre-set correspondence between the control stage and the control speed, and controls the movement of the push knife 33 according to the control speed.
[0091] It should be noted that the predetermined correspondence between the control stage and the control speed is also set according to actual needs and is not limited in this embodiment. Optionally, in one possible implementation, different control stages correspond to different control speeds, and the later the control stage, the lower the control speed.
[0092] In combination with the above introduction, for example, in one embodiment, the speed of the pusher 33 is faster at the beginning; the speed of the pusher 33 gradually slows down at the middle stage; and the speed of the pusher 33 continues to decrease at the end stage.
[0093] Referring to the previous introduction, for example, in one possible implementation, different speeds can be set for testing according to the force sensed by the load sensor. Taking the 40*40mm chip structure 4 as an example, the estimated tensile stress of the chip structure 4 is about 400N, and the estimated shear stress is about 160N.
[0094] When conducting the tensile stress test, when the load sensor senses a tensile stress less than or equal to 200N, it is determined to be the first stage. At this time, the test is carried out at a speed of 50mm / min;
[0095] Furthermore, when the load sensor senses a tensile stress greater than 200 N, it is determined to be the second stage, at which point the test is performed at a speed of 10 mm / min until the test is completed.
[0096] Similarly, when conducting shear stress tests, when the load sensor senses a tensile stress less than or equal to 80N, the test is performed at a speed of 50mm / min; when the load sensor senses a tensile stress greater than 80N, the test is performed at a speed of 10mm / min until the end of the test.
[0097] The test equipment provided in the present application, when measuring the shear force of the chip structure, senses the force exerted on the push knife, and then determines the control stage according to the force exerted on the push knife, and determines the control speed according to the control stage. In this way, different control speeds can be used to control the movement of the push knife in different control stages, and precise motion control of the push knife can be achieved, which not only makes the work flow of the test equipment more smooth and orderly, but also ensures the safety of the push knife during movement.
[0098] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.
Claims
1. A testing device, characterized in that: The testing device is used to test the shear force of the chip structure; the testing device includes a base, a clamping mechanism for clamping the chip structure, and a servo pusher system; wherein, The clamping mechanism is provided on the base, and includes a first clamping plate and a second clamping plate arranged opposite to each other; wherein the first clamping plate is used to fix the substrate side of the chip structure; and the second clamping plate is used to fix the heat dissipation cover side of the chip structure; The servo pusher system includes a controller, a servo motor electrically connected to the controller, and a pusher driven by the servo motor; The second splint is provided with a lower knife groove; The controller is used to control the push knife to be inserted into and engaged with the lower knife groove when measuring the shear force of the chip structure; The controller is also used to control the push knife to move along the first direction until the substrate and the heat dissipation cover of the chip structure are separated to test the shear stress of the chip structure; wherein the first direction is a direction within the plane where the base is located and perpendicular to the second direction; the second direction is a direction from the first clamping plate to the second clamping plate.
2. The testing device according to claim 1, characterized in that The second clamping plate can be moved in a direction away from the first clamping plate or in a direction close to the first clamping plate to adjust the distance between the first clamping plate and the second clamping plate, so as to clamp chip structures of different sizes through the clamping mechanism to test the shear force of chip structures of different sizes.
3. The testing device according to claim 1, wherein: The controller is further configured to control the push knife to move along the second direction until the substrate and the heat dissipation cover are separated, so as to test the tensile stress of the chip structure.
4. The testing device according to claim 1, wherein: The substrate side of the chip structure is fixed to the first clamping plate by gluing; and / or, The heat dissipation cover side of the chip structure is fixed to the second clamping plate by gluing.
5. The testing device according to claim 1, characterized in that The first clamping plate and the second clamping plate are made of metal material.
6. The testing device according to claim 4, characterized in that The substrate side and the heat dissipation cover side of the chip structure are bonded to the clamping structure by two-component epoxy resin glue.
7. The testing device according to claim 1, characterized in that The controller is further configured to monitor the current of the servo motor when measuring the shear force of the chip structure, and determine the force applied to the push blade based on the current and the corresponding relationship between the current and the driving force of the servo motor; The controller is further configured to determine a current control stage based on the force applied to the push knife and a predetermined correspondence between the force and the control stage; The controller is further configured to determine the control speed corresponding to the current control stage according to the current control stage and the pre-set correspondence between the control stage and the control speed, and control the movement of the push knife according to the control speed.
8. The testing device according to claim 7, characterized in that Different control stages correspond to different control speeds. The later the control stage, the smaller the control speed.