Circuit chip defect detection system

Abstract

The utility model provides a circuit chip defect detection system, which relates to the field of mechanical automation and comprises a feeding conveying mechanism, a discharging conveying mechanism, a reverse optical detection module, a tray transfer mechanism, a front optical detection module and a braiding mechanism module. The discharging conveying mechanism is used for transferring out materials. The reverse side optical detection module is used for detecting whether the reverse side of the material in the feeding conveying mechanism has defects or not; the tray transfer mechanism is used for transferring the materials detected by the optical detection module in the feeding conveying mechanism into the discharging conveying mechanism; the front optical detection module is used for detecting whether the front face of the material in the discharging conveying mechanism has defects or not. According to the utility model, the full-automatic detection process can be realized, poor materials caused by human intervention are reduced, and the yield of the materials is improved.

Description

Technical Field

[0001] The utility model relates to the field of mechanical automation, and in particular to a circuit chip defect detection system. Background Art

[0002] There are two existing methods for chip appearance inspection. One is manual inspection, where workers inspect each chip individually. This method is inefficient, has low detection accuracy, a high rate of missed detections, and can easily contaminate the chip's appearance. The other method is semi-automatic inspection, where a camera inspects one side of the chip, then the chip is manually flipped over and inspected on the other side. This method is also inefficient, prone to secondary damage, and cannot simultaneously complete subsequent processes such as packaging. Utility Model Content

[0003] The purpose of the utility model is to provide a circuit chip defect detection system, which can realize a fully automatic detection process, reduce material defects caused by human intervention, and improve the material yield.

[0004] The embodiment of the present utility model is achieved as follows:

[0005] In a first aspect, the present invention provides a circuit chip defect detection system, comprising:

[0006] The feeding and conveying mechanism is used to transfer materials;

[0007] Unloading conveying mechanism, which is used to transfer materials;

[0008] The reverse optical inspection module is used to detect whether there are defects on the reverse side of the material in the feeding and conveying mechanism;

[0009] The tray transfer mechanism is used to transfer the materials in the loading conveying mechanism that have been inspected by the optical inspection module to the unloading conveying mechanism;

[0010] Front optical inspection module: The front optical inspection module is used to detect whether there are defects on the front of the material in the unloading and conveying mechanism.

[0011] In an optional embodiment, the circuit chip defect detection system further includes a taping mechanism module, which is used to package defect-free materials in the unloading and conveying mechanism.

[0012] In an optional embodiment, the blanking conveying mechanism includes a first blanking conveying channel and a second blanking conveying channel, and the first blanking conveying channel and the second blanking conveying channel are arranged in parallel.

[0013] In an optional embodiment, the circuit chip defect detection system further includes a picking and patching mechanism, which is disposed on the front optical inspection module and is used to exchange defective materials in the second unloading and conveying channel with normal materials in the first unloading and conveying channel.

[0014] In an optional embodiment, the circuit chip defect detection system further includes a material picking X-axis module, and the material picking X-axis module is used to drive the functional component to move along the X-axis.

[0015] In an optional embodiment, the functional component includes a suction nozzle picking mechanism movably set on the material picking X-axis module, and the suction nozzle picking mechanism is movably set on the material picking X-axis module. The suction nozzle picking mechanism is used to send the material in the loading and conveying mechanism to the reverse optical detection module for detection, and send the detected material back to the loading and conveying mechanism.

[0016] In an optional embodiment, the functional component includes a front optical detection module that is movably arranged on the material picking X-axis module and can detect the material back and forth above the unloading conveying mechanism.

[0017] In an optional embodiment, the functional component further includes a material rotation picking mechanism, which is movably disposed on a material picking X-axis module, and is used to transfer normal materials in the unloading conveying mechanism.

[0018] In an optional embodiment, the circuit chip defect detection system further includes a taping mechanism module for packaging non-defective materials in the unloading and conveying mechanism, and the material rotating and collecting mechanism transfers normal materials to the taping mechanism module for packaging.

[0019] In an optional embodiment, the circuit chip defect detection system further includes a tray transfer X-axis, and the tray transfer mechanism is disposed on the tray transfer X-axis.

[0020] The beneficial effects of the embodiments of the present utility model are:

[0021] The present invention provides a circuit chip defect detection system, comprising: a loading and conveying mechanism, a unloading and conveying mechanism, a reverse optical inspection module, a tray transfer mechanism, a front optical inspection module, and a tape mechanism module. The loading and conveying mechanism is used to transfer materials in; the unloading and conveying mechanism is used to transfer materials out; the reverse optical inspection module is used to detect whether the reverse side of the materials in the loading and conveying mechanism has defects; the tray transfer mechanism is used to transfer the materials in the loading and conveying mechanism that have been inspected by the optical inspection module to the unloading and conveying mechanism; the front optical inspection module is used to detect whether the front side of the materials in the unloading and conveying mechanism has defects; and the tape mechanism module is used to package the defect-free materials in the unloading and conveying mechanism. In the present invention, the entire chip inspection process and transfer do not require manual operation, realizing full automation of the entire process. Compared with the existing manual chip inspection and chip semi-automatic inspection, it can improve efficiency, improve detection accuracy, reduce missed detection rate, and can also carry out subsequent packaging of the chips at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 A schematic diagram of a circuit chip defect detection system from a first perspective provided by an embodiment of the present utility model;

[0024] Figure 2 A schematic diagram of a circuit chip defect detection system from a second perspective provided by an embodiment of the present utility model.

[0025] icon:

[0026] 10-loading conveying mechanism; 20-unloading conveying mechanism; 21-first unloading conveying channel; 22-second unloading conveying channel; 30-reverse optical detection module; 40-tray transfer mechanism; 50-front optical detection module; 60-taping mechanism module; 70-picking and patching mechanism; 80-material picking X-axis module; 90-suction nozzle picking mechanism; 100-tray transfer X-axis; 110-material rotation picking mechanism. DETAILED DESCRIPTION

[0027] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0029] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0030] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the utility model product is typically placed when in use. These terms are intended solely to facilitate the description of this utility model and to simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0031] In addition, the terms "horizontal" and "vertical" do not mean that the components must be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0032] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0033] like Figure 1 As shown, this embodiment provides a circuit chip defect detection system, including: a loading and conveying mechanism 10, a unloading and conveying mechanism 20, a reverse optical detection module 30, a tray transfer mechanism 40, a front optical detection module 50 and a taping mechanism module 60, the loading and conveying mechanism 10 is used to transfer in materials; the unloading and conveying mechanism 20 is used to transfer out materials; the reverse optical detection module 30 is used to detect whether the reverse side of the material in the loading and conveying mechanism 10 has defects; the tray transfer mechanism 40 is used to transfer the material in the loading and conveying mechanism 10 that has been detected by the optical detection module to the unloading and conveying mechanism 20; the front optical detection module 50 is used to detect whether the front side of the material in the unloading and conveying mechanism 20 has defects; and the taping mechanism module 60 is used to package the defect-free material in the unloading and conveying mechanism 20.

[0034] In the embodiment, the entire chip detection process and transportation do not require manual operation, and the entire process is fully automated. Compared with the manual chip detection and semi-automatic chip detection in the existing technology, it can improve efficiency, improve detection accuracy, reduce missed detection rate, and can also perform subsequent packaging of the chip at the same time.

[0035] Furthermore, the material feeding and conveying mechanism 20 includes a first material feeding and conveying channel 21 and a second material feeding and conveying channel 22, and the first material feeding and conveying channel 21 and the second material feeding and conveying channel 22 are arranged in parallel. In detail, the material feeding and conveying mechanism 20 adopts a linear motor for conveying, which can convey materials more efficiently.

[0036] Furthermore, the circuit chip defect detection system also includes a picking and patching mechanism 70, which is arranged on the front optical inspection module 50 and is used to exchange the defective material in the second unloading and conveying channel 22 with the normal material in the first unloading and conveying channel 21.

[0037] In detail, in this embodiment, defective materials are stored in the first unloading and conveying channel 21, and good materials are stored in the second unloading and conveying channel 22. The picking and filling mechanism 70 and the front optical detection module 50 are arranged together. When the front optical detection module 50 detects that there are defects in the materials in the second unloading and conveying channel 22, the picking and filling mechanism 70 can promptly pick out the defective materials from the second unloading and conveying channel 22, and then put the defective materials into the first unloading and conveying channel 21, and put the good materials in the first unloading and conveying channel 21 into the second unloading and conveying channel 22.

[0038] like Figure 2As shown, the circuit chip defect detection system further includes a material picking X-axis module 80, which is used to drive the functional components to move along the X-axis. The functional components include a nozzle picking mechanism 90 movably arranged on the material picking X-axis module 80. The nozzle picking mechanism 90 is used to send the material in the loading and conveying mechanism 10 to the reverse optical inspection module 30 for inspection, and to send the inspected material back to the loading and conveying mechanism 10. In detail, the loading and conveying mechanism 10 and the unloading and conveying mechanism 20 are both arranged along the Y-axis direction, while the material picking X-axis module 80 is arranged in the X-axis direction and spans the loading and conveying mechanism 10 and the unloading and conveying mechanism 20. A linear motor is provided on the material picking X-axis module 80, which drives the nozzle picking mechanism 90 to move on the X-axis and transfers the material in the loading and conveying mechanism 10 to the top of the reverse optical inspection module 30 for reverse inspection.

[0039] Furthermore, the functional component includes a front optical detection module 50 movably arranged on the material picking X-axis module 80.

[0040] In this embodiment, the front optical inspection module 50 is movably disposed on the material picking X-axis module 80 and can inspect the material back and forth above the unloading conveying mechanism 20. Specifically, the front optical inspection module 50 drives the picking mechanism 70 to move back and forth during the back and forth movement.

[0041] Furthermore, the functional components also include a material rotating picking mechanism 110, which is movably arranged on the material picking X-axis module 80. The material rotating picking mechanism 110 is used to transfer normal materials in the unloading conveying mechanism 20. In detail, the material rotating picking mechanism 110 is used to transfer normal materials in the unloading conveying mechanism 20 to the braiding mechanism module 60 for packaging.

[0042] It can be understood that the purpose of the equipment provided in this embodiment is to realize full automation of the detection process. In order to further reduce material defects caused by human intervention, mechanical automated packaging is also used in the final material packaging process to realize full process automation and improve the material yield.

[0043] Furthermore, the circuit chip defect detection system also includes a tray transfer X-axis 100, and the tray transfer mechanism 40 is disposed on the tray transfer X-axis 100. Specifically, the tray transfer X-axis 100 is arranged parallel to the material pickup X-axis module 80, located at the rear of the loading conveyor mechanism 10, and also spans above the loading conveyor mechanism 10 and the unloading conveyor mechanism 20. A linear motor is also disposed on the tray transfer X-axis 100 to connect to the tray transfer mechanism 40.

[0044] Optionally, this embodiment further provides a circuit chip defect detection method, comprising the following steps:

[0045] Step 1: The material to be tested is placed on the loading end of the loading and conveying mechanism 10, and the material moves on the loading and conveying mechanism 10 from the loading end to the unloading end;

[0046] Step 2: When the material moves to the middle section of the loading and conveying mechanism 10, the back optical inspection module 30 inspects the back of the material to see if there are any defects until the inspection is completed.

[0047] Step 3: After the back side detection is completed, the material continues to move to the unloading end of the loading and conveying mechanism 10;

[0048] Step 4: The material in the loading conveying mechanism 10 is transferred to the loading end of the first unloading conveying mechanism 20 or the second unloading conveying mechanism 20 through the material tray transfer mechanism 40;

[0049] Step 5: When the material moves to the middle section of the first material delivery channel 21 or the second material delivery channel 22, the front optical inspection module 50 performs a front inspection on the material. If defective material appears in the second material delivery channel 22, the picking and replenishing mechanism 70 exchanges the defective material with the material in the first material delivery channel 21. The inspection cycle then continues until the inspection is complete.

[0050] Step 6: After the detection is completed, the material continues to move to the discharge end driven by the first discharge conveying channel 21 and the second discharge conveying channel 22;

[0051] Step 7: The braiding mechanism module 60 packages the material in the second unloading conveying channel 22 .

[0052] Furthermore, in step two, a suction nozzle picking mechanism 90 is provided, which sucks the material and transfers it to the reverse optical detection module 30 to detect the reverse side of the material. After the detection is completed, the suction nozzle picking mechanism 90 transports the material back to the loading and conveying mechanism 10, and the cycle is repeated until the material in the loading and conveying mechanism 10 is completed.

[0053] Furthermore, in step seven, a material rotary picking mechanism 110 is provided, and the material in the unloading end of the second unloading conveying channel 22 is transferred to the braiding mechanism module 60 for packaging through the material rotary picking mechanism 110 .

[0054] It should be noted that the above steps can be replaced in a reasonable order according to the operator's choice. For example, the materials in the first material delivery channel 21 and the second material delivery channel 22 can be inspected and then replenished through the replenishment mechanism 70.

[0055] The circuit chip defect detection system and method provided by this embodiment have the following advantages:

[0056] In this embodiment, the entire chip detection process and transfer do not require manual operation, and the entire process is fully automated. Compared with the manual chip detection and semi-automatic chip detection in the existing technology, it can improve efficiency, improve detection accuracy, and reduce missed detection rate. In addition, in order to further reduce material defects caused by human intervention, in the final material packaging process, the material in the unloading end of the second unloading conveying channel 22 is transferred to the braiding mechanism module 60 through the material rotating picking mechanism 110, and the braiding mechanism module 60 packages the material, realizing true overall full process automation and improving the material yield.

[0057] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A circuit chip defect detection system, characterized in that: include: A feeding and conveying mechanism, wherein the feeding and conveying mechanism is used to transfer materials; A material unloading and conveying mechanism, the material unloading and conveying mechanism is used to transfer the material; a reverse optical detection module, the reverse optical detection module being used to detect whether the reverse side of the material in the feeding and conveying mechanism has defects; A tray transfer mechanism, which is used to transfer the material in the loading conveying mechanism after being detected by the optical detection module to the unloading conveying mechanism; A front optical detection module is used to detect whether there are defects on the front side of the material in the unloading and conveying mechanism.

2. The circuit chip defect detection system according to claim 1, characterized in that: Also includes: A braiding mechanism module is used to package the defect-free materials in the unloading and conveying mechanism.

3. A circuit chip defect detection system according to claim 2, characterized in that: The blanking and conveying mechanism includes a first blanking and conveying channel and a second blanking and conveying channel, and the first blanking and conveying channel and the second blanking and conveying channel are arranged in parallel.

4. A circuit chip defect detection system according to claim 3, characterized in that: The circuit chip defect detection system further includes a picking and patching mechanism, which is disposed on the front optical detection module and is used to exchange defective materials in the second material unloading and conveying channel with normal materials in the first material unloading and conveying channel.

5. The circuit chip defect detection system according to claim 1, characterized in that: The circuit chip defect detection system further includes a material picking X-axis module, and the material picking X-axis module is used to drive the functional components to move along the X-axis.

6. A circuit chip defect detection system according to claim 5, characterized in that: The functional component includes a suction nozzle picking mechanism movably arranged on the material picking X-axis module, and the suction nozzle picking mechanism is used to send the material in the loading and conveying mechanism to the reverse optical detection module for detection, and send the detected material back to the loading and conveying mechanism.

7. The circuit chip defect detection system according to claim 5, characterized in that: The functional component includes a front optical detection module that is movably arranged on the material picking X-axis module and can detect the material back and forth above the unloading conveying mechanism.

8. The circuit chip defect detection system according to claim 5, characterized in that: The functional component also includes a material rotation picking mechanism, which is movably arranged on the material picking X-axis module, and is used to transfer normal materials in the unloading conveying mechanism.

9. A circuit chip defect detection system according to claim 8, characterized in that: The circuit chip defect detection system further includes a braiding mechanism module for packaging the defect-free material in the unloading and conveying mechanism, and the material rotating and collecting mechanism transfers the normal material to the braiding mechanism module for packaging.

10. The circuit chip defect detection system according to claim 5, characterized in that: The circuit chip defect detection system also includes a tray transfer X-axis, and the tray transfer mechanism is arranged on the tray transfer X-axis.

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