Chip turn-over device and chip detection equipment

Abstract

The utility model discloses a chip turn-over device and chip detection equipment, the chip turn-over device comprises a base, a first turn-over assembly, a second turn-over assembly and a movement driving assembly, a first turn-over driver can drive a first adsorption part to rotate, so that a first adsorption surface has a first detection state and a first turn-over state; when the second adsorption surface is in the second overturning state and the first adsorption surface is in the first overturning state, the second adsorption surface and the first adsorption surface are oppositely arranged; the moving driving assembly is connected with the first overturning assembly and / or the second overturning assembly and used for driving the first overturning assembly and the second overturning assembly to get close to each other or get away from each other in the first direction. The front and back side testing of the chip is realized, the operation is convenient, the labor cost is saved, the chip is adsorbed, the surface of the chip is not abraded, and the chip is well protected.

Description

Technical Field

[0001] The present application relates to the field of semiconductor testing technology, and in particular to a chip flipping device and chip testing equipment. Background Art

[0002] Semiconductor chips are semiconductor devices that achieve specific functions by etching and wiring semiconductor sheets. The fundamental steps in making a semiconductor chip are design, tape-out, packaging, and testing. During testing, both the front and back sides of the chip must be tested. However, traditional manual flipping tests increase the workload for workers. The small size of the chips makes them difficult to handle, making chip inspection time-consuming and labor-intensive, adding to the difficulty of the task. Utility Model Content

[0003] In response to the above-mentioned deficiencies in the prior art, the present application discloses a chip flipping device and a chip detection device, which can realize chip flipping detection by adsorbing and flipping the chip. It is easy to use, saves manpower, and the adsorption method does not cause wear on the chip surface.

[0004] In order to achieve the above objectives, the present application discloses a chip flipping device, comprising:

[0005] base;

[0006] a first flip assembly, the first flip assembly being arranged on the base, the first flip assembly comprising a first flip driver and a first adsorption member in transmission connection, the first adsorption member having a first adsorption surface, the first flip driver being capable of driving the first adsorption member to rotate so that the first adsorption surface has a first detection state for facing the detection device and a first flip state for flipping the chip;

[0007] a second flip assembly, the second flip assembly being arranged on the base, the second flip assembly comprising a second flip driver and a second adsorption member in transmission connection, the second adsorption member being arranged opposite to the first adsorption member along a first direction, the second adsorption member having a second adsorption surface, the second flip driver being capable of driving the second adsorption member to rotate so that the second adsorption surface has a second detection state for facing the detection device and a second flip state for flipping the chip, when the second adsorption surface is in the second flip state and the first adsorption surface is in the first flip state, the second adsorption surface and the first adsorption surface are arranged opposite to each other;

[0008] A mobile driving assembly is connected to the first flip assembly and / or the second flip assembly, and is used to drive the first flip assembly and the second flip assembly to move closer to or away from each other along the first direction.

[0009] In a first possible implementation, the chip flipping device includes a first vacuum source, the first adsorption member includes a first suction cup, the first vacuum source is in communication with the first adsorption surface, and the first vacuum source can control the first suction cup to evacuate or release the vacuum;

[0010] The chip flipping device includes a second vacuum source, the second adsorption component includes a second suction cup, the second vacuum source is connected to the second adsorption surface, and the second vacuum source can control the second suction cup to evacuate or release the vacuum.

[0011] In a first possible implementation, a first filter is connected in series between the first vacuum source and the first adsorption element, and a second filter is connected in series between the second vacuum source and the second adsorption element.

[0012] In a first possible implementation manner, the rotation axis of the first adsorption component and the rotation axis of the second adsorption component are arranged in parallel.

[0013] In a first possible implementation, the first flip assembly further includes a first hollow shaft, the first adsorption member is connected to a side wall of the first hollow shaft and communicates with an inner hole of the first hollow shaft, the first flip driver includes a first flip motor, and the first hollow shaft is drivingly connected to an output shaft of the first flip motor;

[0014] The second flip assembly also includes a second hollow shaft, the second adsorption member is connected to the side wall of the second hollow shaft and communicates with the inner hole of the second hollow shaft, the second flip driver includes a second flip motor, and the second hollow shaft is transmission-connected to the output shaft of the second flip motor.

[0015] In a first possible implementation, the first flip assembly further includes a first driven shaft, the first driven shaft, the first hollow shaft, and the output shaft of the first flip motor are coaxially arranged, and the first hollow shaft is drivingly connected to the output shaft of the first flip motor via the first driven shaft;

[0016] The second flip assembly further includes a second driven shaft. The second driven shaft, the second hollow shaft and the output shaft of the second flip motor are coaxially arranged. The second hollow shaft is transmission-connected to the output shaft of the second flip motor via the second driven shaft.

[0017] In a first possible implementation, the first flip assembly further includes a first coupling, and the first driven shaft is connected to the output shaft of the first flip motor via the first coupling;

[0018] The second flip assembly further includes a second coupling, and the second driven shaft and the output shaft of the second flip motor are connected via the second coupling.

[0019] In a first possible implementation, the first flip assembly further includes:

[0020] a first universal rotary joint connected to the first hollow shaft;

[0021] The second flip assembly further includes:

[0022] A second universal rotary joint is connected to the second hollow shaft.

[0023] In a first possible implementation, the first flip assembly further includes a first fixing member and a second fixing member that are fixedly connected, the first fixing member is detachably connected to the first hollow shaft, and the second fixing member is detachably connected to the first adsorption member;

[0024] The second flip assembly further includes a fourth fixing member and a fifth fixing member that are fixedly connected. The fourth fixing member is detachably connected to the second hollow shaft, and the fifth fixing member is detachably connected to the second adsorption member.

[0025] In a first possible implementation, the first flip assembly further includes a third fixing member, both ends of which are respectively sleeved on the first hollow shaft and the first universal joint, an end of the first universal joint close to the first hollow shaft is threadedly connected to a first nut, one end surface of the third fixing member axially abuts against the first fixing member, and the other end surface of the third fixing member axially abuts against the first nut;

[0026] The second flip assembly also includes a sixth fixing member, both ends of which are respectively sleeved on the second hollow shaft and the second universal joint, and an end of the second universal joint close to the second hollow shaft is threadedly connected to a second nut, one end face of the sixth fixing member is axially abutted against the fourth fixing member, and the other end face of the sixth fixing member is axially abutted against the second nut.

[0027] In a first possible implementation, the first flip assembly is fixed on the base, and the second flip assembly is slidably disposed on the base along the first direction.

[0028] In a first possible implementation, the mobile drive assembly includes a mobile motor, a gear and a rack, the gear is sleeved on the output shaft of the mobile motor, the rack is engaged with the gear, the second flip assembly is connected to the rack, and the rack is arranged along the first direction.

[0029] In a first possible implementation, a guide rail is provided on the base along the first direction, and a slider is provided on the second flip assembly, and the slider and the guide rail are slidably matched.

[0030] In a first possible implementation, the base includes a pedestal and a mounting seat above the pedestal, the first flip assembly and the second flip assembly are arranged on the mounting seat, there is an accommodating cavity between the base and the mounting seat, the movable motor is arranged in the accommodating cavity, and the output shaft of the movable motor is arranged perpendicular to the first direction and passes through the mounting seat.

[0031] In a first possible implementation, the first suction cup includes a first suction hole and a plurality of second suction holes distributed circumferentially along the first suction hole, and each of the second suction holes is radially connected to the first suction hole;

[0032] The second suction cup includes a third adsorption hole and a plurality of fourth adsorption holes distributed circumferentially along the third adsorption hole, and each of the fourth adsorption holes is radially connected to the third adsorption hole.

[0033] In a first possible implementation manner, the second adsorption holes are evenly distributed around the periphery of the first adsorption holes;

[0034] The fourth adsorption holes are evenly distributed around the periphery of the third adsorption holes.

[0035] The present application also discloses a chip detection device, comprising a detection device and any one of the chip flipping devices described above, wherein the detection device is used to detect the chip when the chip is in the first flipping state and the second flipping state.

[0036] Compared with the prior art, the present invention has the following advantages:

[0037] Generally, a chip has a first surface and a second surface that are arranged opposite to each other. When the chip flipping device of the present application is used to flip the chip, the first adsorption surface of the first adsorption member is first placed in a first detection state facing the detection device, the first surface of the chip is adsorbed on the first adsorption surface of the first adsorption member, and the second surface of the chip is detected. Then, the first adsorption member is flipped to the first flipping state by the first flipping driver, and the second adsorption member is flipped to the second flipping state by the second flipping driver, so that the first adsorption surface and the second adsorption surface are arranged opposite to each other. Then, the first flipping component and the second flipping component are driven to approach each other by the moving driving component. The adsorption action of the second adsorption member adsorbs the chip on the first adsorption member to the second adsorption member. At this time, the second surface of the chip is adsorbed on the second adsorption surface. The moving driving component drives the first flipping component and the second flipping component to move away from each other. Finally, the second flipping driver flips the second adsorption surface of the second adsorption member to the second detection state facing the detection device, thereby completing the flipping of the chip, so that the first surface of the chip faces the detection device, and the first surface of the chip can be detected, thereby realizing the front and back testing of the chip. The operation is convenient and labor costs are saved. In addition, the adsorption method used for the chip will not cause wear on the surface of the chip, thereby providing good protection for the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of this specification, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0039] Figure 1 A schematic diagram of the overall structure of a chip flipping device provided in an embodiment of the present application;

[0040] Figure 2 A schematic diagram showing the structure of a mobile drive assembly provided in an embodiment of the present application;

[0041] Figure 3 A schematic structural diagram showing a first hollow shaft provided in an embodiment of the present application;

[0042] Figure 4 A schematic structural diagram of the first adsorption component provided in an embodiment of the present application;

[0043] Figure 5 A schematic structural diagram of a first fixing member and a second fixing member provided in an embodiment of the present application;

[0044] Figure 6 This is a schematic structural diagram of the third fixing member provided in an embodiment of the present application.

[0045] Description of reference numerals:

[0046] 1-base; 11-base; 12-mounting seat; 121-first guide rail; 122-second guide rail; 2-first flip assembly; 21-first flip driver; 22-first coupling; 23-first driven shaft; 24-first adsorption member; 241-first adsorption tube; 242-first suction cup; 2421-first adsorption hole; 2422-second adsorption hole; 25-first fixing member; 251-first clamping gap; 252-first fastening hole; 26-second fixing member; 261-second clamping gap; 262-second fastening hole; 27-third fixing member; 271-third clamping gap Gap; 272-third fastening hole; 28-first universal joint; 281-first nut; 29-first hollow shaft; 3-second flip assembly; 31-second flip driver; 32-second coupling; 33-second driven shaft; 34-second adsorption member; 35-fourth fixing member; 36-fifth fixing member; 37-sixth fixing member; 38-second universal joint; 381-second nut; 4-moving drive assembly; 41-moving motor; 42-gear; 43-rack; 5-first filter; 6-second filter; 7-support seat; 71-first slider; 72-second slider. DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0048] In this application, the terms "installed," "disposed," "provided with," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections, indirect connections through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0049] Furthermore, the terms "first," "second," etc., are primarily used to distinguish between different devices, elements, or components (which may or may not be of the same type and configuration), and are not intended to indicate or imply the relative importance or quantity of the devices, elements, or components indicated. Unless otherwise specified, "plurality" means two or more.

[0050] During the semiconductor chip testing process, both the front and back sides must be tested. However, the traditional method of manually flipping the chip over for testing increases the workload for workers. The small size of the chip makes it difficult to handle, which makes chip inspection time-consuming and labor-intensive, increasing the difficulty of the work. Therefore, in one embodiment, a chip flipping mechanism equipped with a clamp is used to flip the chip over for testing. However, this clamp requires clamping the chip surface, which can easily damage the chip surface.

[0051] In view of this, the present application discloses a chip flipping device and a chip detection device, which can realize chip flipping detection by adsorbing and flipping the chip. It is easy to use, saves manpower, and the adsorption method does not cause wear on the chip surface.

[0052] The technical solution of the present application will be further described below with reference to specific embodiments and drawings.

[0053] The embodiment of the present application provides a chip flipping device, such as Figure 1 As shown, the chip flipping device includes a base 1, on which a first flipping assembly 2, a second flipping assembly 3 and a moving drive assembly 4 are provided. The first flipping assembly 2 includes a first flipping driver 21 and a first suction member 24, which are transmission-connected to each other. The first suction member 24 has a first suction surface for suctioning the chip. The first flipping driver 21 can drive the first suction member 24 to rotate so that the first suction surface has a first detection state for facing the detection device and a first flipping state for flipping the chip. The second flipping assembly 3 includes a second flipping driver 31 and a second suction member 34, which are transmission-connected to each other. The second suction member 34 is arranged opposite to the first suction member 24 along a first direction. The second suction member 34 has a second suction surface. The second flipping driver 31 can drive the second suction member 34 to rotate so that the second suction surface has a second detection state for facing the detection device and a second flipping state for flipping the chip. When the second suction surface is in the second flipping state and the first suction surface is in the first flipping state, the second suction surface and the first suction surface are arranged opposite each other. The moving drive assembly 4 is connected to the first flip assembly 2 and / or the second flip assembly 3 and is used to drive the first flip assembly 2 and the second flip assembly 3 to move closer to or away from each other along a first direction.

[0054] Usually, a chip has a first surface and a second surface that are arranged opposite to each other. When the chip is turned over by the chip flipping device of the present application, the first adsorption surface of the first adsorption member 24 is first placed in a first detection state facing the detection device, the first surface of the chip is adsorbed on the first adsorption surface of the first adsorption member 24, and the second surface of the chip is detected. Then, the first adsorption member 24 is flipped to the first flipping state by the first flipping driver 21, and the second adsorption member 34 is flipped to the second flipping state by the second flipping driver 31, so that the first adsorption surface and the second adsorption surface are arranged relative to each other, and then the first flipping component 2 and the second flipping component 3 are driven to approach each other by the moving driving component 4, and the second adsorption member 2 is moved to the second flipping component 3. The adsorption effect of 34 adsorbs the chip on the first adsorption part 24 onto the second adsorption part 34. At this time, the second surface of the chip is adsorbed on the second adsorption surface, and the mobile driving component 4 drives the first flip component 2 and the second flip component 3 to move away from each other. Finally, the second flip driver 31 flips the second adsorption surface of the second adsorption part 34 to the second detection state facing the detection device, thereby completing the flipping of the chip, so that the first surface of the chip faces the detection device, and the first surface of the chip can be detected, realizing the front and back test of the chip, which is convenient to operate and saves labor costs. In addition, the chip is adsorbed, which will not cause wear on the surface of the chip and has a good protective effect on the chip.

[0055] There are many ways to implement the chip adsorption method, such as the electromagnet adsorption method, in which electromagnets are provided on the surfaces of the first adsorption part 24 and the second adsorption part 34, so that the adsorption surface is a magnetic surface, and the electromagnet is controlled by the controller to be on and off, thereby achieving adsorption and release of the chip. In this embodiment, vacuum adsorption is adopted as the adsorption method. Specifically, the chip flipping device includes a first vacuum source and a second vacuum source. The first adsorption component 24 includes a first suction cup 242. The first vacuum source is connected to the first adsorption surface. The first vacuum source can control the first suction cup 242 to evacuate or release the vacuum. The second adsorption component 34 includes a second suction cup. The second vacuum source is connected to the second adsorption surface. The second vacuum source can control the second suction cup to evacuate or release the vacuum. When the first adsorption surface is in the first detection state, the first vacuum source controls the first suction cup 242 to be in a vacuum state. When the first adsorption surface is in the first flipping state and the second adsorption surface is in the second flipping state, and the two are close to each other, the second vacuum source controls the second suction cup to be in a vacuum state, and the first vacuum source controls the first suction cup 242 to be in a release state, so that the chip is adsorbed from the first suction cup 242 to the second suction cup. The vacuum adsorption method is used to protect the surface of the chip well without damaging the chip surface.

[0056] It should be explained that the first vacuum source and the second vacuum source, as well as part of the pipeline between the first vacuum source and the first suction cup 242, and part of the pipeline between the second vacuum source and the second suction cup are not shown in the diagram of this embodiment.

[0057] The chip flipping device adopts the vacuum adsorption method, and has a vacuum adsorption channel to adsorb the chip. Therefore, a first filter 5 is connected in series between the first vacuum source and the first adsorption component 24, and a second filter 6 is connected in series between the second vacuum source and the second adsorption component 34. The vacuum adsorption channel can be filtered to ensure a good adsorption effect during long-term use, so that the vacuum adsorption channel is always unobstructed.

[0058] After the first adsorption component 24 and the second adsorption component 34 are rotated to the flipped state at the same time, the first adsorption surface and the second adsorption surface are arranged opposite to each other. Therefore, the rotation axis of the first adsorption component 24 and the rotation axis of the second adsorption component 34 are arranged in parallel, which is convenient for designing the overall structure. For example, the first adsorption component 24 and the second adsorption component 34 are arranged symmetrically, the structure is simple, and the arrangement is convenient. Of course, the rotation axis of the first adsorption component 24 and the rotation axis of the second adsorption component 34 can also be set to be vertical or with a certain angle. At this time, when the first adsorption component 24 is in the first flipped state and the second adsorption component 34 is in the second flipped state, the first adsorption surface and the second adsorption surface can be arranged opposite to each other.

[0059] like Figure 3 As shown, in view of the fact that the first adsorption member 24 and the second adsorption member 34 are connected to the vacuum source, the first adsorption member 24 and the second adsorption member 34 can be directly connected with a vacuum adsorption pipeline to connect with the corresponding vacuum source. In this embodiment, in order to facilitate the assembly of the first adsorption member 24 and the second adsorption member 34, the first flip component 2 also includes a first hollow shaft 29, and the second flip component 3 also includes a second hollow shaft. The first adsorption member 24 is connected to the side wall of the first hollow shaft 29 and is connected to the inner hole of the first hollow shaft 29. The first flip driver 21 includes a first flip motor, and the first hollow shaft 29 is connected to the output shaft of the first flip motor. In this way, on the one hand, the first hollow shaft 29 can be used as part of the vacuum adsorption pipeline, which can facilitate the first adsorption member 24 to achieve adsorption through the first hollow shaft 29. On the other hand, the first hollow shaft 29 can also drive the first adsorption member 24 to rotate, which is easy to use. Similarly, the second adsorption member 34 is connected to the side wall of the second hollow shaft and is connected to the inner hole of the second hollow shaft. The second flipping driver 31 includes a second flipping motor. The second hollow shaft is transmission-connected to the output shaft of the second flipping motor. The first flipping motor and the second flipping motor can be servo motors.

[0060] Specifically, the output shaft of the first flip motor can be directly connected to the first hollow shaft 29, and the output shaft of the second flip motor can be directly connected to the second hollow shaft. In this embodiment, the first flip component 2 also includes a first driven shaft 23, and the first driven shaft 23 and the first hollow shaft 29 are coaxially arranged with the output shaft of the first flip motor. The first hollow shaft 29 is transmission-connected to the output shaft of the first flip motor through the first driven shaft 23. The second flip component 3 also includes a second driven shaft 33, and the second driven shaft 33, the second hollow shaft and the output shaft of the second flip motor are coaxially arranged. The second hollow shaft is transmission-connected to the output shaft of the second flip motor through the second driven shaft 33. The rotation axis of the output shaft of the first flip motor and the rotation axis of the output shaft of the second flip motor are arranged in parallel, so that the rotation axis of the first adsorption member 24 and the rotation axis of the second adsorption member 34 are parallel. The transmission connection between the hollow shaft and the output shaft of the flip motor is realized through the driven shaft. The structure is simple, the transmission is stable, and it is convenient to arrange it reasonably according to the space of the device.

[0061] Specifically, in this embodiment, the first flipping component 2 also includes a first coupling 22, one end of the first coupling 22 is connected to the first driven shaft 23, and the other end is connected to the output shaft of the first flipping motor. The second flipping component 3 also includes a second coupling 32, one end of the second coupling 32 is connected to the second driven shaft 33, and the other end is connected to the output shaft of the second flipping motor. The driven shaft and the output shaft of the flipping motor are connected through the coupling, which is safe and reliable when the transmission distance is long.

[0062] In view of the fact that the first adsorption component 24 and the second adsorption component 34 need to rotate, and both the first adsorption component 24 and the second adsorption component 34 need to be connected to the vacuum adsorption pipeline, the first flip component 2 also includes a first universal rotary joint 28, and the second flip component 3 also includes a second universal rotary joint 38. The universal rotary joint can adjust the angle when connecting the vacuum adsorption pipeline, and is easy to assemble, so that when the first adsorption component 24 and the second adsorption component 34 are flipped, the vacuum adsorption pipeline will not twist, preventing the vacuum adsorption pipeline from being blocked or damaged. The first universal rotary joint 28 is connected to the first hollow shaft 29, and the second universal rotary joint 38 is connected to the second hollow shaft, which is convenient to use.

[0063] The first adsorption member 24 is relatively fixed to the first hollow shaft 29 so as to realize synchronous rotation, and the second adsorption member 34 is relatively fixed to the second hollow shaft so as to realize synchronous rotation. Therefore, there are multiple ways to assemble the first adsorption member 24 and the second adsorption member 34. For example, the first adsorption member 24 can be fixed on the outer wall of the first hollow shaft 29, and the second adsorption member 34 can be fixed on the outer wall of the second hollow shaft. In this embodiment, the first flip assembly 2 also includes a first fixing member 25 and a second fixing member 26. The first fixing member 25 and the second fixing member 26 are fixedly connected. The first fixing member 25 is detachably connected to the first hollow shaft 29, and the second fixing member 26 is detachably connected to the first adsorption member 24. This has a better fixing effect on the first adsorption member 24, and the detachable connection method can facilitate replacement and maintenance, making it more convenient to use. Similarly, the second flip assembly 3 also includes a fourth fixing member 35 and a fifth fixing member 36. The fourth fixing member 35 is fixedly connected to the fifth fixing member 36. The fourth fixing member 35 is detachably connected to the second hollow shaft, and the fifth fixing member 36 is detachably connected to the second adsorption member 34.

[0064] Specifically, if Figure 5 As shown, the first fixing member 25 is sleeved on the first hollow shaft 29 and is provided with a first clamping gap 251, a first fastening hole 252, and a first locking member. The first clamping gap 251 is arranged axially along the first hollow shaft 29, so that the first fixing member 25 located on one side of the first hollow shaft 29 is divided into two parts, which are used to provide a fastening space for the first fixing member 25 to be fixed to the first hollow shaft 29. The first fastening hole 252 is arranged vertically through the first clamping gap 251, and the first locking member passes through the first fastening hole 252 to secure the first fixing member 25 to the first hollow shaft 29. The fourth fixing member 35 is configured similarly to the first fixing member 25 and is not further described.

[0065] The first adsorption component 24 also includes a first adsorption tube body 241, and the second fixing component 26 is sleeved on the first adsorption tube body 241. The second fixing component 26 is provided with a second clamping gap 261, a second fastening hole 262 and a second locking component. The second clamping gap 261 is arranged axially along the first adsorption tube body 241, so that the part of the second fixing component 26 located on one side of the first adsorption tube body 241 is divided into two parts, which is used to provide a fastening space for the second fixing component 26 to fix the first adsorption component 24. The second fastening hole 262 is arranged vertically through the second clamping gap 261, and the second locking component passes through the second fastening hole 262 to fix the second fixing component 26 on the first adsorption tube body 241. The fifth fixing component 36 is arranged in the same way as the second fixing component 26, so it is not repeated here.

[0066] The first flip assembly 2 also includes a third fixing part 27, the two ends of the third fixing part 27 are respectively sleeved on the first hollow shaft 29 and the first universal rotary joint 28, and the end of the first universal rotary joint 28 close to the first hollow shaft 29 is threadedly connected to the first nut 281, one end face of the third fixing part 27 is axially abutted against the first fixing part 25, and the other end face of the third fixing part 27 is axially abutted against the first fixing part 25 by screwing the first nut 281, so that the first adsorption part 24 is well fixed in the axial direction, and a sixth fixing part 37, the two ends of the sixth fixing part 37 are respectively sleeved on the second hollow shaft and the second universal rotary joint 38, and the end of the second universal rotary joint 38 close to the second hollow shaft is threadedly connected to the second nut 381, one end face of the sixth fixing part 37 is axially abutted against the fourth fixing part 35, and the other end face of the sixth fixing part 37 is axially abutted against the second fixing part 26 by screwing the first nut 281, so that the second adsorption part 34 is well fixed in the axial direction.

[0067] Specifically, if Figure 6 As shown, the third fixing member 27 is provided with a third clamping gap 271, a third fastening hole 272, and a third locking member. The third clamping gap 271 is arranged axially along the first hollow shaft 29. The third clamping gap 271 is used to provide a fastening space for the third fixing member 27 to be fixed to the first hollow shaft 29. The portion of the third fixing member 27 located on one side of the first hollow shaft 29 is divided into two parts. The third fastening hole 272 is arranged perpendicularly through the third clamping gap 271. The third locking member passes through the third fastening hole 272 to secure the third fixing member 27 to the first hollow shaft 29. The sixth fixing member 37 is configured similarly to the third fixing member 27 and will not be described in detail here.

[0068] The first flip assembly 2 and the second flip assembly 3 can both be set to slide along the first direction, or the first flip assembly 2 can be fixed on the base 1, and the second flip assembly 3 can be set to slide along the first direction on the base 1. This makes it simple to move the drive assembly 4, and only one assembly needs to be driven to move, which makes the operation simple and convenient.

[0069] The mobile driving component 4 can be implemented in a variety of ways, such as using a screw nut mechanism, driving the screw along the first direction, and the mobile nut is connected to the first flip component 2. In this embodiment, Figure 2 As shown, in one possible implementation, the mobile drive component 4 includes a mobile motor 41, a gear 42 and a rack 43, the gear 42 is sleeved on the output shaft of the mobile motor 41, the rack 43 is engaged with the gear 42, the second flipping component 3 is connected to the rack 43, and the rack 43 is arranged along the first direction.

[0070] Specifically, the base 1 includes a base 11 and a mounting base 12, the mounting base 12 is arranged above the base 11, the first flip component 2 and the second flip component 3 are arranged on the mounting base 12, and there is a accommodating cavity between the base 11 and the mounting base 12, the movable motor 41 is arranged in the accommodating cavity, and the output shaft of the movable motor 41 is arranged perpendicular to the first direction and passes through the mounting base 12, and a first guide rail 121 and a second guide rail 122 are provided on the mounting base 12 along the first direction, and the first guide rail 121 and the second guide rail 122 are respectively located at both ends of the mounting base 12, and a support base 7 is provided above the mounting base 12 of the second flip component 3, and a first slider 71 is provided at a position of the support base 7 corresponding to the first guide rail 121, and a second slider 72 is provided at a position of the support base 7 corresponding to the second guide rail 122. The slider is slidably arranged on the movable guide rail, so that the second flip component 3 is slidably arranged on the base 1 along the first direction, so that the first adsorption surface and the second adsorption surface approach and move away from each other.

[0071] The suction cup can be implemented in a variety of ways. For example, the suction cup can be provided with a conventional circular opening or a square opening for adsorption. In this embodiment, Figure 4 As shown, the first suction cup 242 includes a first adsorption hole 2421 and a plurality of second adsorption holes 2422 distributed circumferentially along the first adsorption hole 2421, and each second adsorption hole 2422 is radially connected to the first adsorption hole 2421. The second suction cup includes a third adsorption hole and a plurality of fourth adsorption holes distributed circumferentially along the third adsorption hole, and each fourth adsorption hole is radially connected to the third adsorption hole, so that the adsorption port increases the adsorption force while ensuring a certain adsorption area, and has better adsorption and support effects on the chip.

[0072] Specifically, in order to increase the adsorption force, multiple second adsorption holes 2422 can be provided on two opposite sides of the first adsorption hole 2421, so that the chip can maintain a stable state at the first adsorption port. In this embodiment, the second adsorption holes 2422 are evenly distributed on the periphery of the first adsorption hole 2421. On the one hand, it is convenient for processing and manufacturing. On the other hand, the second adsorption holes 2422 are evenly arranged along the circumference of the first adsorption hole 2421, which has better adsorption stability for the chip. Similarly, the fourth adsorption holes are evenly distributed on the periphery of the third adsorption hole.

[0073] An embodiment of the present application also discloses a chip detection device, including a detection device and a chip flipping device. The detection device is used to detect the front and back sides of the chip. The chip flipping device in the chip detection device is the above-mentioned chip flipping device. Therefore, the chip detection device in this embodiment has roughly the same technical effect as the above-mentioned chip flipping device. Since the technical effect of the chip flipping device has been fully explained, it will not be repeated here.

[0074] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip flipping device, used for detecting the front and back of a chip by a detection device, characterized in that: include: base; a first flip assembly, the first flip assembly being arranged on the base, the first flip assembly comprising a first flip driver and a first adsorption member in transmission connection, the first adsorption member having a first adsorption surface, the first flip driver being capable of driving the first adsorption member to rotate so that the first adsorption surface has a first detection state for facing the detection device and a first flip state for flipping the chip; a second flip assembly, the second flip assembly being arranged on the base, the second flip assembly comprising a second flip driver and a second adsorption member in transmission connection, the second adsorption member being arranged opposite to the first adsorption member along a first direction, the second adsorption member having a second adsorption surface, the second flip driver being capable of driving the second adsorption member to rotate so that the second adsorption surface has a second detection state for facing the detection device and a second flip state for flipping the chip, when the second adsorption surface is in the second flip state and the first adsorption surface is in the first flip state, the second adsorption surface and the first adsorption surface are arranged opposite to each other; A mobile driving assembly is connected to the first flip assembly and / or the second flip assembly, and is used to drive the first flip assembly and the second flip assembly to move closer to or away from each other along the first direction.

2. The chip flipping device according to claim 1, characterized in that: The chip flipping device includes a first vacuum source, the first adsorption member includes a first suction cup, the first vacuum source is connected to the first adsorption surface, and the first vacuum source can control the first suction cup to evacuate or release the vacuum; The chip flipping device includes a second vacuum source, the second adsorption component includes a second suction cup, the second vacuum source is connected to the second adsorption surface, and the second vacuum source can control the second suction cup to evacuate or release the vacuum.

3. The chip flipping device according to claim 2, characterized in that: A first filter is connected in series between the first vacuum source and the first adsorption component, and a second filter is connected in series between the second vacuum source and the second adsorption component.

4. The chip flipping device according to claim 1, characterized in that: The rotation axis of the first adsorption member and the rotation axis of the second adsorption member are arranged in parallel.

5. The chip flipping device according to claim 1, characterized in that: The first flip assembly further includes a first hollow shaft, the first adsorption member is connected to the side wall of the first hollow shaft and communicates with the inner hole of the first hollow shaft, the first flip driver includes a first flip motor, and the first hollow shaft is drivingly connected to the output shaft of the first flip motor; The second flip assembly also includes a second hollow shaft, the second adsorption member is connected to the side wall of the second hollow shaft and communicates with the inner hole of the second hollow shaft, the second flip driver includes a second flip motor, and the second hollow shaft is transmission-connected to the output shaft of the second flip motor.

6. The chip flipping device according to claim 5, characterized in that: The first flip assembly further includes a first driven shaft, the first driven shaft, the first hollow shaft and the output shaft of the first flip motor are coaxially arranged, and the first hollow shaft is transmission-connected to the output shaft of the first flip motor via the first driven shaft; The second flip assembly further includes a second driven shaft. The second driven shaft, the second hollow shaft and the output shaft of the second flip motor are coaxially arranged. The second hollow shaft is transmission-connected to the output shaft of the second flip motor via the second driven shaft.

7. The chip flipping device according to claim 6, characterized in that: The first flip assembly further includes a first coupling, and the first driven shaft is connected to the output shaft of the first flip motor via the first coupling; The second flip assembly further includes a second coupling, and the second driven shaft and the output shaft of the second flip motor are connected via the second coupling.

8. The chip flipping device according to claim 5, characterized in that: The first flip assembly further includes: a first universal rotary joint connected to the first hollow shaft; The second flip assembly further includes: A second universal rotary joint is connected to the second hollow shaft.

9. The chip flipping device according to claim 8, characterized in that: The first flip assembly further includes a first fixing member and a second fixing member that are fixedly connected, the first fixing member is detachably connected to the first hollow shaft, and the second fixing member is detachably connected to the first adsorption member; The second flip assembly further includes a fourth fixing member and a fifth fixing member that are fixedly connected. The fourth fixing member is detachably connected to the second hollow shaft, and the fifth fixing member is detachably connected to the second adsorption member.

10. The chip flipping device according to claim 9, characterized in that: The first flip assembly further includes a third fixing member, both ends of which are respectively sleeved on the first hollow shaft and the first universal rotary joint, an end of the first universal rotary joint close to the first hollow shaft is threadedly connected to a first nut, one end surface of the third fixing member axially abuts against the first fixing member, and the other end surface of the third fixing member axially abuts against the first nut; The second flip assembly also includes a sixth fixing member, both ends of which are respectively sleeved on the second hollow shaft and the second universal joint, and an end of the second universal joint close to the second hollow shaft is threadedly connected to a second nut, one end face of the sixth fixing member is axially abutted against the fourth fixing member, and the other end face of the sixth fixing member is axially abutted against the second nut.

11. The chip flipping device according to any one of claims 1 to 10, characterized in that: The first flip assembly is fixed on the base, and the second flip assembly is slidably arranged on the base along the first direction.

12. The chip flipping device according to claim 11, characterized in that: The mobile driving assembly includes a mobile motor, a gear and a rack. The gear is sleeved on the output shaft of the mobile motor. The rack is engaged with the gear. The second flip assembly is connected to the rack. The rack is arranged along the first direction.

13. The chip flipping device according to claim 12, wherein: A guide rail is provided on the base along the first direction, and a slider is provided on the second flip assembly. The slider is slidably matched with the guide rail.

14. The chip flipping device according to claim 12, wherein: The base includes a pedestal and a mounting seat above the pedestal, the first flip assembly and the second flip assembly are arranged on the mounting seat, there is an accommodating cavity between the base and the mounting seat, the movable motor is arranged in the accommodating cavity, and the output shaft of the movable motor is arranged perpendicular to the first direction and passes through the mounting seat.

15. The chip flipping device according to any one of claims 2-3, characterized in that: The first suction cup includes a first suction hole and a plurality of second suction holes distributed circumferentially along the first suction hole, and each of the second suction holes is radially connected to the first suction hole; The second suction cup includes a third adsorption hole and a plurality of fourth adsorption holes distributed circumferentially along the third adsorption hole, and each of the fourth adsorption holes is radially connected to the third adsorption hole.

16. The chip flipping device according to claim 15, characterized in that: The second adsorption holes are evenly distributed around the periphery of the first adsorption holes; The fourth adsorption holes are evenly distributed around the periphery of the third adsorption holes.

17. A chip detection device, characterized in that: The chip flipping device comprises a detection device and the chip flipping device according to any one of claims 1 to 16, wherein the detection device is used to detect the chip when the chip is in the first flipping state and the second flipping state.

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