Computer mainboard easy to dissipate heat

Abstract

The utility model provides a computer mainboard easy to dissipate heat, and belongs to the technical field of computer accessories. The computer mainboard easy to dissipate heat comprises an upper box shell and a lower box shell. An air outlet is formed in the top of the upper box shell, a heat dissipation fan is installed in the air outlet, transverse heat conduction pipes are arranged on the two sides in the upper box shell, a plurality of longitudinal heat conduction pipes are arranged between the two transverse heat conduction pipes, and the longitudinal heat conduction pipes are all arranged below the heat dissipation fan; the lower box shell and the upper box shell are detachably installed, an air inlet is formed in one side of the upper box shell and one side of the lower box shell, and a first net plate is installed in the air inlet. When the heat dissipation fan exhausts heat in air in the upper box shell and the lower box shell, generated air rapidly passes through the surfaces of the longitudinal heat conduction pipes, so that heat absorbed by the transverse heat conduction pipes and the longitudinal heat conduction pipes is rapidly taken away by the rapidly-circulated air, and the overall heat dissipation efficiency of the computer mainboard is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of computer accessories, in particular to a computer mainboard that is easy to dissipate heat. Background Art

[0002] When a computer motherboard is installed inside a chassis, it requires a corresponding heat dissipation assembly to dissipate heat. For example, the document published with publication number CN213904273U describes a stable and heat-dissipating computer motherboard, including a chassis with a mounting bracket disposed within the chassis. The mounting bracket is configured as a U-shaped bracket, with two spring-loaded telescopic rods fixedly connected to the middle of each inner end of the mounting bracket. The bottom ends of the spring-loaded telescopic rods are fixedly connected to fixed blocks.

[0003] The above-mentioned heat dissipation computer motherboard mainly uses a fan to dissipate heat from the motherboard inside the chassis, and the internal air circulation effect is average, resulting in the motherboard heat dissipation effect not being fast and efficient enough. Utility Model Content

[0004] In order to make up for the above shortcomings, the utility model provides a computer motherboard that is easy to dissipate heat, aiming to improve the problem in the related art that the heat dissipation computer motherboard mainly uses a fan to dissipate heat from the motherboard inside the chassis, and the internal air circulation effect is general, resulting in the motherboard heat dissipation effect not being fast and efficient enough.

[0005] The utility model is achieved in this way:

[0006] The utility model provides a computer mainboard which is easy to dissipate heat and comprises an upper box shell and a lower box shell.

[0007] The top of the upper box shell is provided with an exhaust port, and a heat dissipation fan is installed inside the exhaust port. Both sides of the interior of the upper box shell are provided with transverse heat conduction pipes, and a plurality of longitudinal heat conduction pipes are provided between two transverse heat conduction pipes, and the plurality of longitudinal heat conduction pipes are provided below the heat dissipation fan.

[0008] The lower box shell and the upper box shell are detachably mounted. An air inlet is provided on one side of the upper box shell and the lower box shell, and a first mesh plate is installed inside the air inlet.

[0009] In one embodiment of the present invention, a second mesh plate is provided inside the air outlet on the top of the upper box shell.

[0010] The computer motherboard with easy heat dissipation also includes a bottom support component, which includes a support and a foot plate. The support is fixedly arranged on the bottom of the lower box shell, and two groups of the foot plates are respectively arranged on both sides below the support.

[0011] In one embodiment of the present invention, a mounting slot is provided at the bottom of the lower box shell, and the top of the support is inserted into the mounting slot.

[0012] In an embodiment of the present invention, a plurality of heat dissipation blades distributed at equal intervals are provided in the U-shaped notch area below the support.

[0013] In an embodiment of the present invention, ventilation holes are provided on the bottom of the support between two adjacent heat dissipation blades.

[0014] In one embodiment of the present invention, the bottom support assembly further includes a third mesh plate, and the third mesh plate is arranged on the top of the support.

[0015] In one embodiment of the present invention, the bottom support assembly further includes an anti-slip pad, which is arranged at the bottom of the footboard.

[0016] The beneficial effects of the present invention are as follows: the present invention obtains a computer motherboard that is easy to dissipate heat through the above design, and the heat generated by the motherboard between the upper box shell and the lower box shell is quickly absorbed by the longitudinal heat-conducting pipes and the transverse heat-conducting pipes around the heat dissipation fan. When the heat dissipation fan discharges the heat in the air inside the upper box shell and the lower box shell, the air circulation generated by the heat dissipation fan quickly passes through the surface of the longitudinal heat-conducting pipe, so that the heat absorbed by the transverse heat-conducting pipe and the longitudinal heat-conducting pipe is quickly taken away by the fast-circulating air, thereby improving the overall heat dissipation efficiency of the computer motherboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 This is a schematic diagram of the structure of a computer motherboard that is easy to dissipate heat provided by an embodiment of the utility model;

[0019] Figure 2 Schematic diagram of the upper box shell, heat dissipation fan, horizontal heat pipe and longitudinal heat pipe structure provided by the embodiment of the utility model;

[0020] Figure 3 A schematic diagram of the lower box shell structure provided by an embodiment of the present utility model;

[0021] Figure 4 Schematic diagram of the bottom support assembly structure provided by the embodiment of the utility model Figure 1 ;

[0022] Figure 5 Schematic diagram of the bottom support assembly structure provided by the embodiment of the utility model Figure 2 .

[0023] In the figure: 10 - upper box shell; 110 - cooling fan; 120 - horizontal heat pipe; 130 - vertical heat pipe; 140 - first mesh plate; 150 - second mesh plate; 20 - lower box shell; 210 - mounting slot; 30 - bottom support assembly; 310 - support; 320 - foot plate; 330 - cooling blade; 340 - ventilation hole; 350 - third mesh plate; 360 - anti-slip pad. DETAILED DESCRIPTION

[0024] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] Example

[0026] See also Figure 1-Figure 5 The utility model provides a computer motherboard that is easy to dissipate heat, including an upper box shell 10 and a lower box shell 20.

[0027] The upper housing 10 is equipped with an exhaust vent at the top, and a cooling fan 110 is installed inside the vent. Horizontal heat pipes 120 are installed on both sides of the upper housing 10, and several longitudinal heat pipes 130 are installed between the two transverse heat pipes 120. The transverse heat pipes 120 and the longitudinal heat pipes 130 are fixed together by welding. The multiple longitudinal heat pipes 130 are located below the cooling fan 110. The lower housing 20 is detachable from the upper housing 10. Air inlets are installed on one side of the upper housing 10 and the lower housing 20, and a first mesh panel 140 is installed inside the air inlets.

[0028] The heat generated by the motherboard inside the upper and lower housings 10 and 20 is rapidly dissipated through the exhaust vents at the top of the upper housing 10 by the cooling fan 110. Heat generated by the motherboard between the upper and lower housings 10 and 20 is also rapidly absorbed by the longitudinal heat pipes 130 and transverse heat pipes 120 surrounding the cooling fan 110. While the cooling fan 110 dissipates heat from the air inside the upper and lower housings 10 and 20, it also generates air that rapidly circulates across the surfaces of the longitudinal heat pipes 130. This allows the heat absorbed by the transverse and longitudinal heat pipes 120 and 130 to be quickly carried away by the rapidly circulating air, thereby improving the overall cooling efficiency of the computer motherboard.

[0029] For details, please refer to Figure 1A second mesh plate 150 is provided inside the air outlet at the top of the upper shell 10 , and the second mesh plate 150 is used to protect the heat dissipation fan 110 .

[0030] See also Figure 1 、 Figure 4 and Figure 5 The heat-dissipating computer motherboard also includes a bottom support assembly 30, which includes a support 310 and foot plates 320. The support 310 is fixedly mounted on the bottom of the lower housing 20, and two sets of foot plates 320 are respectively disposed on either side below the support 310. A mounting slot 210 is provided at the bottom of the lower housing 20, and the top of the support 310 is inserted into the mounting slot 210. A plurality of evenly spaced heat dissipating blades 330 are disposed in the U-shaped notch area below the support 310. Ventilation holes 340 are provided between two adjacent heat dissipating blades 330 at the bottom of the support 310.

[0031] When cooling fan 110 draws air from the interiors of upper and lower housings 10 and 20, some air is drawn in through the air inlet on one side, while some air enters the interiors of upper and lower housings 10 and 20 through vents 340 at the bottom of support 310. Support 310 and cooling blades 330 are both made of aluminum with excellent thermal conductivity, quickly dissipating heat from the interior of upper housing 10 and further improving the overall cooling efficiency of the computer motherboard.

[0032] Furthermore, the bottom support assembly 30 also includes a third mesh plate 350, which is arranged on the top of the support 310. The arrangement of the third mesh plate 350 is to reduce the dust in the air from entering the space formed by the upper box shell 10 and the lower box shell 20 through the ventilation hole 340.

[0033] In the specific setting, the bottom support assembly 30 also includes an anti-skid pad 360, which is set at the bottom of the footboard 320. The anti-skid pad 360 can be made of a rubber gasket with good anti-skid performance to increase the overall anti-skid performance of the bottom support assembly 30.

[0034] It should be noted that the specific model and specifications of the cooling fan 110 need to be selected based on the actual specifications of the device, and the specific selection calculation method adopts the existing technology in this field, so it will not be described in detail. The power supply and principle of the cooling fan 110 are clear to those skilled in the art and will not be described in detail here.

[0035] The working principle of this easy-to-dissipate computer motherboard is as follows: When in use, the heat generated by the motherboard inside the upper and lower housings 10 and 20 by the heat dissipation fan 110 is rapidly discharged through the exhaust vents at the top of the upper housing 10. The heat generated by the motherboard between the upper and lower housings 10 and 20 is simultaneously rapidly absorbed by the longitudinal heat pipes 130 and the transverse heat pipes 120 surrounding the heat dissipation fan 110. While the heat dissipation fan 110 is dissipating heat from the air inside the upper and lower housings 10 and 20, the air generated by the heat dissipation fan 110 rapidly flows through the surface of the longitudinal heat pipes 130, allowing the heat absorbed by the transverse and longitudinal heat pipes 120 and 130 to be quickly carried away by the rapidly circulating air, thereby improving the overall heat dissipation efficiency of the computer motherboard.

[0036] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A computer motherboard that is easy to dissipate heat, characterized in that: include An upper box shell (10), wherein an air outlet is provided at the top of the upper box shell (10), and a heat dissipation fan (110) is installed inside the air outlet, transverse heat conduction pipes (120) are provided on both sides of the interior of the upper box shell (10), and a plurality of longitudinal heat conduction pipes (130) are provided between two of the transverse heat conduction pipes (120), and the plurality of longitudinal heat conduction pipes (130) are all provided below the heat dissipation fan (110); A lower box shell (20) is detachably mounted on the upper box shell (10), and an air inlet is provided on one side of the upper box shell (10) and the lower box shell (20), and a first mesh plate (140) is installed inside the air inlet.

2. A computer motherboard with easy heat dissipation according to claim 1, characterized in that: A second mesh plate (150) is provided inside the air outlet at the top of the upper box shell (10).

3. The computer motherboard with easy heat dissipation according to claim 1, characterized in that: The bottom support assembly (30) is further comprised, wherein the bottom support assembly (30) comprises a support (310) and a foot plate (320), wherein the support (310) is fixedly arranged at the bottom of the lower box shell (20), and two groups of the foot plates (320) are respectively arranged on both sides below the support (310).

4. A computer motherboard with easy heat dissipation according to claim 3, characterized in that: The bottom of the lower box shell (20) is provided with a mounting slot (210), and the top of the support (310) is inserted into the mounting slot (210).

5. The computer motherboard with easy heat dissipation according to claim 4, characterized in that: A plurality of heat dissipation blades (330) distributed at equal intervals are provided in the U-shaped notch area below the support (310).

6. The computer motherboard with easy heat dissipation according to claim 5, characterized in that: The bottom of the support (310) is provided with ventilation holes (340) between two adjacent heat dissipation blades (330).

7. A computer motherboard with easy heat dissipation according to claim 6, characterized in that: The bottom support assembly (30) further comprises a third mesh plate (350), and the third mesh plate (350) is arranged on the top of the support (310).

8. The computer motherboard with easy heat dissipation according to claim 3, characterized in that: The bottom support assembly (30) further includes an anti-skid pad (360), and the anti-skid pad (360) is arranged at the bottom of the footboard (320).

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