Heat dissipation device for integrated circuit component

Abstract

The utility model discloses a heat dissipation device for integrated circuit components, which relates to the field of heat dissipation of integrated circuit components and comprises a fixing plate, a fixing frame is fixed inside the fixing plate, a heat dissipation fan is arranged in the middle of the fixing frame, and a circulating curve groove is arranged in the middle of the outer side of the heat dissipation fan. The heat dissipation device comprises a heat dissipation fan, a circulating curve groove is formed in the heat dissipation fan, a patting plate is arranged on the outer side of the heat dissipation fan, a sliding column is rotationally connected to the inner wall of the patting plate, the sliding column is slidably connected with the interior of the circulating curve groove, and a bolt is arranged on one side of the heat dissipation fan. And the flapping plate flaps the surface of the filter screen when moving back and forth, so that dust adhered to the surface of the filter screen is cleaned, and then is discharged through a sewage draining exit in the bottom of the fixed plate, so that the dust is prevented from influencing heat dissipation and blocking the filter screen.

Description

Technical Field

[0001] The utility model relates to the field of heat dissipation of integrated circuit components, in particular to a heat dissipation device for integrated circuit components. Background Art

[0002] Integrated circuits generate a lot of heat when working. If this heat cannot be dissipated in time, it will cause the components to overheat and then be damaged. Keeping the integrated circuit components within the appropriate operating temperature range can ensure their stable performance. The radiator ensures that the components operate within the optimal operating temperature range by effectively dissipating heat, thereby ensuring their stable performance.

[0003] The existing patent CN213660389U discloses a heat dissipation device for components used in integrated circuits. The handle is threadedly connected to the fixed plate by rotating it clockwise through a screw, and then the second sliding block on the fixed block is slidably connected to the second sliding groove on the outer shell. The handle is pulled to drive the telescopic spring to slide the fixed plate out through the second sliding groove, thereby effectively fixing the heat dissipation device. The heat dissipation device for components used in integrated circuits can effectively disassemble the fan blades by providing a clamping block. The clamping slot on the fan blade is engaged with the clamping block on the rotating shaft, and the fan blades can be disassembled and cleaned regularly.

[0004] When the above device dissipates heat for a long time, the air circulation around the heat dissipation port is relatively good, which makes the spring more likely to come into contact with oxygen in the air. Rust is a loose and porous substance. It will not protect the spring like a dense oxide film. Instead, it will further corrode the spring. In addition, after long-term use, the filter itself will be clogged with a lot of dust, making it difficult for air to circulate. Utility Model Content

[0005] The purpose of the utility model is to solve the problem that the air circulation around the heat dissipation port is relatively good, which makes the spring more likely to come into contact with oxygen in the air. Rust is a loose and porous substance. It does not protect the spring like a dense oxide film. Instead, it will further corrode the spring. Moreover, after long-term use, the filter screen itself will be clogged with a lot of dust, making it difficult for air to circulate. A heat dissipation device for integrated circuit components is provided.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a heat dissipation device for integrated circuit components, comprising a fixed plate, a fixed frame fixed inside the fixed plate, a cooling fan provided in the middle of the fixed frame, a circulating curved groove provided in the middle of the outer side of the cooling fan, when the cooling fan rotates, the circulating curved groove in the cooling fan squeezes the flapping plate to move back and forth, a flapping plate is provided on the outer side of the cooling fan, and a sliding column is rotatably connected to the inner wall of the flapping plate.

[0007] As a further solution of the present invention: the sliding column is slidably connected to the inside of the circulation curve groove, and a bolt is provided on one side of the cooling fan.

[0008] As a further solution of the present invention: a filter is provided on the outside of the cooling fan, located on one side of the flapping plate. The flapping plate will flap the surface of the filter when it moves back and forth. A sewage outlet is provided at the bottom inside the fixed plate, and the sewage is discharged through the sewage outlet at the bottom of the fixed plate to prevent dust from affecting heat dissipation and clogging the filter.

[0009] As a further solution of the present invention: the position of the sewage outlet is aligned with the position of the filter, two fixing plates are provided, and a clamping plate is fixed on one side of the fixing plate. The cooling fan is disassembled or installed by turning the bolts. When the cooling fan is disassembled, the filter and the flapping plate on the outside of the cooling fan will also be disassembled together.

[0010] As a further solution of the present invention: a plurality of card blocks are fixed on the inner wall of the card plate, a heat dissipation box is provided between the two fixed plates, a card slot is provided in the inner cavity of the heat dissipation box, and the card plate is installed into the heat dissipation box so that the card blocks in the card plate are engaged with the card slots in the heat dissipation box.

[0011] As a further solution of the present invention: the interior of the card slot is in contact with the card block, the heat dissipation box is made of a double-layer material, and the card plate is arranged in the inner cavity of the heat dissipation box.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] 1. Install the card board into the heat dissipation box through the provided card blocks and card slots, so that the card blocks in the card board are engaged with the card slots in the heat dissipation box, and then remove or install the cooling fan by turning the bolts. When the cooling fan is removed, the filter and the flapping plate on the outside of the cooling fan will also be removed together. When the card blocks in the card board are engaged with the card slots in the heat dissipation box, the fixing plate and the heat dissipation box form a whole, and can be installed and disassembled without more mechanical structures.

[0014] 2. The slapping plate is squeezed through the circulating curve groove in the cooling fan to move back and forth. The slapping plate will slap the surface of the filter when moving back and forth, so that the dust adhering to the surface of the filter is cleaned and then discharged through the drain port at the bottom of the fixed plate to prevent dust from affecting heat dissipation and clogging the filter. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 This is a schematic structural diagram of the overall cross-section of the utility model;

[0017] Figure 3 This is a schematic structural diagram of the heat dissipation box of the utility model;

[0018] Figure 4 It is a structural schematic diagram of the flapping board of the utility model.

[0019] In the figure: 1. fixing plate; 101. clamping plate; 102. clamping block; 103. drain outlet; 2. heat dissipation box; 201. clamping slot; 3. fixing frame; 301. cooling fan; 302. circulation curve slot; 303. filter; 304. bolt; 4. flapping plate; 401. sliding column. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] See also Figure 1 、 2 4. In an embodiment of the present invention, a heat dissipation device for integrated circuit components includes a fixed plate 1, a fixed frame 3 is fixed inside the fixed plate 1, a cooling fan 301 is arranged in the middle of the fixed frame 3, and a circulation curve groove 302 is arranged in the middle of the outer side of the cooling fan 301. When the cooling fan 301 rotates, the circulation curve groove 302 in the cooling fan 301 squeezes the flapping plate 4 to move back and forth, a flapping plate 4 is arranged on the outer side of the cooling fan 301, and a sliding column 401 is rotatably connected to the inner wall of the flapping plate 4. The sliding column 401 is slidably connected to the inner side of the circulation curve groove 302, a bolt 304 is arranged on one side of the cooling fan 301, and a filter 303 is arranged on the outer side of the cooling fan 301 at one side of the flapping plate 4. The flapping plate 4 will flap the surface of the filter 303 when moving back and forth, and a sewage outlet 103 is arranged at the bottom inside the fixed plate 1. The sewage is discharged through the sewage outlet 103 at the bottom of the fixed plate 1 to prevent dust from affecting heat dissipation and clogging the filter 303.

[0022] In this embodiment: when the cooling fan 301 rotates, the circulating curved groove 302 in the cooling fan 301 squeezes the flapping plate 4 to move back and forth. When moving back and forth, the flapping plate 4 will flap the surface of the filter 303, so that the dust adhering to the surface of the filter 303 is cleaned and then discharged through the sewage outlet 103 at the bottom of the fixed plate 1 to prevent the dust from affecting heat dissipation and clogging the filter 303.

[0023] Please refer to Figure 1 、 3 The position of the sewage outlet 103 is aligned with the position of the filter 303. Two fixing plates 1 are provided. A card plate 101 is fixed to one side of the fixing plate 1. The cooling fan 301 is removed or installed by rotating the bolt 304. When the cooling fan 301 is removed, the filter 303 on the outside of the cooling fan 301 and the flapping plate 4 are also removed together. The inside of the card slot 201 is in contact with the card block 102. The heat dissipation box 2 is a double-layer material. The card plate 101 is arranged in the inner cavity of the heat dissipation box 2. A plurality of card blocks 102 are fixed to the inner wall of the card plate 101. A heat dissipation box 2 is provided between the two fixing plates 1. A card slot 201 is provided in the inner cavity of the heat dissipation box 2. The card plate 101 is installed into the heat dissipation box 2 so that the card block 102 in the card plate 101 is engaged with the card slot 201 in the heat dissipation box 2.

[0024] In this embodiment: the card plate 101 is installed in the heat dissipation box 2, so that the block 102 in the card plate 101 is engaged with the slot 201 in the heat dissipation box 2, and then the cooling fan 301 is removed or installed by rotating the bolt 304. When the cooling fan 301 is removed, the filter 303 and the flapping plate 4 on the outside of the cooling fan 301 are also removed together. When the block 102 in the card plate 101 is engaged with the slot 201 in the heat dissipation box 2, the fixing plate 1 and the heat dissipation box 2 form a whole.

[0025] Working principle: The card board 101 is installed into the heat dissipation box 2 through the provided card block 102 and the card slot 201, so that the card block 102 in the card board 101 is engaged with the card slot 201 in the heat dissipation box 2, and then the cooling fan 301 is removed or installed by rotating the bolt 304. When the cooling fan 301 is removed, the filter 303 and the flapping plate 4 on the outside of the cooling fan 301 are also removed together. When the card block 102 in the card board 101 is engaged with the card slot 201 in the heat dissipation box 2, the fixing plate 1 and the heat dissipation box 2 form a whole, and can be installed and disassembled without requiring a large number of mechanical structures.

[0026] When the cooling fan 301 rotates, the circulating curved groove 302 in the cooling fan 301 squeezes the flapping plate 4 to move back and forth. When moving back and forth, the flapping plate 4 will flap the surface of the filter 303, so that the dust adhering to the surface of the filter 303 is cleaned and then discharged through the sewage outlet 103 at the bottom of the fixed plate 1 to prevent the dust from affecting heat dissipation and clogging the filter 303.

[0027] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A heat dissipation device for integrated circuit components, comprising a fixing plate (1), characterized in that: A fixing frame (3) is fixed inside the fixing plate (1), a cooling fan (301) is provided in the middle of the fixing frame (3), a circulating curved groove (302) is provided in the middle of the outer side of the cooling fan (301), a flapping plate (4) is provided on the outer side of the cooling fan (301), and a sliding column (401) is rotatably connected to the inner wall of the flapping plate (4).

2. The integrated circuit component heat dissipation device according to claim 1, characterized in that: The sliding column (401) is slidably connected to the inside of the circulation curved groove (302), and a bolt (304) is provided on one side of the cooling fan (301).

3. The integrated circuit component heat dissipation device according to claim 1, characterized in that: A filter screen (303) is provided on the outside of the cooling fan (301) and on one side of the flapping plate (4), and a sewage outlet (103) is provided at the bottom inside the fixing plate (1).

4. The integrated circuit component heat dissipation device according to claim 3, characterized in that: The position of the sewage outlet (103) is aligned with the position of the filter screen (303), two fixing plates (1) are provided, and a clamping plate (101) is fixed on one side of the fixing plate (1).

5. The integrated circuit component heat dissipation device according to claim 4, characterized in that: A plurality of card blocks (102) are fixed to the inner wall of the card plate (101), a heat dissipation box (2) is provided between the two fixed plates (1), and a card slot (201) is provided in the inner cavity of the heat dissipation box (2).

6. The integrated circuit component heat dissipation device according to claim 5, characterized in that: The interior of the card slot (201) is in contact with the card block (102); the heat dissipation box (2) is made of a double-layer material; and the card plate (101) is arranged in the inner cavity of the heat dissipation box (2).

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