Antenna structure capable of reducing size of grounding copper foil and antenna assembly

By using a serpentine signal metal strip in the circuit board antenna and adjusting the feed point position, the high cost and space occupation problems caused by the excessive grounding copper foil area are solved, and the cost is reduced and the radiation efficiency is optimized without reducing performance.

CN223347995UActive Publication Date: 2025-09-16KUNSHAN HUBBLE ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202422850570.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-22
Publication Date
2025-09-16
Estimated Expiration
2034-11-22

AI Technical Summary

Technical Problem

The grounding copper foil of existing circuit board antennas is large in size, resulting in high manufacturing costs and taking up more space in compact devices.

Method used

A serpentine-structured signal metal strip is used and the positions of the signal feed point and the ground wire feed point are adjusted to reduce the area of ​​the grounding copper foil while maintaining antenna performance.

Benefits of technology

Without affecting the performance of the antenna, the area of ​​the grounding copper foil is reduced, the manufacturing cost of the antenna is reduced, and the radiation efficiency of the antenna is optimized.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an antenna structure and an antenna assembly capable of reducing the size of a grounding copper foil, the antenna structure comprises a base material layer and a metal wiring layer arranged on the base material layer, the metal wiring layer comprises a signal metal strip, a grounding metal strip and a connecting metal strip connecting the signal metal strip and the grounding metal strip; the signal metal strip is of a snakelike structure, a signal feed point welding area is arranged on the signal metal strip, a ground wire feed point welding area is arranged on the grounding metal strip, and the ground wire feed point welding area is connected with a grounding copper foil. According to the utility model, the shape of the signal metal strip is improved into a snakelike structure, and the positions of the signal feed point welding area and the ground wire feed point welding area are optimized, so that the radiation efficiency of the antenna is higher; in addition, the area of the grounding metal strip is increased, and the area of the grounding copper foil can be reduced under the condition that the performance of the antenna is not obviously reduced, so that the cost of the antenna is saved.
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Description

Technical Field

[0001] The utility model belongs to the field of antennas, and in particular relates to an antenna structure and an antenna assembly capable of reducing the size of a grounding copper foil. Background Art

[0002] PCB antennas are antennas made from printed circuit boards and are commonly used in devices requiring wireless data transmission, such as mobile phones, tablets, and laptops, as well as devices with wireless data transmission capabilities, such as smart home appliances and handheld devices. Due to their adaptability as built-in antennas within a variety of complex and compact devices, PCB antennas have become a popular choice in the market, finding widespread application in consumer electronics, automotive electronics, medical devices, smart homes, and other fields. Given their widespread application and enormous demand, it's crucial to minimize their production costs. Utility Model Content

[0003] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by the present invention is to provide an antenna structure and an antenna assembly that can reduce the size of the grounding copper foil.

[0004] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0005] An antenna structure with a reduced ground copper foil size includes a substrate layer and a metal wiring layer arranged on the substrate layer, wherein the metal wiring layer includes a signal metal strip, a ground metal strip, and a connecting metal strip connecting the signal metal strip and the ground metal strip; the signal metal strip has a serpentine structure, a signal feed point welding area is provided on the signal metal strip, a ground wire feed point welding area is provided on the ground metal strip, and the ground wire feed point welding area is connected to the ground copper foil.

[0006] Furthermore, the signal metal strip includes a first longitudinal metal strip, a second longitudinal metal strip, a third longitudinal metal strip and a fourth longitudinal metal strip arranged in parallel in sequence, the first end of the first longitudinal metal strip is connected to the first end of the second longitudinal metal strip through a first transverse metal strip, the second end of the second longitudinal metal strip is connected to the second end of the third longitudinal metal strip through a second transverse metal strip, and the first end of the third longitudinal metal strip is connected to the first end of the fourth longitudinal metal strip through a third transverse metal strip; the middle part of the first longitudinal metal strip is connected to the second end of the connecting metal strip, and the signal feeding point welding area is arranged on the side of the connection area between the first longitudinal metal strip and the connecting metal strip facing the second end of the first longitudinal metal strip.

[0007] Furthermore, the second end of the fourth longitudinal metal strip is connected to a fourth transverse metal strip, and the fourth transverse metal strip and the fourth longitudinal metal strip are perpendicular to each other.

[0008] Furthermore, the second end of the first longitudinal metal strip extends outward and is connected to a fifth transverse metal strip, and the fifth transverse metal strip is perpendicular to the first longitudinal metal strip.

[0009] Furthermore, the grounding metal strip includes a fifth transverse metal strip, a sixth transverse metal strip and a sixth longitudinal metal strip, the fifth transverse metal strip and the sixth transverse metal strip are respectively arranged on both sides of the connecting metal strip, the two ends of the sixth longitudinal metal strip are respectively connected to the first end of the fifth transverse metal strip and the first end of the sixth transverse metal strip, the first end of the connecting metal strip is connected to the middle part of the sixth longitudinal metal strip, and the ground wire feed point welding area is arranged at the second end of the fifth transverse metal strip.

[0010] Furthermore, the length of the sixth transverse metal strip is less than that of the fifth transverse metal strip, the position of the sixth transverse metal strip corresponds to the first transverse metal strip, and the first end of the first transverse metal strip extends to a position close to the sixth transverse metal strip.

[0011] Furthermore, the ground wire feed point welding area is "L"-shaped, including a transverse welding area and a longitudinal welding area located on the side of the transverse welding area facing the connecting metal strip, and the grounding copper foil is connected to the end of the transverse welding area away from the connecting metal strip.

[0012] Furthermore, the signal feed point welding area and the ground wire feed point welding area are gold-plated layers formed by gold plating on the signal metal strip and the ground metal strip respectively, the surface of the gold-plated layer is covered with an OSP film, and the surface of the substrate layer in the area where the gold-plated layer is not provided is covered with an insulating protective film.

[0013] Furthermore, the substrate layer includes a first end and a second end oppositely arranged in the length direction thereof, the grounding metal strip is adjacent to the first end of the substrate layer, and the signal metal strip is adjacent to the second end of the substrate layer.

[0014] An antenna assembly comprising

[0015] An antenna structure with reduced ground copper foil size; and

[0016] An RF connection cable, wherein the second end of the signal line of the RF connection cable is welded and fixed to the signal feed point welding area of ​​the antenna structure, the second end of the ground line of the RF connection cable is welded and fixed to the ground line feed point welding area of ​​the antenna structure, and the first end of the RF connection cable extends outward from the first end of the substrate layer and is provided with a connection terminal.

[0017] This utility model optimizes the antenna structure by modifying the shape of the signal metal strip into a serpentine structure and adjusting the positions of the signal feed point and ground wire feed point soldering areas, resulting in higher radiation efficiency. The signal metal strip is located only on one side of the substrate layer, reducing the area occupied by the signal metal strip, thereby increasing the area of ​​the ground metal strip. This reduces the area of ​​the grounding copper foil while ensuring no significant degradation in antenna performance, thereby saving antenna costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0019] Figure 1 The figure is a schematic structural diagram of an antenna structure with grounded copper foil in the prior art.

[0020] Figure 2 This is a structural schematic diagram of an embodiment of an antenna structure for reducing the size of a ground copper foil according to the present invention.

[0021] Figure 3 It is a cross-sectional schematic diagram of the boundary area between the area where the gold plating layer is provided and the area where the gold plating layer is not provided on the metal wiring layer.

[0022] Figure 4 Schematic diagram of the structure of the metal wiring layer and the gold plating layer.

[0023] Figure 5 The following is an antenna performance test table for an existing antenna structure.

[0024] Figure 6 The figure is a schematic diagram of an antenna performance test curve of an existing antenna structure.

[0025] Figure 7 This is an antenna performance test table of the antenna structure of this embodiment.

[0026] Figure 8 Schematic diagram of antenna performance test curve of the antenna structure of this embodiment.

[0027] Figure 9 The figure is a structural diagram of an antenna assembly according to an embodiment of the present invention.

[0028] Figure 10 This is a structural diagram of the RF connection cable.

[0029] The accompanying drawings in this specification are numeraled as follows:

[0030] Base material layer 100; grounding area 101; antenna radiation area 102; insulating film 110; double-sided adhesive layer 120; adhesive layer 130; release paper 140;

[0031] Metal wiring layer-200; signal metal strip-210; ground metal strip-220; connection metal strip-230;

[0032] First longitudinal metal strip 251; second longitudinal metal strip 252; third longitudinal metal strip 253; fourth longitudinal metal strip 254; fifth longitudinal metal strip 255; sixth longitudinal metal strip 256;

[0033] First transverse metal strip 261; second transverse metal strip 262; third transverse metal strip 263; fourth transverse metal strip 264; fifth transverse metal strip 265; sixth transverse metal strip 266;

[0034] Gold plating layer - 300; signal feed point welding area - 310; ground wire feed point welding area - 320; horizontal welding area - 321; vertical welding area - 322; OSP film - 400; insulation protection film - 500; grounding copper foil - 600;

[0035] RF connection cable 700; signal line 701; ground line 702; first insulation layer 711; second insulation layer 712; connection terminal 720; terminal protective cover 730;

[0036] Substrate 800 ; first metal strip 810 ; second metal strip 820 ; third metal strip 830 ; first welding area 840 ; second welding area 850 ; third welding area 860 ; copper foil 870 . DETAILED DESCRIPTION

[0037] The following describes the implementation of the present invention through specific examples. The illustrations provided in the following embodiments are only used to schematically illustrate the basic concept of the present invention. The following embodiments and features in the embodiments can be combined with each other unless there is any conflict.

[0038] See also Figure 1 In the prior art, an antenna structure with a grounded copper foil includes a substrate 800 and a first metal strip 810, a second metal strip 820, and a third metal strip 830 arranged on the substrate 800. The first metal strip 810 is distributed in the upper half and right half areas of the substrate 800, the second metal strip 820 is arranged in the lower left part of the substrate 800, and the third metal strip 830 is arranged in the lower part of the substrate 800. The left end of the third metal strip 830 is connected to the second metal strip 820, and the right end is connected to the first metal strip 810.

[0039] The first metal strip 810 is provided with a first welding area 840 for connecting the RF cable signal line, the second metal strip 820 is provided with a second welding area 850 for connecting the RF cable ground line, and the connection area between the third metal strip 830 and the second metal strip 820 is provided with a third welding area 860, and a copper foil 870 for grounding is welded and fixed to the third welding area 860.

[0040] See also Figure 2 , Figure 2 This is a schematic diagram of an embodiment of an antenna structure for reducing the size of grounding copper foil according to the present invention. The antenna structure for reducing the size of grounding copper foil according to this embodiment includes a substrate layer 100 and a metal wiring layer 200 disposed on the substrate layer 100. The metal wiring layer 200 includes a signal metal strip 210, a grounding metal strip 220, and a connecting metal strip 230 connecting the signal metal strip 210 and the grounding metal strip 220. In this embodiment, the substrate layer 100 includes a first end (i.e., a metal strip) disposed opposite to the first end in its longitudinal direction. Figure 1 The left end of the substrate layer 100) and the second end (ie Figure 1 The antenna is positioned at the right end of the substrate layer 100 (center), with the grounding metal strip 220 adjacent to the first end of the substrate layer 100, and the signal metal strip 210 adjacent to the second end of the substrate layer 100. The signal metal strip 210 has a serpentine structure, which increases the antenna's electrical length within a limited installation area and leaves more area for the grounding metal strip 220, allowing for the use of a smaller grounding copper foil 600 to save costs. A signal feed pad 310 is provided on the signal metal strip 210, and a ground feed pad 320 is provided on the ground metal strip 220. The ground feed pad 320 is connected to the grounding copper foil 600.

[0041] See also Figure 3The antenna structure of this embodiment preferably takes the form of a flexible circuit board antenna, wherein the substrate layer 100 includes an insulating film 110, a double-sided adhesive layer 120 disposed on the front of the insulating film 110, an adhesive layer 130 disposed on the back of the insulating film 110, and a release paper 140 adhered to the insulating film 110 via the adhesive layer 130. The metal wiring layer 200 is adhered to the insulating film 110 via the double-sided adhesive layer 120, and the signal feed point welding area 310 and the ground feed point welding area 320 are gold-plated layers 300 formed by gold plating on the signal metal strip 210 and the ground metal strip 220, respectively. To protect the metal wiring layer 200 and the gold-plated layer 300, the surface of the gold-plated layer 300 is covered with an OSP film 400 (Organic Solderability Preservative). The surface of the substrate layer 100 not provided with the gold-plated layer 300 (including the surface of the metal wiring layer 200) is covered with an insulating protective film 500. During use, the release paper 140 is removed, and the antenna structure can be adhered and fixed to the desired location using the adhesive layer 130.

[0042] OSP is a surface treatment technology that chemically grows an organic film on the clean bare copper surface. It is mainly used on printed circuit boards to prevent oxidation and corrosion of the copper surface. This organic film has anti-oxidation, heat shock resistance, and moisture resistance, and is used to protect the copper surface from rusting (oxidation or sulfide, etc.) in a normal environment. However, in the subsequent high temperature of welding, this protective film can be easily removed by the flux, so that the exposed clean copper surface can be immediately combined with the molten solder in a very short time to form a solid solder joint. It should be noted that Figure 1 In order to facilitate the display of the structure of the metal wiring layer 200 and the gold plating layer 300, the insulating protection film 500 and the OSP film 400 are not shown.

[0043] See also Figure 4 The serpentine structure of the signal metal strip 210 can be formed by connecting multiple longitudinal metal strips and multiple transverse metal strips. For example, from left to right, the upper ends of the longitudinal metal strips of the odd-numbered stages are connected to the upper ends of the longitudinal metal strips of the next stage via a transverse metal strip, and the lower ends of the longitudinal metal strips of the even-numbered stages are connected to the lower ends of the longitudinal metal strips of the next stage via a transverse metal strip. Of course, from left to right, the lower ends of the longitudinal metal strips of the odd-numbered stages can also be connected to the lower ends of the longitudinal metal strips of the next stage via a transverse metal strip, and the upper ends of the longitudinal metal strips of the even-numbered stages can be connected to the upper ends of the longitudinal metal strips of the next stage via a transverse metal strip.

[0044] In this embodiment, the signal metal strip 210 includes a first longitudinal metal strip 251, a second longitudinal metal strip 252, a third longitudinal metal strip 253, and a fourth longitudinal metal strip 254, sequentially arranged from left to right on the substrate layer 100. The first longitudinal metal strip 251, the second longitudinal metal strip 252, the third longitudinal metal strip 253, and the fourth longitudinal metal strip 254 are parallel to each other. The first end of the first longitudinal metal strip 251 is connected to the first end of the second longitudinal metal strip 252 via a first transverse metal strip 261. The second end of the second longitudinal metal strip 252 is connected to the second end of the third longitudinal metal strip 253 via a second transverse metal strip 262. The first end of the third longitudinal metal strip 253 is connected to the first end of the fourth longitudinal metal strip 254 via the third transverse metal strip 263, thereby forming a serpentine-shaped signal metal strip 210.

[0045] In order to increase the electrical length of the signal metal strip 210, the second end of the first longitudinal metal strip 251 can also extend outward and be connected to a fifth transverse metal strip 265, and the fifth transverse metal strip 265 is perpendicular to the first longitudinal metal strip 251; the second end of the fourth longitudinal metal strip 254 can also be connected to a fourth transverse metal strip 264, and the fourth transverse metal strip 264 is perpendicular to the fourth longitudinal metal strip 254.

[0046] Please continue reading Figure 4 In this embodiment, the grounding metal strip 220 may include a fifth transverse metal strip 265, a sixth transverse metal strip 266, and a sixth longitudinal metal strip 256. The fifth transverse metal strip 265 and the sixth transverse metal strip 266 are respectively disposed on either side of the connecting metal strip 230, and the ends of the sixth longitudinal metal strip 256 are respectively connected to the first end of the fifth transverse metal strip 265 and the first end of the sixth transverse metal strip 266. In this embodiment, the fifth transverse metal strip 265 is disposed near the lower edge of the substrate layer 100, the sixth transverse metal strip 266 is disposed near the upper edge of the substrate layer 100, and the sixth longitudinal metal strip 256 is disposed near the left edge of the substrate layer 100.

[0047] The first end of the connecting metal strip 230 is generally connected to the middle of the sixth longitudinal metal strip 256. The ground feed point welding area 320 is provided at the second end of the fifth transverse metal strip 265, i.e., at a position of the fifth transverse metal strip 265 near the lower end of the first longitudinal metal strip 251. The second end of the connecting metal strip 230 is generally connected to the middle of the first longitudinal metal strip 251. The signal feed point welding area 310 is provided on the side of the connection area between the first longitudinal metal strip 251 and the connecting metal strip 230, facing the second end of the first longitudinal metal strip 251, i.e., at a position slightly below the middle of the first longitudinal metal strip 251.

[0048] The length of the sixth transverse metal strip 266 is less than that of the fifth transverse metal strip 265. The length of the sixth transverse metal strip 266 is generally 0.3 to 0.8 times the length of the fifth transverse metal strip 265. In this embodiment, the length of the sixth transverse metal strip 266 is approximately half the length of the fifth transverse metal strip 265. The position of the sixth transverse metal strip 266 corresponds to the first transverse metal strip 261, and the first end of the first transverse metal strip 261 extends to a position close to the sixth transverse metal strip 266, thereby further increasing the electrical length of the signal metal strip 210.

[0049] The ground wire feed point welding area 320 is in an "L" shape, including a transverse welding area 321 and a longitudinal welding area 322 located on the side of the transverse welding area 321 facing the connecting metal strip 230. The transverse welding area 321 is used to weld the ground copper foil 600, and the ground copper foil 600 is connected to the end of the transverse welding area 321 away from the connecting metal strip 230; the longitudinal welding area 322 is used to connect the ground wire 702 of the RF cable, thereby replacing the ground wire 702 of the RF cable with an "L"-shaped ground wire feed point welding area 320. Figure 1 The second welding area 850 and the third welding area 860 in the existing antenna structure.

[0050] See also Figure 5 and Figure 6 , for the use of Figure 1 The antenna structure, copper foil 870 size is 10mm × 9mm, and the antenna performance test table and antenna performance test curve are obtained by testing at multiple frequencies in the 802.11.g band, 802.11.a band and Wi-Fi 6E band. Figure 7 and Figure 8 , for the antenna structure of this embodiment, when the grounding copper foil 600 has a size of 9mm×8mm, the antenna performance test table and antenna performance test curve are obtained by testing at multiple frequency points in the 802.11.g band, 802.11.a band and WIFI 6E band. By comparison, it can be seen that in the free state, Figure 1 The average efficiency of the antenna in the medium antenna structure is -4.51 dB, and the average gain of the antenna is 1.14 dB. After the antenna structure is improved in this embodiment, when the area of ​​the ground copper foil 600 is reduced by 20%, the average efficiency of the antenna is -4.43 dB, and the average gain of the antenna is 1.14 dB. That is, after adopting the structure of this embodiment and reducing the area of ​​the ground copper foil 600, the average gain of the antenna remains basically unchanged at 1.14 dB, and the antenna efficiency not only does not decrease, but is slightly improved.

[0051] In this embodiment, by modifying the shape of the signal metal strip 210 into a serpentine structure, the antenna's electrical length is increased. Adjusting the positions of the signal feed point soldering area 310 and the ground feed point soldering area 320 optimizes the positions of the signal and ground feed points, thereby enhancing the antenna's radiation efficiency. Positioning the signal metal strip 210 on only one side of the substrate layer 100 reduces the area occupied by the signal metal strip 210, thereby increasing the area of ​​the ground metal strip 220. This reduces the area of ​​the ground copper foil 600 while ensuring no significant degradation in antenna performance, thereby saving antenna costs and potentially enabling its use as an internal antenna for devices such as built-in Wi-Fi antennas.

[0052] See also Figure 9 , Figure 9 The antenna assembly of this embodiment includes an antenna structure and a radio frequency connection cable 700 . The antenna structure can adopt any of the above embodiments with a reduced size of the grounding copper foil 600 .

[0053] See also Figure 10 The radio frequency connection cable 700 includes a signal line 701, a first insulating layer 711 wrapping the signal line 701, a ground line 702 in a mesh shape on the first insulating layer 711, and a second insulating layer 712 wrapping the ground line 702. The second end (i.e. Figure 5 The right end of the RF connection cable 700) is welded and fixed to the signal feed point welding area 310 of the antenna structure, and the second end of the ground wire 702 of the RF connection cable 700 (ie Figure 5 The right end of the RF connection cable 700) is welded and fixed to the ground wire feed point welding area 320 of the antenna structure. The first end of the RF connection cable 700 (ie Figure 5 The left end of the RF connection cable 700 extends outward from the first end of the substrate layer 100 and is provided with a connection terminal 720. Of course, the connection terminal 720 is generally further provided with a terminal protection sleeve 730 to protect the connection terminal 720.

[0054] In this embodiment, by improving the antenna structure, the area of ​​the grounding copper foil 600 can be reduced while maintaining substantially the same antenna performance, thereby reducing antenna costs. Furthermore, by placing the signal metal strip 210 on one side of the substrate layer 100, the antenna can be shielded from handheld devices such as handheld game consoles, thereby reducing the environmental requirements for the antenna.

[0055] The above embodiments merely represent preferred implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present utility model patent shall be determined by the appended claims.

Claims

1. An antenna structure with reduced ground copper foil size, characterized by: It includes a substrate layer and a metal wiring layer arranged on the substrate layer, the metal wiring layer includes a signal metal strip, a grounding metal strip and a connecting metal strip connecting the signal metal strip and the grounding metal strip; the signal metal strip is in a serpentine structure, a signal feed point welding area is provided on the signal metal strip, a ground wire feed point welding area is provided on the grounding metal strip, and the ground wire feed point welding area is connected to a grounding copper foil.

2. The antenna structure for reducing the size of the ground copper foil according to claim 1, wherein: The signal metal strip includes a first longitudinal metal strip, a second longitudinal metal strip, a third longitudinal metal strip and a fourth longitudinal metal strip arranged in parallel in sequence, the first end of the first longitudinal metal strip is connected to the first end of the second longitudinal metal strip through the first transverse metal strip, the second end of the second longitudinal metal strip is connected to the second end of the third longitudinal metal strip through the second transverse metal strip, and the first end of the third longitudinal metal strip is connected to the first end of the fourth longitudinal metal strip through the third transverse metal strip; the middle part of the first longitudinal metal strip is connected to the second end of the connecting metal strip, and the signal feeding point welding area is arranged on the side of the connection area between the first longitudinal metal strip and the connecting metal strip facing the second end of the first longitudinal metal strip.

3. The antenna structure for reducing the size of the ground copper foil according to claim 2, wherein: The second end of the fourth longitudinal metal strip is connected to the fourth transverse metal strip, and the fourth transverse metal strip and the fourth longitudinal metal strip are perpendicular to each other.

4. The antenna structure for reducing the size of the ground copper foil according to claim 2, wherein: The second end of the first longitudinal metal strip extends outward and is connected to a fifth transverse metal strip, and the fifth transverse metal strip is perpendicular to the first longitudinal metal strip.

5. The antenna structure for reducing the size of the ground copper foil according to claim 2, wherein: The grounding metal strip includes a fifth transverse metal strip, a sixth transverse metal strip and a sixth longitudinal metal strip, the fifth transverse metal strip and the sixth transverse metal strip are respectively arranged on both sides of the connecting metal strip, the two ends of the sixth longitudinal metal strip are respectively connected to the first end of the fifth transverse metal strip and the first end of the sixth transverse metal strip, the first end of the connecting metal strip is connected to the middle part of the sixth longitudinal metal strip, and the ground wire feed point welding area is arranged at the second end of the fifth transverse metal strip.

6. The antenna structure for reducing the size of the ground copper foil according to claim 5, wherein: The length of the sixth transverse metal strip is less than that of the fifth transverse metal strip. The position of the sixth transverse metal strip corresponds to the first transverse metal strip, and the first end of the first transverse metal strip extends to a position close to the sixth transverse metal strip.

7. The antenna structure for reducing the size of the ground copper foil according to claim 5, wherein: The ground wire feed point welding area is "L"-shaped, including a transverse welding area and a longitudinal welding area located on the side of the transverse welding area facing the connecting metal strip, and the grounding copper foil is connected to the end of the transverse welding area away from the connecting metal strip.

8. The antenna structure for reducing the size of the ground copper foil according to claim 5, wherein: The signal feed point welding area and the ground wire feed point welding area are gold-plated layers formed by gold plating on the signal metal strip and the ground metal strip respectively. The surface of the gold-plated layer is covered with an OSP film, and the surface of the substrate layer in the area where the gold-plated layer is not provided is covered with an insulating protective film.

9. The antenna structure for reducing the size of the ground copper foil according to any one of claims 1 to 8, characterized in that: The substrate layer includes a first end and a second end opposite to each other in a length direction thereof. The grounding metal strip is adjacent to the first end of the substrate layer, and the signal metal strip is adjacent to the second end of the substrate layer.

10. An antenna assembly, characterized in that: include An antenna structure with reduced ground copper foil size as claimed in any one of claims 1 to 9; as well as An RF connection cable, wherein the second end of the signal line of the RF connection cable is welded and fixed to the signal feed point welding area of ​​the antenna structure, the second end of the ground line of the RF connection cable is welded and fixed to the ground line feed point welding area of ​​the antenna structure, and the first end of the RF connection cable extends outward from the first end of the substrate layer and is provided with a connection terminal.