Capsule device based on baseband chip GD32VW553XX

Abstract

The utility model discloses a capsule device based on a baseband chip GD32VW553XX, which is used for being placed in a rumen of a ruminant and comprises a baseband chip GD32VW553XX kernel circuit, an antenna circuit, a power supply configuration circuit, a temperature sensor circuit and a motion sensor circuit, the power supply configuration circuit is used for supplying power to each circuit; the antenna circuit is used for transmitting and receiving radio signals of the baseband chip GD32VW553XX kernel circuit, the temperature sensor circuit is used for collecting temperature data of a rumen of a ruminant and sending the temperature data to the baseband chip GD32VW553XX kernel circuit, and the motion sensor circuit is used for collecting motion data of the ruminant and sending the motion data to the baseband chip GD32VW553XX kernel circuit; and the baseband chip GD32VW553XX kernel circuit is used for sending the processed temperature data and motion data to the DC big data computing center. The utility model has the advantages of long data receiving and transmitting distance, high data receiving and transmitting sensitivity, complete data acquisition and stable data transmission.

Description

Technical Field

[0001] The utility model relates to the field of circuit structures, in particular to a capsule device based on a baseband chip GD32VW553XX. Background Art

[0002] With the development of Internet of Things (IoT), a variety of wireless technologies have emerged. Among these technologies, WIFI technology, a form of LPWAN communication technology, has emerged. Its long-distance, low-power, multi-node, and low-cost features have been recognized by the IoT community.

[0003] Placed in a cow's stomach, it monitors its vital signs and milk production, enabling timely detection of illnesses. This not only reduces costs but also increases milk production. The Cow Stomach Capsule is ushering in a new era for digital agriculture and animal husbandry. Like a robot implanted in a cow, the Cow Stomach Capsule can sense its true body temperature, posture, activity level, water intake, location, and other data. This data can be used to predict a cow's health, manage estrus and calving times, and monitor gastric acid levels to improve feed formulations and prevent acid poisoning.

[0004] Currently, the GD32VW553XX solution for cow stomach capsules is available on the market. This low-cost solution is particularly effective for scenarios with a small number of terminals and low upload frequency, or for supplementing signals in blind spots. However, because it operates within the cow's stomach, existing technology still suffers from shortcomings such as short transmission and reception distance, low sensitivity, incomplete data, and unstable data. It is still in the extensive development stage.

[0005] Therefore, the existing technology has defects and needs to be improved. Utility Model Content

[0006] The technical problem to be solved by the utility model is to provide a capsule device based on the baseband chip GD32VW553XX, which has a long data receiving and sending distance, high data receiving and sending sensitivity, relatively complete data collection, and stable data transmission.

[0007] The technical solution of the utility model is as follows:

[0008] A capsule device based on a baseband chip GD32VW553XX is used to be placed in the rumen of a ruminant, comprising a baseband chip GD32VW553XX core circuit, an antenna circuit, a power configuration circuit, a temperature sensor circuit, and a motion sensor circuit; wherein the power configuration circuit is respectively connected to the baseband chip GD32VW553XX core circuit, the temperature sensor circuit, and the motion sensor circuit, and is used to supply power to the baseband chip GD32VW553XX core circuit, the temperature sensor circuit, and the motion sensor circuit; and the antenna circuit, the temperature sensor circuit, and the motion sensor circuit are respectively connected to the baseband chip GD32VW553XX core circuit, the temperature sensor circuit, and the motion sensor circuit. The antenna circuit is used to transmit and receive radio signals of the baseband chip GD32VW553XX core circuit, the temperature sensor circuit is used to collect temperature data of the rumen of ruminants and send it to the baseband chip GD32VW553XX core circuit, and the motion sensor circuit is used to collect motion data of ruminants and send it to the baseband chip GD32VW553XX core circuit; the baseband chip GD32VW553XX core circuit is connected to the external IDC big data computing center through the antenna circuit, and is used to send the processed temperature data and motion data to the DC big data computing center.

[0009] Applied to the above technical solution, in the capsule device, the baseband chip GD32VW553XX core circuit includes a baseband chip GD32VW553XX, and the baseband chip GD32VW553XX is integrated with a radio frequency transceiver, a modem and a 32-bit RISC microcontroller.

[0010] Applied to each of the above technical solutions, in the capsule device, the power configuration circuit includes a step-up DC-DC converter chip, which is used to generate a 3.3V voltage to power the core circuit of the baseband chip GD32VW553XX, and a 3.3V voltage to power the temperature sensor circuit and the motion sensor circuit.

[0011] Applied to each of the above technical solutions, in the capsule device, the boost DC-DC converter chip uses a TPS613221A chip.

[0012] Applied to each of the above technical solutions, in the capsule device, the baseband chip GD32VW553XX and the temperature sensor circuit communicate using an I2C line interface; the baseband chip GD32VW553XX and the motion sensor circuit communicate using an SPI line interface.

[0013] Applied to each of the above technical solutions, the capsule device further includes a reset circuit connected to the baseband chip GD32VW553XX, and the reset circuit is controlled by a RESET line interface connected to the baseband chip GD32VW553XX.

[0014] Applied to each of the above technical solutions, in the capsule device, the baseband chip GD32VW553XX adopts a QFN 4 mm×4 mm packaging structure.

[0015] Applied to each of the above technical solutions, in the capsule device, the antenna circuit is configured as a 2.4G antenna circuit structure.

[0016] Applied to each of the above technical solutions, in the capsule device, the temperature sensor circuit includes a GXTS03 temperature sensor chip.

[0017] Applied to each of the above technical solutions, in the capsule device, the motion sensor circuit includes a BMA456 motion sensor chip.

[0018] The beneficial effects of the utility model are:

[0019] The utility model integrates a baseband chip GD32VW553XX core circuit, an antenna circuit, a power configuration circuit, a temperature sensor circuit, and a motion sensor circuit in a capsule device. Thus, the temperature sensor circuit and the motion sensor circuit respectively collect temperature data from the rumen of a ruminant and motion data of the ruminant. After being processed by the baseband chip GD32VW553XX core circuit, the data is sent to a DC big data computing center for analysis and display via the antenna circuit. The collected data is relatively complete and the transmission and reception distance is relatively long. Furthermore, the baseband chip GD32VW553XX core circuit and the temperature sensor circuit communicate via an I2C line interface.

[0020] The baseband chip GD32VW553XX core circuit and the motion sensor circuit communicate using an SPI line interface, and the baseband chip GD32VW553XX core circuit and the DC big data computing center are connected using an antenna circuit, which has high data transmission and reception sensitivity and stable data transmission; and through the integrated setting, the capsule device is smaller in size. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a circuit diagram of the core circuit of the baseband chip GD32VW553XX in this utility model;

[0022] Figure 2 A circuit diagram of the power configuration circuit in the utility model;

[0023] Figure 3A circuit diagram of the antenna circuit in the present utility model;

[0024] Figure 4 This is a circuit diagram of the temperature sensor circuit in the present utility model;

[0025] Figure 5 This is a circuit diagram of the motion sensor circuit in the present utility model;

[0026] Figure 6 This is a circuit diagram of the reset circuit in the utility model; DETAILED DESCRIPTION

[0027] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0028] This embodiment provides a capsule device based on the baseband chip GD32VW553XX. The capsule device can be placed in the rumen of a cow or sheep, and uses sensors to collect information such as the temperature and body shape of the cow or sheep. In addition, environmental parameters in the rumen, including temperature, step count, body shape, and position, are obtained from the capsule device installed in the rumen of the cow or sheep. The obtained information data is then sent to the baseband chip GD32VW553XX for data processing and then to a remote DC big data computing center. After analysis by the DC big data computing center, all raw data and analysis results are presented on the cattle health management APP platform on the farmer's mobile phone, allowing users to monitor the health status of the cattle or sheep in real time.

[0029] The IDC Big Data Computing Center not only helps farmers improve the scientific and rational nature of their farming practices, but also helps managers and veterinarians conduct precise reproductive management and comprehensive health management of cattle based on pushed task lists. It also stores all collected data and early warning information in this IDC Big Data Computing Center, providing government management departments with safe and reliable traceability data, and offering data support to veterinary pharmaceutical and feed companies.

[0030] The capsule device includes a baseband chip GD32VW553XX core circuit, an antenna circuit, a power configuration circuit, a temperature sensor circuit, and a motion sensor circuit; Figure 1As shown, the core circuit of the baseband chip GD32VW553XX includes a baseband chip GD32VW553XX, which is integrated with an RF transceiver, a modem and a 32-bit RISC microcontroller. The microcontroller uses ARMSTAR and has an operating frequency of 48MHz. The RF transceiver has a 2.4G frequency coverage range. The modem supports 2.4G modulation for LPWAN use cases and (G)FSK modulation for legacy use cases. The Mod modulator in the modem also supports BPSK modulation in TX and (G)MSK modulation in TX and RX. The LPWAN wireless communication module designed with GD32VW553XX provides ultra-long range and ultra-low power communication for LPWAN applications. GD32VW553XX can achieve high sensitivity to -100dBm and a maximum transmission power of +22dBm; the specific circuit diagram of the core circuit of the baseband chip GD32VW553XX is shown as follows Figure 1 As shown, since the baseband chip GD32VW553XX is a prior art chip, its specific circuit structure setting is not described here.

[0031] like Figure 2 As shown, the power configuration circuit is respectively connected to the baseband chip GD32VW553XX core circuit, the temperature sensor circuit, and the motion sensor circuit, and is used to respectively power the baseband chip GD32VW553XX core circuit, the temperature sensor circuit, and the motion sensor circuit; wherein the power configuration circuit is connected to the lithium battery pack and is powered by the lithium battery pack, and the power configuration circuit includes a boost DC-DC converter chip, and the boost DC-DC converter chip adopts the TPS613221A chip U3 to generate a 3.3V voltage for the baseband chip GD32VW553XX core circuit;

[0032] The TPS613221A chip U3 is used to generate a 3.3V voltage to power the temperature sensor circuit and the motion sensor circuit.

[0033] The antenna circuit is connected to the core circuit of the baseband chip GD32VW553XX. The antenna circuit is set to a 2.4G antenna circuit structure. The specific circuit structure is as follows: Figure 3 As shown in the figure, the antenna circuits are respectively connected to the P8 pin of the baseband chip GD32VW553XX. The antenna circuits are used to transmit and receive radio signals from the core circuit of the baseband chip GD32VW553XX. The specific circuit structure of the antenna circuit can also be achieved through existing technologies and will not be described in detail here.

[0034] The GD32VW553XX baseband chip's core circuit is responsible for RF signals, connecting to an external gateway host and exchanging signals with an external DC big data computing center. The GD32VW553XX's RF is responsible for sending and receiving signals. The signals are then sent to the GD32VW553XX baseband chip for demodulation and processing.

[0035] In addition, the temperature sensor circuit and the motion sensor circuit are respectively connected to the core circuit of the baseband chip GD32VW553XX. Specifically, the temperature sensor circuit and the motion sensor circuit are respectively connected to the baseband chip GD32VW553XX of the core circuit of the baseband chip GD32VW553XX. The baseband chip GD32VW553XX and the temperature sensor circuit communicate using an I2C line interface; the baseband chip GD32VW553XX and the motion sensor circuit communicate using an SPI line interface. The register data of the I2C and SPI interfaces of the 2.4G baseband chip GD32VW553XX is configured through the core circuit of the baseband chip GD32VW553XX to complete 2.4G data transmission and reception control and data communication.

[0036] In addition, the temperature sensor circuit is used to collect the temperature data of the rumen of cattle or sheep and send it to the core circuit of the baseband chip GD32VW553XX. The motion sensor circuit is used to collect the motion data of cattle or sheep and send it to the core circuit of the baseband chip GD32VW553XX. The baseband chip GD32VW553XX core circuit is connected to the external IDC big data computing center through the antenna circuit.

[0037] Used to send raw data and processed temperature data and motion data to the DC big data computing center.

[0038] The temperature sensor circuit includes a GXTS03 temperature sensor chip U6. The circuit structure of the temperature sensor circuit using the GXTS03 temperature sensor chip U6 is as follows: Figure 4 As shown; the temperature sensor circuit is specifically connected to pins 16 and 17 of the baseband chip GD32VW553XX; wherein, the GXTS03 temperature sensor chip belongs to the existing temperature sensor chip.

[0039] Furthermore, the motion sensor circuit includes a BMA456 motion sensor chip U5, wherein the motion sensor circuit using the BMA456 motion sensor chip is as follows: Figure 5 As shown, the motion sensor circuit is specifically connected to pins 18, 19, 20, and 21 of the baseband chip GD32VW553XX, wherein the BMA456 motion sensor chip is an existing motion sensor chip.

[0040] Furthermore, it also includes a reset circuit connected to the baseband chip GD32VW553XX. The reset circuit TPL5010 chip is controlled by a RESET line interface connected to the baseband chip GD32VW553XX. The specific circuit structure of the reset circuit is as follows: Figure 6 As shown, the reset circuit is connected to pin 1 and pin 5 of the baseband chip GD32VW553XX; the RESET line interface circuit structure is as follows Figure 6 As shown, through the core circuit of the baseband chip GD32VW553XX, the communication baseband chip GD32VW553XX is effectively controlled by high and low levels to complete the opening and closing of the reset circuit.

[0041] The TPL5010 chip in the reset circuit is part of the reset circuit. When the baseband chip GD32VW553XX is faulty, it resets the baseband chip GD32VW553XX, starts recovery work, and sends and receives data.

[0042] The GD32VW553XX baseband chip is housed in a very small package, using a 4mm x 4mm QFN pinout. The 2.4G wireless communication module designed with the GD32VW553XX baseband chip provides ultra-long-range, ultra-low-power, multi-node, and low-cost communication for LPWAN applications.

[0043] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A capsule device based on the baseband chip GD32VW553XX, for placement in the rumen of a ruminant, characterized by: including a core circuit, an antenna circuit, a power configuration circuit, a temperature sensor circuit, and a motion sensor circuit; Wherein, the power configuration circuit is respectively connected with the core circuit, the temperature sensor circuit, and the motion sensor circuit; Furthermore, the antenna circuit, the temperature sensor circuit, and the motion sensor circuit are respectively connected to the core circuit, wherein the antenna circuit is used to transmit and receive radio signals of the core circuit; The antenna circuit is connected to an external IDC big data computing center to send the processed temperature data and motion data to the DC big data computing center.

2. The capsule device according to claim 1, wherein: The core circuit includes a baseband chip GD32VW553XX, which is integrated with a radio frequency transceiver, a modem and a 32-bit RISC microcontroller.

3. The capsule device according to claim 1, wherein: The power configuration circuit includes a boost DC-DC conversion chip, which generates a 3.3V voltage to power the temperature sensor circuit and the motion sensor circuit.

4. The capsule device according to claim 3, wherein: The boost DC-DC conversion chip adopts the TPS613221A chip.

5. The capsule device according to claim 2, wherein: The baseband chip GD32VW553XX and the temperature sensor circuit communicate using an I2C line interface; the baseband chip GD32VW553XX and the motion sensor circuit communicate using an SPI line interface.

6. The capsule device according to claim 2, wherein: It also includes a reset circuit connected to the baseband chip GD32VW553XX, and the reset circuit is controlled by a RESET line interface connected to the baseband chip GD32VW553XX.

7. The capsule device according to claim 2, wherein: The baseband chip GD32VW553XX adopts a QFN 4mm×4mm packaging structure.

8. The capsule device according to claim 2, wherein: The antenna circuit is configured as a 2.4G antenna circuit structure.

9. The capsule device according to claim 2, wherein: The temperature sensor circuit includes a GXTSO3 temperature sensor chip.

10. The capsule device according to claim 2, characterized in that: The motion sensor circuit includes a BMA456 motion sensor chip.

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