Integrated structure of lower cover of Bluetooth sound box

Abstract

The utility model belongs to the field of integrally-formed structures, particularly relates to a lower cover integrally-formed structure of a Bluetooth sound box, and aims to solve the problems that an existing Bluetooth sound box is easily wetted by water due to poor sealing performance of a lower cover, even sound leakage occurs to the sound box due to poor sealing performance, screws are exposed on the surface of a shell, the attractiveness of the sound box is affected, buckling connection is poor, and the like. In order to solve the problem that a lower cover is easy to fall off from a shell, the utility model provides the following scheme: the lower cover comprises a lower shell, the top of the lower shell is fixedly connected with a connecting ring, a clamping port is formed between the lower shell and the connecting ring, the top of the connecting ring is provided with a sealing groove, and a sealing ring is arranged in the sealing groove. Therefore, the connection between the lower shell of the sound box and the whole sound box is more stable, the disassembly of the sound box is simpler due to the matching use of the simple buckle structure and the screws, and the sound quality performance and the waterproof performance of the sound box are also improved due to the use of the sound insulation pad and the sealing ring.

Description

Technical Field

[0001] The utility model relates to the technical field of one-piece molding structures, in particular to an one-piece molding structure of a lower cover of a Bluetooth speaker. Background Art

[0002] As a type of audio playback device, Bluetooth speakers are designed to connect to various data and voice devices wirelessly. With the development of the times, Bluetooth speakers have gradually become popular among consumers due to their portability, convenience of wireless connection and good sound quality. With the continuous development and popularization of Bluetooth technology, the requirements for Bluetooth speakers are also gradually increasing.

[0003] The existing one-piece molding structure of the lower cover of the Bluetooth speaker still has some shortcomings in actual use:

[0004] 1. Existing Bluetooth speakers generally have poor sealing. When a cup of water is spilled on the table, the Bluetooth speaker placed on the table is easily soaked by water due to the poor sealing of the lower cover, and even the speaker may leak sound due to the poor sealing.

[0005] 2. The lower cover of existing Bluetooth speakers is mostly fixed with screws. After fixing, the screws will be exposed on the surface of the shell, affecting the aesthetics of the speaker. Some speakers also use a single snap connection, and the lower cover is easy to fall off from the shell. Both connection methods have certain disadvantages. Utility Model Content

[0006] The purpose of the utility model is to solve the problems in the prior art that the Bluetooth speaker is easily soaked by water due to poor sealing of the lower cover, and even the speaker may leak sound due to poor sealing. The screws will be exposed on the surface of the shell, affecting the aesthetics of the speaker. The snap connection makes the lower cover easily fall off from the shell. A Bluetooth speaker lower cover integrally formed structure is proposed.

[0007] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0008] A Bluetooth speaker lower cover integrally formed structure includes a lower shell, a connecting ring is fixedly connected to the top of the lower shell, a card interface is formed between the lower shell and the connecting ring, a sealing groove is provided on the top of the connecting ring, a sealing ring is placed in the sealing groove, a plurality of insertion grooves are provided at the bottom of the lower shell, a plurality of through-columns are fixedly connected to the bottom inner wall of the lower shell, screws are passed through the through-columns, and the lower shell is connected to other shells by screws, and two triangular card blocks are provided on the four outer walls of the connecting ring, and the triangular card blocks are used to connect to the speaker shell.

[0009] In a possible design, the outer wall fixing sleeve of the through-column is provided with a bottom plate, and the bottom of the bottom plate is fixedly connected to the bottom inner wall of the lower shell.

[0010] In a possible design, four pressing blocks are provided on the outer wall of the connecting ring. The pressing blocks are located between two adjacent triangular clamping blocks and are used to squeeze the connecting ring.

[0011] In a possible design, a sound insulation groove is provided in the lower shell, and a sound insulation pad is adhered to the sound insulation groove.

[0012] In a possible design, four bottom grooves are provided at the bottom of the lower shell, the bottom grooves are connected to the insertion grooves, and rubber bases are adhered in the bottom grooves.

[0013] In a possible design, four limiting blocks are fixedly connected in the lower shell, and a receiving platform is provided on the top of the limiting block for placing the circuit control board. A limiting column is provided at one end of the limiting block, and the circuit control board passes through the limiting column and is limited by the limiting column.

[0014] In this application, the receiving platform on the top of the four limiting blocks in the lower shell can be used to receive the circuit board, the limiting column can pass through the circuit board to limit the circuit board, and the card interface on the top can provide space for the connection between the speaker and the lower shell. At the same time, the sealing groove in the connecting ring can be used to place a sealing ring, and the sound insulation pad can be placed in the sound insulation groove to prevent the sound from spreading to the bottom and leaking. When the speaker is connected to the lower shell, a card connection is formed by multiple triangular card blocks, and four screws are passed through the slot and the through-column to connect to the speaker, and then a rubber base is inserted into the bottom groove to improve the stability of the placement. When disassembling, unscrew the screws and press the pressing block to complete the disassembly.

[0015] Beneficial effects:

[0016] In the present invention, the one-piece structure of the lower cover of the Bluetooth speaker effectively blocks the diffusion of sound to the bottom and the intrusion of water from the outside through the design of the sealing ring and the application of the sound insulation pad, thereby improving the sound quality and waterproof performance of the speaker.

[0017] In the present invention, the integrated structure of the lower cover of the Bluetooth speaker and the combined use of screws and buckle structures ensure the stability of the lower shell connection. At the same time, each connection structure is easy to operate, ensuring the stability of the connection structure.

[0018] In the present invention, the connection between the lower shell of the speaker and the entire speaker is more stable. At the same time, the simple snap-on structure and the use of screws make it easier to disassemble the speaker. At the same time, the use of sound insulation pads and sealing rings also improves the sound quality and waterproof performance of the speaker. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a three-dimensional structural diagram of an integrated lower cover structure of a Bluetooth speaker proposed in the present invention;

[0020] Figure 2 This is a three-dimensional structural diagram of a connecting ring of an integrally formed structure of a Bluetooth speaker lower cover proposed in the present invention;

[0021] Figure 3 This is a multi-angle three-dimensional structural schematic diagram of the lower shell of the Bluetooth speaker with an integrated lower cover structure proposed by the present invention.

[0022] In the figure: 1. Lower shell; 2. Card interface; 3. Connecting ring; 4. Limiting block; 5. Supporting platform; 6. Limiting column; 7. Through column; 8. Bottom plate; 9. Sound insulation groove; 10. Triangular card block; 11. Sealing groove; 12. Pressing block; 13. Bottom groove; 14. Inserting groove. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0024] Example 1

[0025] Reference Figure 1 and Figure 2 An integrated structure includes a lower housing 1. A connecting ring 3 is fixedly connected to the top of the lower housing 1. A card interface 2 is formed between the lower housing 1 and the connecting ring 3. A sealing groove 11 is provided on the top of the connecting ring 3. A sealing ring is placed in the sealing groove 11. The bottom of the lower housing 1 is provided with multiple insertion slots 14. Multiple through-pillars 7 are fixedly connected to the bottom inner wall of the lower housing 1. Screws are inserted into the through-pillars 7, and the lower housing 1 is connected to other housings via screws. Two triangular clamping blocks 10 are provided on each of the four outer walls of the connecting ring 3. The triangular clamping blocks 10 are used to connect to the speaker housing. The lower housing 1 is the main structure. A sealing ring is placed in the top connecting ring 3 for sealing. The bottom inner wall of the lower housing 1 has through-pillars 7. Screws pass through the insertion slots 14 and the through-pillars 7 in sequence to connect.

[0026] Reference Figure 1 The outer wall of the through column 7 is fixedly sleeved with a bottom plate 8, and the bottom of the bottom plate 8 is fixedly connected to the bottom inner wall of the lower shell 1. The bottom plate 8 supports the through column 7 to ensure the stability of the through column 7.

[0027] Reference Figure 2 The outer wall of the connecting ring 3 is provided with four pressing blocks 12, which are located between two adjacent triangular clamping blocks 10 and are used to squeeze the connecting ring 3. The pressing blocks 12 on the outer wall of the connecting ring 3 are located between two adjacent triangular clamping blocks 10. By pressing, the connecting ring 3 can be released from the snap connection with the speaker housing.

[0028] Reference Figure 1 A sound insulation groove 9 is provided in the lower shell 1, and a sound insulation pad is adhered in the sound insulation groove 9. A sound insulation pad is placed in the sound insulation groove 9 to prevent the sound from diffusing to the bottom and leaking.

[0029] Reference Figure 3 The bottom of the lower shell 1 is provided with four bottom grooves 13, which are connected to the insertion groove 14, and a rubber base is adhered in the bottom groove 13. The rubber base is inserted into the bottom groove 13 to improve the stability of placement.

[0030] This application can be used in the field of Bluetooth speaker lower covers, and can also be used in other fields applicable to this application.

[0031] Example 2

[0032] refer to Figure 1 Based on the first embodiment, an improved embodiment is provided: a Bluetooth speaker lower cover integrally molded structure, which is applied to the field of Bluetooth speaker lower covers. Four limiting blocks 4 are fixedly connected to the lower housing 1. The tops of the limiting blocks 4 are provided with a receiving platform 5 for placing a circuit control board. One end of the limiting block 4 is provided with a limiting column 6, and the circuit control board passes through the limiting column 6 to be restrained by the limiting column 6. The receiving platform 5 on the tops of the four limiting blocks 4 in the lower housing 1 can be used to receive the circuit board, and the limiting column 6 can pass through the circuit board to restrain it.

[0033] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A Bluetooth speaker lower cover integrally formed structure, characterized in that: include; A lower shell (1) is provided, wherein the top of the lower shell (1) is fixedly connected to a connecting ring (3), a card interface (2) is formed between the lower shell (1) and the connecting ring (3), a sealing groove (11) is provided on the top of the connecting ring (3), a sealing ring is placed in the sealing groove (11), a plurality of insertion grooves (14) are provided at the bottom of the lower shell (1), a plurality of through-columns (7) are fixedly connected to the inner wall of the bottom of the lower shell (1), screws are passed through the through-columns (7), and the lower shell (1) is connected to other shells by screws, and the four outer walls of the connecting ring (3) are each provided with two triangular card blocks (10), and the triangular card blocks (10) are used to connect to the speaker shell.

2. The Bluetooth speaker lower cover integrally formed structure according to claim 1, characterized in that: The outer wall of the through-column (7) is fixedly sleeved with a bottom plate (8), and the bottom of the bottom plate (8) is fixedly connected to the bottom inner wall of the lower shell (1).

3. The Bluetooth speaker lower cover integrally formed structure according to claim 1, characterized in that: The outer wall of the connecting ring (3) is provided with four pressing blocks (12), and the pressing blocks (12) are located between two adjacent triangular clamping blocks (10) and are used to press the connecting ring (3).

4. The Bluetooth speaker lower cover integrally formed structure according to claim 1, characterized in that: A sound insulation groove (9) is provided in the lower shell (1), and a sound insulation pad is adhered in the sound insulation groove (9).

5. The Bluetooth speaker lower cover integrally formed structure according to claim 1, characterized in that: The bottom of the lower shell (1) is provided with four bottom grooves (13), the bottom grooves (13) and the insertion grooves (14) are connected, and a rubber base is adhered in the bottom grooves (13).

6. The Bluetooth speaker lower cover integrally formed structure according to claim 1, characterized in that: Four limiting blocks (4) are fixedly connected in the lower shell (1); a receiving platform (5) is provided on the top of each limiting block (4) for placing a circuit control board; a limiting column (6) is provided at one end of each limiting block (4); and the circuit control board passes through the limiting column (6) and is limited by the limiting column (6).

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