Current carrying board, power mainboard, power board and energy storage product

Abstract

The embodiment of the utility model relates to a current-carrying board, a power mainboard, a power board and an energy storage product, and the current-carrying board comprises a first main body which is provided with a first surface; and the plurality of first connecting pieces are distributed on the first surface, and the first connecting pieces are used for being electrically connected with first connecting elements distributed on a power mainboard. Through the current-carrying board, when the first connecting piece of the current-carrying board is electrically connected with the first connecting element of the power mainboard, the through-flow area of the power mainboard can be increased through the first main body of the current-carrying board, the through-flow capability of the power mainboard is improved, and the heat dissipation capability of the power mainboard is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of energy storage technology, and in particular to a current-carrying board, a power main board, a power board, and an energy storage product. Background Art

[0002] With the rapid development of energy storage technology, various energy storage products have increasingly higher requirements for power management. As a key component responsible for power conversion and distribution in energy storage products, the technological evolution of the power motherboard is crucial to improving the performance, stability, and energy efficiency of energy storage products. In household energy storage products, the power motherboard is responsible for completing the DC-DC current (Direct Current to Direct Current) and voltage conversion functions. Against the backdrop of the demand for highly integrated, high-power density household energy storage products, DCDC conversion units have begun to develop in the direction of small size and high efficiency, so the design of high switching frequency and large current has become inevitable.

[0003] During the process of realizing the present application, the applicant of the present application discovered that the current flow capacity of the current power motherboard is limited. Utility Model Content

[0004] In view of the above problems, the embodiments of the present application provide a current-carrying board, a power main board, a power board, and an energy storage product, which overcome the above problems or at least partially solve the above problems.

[0005] According to one aspect of an embodiment of the present application, a current-carrying board is provided, comprising: a first main body having a first surface; a plurality of first connectors distributed on the first surface, the first connectors being used to electrically connect to first connecting elements distributed on a power main board.

[0006] In an optional manner, the first connector array is distributed on the first surface, and a first connector is used to electrically connect to a first connecting element.

[0007] In an optional manner, welding material is provided on the first connecting member, and the first connecting member is used to be welded to the first connecting element.

[0008] In an optional manner, the current-carrying plate further includes an insulating layer, the insulating layer is stacked on the first surface, the insulating layer is provided with a plurality of through holes, and the first body is exposed at the through holes to form the first connecting member.

[0009] In an optional embodiment, the first body further has a second surface, and the first surface and the second surface are arranged opposite to each other along the thickness direction of the first body; the current-carrying plate further includes a plurality of second connectors distributed on the second surface, and the second connectors are used to electrically connect electronic components.

[0010] In an optional manner, the first main body is provided with a connection hole, and the connection hole is used for electrically connecting the pins of the electronic component with the power mainboard.

[0011] In an optional manner, the first main body is provided with at least one observation hole, and a connecting material is provided at each of the observation holes, and the connecting material is used to electrically connect to a connecting component provided on the power mainboard.

[0012] In an optional manner, the observation hole is provided close to the edge of the first body.

[0013] In an optional manner, the first body includes a plurality of stacked first conductive layers, the first body is provided with via holes, and the plurality of first conductive layers are electrically connected at the via holes.

[0014] According to one aspect of an embodiment of the present application, a power main board is provided, comprising: a second main body having a first surface; a plurality of first connecting elements distributed on the first surface, the first connecting elements being used to electrically connect to first connecting pieces distributed on a current-carrying board.

[0015] In an optional manner, the first connecting element array is distributed on the first surface, and a first connecting element is used to be electrically connected to a first connecting piece.

[0016] In an optional manner, the power main board further includes at least one connecting component provided on the first surface, and the connecting component is used to be electrically connected to a connecting material on the current-carrying board.

[0017] According to one aspect of an embodiment of the present application, a power board is provided, comprising the above-mentioned current-carrying board and the above-mentioned power main board.

[0018] According to one aspect of an embodiment of the present application, there is provided an energy storage product including the above-mentioned power board.

[0019] The beneficial effects of the embodiments of the present application include: through the current-carrying plate, when the first connecting member of the current-carrying plate is electrically connected to the first connecting element of the power mainboard, the flow area of ​​the power mainboard can be increased through the first body of the current-carrying plate, thereby improving the flow capacity of the power mainboard and improving the heat dissipation capacity of the power mainboard.

[0020] Furthermore, because the current-carrying plate is connected to the multiple first connection elements of the power mainboard via multiple first connectors, the connection between the current-carrying plate and the power mainboard is secure. Equally important, because the first connectors are located on the first surface of the current-carrying plate and the first connection elements are located on the first side of the power mainboard, the current-carrying plate is effectively stacked on the power mainboard. This shortens the distance between the current-carrying plate and the power mainboard, improving flow between the two.

[0021] In addition, by connecting the first connector on the current-carrying board and the first connecting element on the power mainboard, there is no need to destroy the main structure of the power mainboard, there is no need to drill holes in the power mainboard, and the internal network structure of the power mainboard is not damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] One or more embodiments are exemplarily illustrated by pictures in the corresponding drawings. These exemplifications do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements. Unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0023] Figure 1 is a schematic diagram of a power board provided in an embodiment of the present application;

[0024] Figure 2 is an exploded schematic diagram of a power board provided in an embodiment of the present application;

[0025] Figure 3 This embodiment of the present application provides Figure 2 Enlarged schematic diagram of part A in the middle.

[0026] The reference numerals are as follows:

[0027] Current-carrying plate 100; first body 101, first surface 11, second surface 12, connecting hole 1011, observation hole 1012, avoidance hole 1013;

[0028] thickness direction L1 of the first body;

[0029] First connecting member 102; second connecting member 103; connecting material 104;

[0030] Power motherboard 200;

[0031] Second body 201, first surface 21;

[0032] First connecting element 202; connecting component 203;

[0033] Power board 10. DETAILED DESCRIPTION

[0034] In order to facilitate understanding of the present application, the present application is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or there can be one or more centered elements therebetween. When an element is described as "connected to" another element, it can be directly connected to the other element, or there can be one or more centered elements therebetween. The terms "vertical", "horizontal", "left", "right", "inside", "outside" and similar expressions used in this specification are for illustrative purposes only.

[0035] Unless otherwise defined, all technical and scientific terms used in this specification have the same meanings as those commonly understood by those skilled in the art to which this application belongs. The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" as used in this specification includes any and all combinations of one or more of the relevant listed items.

[0036] See also Figure 1 , an embodiment of the present application provides a power board 10, which is a key component responsible for the conversion and distribution of electric energy in energy storage products. The power board 10 provided in the embodiment of the present application includes a power main board 200 and a current-carrying board 100. The current-carrying board 100 is superimposed on the power main board 200, and the current-carrying board 100 is electrically connected to the power main board 200. Among them, the power main board 200 is the core component in the power board 10 and is the main component responsible for the conversion and distribution of electric energy. The current-carrying board 100 is connected to the power main board 200, and the current-carrying board 100 is used to increase the flow area of ​​the power main board 200, improve the flow capacity of the power main board 200, and improve the heat dissipation capacity of the power main board 200.

[0037] For the current carrying plate 100, see Figure 2 and Figure 3 The current-carrying board 100 includes a first body 101 and a plurality of first connectors 102. The first body 101 has a first surface 11. The plurality of first connectors 102 are distributed on the first surface 11. The first connectors 102 are configured to electrically connect to first connecting elements 202 distributed on the power motherboard 200. Specifically, when the first connectors 102 of the current-carrying board 100 are electrically connected to the first connecting elements 202 of the power motherboard 200, the flow area of ​​the power motherboard 200 can be increased through the first body 101 of the current-carrying board 100, thereby improving the flow capacity and heat dissipation capability of the power motherboard 200.

[0038] The first surface 11 is a surface of the first body 101 in the thickness direction L1 .

[0039] It is worth noting that by connecting the first connecting piece 102 on the current-carrying board 100 and the first connecting element 202 on the power mainboard 200, there is no need to destroy the main structure of the power mainboard 200, there is no need to drill holes in the power mainboard 200, and the internal network structure of the power mainboard 200 is not damaged.

[0040] In some embodiments, the first connector 102 is compatible with the first connecting element 202 .

[0041] In some embodiments, the first connectors 102 are arranged in an array on the first surface 11, and each first connector 102 is configured to electrically connect to a first connecting element 202 distributed on the power motherboard 200. With this arrangement, the current-carrying board 100 is securely connected to the first connecting element 202 of the power motherboard 200 via the first connectors 102.

[0042] In some embodiments, welding material is provided on the first connector 102, and the first connector 102 is used to be welded to the first connecting element 202. In another embodiment, welding material is provided on the first connecting element 202, thereby enabling a welded connection between the first connector 102 of the current carrier board 100 and the first connecting element 202 of the power motherboard 200. In yet another embodiment, welding material is provided on the first connector 102, and welding material is also provided on the first connecting element 202, thereby enabling a welded connection between the first connector 102 of the current carrier board 100 and the first connecting element 202 of the power motherboard 200.

[0043] In some embodiments, the welding material is solder paste, that is, solder paste is coated on the surface of the first connector 102 or the first connecting element 202, the current-carrying board 100 is mounted on the power mainboard 200, and the first connector 102 corresponds to the first connecting element 202 one by one, and the first connector 102 and the first connecting element 202 are soldered by a reflow soldering process.

[0044] In some embodiments, the current-carrying plate 100 further includes an insulating layer (not shown), which is stacked on the first surface 11 and has a plurality of through-holes (not shown). The first body 101 is exposed at the through-holes to form the first connectors 102. Each through-hole corresponds to one first connector 102.

[0045] It is worth noting that when the first connector 102 comprises a solder material, the insulating layer comprises a solder resist, such as green wax. This allows for a solder connection between the first connector 102 of the current-carrying board 100 and the first connecting element 202 of the power mainboard 200, while also reducing damage to other areas / components of the current-carrying board 100 during soldering of the first connector 102 and the first connecting element 202, due to the insulating layer. Specifically, multiple first connectors 102 are provided on the first body 101, separated by green wax, thereby reducing displacement of the current-carrying board 100 during the reflow process.

[0046] In some embodiments, the first body 101 further comprises a second surface 12. The first surface 11 and the second surface 12 are arranged opposite each other along a thickness direction L1 of the first body 101. The thickness direction L1 of the first body 101 coincides with the stacking direction of the current-carrying board 100 and the power motherboard 200. The current-carrying board 100 further comprises a plurality of second connectors 103 distributed on the second surface 12. The second connectors 103 are used to electrically connect electronic components, such as thin film capacitors. Furthermore, the provision of multiple second connectors 103 increases the surface area of ​​the first body 101, thereby improving the heat dissipation performance of the current-carrying board 100.

[0047] In some embodiments, a plurality of second connectors 103 are arrayed on the second surface 12, and any second connector 103 is used to electrically connect to the electronic component.

[0048] It is worth noting that, in some embodiments, the number of the second connecting members 103 is the same as the number of the first connecting members 102 , and one second connecting member 103 corresponds to one first connecting member 102 .

[0049] In some embodiments, the first body 101 is provided with connection holes 1011 for electrically connecting the pins of the electronic components to the power mainboard 200. Because the current-carrying plate 100 and the power mainboard 200 overlap, the pins of the electronic components are electrically connected to the power mainboard 200 through the connection holes 1011, which reduces the connection distance between the electronic components and the power mainboard 200. Specifically, the distance from the electronic components to the power mainboard 200 is shortened, shortening the current path between the electronic components and the power mainboard 200, thereby effectively reducing EMC (Electromagnetic Compatibility) interference.

[0050] In some embodiments, the first body 101 is further provided with a relief hole 1013, which is used to facilitate the electrical connection of electronic components to the first body 101 through the second connector 103. It should be noted that the relief hole 1013 can be provided according to the actual structure of the product.

[0051] In some embodiments, the first body 101 further comprises at least one observation hole 1012. Connecting material 104 is disposed in each observation hole 1012. Each connecting material 104 is configured to electrically connect to a connecting component 203 disposed on the power motherboard 200. The connecting material 104 may be attached to the wall of the observation hole 1012. When the first connecting member 102 of the current carrier board 100 is welded to the first connecting element 202 of the power motherboard 200, the connection between the connecting material 104 and the connecting component 203 of the power motherboard 200 can be observed through the observation hole 1012, or the penetration of the connecting component 203 into the observation hole 1012 can be observed through the observation hole 1012. This allows the user to determine the integrity of the welded connection between the first connecting member 102 of the current carrier board 100 and the first connecting element 202 of the power motherboard 200, thereby facilitating the electrical connection between the current carrier board 100 and the power motherboard 200 via the first connecting member 102 and the first connecting element 202.

[0052] In some embodiments, the observation hole 1012 is provided near an edge of the first main body 101 . When the connection material 104 and the connection component 203 at the observation hole 1012 are fully connected, it can be inferred that the first connection member 102 of the current-carrying plate 100 and the first connection element 202 of the power main board 200 are fully connected.

[0053] In some embodiments, the observation hole 1012 is not only disposed near the edge of the first body 101 , but also there are multiple observation holes 1012 , distributed on the first surface 11 of the first body 101 .

[0054] In some embodiments, the first body 101 includes a plurality of stacked first conductive layers (not shown), and the first body 101 is provided with vias (not shown), and the plurality of first conductive layers are electrically connected at the vias. The first conductive layer may be a copper layer. Through this arrangement, on the one hand, in the multi-layer first conductive layer, multiple first conductive layers are connected through vias, so that cross-layer transmission of electrical signals can be achieved. This connection method is particularly important in complex circuit design because it allows designers to flexibly arrange wiring without increasing the size of the current-carrying board 100, thereby improving wiring density and signal integrity. On the other hand, for high-power first conductive layers of different layers, they can also be used for current commutation and heat dissipation, that is, by increasing the area and interlayer connection by multiple first conductive layers, the resistance can be effectively reduced, the current carrying capacity can be improved, and the heat can be dispersed, the temperature rise can be reduced, and the reliability and stability of the entire current-carrying board 100 can be improved.

[0055] In some embodiments, the first body 101 is made of copper.

[0056] In some embodiments, the material of the first body 101 can be a plate with a high glass transition temperature and small deformation, such as a glass fiber epoxy resin copper clad plate.

[0057] For the power board 200, see Figure 2 and Figure 3 The power motherboard 200 includes a second body 201 and a plurality of first connecting elements 202. The second body 201 has a first surface 21; the plurality of first connecting elements 202 are distributed on the first surface 21 and are electrically connected to the first connecting members 102 distributed on the current-carrying board 100. Specifically, by placing the current-carrying board 100 on the power motherboard 200 and electrically connecting the first connecting members 102 of the current-carrying board 100 to the first connecting elements 202 of the power motherboard 200, the flow area of ​​the power motherboard 200 can be increased through the first body 101 of the current-carrying board 100, thereby improving the flow capacity and heat dissipation capability of the power motherboard 200.

[0058] The first surface 21 is a surface in the thickness direction L1 of the power mainboard 200. Since the first connector 102 is located on the first surface 11 of the current-carrying board 100 and the first connecting element 202 is located on the first surface 21 of the power mainboard 200, the current-carrying board 100 is effectively stacked on the power mainboard 200. This shortens the connection distance between the current-carrying board 100 and the power mainboard 200, improving the flow between the two.

[0059] In some embodiments, the first connecting elements 202 are arranged in an array on the first surface 21, and each first connecting element 202 is used to electrically connect to a first connecting member 102 distributed on the current-carrying board 100. With this arrangement, the first connecting elements 202 of the power board 200 and the first connecting members 102 of the current-carrying board 100 are firmly connected.

[0060] It can be understood that the first connecting element 202 is arranged corresponding to the first connecting member 102.

[0061] In some embodiments, the power motherboard 200 further includes a protective layer (not shown), which is stacked on the first surface 21 and has a plurality of openings (not shown). The second body 201 is exposed at the openings to form the first connecting element 202. One opening corresponds to one first connecting member 102.

[0062] It is worth noting that when the first connecting element 202 includes a welding material, the protective layer includes a solder resist, such as green oil, so that on the one hand, the first connecting element 202 of the power mainboard 200 and the first connecting member 102 of the current-carrying board 100 can be welded and connected, and on the other hand, the protective layer can reduce damage to other areas / components of the power mainboard 200 when welding the first connecting element 202 and the first connecting member 102.

[0063] In some embodiments, the power mainboard 200 further includes at least one connecting component 203 disposed on the first surface 21. The connecting component 203 is configured to electrically connect to a connecting material 104 on the current-carrying board 100. Thus, by observing the connection between the connecting material 104 and the connecting component 203 through the observation hole 1012 of the current-carrying board 100, or by observing the connecting component 203 creeping into the observation hole 1012 through the observation hole 1012, the completeness of the welded connection between the first connecting element 202 of the power mainboard 200 and the first connecting member 102 of the current-carrying board 100 can be determined, thereby facilitating the user to electrically connect the power mainboard 200 and the current-carrying board 100 through the first connecting element 202 and the first connecting member 102.

[0064] It is understood that the number and position of the connecting components 203 are arranged corresponding to the observation holes 1012 of the current-carrying plate 100. When there are multiple observation holes 1012, there are multiple connecting materials 104, and there are multiple connecting components 203, and the observation holes 1012, connecting materials 104, and connecting components 203 correspond one to one.

[0065] In some embodiments, the second body 201 includes a plurality of stacked second conductive layers (not shown). The second conductive layers may be copper layers.

[0066] In some embodiments, the second body 201 is made of copper.

[0067] In some embodiments, the material of the second body 201 may also be a plate with a high glass transition temperature and small deformation, such as a glass fiber epoxy resin copper clad laminate.

[0068] In an embodiment of the present application, the power board 10 includes a current-carrying board 100 and a power main board 200. The current-carrying board 100 is stacked on the power main board 200. The first connecting member 102 of the current-carrying board 100 is electrically connected to the first connecting member 202 of the power main board 200. This increases the current-carrying capacity of the power main board 200 through the current-carrying board 100 and avoids the disadvantages caused by the skin effect. The skin effect refers to the phenomenon that when alternating current passes through a conductor, the current tends to flow on the surface of the conductor rather than being evenly distributed within the conductor. In addition, since the current-carrying board 100 is stacked on the power main board 200, when a heat sink is provided on the side of the power main board 200 facing away from the current-carrying board 100, the distance between the heat sink and the current-carrying board 100 is close, which can reduce thermal resistance and improve heat dissipation capacity.

[0069] The present application also provides an embodiment of an energy storage product, which includes the power board 10. The specific structure and function of the power board 10 can be found in the above embodiments and will not be described in detail here.

[0070] It should be noted that the preferred embodiments of the present application are given in the specification and drawings of this application. However, the present application can be implemented in many different forms and is not limited to the embodiments described in this specification. These embodiments are not intended to be additional limitations on the content of this application. The purpose of providing these embodiments is to make the understanding of the disclosure of this application more thorough and comprehensive. In addition, the above-mentioned technical features can be combined with each other to form various embodiments not listed above, which are all considered to be within the scope of the description of this application; further, it is obvious to those skilled in the art that improvements or changes can be made based on the above description, and all such improvements and changes should fall within the scope of protection of the claims attached to this application.

Claims

1. A current-carrying plate, characterized in that: include: a first body having a first surface; A plurality of first connecting members are distributed in an array on the first surface, and each of the first connecting members is used to electrically connect to a first connecting element distributed on the power mainboard.

2. The current-carrying plate according to claim 1, characterized in that: The first connecting member is provided with welding material, and the first connecting member is used for welding connection with the first connecting element.

3. The current-carrying plate according to any one of claims 1 to 2, characterized in that: The current-carrying plate further includes an insulating layer, which is stacked on the first surface. The insulating layer is provided with a plurality of through holes, and the first body is exposed at the through holes to form the first connecting member.

4. The current-carrying plate according to any one of claims 1-2, characterized in that: The first body further has a second surface, and the first surface and the second surface are arranged opposite to each other along the thickness direction of the first body; The current-carrying plate further includes a plurality of second connecting members distributed on the second surface, and the second connecting members are used for electrically connecting electronic components.

5. The current-carrying plate according to claim 4, characterized in that: The first body is provided with a connection hole, and the connection hole is used for electrically connecting the pins of the electronic component with the power mainboard.

6. The current-carrying plate according to any one of claims 1-2, characterized in that: The first main body is provided with at least one observation hole, and a connecting material is provided at each of the observation holes. The connecting material is used to be electrically connected to a connecting component provided on the power mainboard.

7. The current-carrying plate according to claim 6, characterized in that: The observation hole is arranged close to the edge of the first body.

8. The current-carrying plate according to any one of claims 1-2, characterized in that: The first body includes a plurality of stacked first conductive layers. The first body is provided with via holes, and the plurality of first conductive layers are electrically connected at the via holes.

9. A power motherboard, characterized in that: include: a second body having a first surface; A plurality of first connecting elements are distributed in an array on the first surface, and each of the first connecting elements is used to be electrically connected to a first connecting piece distributed on the current-carrying board.

10. The power motherboard according to claim 9, characterized in that: The power mainboard further includes at least one connecting component disposed on the first surface, wherein the connecting component is used to electrically connect to a connecting material on the current-carrying board.

11. A power board, characterized in that: include: The current-carrying board according to any one of claims 1 to 8, and the power mainboard according to any one of claims 9 to 10.

12. An energy storage product, characterized in that: Comprising the power board as claimed in claim 11.

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