Reaction device and cooling system
By using heat exchange components and cooling systems in the reaction device and utilizing heat exchange between the heat exchange medium and the conduction medium, the problem of the refrigeration equipment being unable to reach the target temperature is solved, and the normal progress of the chemical reaction is achieved and the safety is improved.
Patent Information
- Application Number
- CN202422411339.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-30
- Publication Date
- 2025-09-19
- Estimated Expiration
- 2034-09-30
AI Technical Summary
During the chemical reaction process, the refrigeration equipment cannot reach the target temperature, making it difficult for the reaction to proceed normally.
By using the heat exchange components and cooling system in the reaction device, heat is exchanged between the heat exchange medium and the conduction medium in the heat exchange pipe. By utilizing the design of the heat exchange kettle and the reactor, the target temperature can be reached without refrigeration equipment.
It realizes the normal progress of chemical reactions in low-temperature environments, avoids the limitations of refrigeration equipment, improves safety and practicality, and is suitable for manufacturers of different sizes.
Smart Images
Figure CN223351683U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of chemical cooling technology, and in particular to a reaction device and a cooling system. Background Art
[0002] In industrial production, various chemical products are widely used. Chemical products usually require a variety of conductive media and are prepared through chemical reactions using special processes. During the chemical reaction process, different conductive media require different reaction conditions.
[0003] In related technologies, when low-temperature reaction conditions are required, refrigeration equipment is usually used to cool the reactor to reach the target reaction temperature. If the refrigeration equipment cannot reach the target temperature, it is more difficult to create a reaction environment, making it difficult for the chemical reaction to proceed normally. Summary of the Invention
[0004] In order to overcome the defects in the related art, the present application provides a reaction device and a cooling system.
[0005] In order to achieve the above objectives,
[0006] A reaction apparatus includes a reaction assembly and a heat exchange assembly. The reaction assembly includes a reactor for carrying a conductive medium. The heat exchange assembly includes a heat exchange kettle and a heat exchange pipe, the heat exchange pipe being disposed within the heat exchange kettle. A heat exchange medium flows through the heat exchange pipe for heat exchange with the material within the heat exchange kettle. The reaction kettle is in communication with the heat exchange kettle.
[0007] Furthermore, the heat exchange pipe includes a connecting portion and a heat exchange portion, wherein the connecting portion is connected to the heat exchange portion, and two connecting portions are provided, and the two connecting portions are respectively arranged at both ends of the heat exchange portion. The heat exchange portion is arranged in the heat exchange kettle, and the connecting portion extends outside the heat exchange kettle, and at least one of the connecting portions is connected to a heat exchange source.
[0008] Furthermore, the heat exchange portion is spirally arranged along the inner wall of the heat exchange kettle.
[0009] Furthermore, a material exchange port is provided at the bottom of the heat exchange kettle, and the material exchange port is connected to the bottom of the reactor through a pipeline.
[0010] Furthermore, a heat exchange interlayer is provided on the reactor, and the material exchange port is connected to the heat exchange interlayer through a pipeline.
[0011] Furthermore, a discharge port is provided on the top of the heat exchange interlayer, and the discharge port is connected to the heat exchange kettle through a pipeline.
[0012] Furthermore, a stirring component is provided in the heat exchange kettle for stirring the loaded material.
[0013] Furthermore, the stirring assembly includes a stirring shaft and a stirring frame, wherein the stirring shaft is vertically arranged in the heat exchange kettle, one end of the stirring shaft extends outside the heat exchange kettle and is connected to a power member, and the stirring frame is arranged on an end of the stirring shaft away from the power member.
[0014] A cooling system comprises a heat exchange source component, a buffer component and the reaction device described in any one of the above embodiments, wherein the heat exchange source component comprises a heat exchange source, the output port of the heat exchange source component is connected to the heat exchange pipe, and is used to supply heat exchange medium into the heat exchange pipe; the buffer component comprises a buffer tank, and the buffer tank is connected to the heat exchange kettle, and is used to carry the heat exchange medium.
[0015] Furthermore, the buffer tank includes a cooling unit, which is capable of cooling the cooling return water.
[0016] The beneficial effects of this application are as follows:
[0017] When using the reaction device of the present application,
[0018] When the reaction device of the present application is used, a conductive medium that needs to react at a low temperature is placed into a heat exchange kettle, and the heat exchange medium is introduced into the heat exchange pipe, allowing the heat exchange medium to flow along the heat exchange pipe and then into the heat exchange kettle. At this time, the heat exchange medium contacts the heat exchange pipe inside the heat exchange pipe, and the conductive medium contacts the heat exchange pipe outside the heat exchange pipe. The heat exchange medium can then exchange heat with the conductive medium through the pipe wall. The conductive medium then cools the reaction tank to provide a suitable reaction temperature for the reactants.
[0019] The reaction device of the present application can reduce the conduction medium to the target temperature without requiring refrigeration equipment, thus preventing the reaction temperature of the reactor from being limited by the refrigeration temperature range of the refrigeration equipment. Furthermore, since the heat exchange process is completed within the heat exchange kettle, damage to the reactor due to the heat exchange medium's temperature cannot be avoided, thus improving the safety of the present application.
[0020] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.
[0022] Figure 1 A schematic structural diagram of a reaction device according to an embodiment of the present application from one perspective;
[0023] Figure 2 This is a structural schematic diagram of a cooling system from one perspective according to an embodiment of the present application.
[0024] icon:
[0025] 100-reaction component; 110-reactor; 120-discharge port; 121-discharge pipe; 200-heat exchange component; 210-heat exchange kettle; 220-heat exchange pipe; 221-connecting part; 222-heat exchange part; 230-recharge port; 300-stirring component; 310-stirring shaft; 320-stirring frame; 330-power part; 400-buffer component; 410-buffer tank; 411-cooling part. DETAILED DESCRIPTION
[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.
[0027] In the description of this application, it should be noted that the terms "inner" and "outer" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or the orientations or positional relationships in which the product of this application is typically placed when in use. These terms are intended solely to facilitate the description of this application and simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first" and "second" and the like are used solely for distinction and should not be construed as indicating or implying relative importance.
[0028] It should also be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "disposed" and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to direct connections, indirect connections through an intermediate medium, or internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.
[0029] The present application provides a reaction device to solve the problem in the related art that, during a chemical reaction, the refrigeration equipment cannot reach the temperature required for the reaction, resulting in the inability to proceed with the chemical reaction or affecting the normal progress of the chemical reaction.
[0030] See also Figure 1 A reaction apparatus includes a reaction assembly 100 and a heat exchange assembly 200. Reaction assembly 100 includes a reactor 110 for carrying a conductive medium. Heat exchange assembly 200 includes a heat exchange kettle 210 and a heat exchange pipe 220. Heat exchange pipe 220 is disposed within heat exchange kettle 210. Heat exchange medium flows through heat exchange pipe 220 for heat exchange with the material within heat exchange kettle 210. Reactor 110 is in communication with heat exchange kettle 210.
[0031] When using this embodiment, the conductive medium is introduced into the heat exchange kettle 210, and then the heat exchange medium is introduced into the heat exchange pipe 220. At this time, the conductive medium is in the heat exchange kettle 210 and is located outside the heat exchange pipe 220, and the heat exchange medium is in the heat exchange kettle 210 and is located inside the heat exchange pipe 220. The conductive medium and the heat exchange medium can exchange heat through the pipe wall of the heat exchange pipe 220.
[0032] After the conductive medium is cooled to the target temperature by the heat exchange medium, the conductive medium is passed from the heat exchange kettle 210 into the reactor 110. The reactor 110 is cooled by the cooled conductive medium, so that the reactor 110 reaches the target temperature, providing a reaction environment for the reactants.
[0033] By using this embodiment, the material in the reactor 110 can be cooled to the target temperature quickly and conveniently, providing a reaction environment for the reactants and ensuring the reaction effect of the reactants. At the same time, the reactor 110 is no longer limited by the refrigeration temperature range of the refrigeration equipment during use, thereby improving the practicality and applicability of this embodiment.
[0034] In one embodiment, for example, Figure 1 As shown, the heat exchange pipe 220 includes a connecting portion 221 and a heat exchange portion 222. The connecting portion 221 and the heat exchange portion 222 are connected. Two connecting portions 221 are provided, and the two connecting portions 221 are respectively arranged at both ends of the heat exchange portion 222. The heat exchange portion 222 is arranged in the heat exchange kettle 210, and the connecting portions 221 extend outside the heat exchange kettle 210. At least one of the connecting portions 221 is connected to a heat exchange source.
[0035] Two connecting portions 221 extending to the outside of the heat exchange kettle 210 are respectively provided at both ends of the heat exchange portion 222, and at least one connecting portion 221 is connected to a heat exchange source. In this way, when adding heat exchange medium to the heat exchange pipe 220, the heat exchange medium can be directly passed into the heat exchange portion 222 through the connecting portion 221, that is, into the heat exchange pipe 220, thereby reducing the difficulty of using this embodiment.
[0036] Furthermore, the heat exchange portion 222 is provided with two connecting portions 221. Specifically, when in use, one connecting portion 221 communicates with a heat source to introduce heat exchange medium into the heat exchange pipe 220. The other connecting portion 221 can be connected to other storage devices, such as a buffer tank 410 or a storage tank. When in use, the heat exchange medium enters the heat exchange portion 222 from one connecting portion 221, flows along the heat exchange portion 222, and then exits from the other connecting portion 221. This continuous flow forms a cycle, ensuring that the temperature of the heat exchange medium within the heat exchange pipe 220 is not affected by the material, the environment, or other factors, which could cause a temperature rise and affect the cooling effect on the material, thereby maintaining the cooling and temperature reduction effect of this embodiment.
[0037] It is understandable that the flow rate of the heat exchange medium in the heat exchange pipe 220 can be adaptively adjusted according to factors such as the temperature difference between the heat exchange medium and the conductive medium, the temperature difference between the heat exchange medium and the environment, as long as the heat exchange medium can cool the conductive medium and the reactants to a suitable temperature.
[0038] It is worth mentioning that due to the large size and high cost of refrigeration equipment, some smaller manufacturers do not have refrigeration equipment, or the manufacturer's main production line does not need refrigeration equipment. In this case, the reaction device of this embodiment can be used to provide a reaction environment for the material, making this embodiment more practical.
[0039] The heat exchange source can be arbitrarily configured based on practical needs, as long as it can flow normally within heat exchange pipe 220 and cool the conductive medium and reactants to a suitable temperature. For example, in this embodiment, liquid nitrogen is used as the heat exchange source. Liquid nitrogen is a common and readily available chemical product, low in cost, and readily available, making this embodiment convenient to use. Once introduced into heat exchange pipe 220, the liquid nitrogen rapidly cools heat exchange pipe 220, which in turn cools the conductive medium, ensuring a cooling effect.
[0040] Furthermore, it should be noted that when reacting, the reactants are usually reacted in the reactor 110 so that the reactor 110 provides a suitable reaction environment for the materials, such as suitable atmospheric pressure, humidity, etc. The reactor 110 is usually made of enamel. If a heat exchange medium is directly placed in the reactor 110, using liquid nitrogen, which is currently the most commonly used heat exchange medium, as an example, the boiling point of liquid nitrogen is -196°C under standard atmospheric pressure. Directly introducing liquid nitrogen into the reactor 110 to heat and cool the materials can easily cause the enamel of the reactor 110 to explode, thereby damaging the reactor 110.
[0041] For the reasons described above, a heat exchange kettle 210 is positioned near reactor 110. The material of heat exchange kettle 210 is not limited, as long as it can carry liquid nitrogen without damage. After the conductive medium is cooled to an appropriate temperature in heat exchange kettle 210, the conductive medium is used to cool reactor 110, thereby maintaining reactor 110 at an appropriate temperature. This allows the reactants to react normally within reactor 110, without damaging reactor 110 and providing a suitable reaction environment for the reactants.
[0042] In one embodiment, for example, Figure 1 As shown, the heat exchange portion 222 is spirally wound along the inner wall of the heat exchange kettle 210. Providing the heat exchange portion 222 as a spiral pipe can greatly extend the length of the heat exchange portion 222 within the heat exchange kettle 210. In other words, it can extend the flow path of the heat exchange medium within the heat exchange kettle 210 and extend the heat exchange time between the heat exchange medium and the conductive medium, thereby improving the heat exchange effect of this embodiment.
[0043] In one embodiment, for example, Figure 1 As shown, a refueling port 230 is provided at the bottom of the heat exchange kettle 210, which is connected to the bottom of the reactor 110 via a pipe. Providing the refueling port 230 at the bottom of the heat exchange kettle 210 ensures that the conductive medium flows out completely from the refueling port 230, thereby preventing or reducing any residual conductive medium in the heat exchange kettle 210.
[0044] In one embodiment, for example, Figure 1 As shown, reactor 110 is provided with a heat exchange interlayer, and refueling port 230 is connected to the heat exchange interlayer via a pipe. In other words, the conductive medium cooled within heat exchange reactor 210 is passed into the heat exchange interlayer of reactor 110, cooling reactor 110 and providing a suitable reaction environment for the reactants. The heat exchange interlayer prevents direct contact between the conductive medium and the reactants, preventing contamination of the reactants and improving the practicality of this embodiment.
[0045] In one embodiment, for example, Figure 1As shown, a discharge port 120 is provided at the top of the heat exchange interlayer, which is connected to the heat exchange kettle 210 via a pipe. The material in the reactor 110 can be introduced into the heat exchange interlayer through the discharge port 120. That is, after the conductive medium is introduced into the heat exchange kettle 210, it is heat exchanged and cooled via the heat exchange pipe 220. After reaching the reaction temperature, the conductive medium is introduced into the heat exchange interlayer of the reactor 110 from the material exchange port 230 to cool the reactor 110. During the reaction process of the reactants, due to various factors, the temperature of the reactor 110 rises. When the temperature of the reactor 110 is no longer within the reaction condition range, the conductive medium in the heat exchange interlayer can be reintroduced into the heat exchange kettle 210. The heat exchange pipe 220 further heats and cools the conductive medium, so that the conductive medium can be maintained at the target temperature throughout the reaction process. That is, the reactor 110 is always maintained at the target temperature, thereby ensuring the reaction effect of the reactants.
[0046] In one embodiment, for example, Figure 1 、 Figure 2 As shown, a circulating pump is provided on the pipeline between the refueling port 230 and the bottom of the reactor 110. This pump is used to extract the conductive medium cooled to the target temperature in the heat exchange reactor 210 and transport it along the pipeline to the heat exchange interlayer of the reactor 110 to cool the reactor 110. Accordingly, a circulating pump can also be provided on the pipeline between the discharge port 120 of the reactor 110 and the heat exchange reactor 210 to transport the conductive medium at an unsuitable temperature in the heat exchange interlayer of the reactor 110 back into the heat exchange reactor 210 for reheat exchange to reduce the temperature to the target.
[0047] A circulation pump is provided between the heat exchange kettle 210 and the reactor 110 to ensure that the conductive medium flows stably between the heat exchange kettle 210 and the reactor 110. By continuously cooling the conductive medium by the heat exchange kettle 210, the reaction temperature in the reactor 110 can always be maintained at the target temperature for reaction, thereby ensuring the complete reaction and improving the practicality of this embodiment.
[0048] In one embodiment, for example, Figure 1 As shown, a discharge pipe 121 is provided at the discharge port 120 extending toward the interior of the reactor 110, and one end of the discharge pipe 121 away from the discharge port 120 extends into the bottom of the reactor 110. The discharge pipe 121 extends to the bottom of the reactor 110. In this way, when the reactants in the reactor 110 need to be withdrawn after the reaction is completed, they can be directly withdrawn along the discharge pipe 121, avoiding the situation where the discharge pipe 121 is insufficient in length, resulting in some reactants at the bottom of the reactor 110 being unable to flow through the discharge pipe 121, thereby ensuring that this embodiment is stable and reliable during use.
[0049] In one embodiment, for example, both the heat exchange kettle 210 and the reactor 110 are provided with an insulation layer. The insulation layer provided on the outside of the reactor 110 can reduce the impact of the external environment on the material, thereby extending the time it takes for the material temperature to recover after being cooled to the target temperature, thereby ensuring the material's reaction effect and the cooling capacity of this embodiment. The insulation layer provided on the outside of the heat exchange kettle 210 can also reduce the impact of the external environment on the temperature inside the heat exchange kettle 210, thereby ensuring the utilization rate of the heat exchange medium in this embodiment.
[0050] In one embodiment, for example, Figure 1 As shown, a stirring assembly 300 is provided within the heat exchange kettle 210 for stirring the reactants. The stirring assembly 300 is provided within the heat exchange kettle 210 to stir the conductive medium during heat exchange with the heat exchange pipe 220, causing the conductive medium to move and changing the conductive medium in contact with the heat exchange pipe 220. This improves the uniformity of the heat exchange process in this embodiment, avoids uneven overall temperature of the conductive medium, and prevents the cooling effect from being affected, thereby ensuring the cooling effect of this embodiment.
[0051] It is understandable that a stirring assembly 300 can also be provided in the reactor 110 to stir the reactants in the reaction, so as to promote sufficient mixing of the various reactants in the reactor 110 and improve the reaction effect.
[0052] In one embodiment, for example, Figure 1 As shown, the stirring assembly 300 includes a stirring shaft 310 and a stirring frame 320. The stirring shaft 310 is vertically disposed within the heat exchange kettle 210. One end of the stirring shaft 310 extends outside the heat exchange kettle 210 and is connected to a power member 330. The stirring frame 320 is disposed on the end of the stirring shaft 310 away from the power member 330. During normal stirring operation, the power member 330 drives the stirring frame 320 to rotate via the stirring shaft 310, and the stirring frame 320 in turn drives the material to rotate, keeping the material flowing and ensuring better and more uniform heat exchange.
[0053] It should be noted that the stirring assembly 300 does not interfere with the heat exchange pipe 220. Specifically, the stirring shaft 310 can pass through the heat exchange pipe 220, and the stirring frame 320 is set in a mountain shape and is wound around the outside of the heat exchange pipe 220. In this way, when the stirring assembly 300 rotates, it can not only stir the conductive medium normally, making the heat exchange process more efficient and the conductive medium temperature more uniform, but also avoid interference between the stirring assembly 300 and the heat exchange pipe 220, ensuring that this embodiment can be used normally. Of course, the stirring frame 320 of the stirring assembly 300 can also be set to any other shape according to actual conditions, as long as it can stir the material.
[0054] See also Figure 2 The present application also provides a cooling system, including a heat exchange source component, a buffer component 400 and a reaction device in any one of the above embodiments, the heat exchange source component includes a heat exchange source, the output port of the heat exchange source component is connected to the heat exchange pipe 220, and is used to supply heat exchange medium into the heat exchange pipe 220; the buffer component 400 includes a buffer tank 410, and the buffer tank 410 is connected to the heat exchange kettle 210 to carry the heat exchange medium.
[0055] When the cooling system of this embodiment is in use, the heat exchange source, heat exchange medium provided by heat exchange pipe 220, flows into the connecting portion 221 at one end of the heat exchange pipe 220, passes through the heat exchange portion 222, and flows out of the connecting portion 221 at the other end of the heat exchange pipe 220 into the buffer tank 410. In other words, the heat exchange medium, having undergone heat exchange with the conductive medium in the heat exchange kettle 210, still has a lower temperature. At this point, the heat exchange medium is stored in the buffer tank 410 to preserve the heat exchange medium. When other materials need to be cooled, the heat exchange medium in the buffer tank 410 can be removed and used for cooling.
[0056] By adding the buffer tank 410, the present embodiment makes more full use of the heat exchange medium. That is, after the heat exchange medium flows through the heat exchange kettle 210 for the initial heat exchange, it can also be stored in the buffer tank 410. In other equipment or reactions that require cooling, the heat exchange medium can be reused, thereby improving the utilization rate of the heat exchange medium.
[0057] In one embodiment, for example, Figure 2 As shown, the buffer tank 410 includes a cooling part 411, and the cooling part 411 is capable of cooling the cooling return water. Cooling return water generally refers to water that is used by the heat exchange equipment and then returns to the cooling circulation system. It is usually necessary to cool the cooling return water again to make it cold water for subsequent use. In this embodiment, the heat exchange medium stored in the buffer tank 410 can be passed into the cooling return water through the cooling part 411 to cool the cooling return water. Alternatively, the cooling part 411 can also be set as a cooling pipe similar to the heat exchange pipe 220, extending into the cooling return water, and the heat exchange medium flows in the cooling pipe, cooling the cooling return water through indirect contact, so that this embodiment can make full use of the heat exchange medium.
[0058] It should be noted that, unless there is any conflict, the features in the embodiments of this application can be combined with each other.
[0059] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.
Claims
1. A reaction device, characterized in that: include: A reaction assembly (100), the reaction assembly (100) comprising a reaction kettle (110) for carrying a conductive medium material; A heat exchange component (200), the heat exchange component (200) comprising a heat exchange kettle (210) and a heat exchange pipe (220), the heat exchange pipe (220) being arranged in the heat exchange kettle (210), a heat exchange medium flowing in the heat exchange pipe (220) for performing heat exchange with the material in the heat exchange kettle (210); The reaction kettle (110) is in communication with the heat exchange kettle (210); The heat exchange pipe (220) comprises a communication portion (221) and a heat exchange portion (222), the communication portion (221) and the heat exchange portion (222) being in communication, two communication portions (221) being provided, and the two communication portions (221) being respectively provided at both ends of the heat exchange portion (222); The heat exchange portion (222) is arranged in the heat exchange kettle (210), the communication portion (221) extends to the outside of the heat exchange kettle (210), and at least one of the communication portions (221) is connected to a heat exchange source.
2. The reaction device according to claim 1, characterized in that The heat exchange portion (222) is spirally wound along the inner wall of the heat exchange kettle (210).
3. The reaction device according to claim 1, characterized in that A material exchange port (230) is provided at the bottom of the heat exchange kettle (210), and the material exchange port (230) is connected to the bottom of the reaction kettle (110) through a pipeline.
4. The reaction device according to claim 3, characterized in that A heat exchange interlayer is provided on the reactor (110), and the material exchange port (230) is connected to the heat exchange interlayer via a pipeline.
5. The reaction device according to claim 4, characterized in that A discharge port (120) is provided on the top of the heat exchange interlayer, and the discharge port (120) is connected to the heat exchange kettle (210) through a pipeline.
6. The reaction device according to any one of claims 1 to 5, characterized in that A stirring assembly (300) is provided in the heat exchange kettle (210) for stirring the loaded material.
7. The reaction device according to claim 6, characterized in that The stirring assembly (300) comprises a stirring shaft (310) and a stirring frame (320), wherein the stirring shaft (310) is vertically arranged in the heat exchange kettle (210); One end of the stirring shaft (310) extends to the outside of the heat exchange kettle (210) and is connected to the power component (330), and the stirring frame (320) is arranged on one end of the stirring shaft (310) away from the power component (330).
8. A cooling system, characterized in that: The invention comprises a heat exchange source component, a buffer component (400) and a reaction device according to any one of claims 1 to 7, wherein the heat exchange source component comprises a heat exchange source, and the output port of the heat exchange source component is connected to the heat exchange pipe (220) for supplying a heat exchange medium into the heat exchange pipe (220); the buffer component (400) comprises a buffer tank (410), and the buffer tank (410) is connected to the heat exchange kettle (210) for carrying the heat exchange medium.
9. The cooling system according to claim 8, characterized in that: The buffer tank (410) includes a cooling portion (411), and the cooling portion (411) is capable of cooling the cooling return water.