Semiconductor constant-temperature test box

Abstract

The utility model relates to the technical field of semiconductor high and low temperature tests, and discloses a semiconductor constant temperature test box which comprises a box body and a box door, a placing box is arranged in the box body, rectangular holes are evenly formed in the two sides of the placing box, a first lead screw is rotatably connected to the middle of one side in the box body, and a second lead screw is rotatably connected to the middle of the other side in the box body. Sliding rods are arranged on the two sides of the first lead screw correspondingly, the outer surfaces of the two sliding rods are slidably connected with the two sides of one side of the containing box correspondingly, the outer surface of the first lead screw is in threaded connection with the middle of one side of the containing box, and one end of the first lead screw penetrates through the upper portion of the box body and is fixedly connected with a first gear; a first tooth groove rod is clamped above the box body in a sliding mode, and one side of the first tooth groove rod is meshed with the side face of the first gear. When the device conducts a cold and hot impact test on a semiconductor, after the thermal impact test is finished, the cold impact test can be conducted without taking the semiconductor out of the box body; and the cold and hot impact test of the semiconductor is more convenient and safer.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor high and low temperature testing, in particular to a semiconductor constant temperature testing box. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductor products and materials are generally used in electronic and electrical equipment. These devices usually encounter high or low temperature conditions during use. In order to ensure the quality of semiconductor products, they need to be tested for high and low temperatures before they are put into use, so a semiconductor test chamber is needed.

[0003] After searching, the existing Chinese patent publication number is CN216900793U. The utility model provides a test box for semiconductor testing, including a box body and a box door, the box door is hinged on the box body, and a movable plate and a heating component are respectively passed through the box body, and a clamping component is passed through the movable plate. The clamping component includes a double-headed screw and two groups of sliding blocks, the sliding blocks are passed through the slide groove, and the slide groove is opened on the movable plate. The device pulls the sliding block to move by the connecting rod, thereby changing the distance between the two groups of fixed plates, so that it clamps and fixes the semiconductor product. Through the setting of the movable plate and the clamping component, the staff can quickly and accurately fix the semiconductor material, making the device more convenient to use.

[0004] However, in the above technology, the high and low temperature boxes of the semiconductor high and low temperature detection device are separate. After the semiconductor completes the high temperature detection, it needs to be taken out and placed in the low temperature box. The detection process is relatively complicated and the risk is also greater when transferring the semiconductor. Therefore, technical personnel in this field provide a semiconductor constant temperature test box to solve the problems raised in the above background technology. Utility Model Content

[0005] In order to make up for the above shortcomings, the utility model provides a semiconductor constant temperature test chamber, which aims to improve the problem that the high and low temperature chambers of the semiconductor high and low temperature detection device are separate. After the semiconductor completes the high temperature test, it needs to be taken out and placed in the low temperature chamber. The detection process is relatively complicated and the risk is also relatively high when transferring the semiconductor.

[0006] The lockhole that is formed on the two ends of the lifting block is formed, and the locking sprocket wheel is the upper end of the lifting block, and the lower end of the lifting block is locked. The locking sprocket wheel is the upper end of the lifting block, and the lower end of the lifting block is locked.

[0007] As a further description of the above technical solution: after the device completes the thermal shock test, it only needs to start the motor, and the motor drives the No. 2 screw rod, which drives the No. 1 toothed rod to move horizontally. The No. 1 gear engaged with the No. 1 toothed rod will also rotate accordingly, and drive the No. 1 screw rod to rotate. At this time, the placement box will move to the bottom of the box under the drive of the No. 1 screw rod, and then the cold shock test can be carried out again. Through this method, when the device performs a cold and hot shock test on the semiconductor, after the thermal shock test is completed, the semiconductor does not need to be removed from the box to perform a cold shock test, making the cold and hot shock test of the semiconductor more convenient and safe.

[0008] Preferably, a placement plate is fixedly connected to the lower part of the placement box, a mounting frame is fixedly connected to the upper end of the placement plate, and both sides of the upper end of the mounting frame are rotatably connected to the No. 2 gear.

[0009] As a further description of the above technical solution: the placement plate can be used to fix the mounting bracket, and the mounting bracket can fix the clamping rod.

[0010] Preferably, both sides of one side of the upper end of the mounting frame are rotatably connected to connecting rods, and one end of the two connecting rods is rotatably connected to a clamping rod.

[0011] As a further description of the above technical solution: the clamping rod can clamp the semiconductor when the semiconductor is subjected to thermal shock test.

[0012] Preferably, one end of the two clamping rods is rotatably connected to one side of the two second gears respectively, and a second toothed rod is meshed between the two second gears.

[0013] As a further description of the above technical solution: the two clamping rods can be brought together when the second gear rotates to play a clamping role.

[0014] Preferably, one end of the No. 2 tooth groove rod is rotatably connected to a fastening rod, and a fixing plate is provided on one side of the mounting frame.

[0015] As a further description of the above technical solution: by rotating the fastening rod, the second tooth groove rod can be pulled to move, and the second gear can be driven to rotate.

[0016] Preferably, the upper portion of the fixing plate is threadedly connected to the outer surface of the fastening rod, and the other end of the fastening rod is fixedly connected to a knob.

[0017] As a further description of the above technical solution: the knob can make it easier to rotate the tightening rod, making it more convenient to clamp it.

[0018] Preferably, one side of each of the two clamping rods is fixedly connected with a clamping plate.

[0019] As a further description of the above technical solution: the clamping plate can be used to increase the contact area of ​​the clamping rod, making it more stable during clamping.

[0020] Preferably, heating mechanisms are fixedly connected to the upper sides of both sides of the box body, and cooling mechanisms are fixedly connected to the lower sides of both sides of the box body.

[0021] As a further description of the above technical solution: the box is divided into two parts, the upper part of the interior is a thermal shock test area, and the lower part is a cold shock test area. The heating mechanism can be used to heat the upper part of the interior of the box, and the cooling mechanism can be used to cool the lower part of the interior of the box.

[0022] Compared with the prior art, the advantages and positive effects of the present invention are:

[0023] 1. In the utility model, after the device completes the thermal shock test, it is only necessary to start the motor, drive the No. 2 screw rod through the motor, and drive the No. 1 toothed rod to move horizontally through the No. 2 screw rod. The No. 1 gear engaged with the No. 1 toothed rod will also rotate accordingly, and drive the No. 1 screw rod to rotate. At this time, the placement box will move to the bottom of the box body under the drive of the No. 1 screw rod, and then the cold shock test can be carried out again. Through this method, when the device performs a cold and hot shock test on the semiconductor, after the thermal shock test is completed, the semiconductor does not need to be removed from the box body to perform a cold shock test, making the cold and hot shock test of the semiconductor more convenient and safe.

[0024] 2. In the present invention, when performing a thermal shock test on a semiconductor, the semiconductor can be placed between the clamping plates, and then the knob is turned to drive the fastening rod to rotate, and the No. 2 toothed rod is pulled to move horizontally. The No. 2 toothed rod can drive the No. 2 gears on both sides to rotate, thereby pushing the two clamping rods to gather together. At this time, the clamping plates can clamp the semiconductor, and then the thermal shock test of the semiconductor can be carried out. This method allows the device to quickly clamp the semiconductor during the thermal shock test, which is more convenient for the smooth progress of the test. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a three-dimensional diagram of a semiconductor constant temperature test box proposed by the present utility model;

[0026] Figure 2 This is a schematic diagram of the internal three-dimensional structure of a semiconductor constant temperature test box proposed by the present invention;

[0027] Figure 3 This is a sectional view of the internal three-dimensional structure of a semiconductor constant temperature test box proposed by the present invention;

[0028] Figure 4 This is a schematic diagram of the three-dimensional structure of a placement box in a semiconductor constant temperature test box proposed by the present invention;

[0029] Figure 5 The utility model is a schematic diagram of the three-dimensional structure of the clamping plate part of the semiconductor constant temperature test box.

[0030] Legend:

[0031] 1. Box body; 2. Box door; 3. Heating mechanism; 4. Cooling mechanism; 5. Screw No. 2; 6. Toothed rod No. 1; 7. Gear No. 1; 8. Motor; 9. Sliding rod; 10. Screw No. 1; 11. Placement plate; 12. Placement box; 13. Rectangular hole; 14. Clamping plate; 15. Knob; 16. Clamping rod; 17. Gear No. 2; 18. Toothed rod No. 2; 19. Connecting rod; 20. Mounting frame; 21. Fastening rod; 22. Fixing plate. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0033] Refer to the attached Figure 1 - Attachment Figure 4The utility model provides an embodiment: it includes a box body 1 and a box door 2. A placement box 12 is provided inside the box body 1. Rectangular holes 13 are evenly opened on both sides of the placement box 12. The middle part of one side of the box body 1 is rotatably connected to a No. 1 screw rod 10. Both sides of the No. 1 screw rod 10 are provided with a slide rod 9. The outer surfaces of the two slide rods 9 are respectively slidably connected to the two sides of one side of the placement box 12. The outer surface of the No. 1 screw rod 10 is threadedly connected to the middle part of one side of the placement box 12. One end of the No. 1 screw rod 10 passes through the top of the box body 1 and is fixedly connected to a No. 1 gear 7. The top of the box body 1 is slidably clamped with a No. 1 toothed rod 6. One side of the No. 1 toothed rod 6 is meshed with the side surface of the No. 1 gear 7. The middle part of the upper end of the box body 1 is rotatably connected to a No. 2 screw rod 5. The outer surface of the No. 2 screw rod 5 is threadedly connected to the other side of the No. 1 toothed rod 6. A motor 8 is fixedly connected to the top of one side of the box body 1, and the output end of the motor 8 is fixedly connected to the other end of the No. 2 screw rod 5.

[0034] In this embodiment, after the device completes the thermal shock test, it is only necessary to start the motor 8, drive the No. 2 screw rod 5 through the motor 8, and drive the No. 1 toothed rod 6 to move horizontally through the No. 2 screw rod 5. The No. 1 gear 7 engaged with the No. 1 toothed rod 6 will also rotate accordingly, and drive the No. 1 screw rod 10 to rotate. At this time, the placement box 12 will move to the bottom of the box body 1 under the drive of the No. 1 screw rod 10, and then the cold shock test can be carried out again. Through this method, when the device performs a cold and hot shock test on the semiconductor, after the thermal shock test is completed, the semiconductor does not need to be removed from the box body 1 to perform a cold shock test, making the cold and hot shock test of the semiconductor more convenient and safe.

[0035] Example 2, as Figure 1 - Figure 5 As shown, a placing plate 11 is fixedly connected to the lower part of the placing box 12, and a mounting bracket 20 is fixedly connected to the upper end of the placing plate 11. Both sides of the upper end of the mounting bracket 20 are rotatably connected to the No. 2 gear 17, and both sides of one side of the upper end of the mounting bracket 20 are rotatably connected to the connecting rod 19. One end of the two connecting rods 19 is rotatably connected to the clamping rod 16, and one end of the two clamping rods 16 is rotatably connected to one side of the two No. 2 gears 17. A No. 2 toothed rod 18 is meshed between the two No. 2 gears 17, and one end of the No. 2 toothed rod 18 is rotatably connected to the fastening rod 21. A fixing plate 22 is provided on one side of the mounting bracket 20, and the upper part of the fixing plate 22 is threadedly connected to the outer surface of the fastening rod 21. The other end of the fastening rod 21 is fixedly connected to the knob 15, and one side of the two clamping rods 16 is fixedly connected to the clamping plate 14. The upper part of both sides of the box body 1 is fixedly connected to the heating mechanism 3, and the lower part of both sides of the box body 1 is fixedly connected to the cooling mechanism 4.

[0036] In this embodiment, when performing a thermal shock test on the semiconductor, the semiconductor can be placed between the clamping plates 14, and then the knob 15 is turned to drive the fastening rod 21 to rotate, and the No. 2 toothed rod 18 is pulled to move horizontally. The No. 2 toothed rod 18 can drive the No. 2 gear 17 on both sides to rotate, thereby pushing the two clamping rods 16 to gather together. At this time, the clamping plate 14 can clamp the semiconductor, and then the thermal shock test of the semiconductor can be carried out. This method allows the device to quickly clamp the semiconductor when performing a thermal shock test, which is more convenient for the smooth progress of the test.

[0037] Working principle: When conducting hot and cold shock tests on the semiconductor, the semiconductor can be placed between the clamping plates 14, and then the knob 15 is turned to drive the fastening rod 21 to rotate, and the No. 2 toothed rod 18 is pulled to move horizontally. The No. 2 toothed rod 18 can drive the No. 2 gear 17 on both sides to rotate, thereby pushing the two clamping rods 16 to gather together. At this time, the clamping plate 14 can clamp the semiconductor, and then the box door 2 is closed, and the heating mechanisms 3 on both sides are started. After the thermal shock test is completed, the motor 8 is started, and the motor 8 drives the No. 2 screw rod 5, and the No. 1 toothed rod 6 is driven to move horizontally through the No. 2 screw rod 5. The No. 1 gear 7 engaged with its No. 1 toothed rod 6 will also rotate accordingly, and drive the No. 1 screw rod 10 to rotate. At this time, the placement box 12 will move to the bottom of the box body 1 driven by the No. 1 screw rod 10, and then the cold shock test can be carried out again.

[0038] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor constant temperature test chamber, comprising a chamber body (1) and a chamber door (2), characterized in that: A placement box (12) is provided inside the box body (1), and rectangular holes (13) are evenly opened on both sides of the placement box (12). A No. 1 screw rod (10) is rotatably connected to the middle of one side of the box body (1), and a slide rod (9) is provided on both sides of the No. 1 screw rod (10). The outer surfaces of the two slide rods (9) are respectively slidably connected to the two sides of one side of the placement box (12). The outer surface of the No. 1 screw rod (10) is threadedly connected to the middle of one side of the placement box (12), and one end of the No. 1 screw rod (10) passes through the No. 1 screw rod (10). A first gear (7) is fixedly connected to the upper part of the box body (1), a first toothed rod (6) is slidably engaged with the upper part of the box body (1), one side of the first toothed rod (6) is meshed with the side surface of the first gear (7), a second screw rod (5) is rotatably connected to the middle part of the upper end of the box body (1), the outer surface of the second screw rod (5) is threadedly connected to the other side of the first toothed rod (6), a motor (8) is fixedly connected to the upper part of one side of the box body (1), and the output end of the motor (8) is fixedly connected to the other end of the second screw rod (5).

2. A semiconductor constant temperature test chamber according to claim 1, characterized in that: A placement plate (11) is fixedly connected to the lower portion of the placement box (12), and a mounting frame (20) is fixedly connected to the upper end of the placement plate (11). Both sides of the upper end of the mounting frame (20) are rotatably connected to a second gear (17).

3. A semiconductor constant temperature test chamber according to claim 2, characterized in that: Both sides of one side of the upper end of the mounting frame (20) are rotatably connected to connecting rods (19), and one end of the two connecting rods (19) is rotatably connected to a clamping rod (16).

4. The semiconductor constant temperature test chamber according to claim 3, characterized in that: One end of the two clamping rods (16) is rotatably connected to one side of the two second gears (17), and a second toothed rod (18) is meshed between the two second gears (17).

5. The semiconductor constant temperature test chamber according to claim 4, characterized in that: One end of the second toothed rod (18) is rotatably connected to a fastening rod (21), and a fixing plate (22) is provided on one side of the mounting frame (20).

6. The semiconductor constant temperature test chamber according to claim 5, characterized in that: The upper portion of the fixing plate (22) is threadedly connected to the outer surface of the fastening rod (21), and the other end of the fastening rod (21) is fixedly connected to a knob (15).

7. The semiconductor constant temperature test chamber according to claim 6, characterized in that: One side of the two clamping rods (16) is fixedly connected with a clamping plate (14).

8. The semiconductor constant temperature test chamber according to claim 1, characterized in that: The upper sides of both sides of the box body (1) are fixedly connected with heating mechanisms (3), and the lower sides of both sides of the box body (1) are fixedly connected with cooling mechanisms (4).

Images