Soldering equipment for PCB (printed circuit board) processing

Abstract

The utility model relates to tin soldering equipment, in particular to tin soldering equipment for PCB (printed circuit board) processing. The tin soldering equipment for PCB processing comprises supports, a tin soldering platform, an automatic mechanical arm, a welding head, a gas processing bin and a fixing assembly, the supports are symmetrically connected to the bottom of the tin soldering platform, the automatic mechanical arm is installed on the rear side of the tin soldering platform, the welding head is installed on the automatic mechanical arm, and the gas processing bin is installed on the gas processing bin. A gas treatment bin is installed on the front side of the welding head, and a fixing assembly is arranged on the tin soldering platform. The gas treatment bin is arranged on the welding head, smoke and particulate matter generated in the welding process can be directly captured and rapidly filtered and purified, the purification efficiency is improved through the method, diffusion of harmful substances to the surrounding environment is remarkably reduced, and the health of an operator is better protected.

Description

Technical Field

[0001] The utility model relates to a soldering device, in particular to a soldering device for processing a PCB circuit board. Background Art

[0002] Soldering is a technique that uses a low-melting-point metal material (primarily tin and its alloys) as a solder. It is heated to melt and fill the gap between two or more metal surfaces, where it cools and solidifies to form a strong connection. Soldering is a crucial step in the manufacturing process of printed circuit boards (PCBs). The purpose of soldering is to secure electronic components to the circuit board and ensure a good electrical connection between these components and the board.

[0003] During soldering operations, some gases and particulate matter that may be harmful to human health and the environment are produced. Solder and flux release fine particles and smoke during the thermal decomposition process. Long-term inhalation of these substances may cause respiratory diseases such as asthma and bronchitis. In order to reduce the impact of these harmful substances, a ventilation system is usually installed in the processing environment. However, traditional fixed ventilation systems have the following problems: once the fixed ventilation system is installed, it is difficult to adjust it according to changes in the actual work position, and it cannot flexibly meet the needs of different workstations. In addition, in larger work areas, the efficiency of the fixed ventilation system is not high, and it is difficult to effectively cover all welding points, resulting in some harmful gases still being inhaled by workers. Utility Model Content

[0004] In order to overcome the above-mentioned shortcomings, the technical problem of the present invention is to provide a soldering device for PCB circuit board processing.

[0005] A soldering device for PCB circuit board processing includes a bracket, a soldering platform, an automated robotic arm, a welding head, a gas treatment chamber and a fixing component. The bracket is symmetrically connected to the bottom of the soldering platform, the automated robotic arm is installed on the rear side of the soldering platform, the welding head is installed on the automated robotic arm, the gas treatment chamber is installed on the front side of the welding head, and the fixing component is provided on the soldering platform.

[0006] Optionally, the gas processing chamber includes a conical suction head, a connecting pipe, a fan and an adsorption plate. Connecting pipes are connected to both sides of the gas processing chamber, and the bottom ends of the connecting pipes are connected to conical suction heads, which face the tip of the welding head. A fan is installed on the upper side of the gas processing chamber, and an adsorption plate is slidably connected to the inside of the gas processing chamber.

[0007] Optionally, the fixing assembly includes a motor, a bidirectional screw, a splint and a guide rod. The motor is installed on the front right side of the soldering platform, and a bidirectional screw is connected to the motor output shaft. The bidirectional screw is rotatably connected to the soldering platform. The guide rod is connected to the rear side of the soldering platform. The left and right sides of the guide rod are slidably connected with splints, and the front side of the splint is threadedly connected to the two ends of the bidirectional screw.

[0008] Optionally, it also includes a wedge-shaped pressure plate, a limit rod and a spring. The clamping plate is symmetrically and slidingly connected to the limit rod. A wedge-shaped pressure plate is connected between the bottoms of the two limit rods on the same side. Springs are connected between both sides of the wedge pressure plate and the clamping plate, and the springs are sleeved on the limit rod.

[0009] Optionally, the inner side of the wedge-shaped pressure plate is an inclined surface, and the bottom surface is a flat surface.

[0010] Optionally, a purification device for purifying the gas generated by soldering is installed inside the gas processing chamber.

[0011] Compared with the existing technology, the utility model has the following advantages: 1. By arranging a gas treatment chamber on the welding head, the smoke and particulate matter generated during the welding process can be directly captured and quickly filtered and purified. This method not only improves the purification efficiency, but also significantly reduces the diffusion of harmful substances into the surrounding environment, better protecting the health of the operator;

[0012] 2. By setting the clamping plate and wedge-shaped pressure plate on the soldering platform, the two sides of the circuit board can be accurately clamped in the center, and pressure is applied at the upper position to ensure the stability and positioning accuracy of the circuit board during the entire soldering process, which helps to improve soldering quality and production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model.

[0014] Figure 2 This is a cross-sectional view of the soldering platform component of the utility model.

[0015] Figure 3 It is a three-dimensional structural diagram of the splint, wedge-shaped pressure plate, limit rod and spring component of the utility model.

[0016] Figure 4 It is a three-dimensional structural diagram of the welding head, gas processing chamber, conical suction head and other components of the utility model.

[0017] The markings of the components in the accompanying drawings are as follows: 1. Bracket, 2. Soldering platform, 3. Automated robotic arm, 4. Welding head, 5. Motor, 6. Bidirectional screw, 7. Clamp, 8. Guide rod, 9. Wedge-shaped pressure plate, 10. Limit rod, 11. Spring, 12. Gas treatment chamber, 13. Conical suction head, 14. Connecting pipe, 15. Fan, 16. Adsorption plate. DETAILED DESCRIPTION

[0018] The following is a clear and complete description of the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0019] Embodiment: A soldering device for PCB circuit board processing, such as Figure 1 、 Figure 2 and Figure 4 As shown, it includes a bracket 1, a soldering platform 2, an automated robotic arm 3, a welding head 4, a gas treatment chamber 12 and a fixed component. The bracket 1 is symmetrically connected to the bottom of the soldering platform 2, and the automated robotic arm 3 is installed on the rear side of the soldering platform 2. The welding head 4 for soldering the circuit board is installed on the automated robotic arm 3, and the gas treatment chamber 12 is installed on the front side of the welding head 4. The gas treatment chamber 12 is installed inside the gas treatment chamber 12. A purification device for purifying the gas generated by soldering is installed, and a fixed component is provided on the soldering platform 2.

[0020] like Figure 1 and Figure 4 As shown, the gas processing chamber 12 includes a conical suction head 13, a connecting pipe 14, a fan 15 and an adsorption plate 16. The left and right sides of the gas processing chamber 12 are connected to the connecting pipe 14, and the bottom end of the connecting pipe 14 is connected to the conical suction head 13, which faces the tip of the welding head 4. A fan 15 for pumping gas is installed on the upper side of the gas processing chamber 12, and an adsorption plate 16 for adsorbing harmful substances in the gas is slidably connected in the gas processing chamber 12.

[0021] like Figure 1-Figure 2 As shown, the fixing assembly includes a motor 5, a bidirectional screw rod 6, a splint 7 and a guide rod 8. The motor 5 is installed on the right front side of the soldering platform 2 by bolts. The bidirectional screw rod 6 is connected to the output shaft of the motor 5. The bidirectional screw rod 6 is rotatably connected to the soldering platform 2. A guide rod 8 is welded to the rear side of the soldering platform 2. The left and right sides of the guide rod 8 are slidably connected with a splint 7 for centering the circuit board. The front side of the splint 7 is threadedly connected to the two ends of the bidirectional screw rod 6.

[0022] like Figure 2-Figure 3 As shown, it also includes a wedge-shaped pressure plate 9, a limit rod 10 and a spring 11. The limit rods 10 are symmetrically connected to the front and rear sliding connections on the clamping plate 7. A wedge-shaped pressure plate 9 for pressing the circuit board is connected between the bottoms of the two limit rods 10 on the same side. Springs 11 are connected between the front and rear sides of the wedge pressure plate 9 and the clamping plate 7. The spring 11 is sleeved on the limit rod 10. The inner side of the wedge pressure plate 9 is an inclined surface, while the bottom surface is a flat surface, which is conducive to pressing the circuit board.

[0023] When soldering the circuit board, place the circuit board on the soldering platform 2, then start the motor 5. The output shaft of the motor 5 rotates to drive the bidirectional screw 6 to rotate, and then drives the clamping plate 7 to move inward along the guide rod 8. The circuit board is centered by the clamping plate 7. The clamping plate 7 moves inward to drive the wedge-shaped pressure plate 9 and the limit rod 10 to move synchronously. The inner inclined surface of the wedge-shaped pressure plate 9 contacts the circuit board, and then squeezes the wedge-shaped pressure plate 9 to move upward. The spring 11 is compressed accordingly, and the top surface of the circuit board is pressed by the wedge-shaped pressure plate 9, while the clamping plate 7 clamps the left and right sides of the circuit board. After the circuit board is fixed, turn off the motor 5, then start the equipment, drive the welding head 4 to move through the automated robotic arm 3, and perform soldering on the circuit board to facilitate fixing the electronic components to the circuit board. Start the fan 15 during soldering, and the fan 15 extracts the gas generated during the soldering process. The gas enters the gas treatment chamber 12 through the conical suction head 13 and the connecting pipe 14, and then passes through the filtration of the adsorption plate 16 and the purification of the internal purification equipment before being discharged. It can filter out harmful substances contained in the gas. The adsorption plate 16 can be removed and replaced after being used for a period of time.

[0024] After the soldering of the circuit board is completed, the motor 5 is controlled to run in the reverse direction, driving the bidirectional screw 6 to reverse, so as to drive the clamping plate 7 to move outward along the guide rod 8, and then drive the wedge-shaped pressure plate 9 to move outward, so that it loosens the fixation on the circuit board, and the spring 11 rebounds and resets. After the clamping plate 7 is reset, the motor 5 is turned off, and then the processed circuit board can be removed. According to the above operation, the soldering process can continue to be performed on the remaining circuit boards.

[0025] The above embodiments are intended only to illustrate the technical concepts and features of the present invention. Their purpose is to enable those familiar with the art to understand the contents of the present invention and implement them accordingly. They are not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications based on the spirit of the present invention are intended to be included in the scope of protection of the present invention.

Claims

1. A soldering device for PCB circuit board processing, characterized by: The invention comprises a bracket (1), a soldering platform (2), an automated mechanical arm (3), a welding head (4), a gas processing chamber (12) and a fixing component. The bottom of the soldering platform (2) is symmetrically connected to the bracket (1), the rear side of the soldering platform (2) is equipped with an automated mechanical arm (3), the welding head (4) is equipped on the automated mechanical arm (3), the front side of the welding head (4) is equipped with a gas processing chamber (12), and the soldering platform (2) is provided with a fixing component.

2. The soldering equipment for PCB circuit board processing according to claim 1, characterized in that: The gas processing chamber (12) comprises a conical suction head (13), a connecting pipe (14), a blower (15) and an adsorption plate (16). Both sides of the gas processing chamber (12) are connected to the connecting pipe (14). The bottom ends of the connecting pipes (14) are connected to the conical suction heads (13). The conical suction heads (13) face the tip of the welding head (4). The blower (15) is installed on the upper side of the gas processing chamber (12). The adsorption plate (16) is slidably connected to the gas processing chamber (12).

3. The soldering equipment for PCB circuit board processing according to claim 2, characterized in that: The fixing assembly comprises a motor (5), a bidirectional screw rod (6), a clamping plate (7) and a guide rod (8). The motor (5) is installed on the right side of the front of the soldering platform (2). The output shaft of the motor (5) is connected with the bidirectional screw rod (6). The bidirectional screw rod (6) is rotatably connected to the soldering platform (2). The rear side of the soldering platform (2) is connected with the guide rod (8). Both sides of the guide rod (8) are slidably connected with the clamping plate (7). The front side of the clamping plate (7) is respectively connected with the two ends of the bidirectional screw rod (6) by thread.

4. The soldering equipment for PCB circuit board processing according to claim 3 is characterized in that: The invention also includes a wedge-shaped pressure plate (9), a limiting rod (10) and a spring (11). The limiting rod (10) is symmetrically and slidingly connected to the clamping plate (7). The bottoms of the two limiting rods (10) on the same side are connected with a wedge-shaped pressure plate (9). The spring (11) is connected between the two sides of the wedge-shaped pressure plate (9) and the clamping plate (7). The spring (11) is sleeved on the limiting rod (10).

5. The soldering equipment for PCB circuit board processing according to claim 4 is characterized in that: The inner side of the wedge-shaped pressing plate (9) is an inclined surface, while the bottom surface is a flat surface.

6. The soldering equipment for PCB circuit board processing according to claim 5, characterized in that: A purification device for purifying the gas generated by soldering is installed inside the gas processing chamber (12).

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