Precise cutting and marking device for chip

Abstract

The utility model relates to a chip precision cutting marking device, which comprises a machine table, a cutting table, a cutting table, a cutting table, a cutting table and a cutting table, and is characterized in that a placing position is arranged at the upper end of the machine table; the camera shooting assembly is arranged at the lower end of the machine table, a through groove penetrating through the upper and lower end faces is formed in the machine table, and the camera shooting assembly is arranged under the through groove; the two camera shooting assemblies are oppositely arranged below the through groove. An angle-adjustable spotlight is also arranged above the machine table; the CCD display module is arranged above the machine table, the camera shooting assembly is electrically connected to the CCD display module, and the CCD display module is used for displaying an alignment image of the product; and the moving module is arranged above the machine table, the moving module is connected with the cutter module, the cutter module can move close to or away from the machine table in the vertical direction, and the moving module is used for driving the cutter module to move at a constant speed along the marks. By the adoption of the structure, precise cutting of the chip is completed, and the production efficiency of products is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip cutting, in particular to a chip precision cutting and marking device. Background Art

[0002] LCOS technology, a high-tech technology that combines liquid crystal display and semiconductor technologies, is widely used in high-definition televisions, computer monitors, projectors, and other fields. Cutting is a crucial step in the LCOS chip production process. To ensure the chip is not damaged during the cutting process, precise positioning is required. The current industry-standard marking process for LCOS chip cutting uses a simple low-magnification lens to illuminate the image and manually push the cutting wheel to find the cutting mark. This marking process has low production efficiency and poor mark precision and stability, significantly reducing the size and quality assurance of single wafer cuts.

[0003] Therefore, there is an urgent need to provide a chip precision cutting and marking device to solve the above problems. Utility Model Content

[0004] The purpose of the utility model is to overcome the deficiencies and defects of the prior art and provide a chip precision cutting and marking device, which completes the precise cutting of chips and improves the production efficiency of products.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] A chip precision cutting and marking device, characterized by comprising:

[0007] The machine platform has a placement position at the top end thereof, and the placement position is used to place and fix the product to be cut;

[0008] A camera assembly is provided at the lower end of the machine platform. A through slot is provided on the machine platform, which passes through the upper and lower end surfaces. The camera assembly is provided directly below the through slot. Two groups of camera assemblies are provided, and the two camera assemblies are arranged opposite to each other below the through slot. A spotlight with an adjustable angle is also provided above the machine platform.

[0009] A CCD display module is provided above the machine platform. The camera assembly is electrically connected to the CCD display module. The CCD display module is used to display the alignment image of the product.

[0010] The movable module is arranged above the machine and is connected to the cutter module. The cutter module can move vertically toward or away from the machine, and the movable module is used to drive the cutter module to move at a uniform speed along the mark.

[0011] Optionally, the machine is a vacuum adsorption platform, and a plurality of adsorption holes are provided through the machine, and the lower ends of the adsorption holes are used to be connected to a vacuum pump.

[0012] Optionally, the movable module includes a fixed frame, a screw rod, a screw rod slider and a drive motor, which are fixed on both sides of the machine, the screw rod is passed through the fixed frame, the screw rod slider is slidably connected to the screw rod, the output end of the drive motor is connected to the screw rod, and the cutter assembly is connected to the lower end of the screw rod slider.

[0013] Optionally, the camera assembly is configured as a high-definition camera, and the magnification of the high-definition camera is 5-20.

[0014] Optionally, the cutter assembly includes a cutter wheel, an airbag assembly and a micrometer assembly, the airbag assembly is arranged between the cutter wheel and the screw slider to adjust the cutting amount of the cutter wheel; the micrometer assembly is connected to the side end of the cutter wheel to accurately measure the cutting amount of the cutter wheel.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] In the utility model, a placement position is provided at the upper end of the machine, which is used to place and fix the product to be cut; the camera component, the spotlight and the CCD display module together constitute a reference calibration component, which together complete the calibration of the baseline of the product; the camera component is arranged at the upper end of the machine, and the machine is provided with a through groove running through the upper and lower end surfaces of the machine, and two groups of camera components are relatively arranged below the through groove. The two groups of camera components are relatively arranged, and cooperate with the spotlight arranged above the machine and with adjustable angles to obtain the alignment image of the product; the CCD display module is arranged above the machine, and the camera component is electrically connected to the CCD display module, and the alignment image is displayed through the CCD display module for the operator to view and adjust; the moving module is arranged above the machine, and the moving module is connected to the cutter module. The cutter module can adjust the cutting amount of the product, and the moving module drives the cutter module to move at a uniform speed along the mark; through the arrangement of the above components, the precise cutting of the chip is completed, and the production efficiency of the product is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural diagram of the present utility model.

[0018] Figure 2 It is a front view of the utility model.

[0019] The above drawings include the following reference numerals:

[0020] 1. Machine, 11. Through slot, 12. Adsorption hole, 2. Camera assembly, 3. CCD display module, 4. Mobile module, 41. Fixed bracket, 42. Screw, 43. Screw slider, 44. Drive motor, 5. Cutter module, 51. Cutter wheel, 52. Airbag assembly. DETAILED DESCRIPTION

[0021] The present invention will be described in further detail below with reference to the embodiments and drawings, but the embodiments of the present invention are not limited thereto.

[0022] The technical solution of the utility model proposes a chip precision cutting and marking device.

[0023] Reference Figures 1 to 2 , in this embodiment, including:

[0024] Machine 1, the upper end of the machine 1 is provided with a placement position, which is used to place and fix the product to be cut;

[0025] The camera assembly 2 is provided at the lower end of the machine 1. The machine 1 is provided with a through slot 11 that passes through the upper and lower end surfaces. The camera assembly 2 is provided directly below the through slot 11. There are two sets of camera assemblies 2, and the two camera assemblies 2 are arranged opposite each other below the through slot 11. A spotlight with an adjustable angle is also provided above the machine 1.

[0026] The CCD display module 3 is located above the machine platform 1. The camera assembly 2 is electrically connected to the CCD display module 3. The CCD display module 3 is used to display the alignment image of the product.

[0027] The movable module 4 is arranged above the machine 1 and is connected to the cutter module 5. The cutter module 5 can move vertically toward or away from the machine 1, and the movable module 4 is used to drive the cutter module 5 to move at a constant speed along the mark.

[0028] Optionally, in this embodiment, the chip precision cutting and marking device includes a machine 1, a camera component 2, a spotlight, a CCD display module 3 and a mobile module 4. A placement position is provided at the upper end of the machine 1, and the placement position is used to place and fix the product to be cut; wherein the camera component 2, the spotlight and the CCD display module 3 together constitute a reference calibration component, which together completes the reference line calibration of the product for subsequent cutting processes; the camera component 2 is provided at the upper end of the machine 1, and the machine 1 is provided with a through groove 11 running through the upper and lower end surfaces of the machine 1, the camera component 2 is provided directly below the through groove 11, and the camera component 2 and the through groove 11 are each provided with two groups, the two groups of camera components 2 are respectively provided below the two groups of through grooves 11, the two groups of camera components 2 are relatively arranged below the through groove 11, the two groups of camera components 2 are relatively arranged, and cooperate with the spotlight with adjustable angle provided above the machine 1, through the through groove 11 can Obtain an alignment image of the product; the CCD display module 3 is arranged above the machine 1, and the camera component 2 is electrically connected to the CCD display module 3, that is, the alignment image obtained by the relative arrangement of the two groups of camera components 2 is displayed through the CCD display module 3 for the operator to view, and the baseline is further calibrated and adjusted through the alignment image; the moving module 4 is arranged above the machine 1, and the moving module 4 is connected to the cutter module 5, wherein the cutter module 5 can be moved in the vertical direction toward or away from the machine, that is, the cutter module 5 can adjust the cutting amount of the product. When the camera component 2, the spotlight and the CCD display module 3 jointly complete the calibration of the baseline, the cutter module 5 cuts into the product, and the moving module 4 drives the cutter module 5 to move at a uniform speed along the mark to complete the cutting of the product; through the setting of the above components, the precise cutting of the chip is completed, and the production efficiency of the product is improved.

[0029] In this embodiment, the machine 1 is a vacuum adsorption platform, and a plurality of adsorption holes 12 are provided on the machine 1. The lower end of the adsorption hole 12 is used to be connected to a vacuum pump, and the other end is connected to the lower end of the product. The vacuum pump is used to perform vacuuming to complete the adsorption and fixation of the product to prevent damage to the product caused by fixing the product. In other embodiments, a positioning fixture can also be used to fix and position the product, and a rubber layer or a buffer pad can be added to the contact surface between the positioning fixture and the product to achieve fixation and positioning of the product while preventing damage to the product. This is not limited here.

[0030] In this embodiment, the movable module 4 includes a fixed frame 41, a screw 42, a screw slider 43, and a drive motor 44. The fixed frame 41 is provided on both sides of the machine 1. The screw 42 is provided through the fixed frame 41 and fixed to fix the screw 42. The screw 42 is rotatably connected to the fixed frame 41. The screw slider 43 is slidably connected to the screw 42. The output end of the drive motor 44 is connected to the screw 42 to drive the screw 42 to rotate, thereby driving the screw slider 43 to slide along the extension direction of the screw 42. The cutter assembly is connected to the lower end of the screw slider 43, that is, the sliding of the screw slider 43 drives the cutter assembly to perform cutting. Furthermore, in this embodiment, the camera assembly 2 is configured as a high-definition camera, and the magnification of the high-definition camera is 5 to 20. The high-magnification camera can achieve high-definition imaging of the product and improve the cutting accuracy of the product.

[0031] In this embodiment, the cutter assembly includes a cutter wheel 51, an airbag assembly 52 and a micrometer assembly, wherein the airbag assembly 52 is arranged between the cutter wheel 51 and the screw slider 43 to adjust the cutting amount of the cutter wheel 51. The specific principle is that by adjusting the air pressure inside the airbag, the hardness and shape of the airbag can be changed, thereby accurately controlling the contact pressure and contact area between the cutter wheel 51 and the product, which helps to achieve uniform cutting depth and high-quality processing surface; the micrometer assembly is connected to the side end of the cutter wheel 51 to accurately measure the cutting depth of the cutter wheel 51, wherein the cutter assembly is also connected to the CCD display module 3, that is, the pressure value inside the airbag assembly 52 and the measurement value of the micrometer assembly can also be displayed through the CCD display module 3, thereby facilitating observation and adjustment by the operator.

[0032] The above-described embodiments merely represent implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A chip precision cutting and marking device, characterized in that: include: The machine platform has a placement position at the top end thereof, and the placement position is used to place and fix the product to be cut; A camera assembly is provided at the lower end of the machine platform. A through slot is provided on the machine platform, which passes through the upper and lower end surfaces. The camera assembly is provided directly below the through slot. Two groups of camera assemblies are provided, and the two camera assemblies are arranged opposite to each other below the through slot. A spotlight with an adjustable angle is also provided above the machine platform. A CCD display module is provided above the machine platform. The camera assembly is electrically connected to the CCD display module. The CCD display module is used to display the alignment image of the product. The movable module is arranged above the machine and is connected to the cutter module. The cutter module can move vertically toward or away from the machine, and the movable module is used to drive the cutter module to move at a uniform speed along the mark.

2. A chip precision cutting and marking device according to claim 1, characterized in that: The machine is a vacuum adsorption platform, and a plurality of adsorption holes are provided through the machine, and the lower ends of the adsorption holes are used to be connected to a vacuum pump.

3. A chip precision cutting and marking device according to claim 2, characterized in that: The movable module includes a fixed frame, a screw rod, a screw rod slider and a driving motor. The fixed frame is arranged on both sides of the machine. The screw rod is passed through the fixed frame. The screw rod slider is slidably connected to the screw rod. The output end of the driving motor is connected to the screw rod, and the cutter assembly is connected to the lower end of the screw rod slider.

4. A chip precision cutting and marking device according to claim 1, characterized in that: The camera assembly is configured as a high-definition camera, and the magnification of the high-definition camera is 5-20.

5. A chip precision cutting and marking device according to claim 3, characterized in that: The cutter assembly includes a cutter wheel, an airbag assembly and a micrometer assembly. The airbag assembly is arranged between the cutter wheel and the screw slider to adjust the cutting amount of the cutter wheel; the micrometer assembly is connected to the side end of the cutter wheel to accurately measure the cutting amount of the cutter wheel.

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