Micro-fluidic chip hot-pressing device

Abstract

The utility model provides a micro-fluidic chip hot-pressing device which comprises a heating plate arranged at the uppermost end of the device; the lower heating module is arranged at the lowermost end of the device, and a gap is formed between the lower heating module and the heating plate without contact; the hot pressing head is detachably connected to the side, close to the lower heating module, of the heating plate; the lower welding head is detachably connected to the side, close to the heating plate, of the lower heating module. The micro-fluidic chip hot-pressing device provided by the utility model solves the problems that the existing equipment can only carry out hot-pressing bonding on a chip with a single model, the reuse efficiency is low and the processing cost is high, and has the advantages that the hot-pressing head can be replaced, the assembly is flexible, the cost is saved, and the reuse efficiency is high.

Description

Technical Field

[0001] The utility model relates to the field of medical equipment, in particular to a microfluidic chip hot pressing device. Background Art

[0002] Currently, medical device diagnostic projects typically employ high-throughput, fully integrated testing. The primary consumables used in these tests are microfluidic chips. The various channels and chambers within these chips are individually designed and arranged according to their desired functions. These chips are non-standard, custom-made products with a wide variety of design structures and forms. To hot-press microfluidic chips with different structures, a custom hot-pressing device is typically used for each chip. This device can only perform hot-press bonding on a single chip model. Therefore, hot-pressing production of multiple microfluidic product models requires the design and development of multiple hot-pressing devices. This design process is lengthy, the assembly process is complex, and the processing costs are high, multiplying the cost of multiple devices. Furthermore, during the microfluidic chip design and development phase, when the structure is not fully determined, the chip structure requiring hot-press bonding undergoes multiple changes and upgrades. If a custom hot-pressing device is required for each chip structure, the cost will increase exponentially. Furthermore, once the chip structure is changed, the hot-pressing device becomes obsolete, resulting in significant waste. Utility Model Content

[0003] The main purpose of the utility model is to provide a microfluidic chip hot pressing device, which overcomes the above technical problems.

[0004] In order to achieve the above purpose, the present invention proposes the following technical solutions:

[0005] A microfluidic chip hot pressing device, comprising:

[0006] A heating plate is provided at the uppermost end of the device;

[0007] The lower heating module is arranged at the bottom of the device, with a gap between it and the heating plate so that they do not touch each other;

[0008] A hot pressing head is detachably connected to the side of the heating plate close to the lower heating module;

[0009] The lower welding head is detachably connected to a side of the lower heating module close to the heating plate.

[0010] Furthermore, a plurality of through holes are provided on the thermal compression head.

[0011] Furthermore, the thermal pressing head fixing screws can pass through the through holes on the thermal pressing head to fix the thermal pressing head on the heating plate.

[0012] Furthermore, a groove is provided on the lower heating module, and the groove can just accommodate the lower welding head, and a through hole is provided on at least one side of the groove.

[0013] Furthermore, the fixing screws of the lower welding head can pass through the through holes on the sides of the groove to fix the lower welding head on the lower heating module.

[0014] Furthermore, a negative pressure interface is provided on one side of the lower welding head, and the negative pressure interface is connected to the negative pressure pipeline.

[0015] Furthermore, a plurality of heating rod holes are provided on the side of the heating plate for inserting heating rods.

[0016] Furthermore, a temperature sensor mounting hole is provided on the upper surface of the heating plate for mounting a temperature sensor.

[0017] Furthermore, heating plate fixing holes are provided at the four corners of the heating plate for fixing the heating plate.

[0018] Furthermore, the heating plate is in contact with the heating rod, and the gap between the two is filled with a thermally conductive material, which includes but is not limited to a thermal pad and thermally conductive silicone grease.

[0019] The microfluidic chip hot pressing device of the utility model solves the problems that the existing equipment can only perform hot pressing bonding on a single type of chip, has low reuse efficiency and high processing cost. It has the advantages of replaceable hot pressing heads, flexible assembly, cost savings and high reuse efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings constituting part of this application are provided to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are provided to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0021] Figure 1 This is an overall structural diagram of a microfluidic chip hot pressing device of the present utility model.

[0022] Figure 2 This is a three-dimensional assembly diagram of a microfluidic chip hot pressing device of the present utility model.

[0023] Figure 3 Schematic diagram of the heating plate structure.

[0024] Figure 4 A thermal compression head in one embodiment.

[0025] Figure 5 A hot pressing head in another embodiment.

[0026] The above drawings include the following reference numerals:

[0027] 01. Heating plate; 02. Hot pressing head; 03. Hot pressing head fixing screw; 04. Lower welding head; 05. Lower heating module; 06. Lower welding head fixing screw; 07. Heating rod hole; 08. Microfluidic chip; 09. Lower heating module fixing hole; 10. Temperature sensor mounting hole; 11. Heating plate fixing hole 12. Negative pressure interface; 13. Negative pressure pipeline. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is in no way intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0029] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0030] Unless otherwise specifically stated, the relative arrangement of the parts and steps, the numerical expressions and the numerical values ​​set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The techniques, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered as part of the authorization specification. In all examples shown and discussed here, any specific values ​​should be interpreted as being merely exemplary and not as limitations. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, and therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0031] Reference below Figures 1 to 5 , the utility model is further described:

[0032] A microfluidic chip hot pressing device, comprising:

[0033] Heating plate 01, set at the top of the device;

[0034] The lower heating module 05 is located at the bottom of the device, with a gap between it and the heating plate 01, so they do not touch each other;

[0035] The hot pressing head 02 is detachably connected to the side of the heating plate 01 close to the lower heating module 05;

[0036] The lower welding head 04 is detachably connected to a side of the lower heating module 05 close to the heating plate 01 .

[0037] In a preferred embodiment, the heating plate 01 is made of aluminum alloy material, and other metal materials with good thermal conductivity can also be used. Figure 3 As shown, the heating plate fixing hole 11 and the mounting plate on the hot press are firmly connected together through a screw rod and a nut.

[0038] The hot pressing head 02 is provided with a plurality of through holes, and the hot pressing head fixing screws 03 can pass through the through holes on the hot pressing head 02 to fix the hot pressing head 02 on the heating plate 01.

[0039] The thermal pressing head 02 is fixedly connected by a positioning mechanism using a thermal pressing head fixing screw 03, with good contact or the addition of a thermal pad, thermal grease and a medium conducive to heat conduction in the middle to minimize thermal resistance, so that heat energy is effectively conducted to the thermal pressing head 02, and microfluidic chip welding is effectively performed.

[0040] like Figure 4 and Figure 5 The following are two different structures of thermal compression heads 02. The thermal compression head 02 can be customized according to the structure of the microfluidic chip to be welded to meet various microfluidic chip welding requirements, such as Figure 4 The figure shows the welding head for welding 4 small dots on the microfluidic chip. Figure 5 The figure shows the welding head for welding the entire large plane. Here we only list two types of thermal compression heads 02. In actual design, a variety of different thermal compression heads 02 can be customized according to the corresponding microfluidic chip to meet the welding requirements of various microfluidic chips.

[0041] There are multiple heating rod holes 07 on the side of the heating plate 01. The heating rods are inserted into the heating rod holes 07 to realize the heating function. The heating rods are in good contact with the heating plate 01. Thermal pads, thermal grease and other materials are added between the gaps, and screws are used to fix them to the heating plate 01 through threaded holes to ensure that the heat from the heating rods can be quickly transferred to the heating plate.

[0042] like Figure 3As shown, in this embodiment, a temperature sensor mounting hole 10 is provided on the upper surface of the heating plate 01, and a temperature sensor is provided in the temperature sensor mounting hole 10. By collecting the temperature of the sensor and adjusting the power of the hot rod hole 07 through PID parameters, the temperature of the heating plate 01 and the hot pressing head 02 can be controlled to meet the high-precision temperature requirements of thermal welding.

[0043] A groove is provided on the lower heating module 05, which can just accommodate the lower welding head 04. A through hole is provided on at least one side of the groove. The lower welding head fixing screw 06 can pass through the through hole on the side of the groove to fix the lower welding head 04 on the lower heating module 05.

[0044] The four corners of the heating plate 01 are provided with heating plate fixing holes 11 for fixing the heating plate 01. The heating plate 01 is in contact with the heating rod, and the gap between the two is filled with thermal conductive material, which includes but is not limited to thermal pads and thermal grease.

[0045] Lower heating module 05 is secured to the lower platform of the hot press using lower heating module fixing holes 09. Lower welding head 04 is fixed to the recessed area above lower heating module 05 and secured with lower welding head fixing screws 06 to prevent slippage and secure the lower welding head 04. The lower heating module 05 and lower welding head 04 ensure good contact, with a thermal pad and thermal grease added between them to ensure efficient heat conduction. Like the upper heating module, lower heating module 05 and lower heating block 04 are regulated using PID parameters, enabling real-time control of the lower heating block 04's temperature.

[0046] The lower welding head 04 can also be customized with the bottom structure of the microfluidic chip 08 to be welded to meet the welding requirements of various microfluidic chips 08. The lower welding head 04 is designed with a plane positioning mechanism of the x-axis and y-axis, which can be positioned by two sides (such as Figure 1 The upper left corner of the middle chip is positioned in the plane by two vertical edges), and through-hole positioning can also be used to ensure that when soldering chips of the same series, each chip can be positioned quickly and accurately, thereby improving production efficiency.

[0047] A negative pressure interface 12 is provided on one side of the lower welding head 04 , and the negative pressure interface 12 is connected to a negative pressure pipeline 13 .

[0048] Some microfluidic chips 08 are designed in the form of a packaging film and a chip body. It is not easy to position the welding head 04 under the film and it is easy to slide. Figure 2 As shown, a negative pressure interface 12 is designed on the lower welding head 04. The negative pressure interface 12 is connected to the negative pressure pipeline 13. The negative pressure pipeline 13 is externally connected to a vacuum pump for exhausting air, forming a negative pressure between the negative pressure interface 12 and the lower surface of the film, which can assist in positioning the film and improve welding efficiency.

[0049] In the description of the present invention, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0050] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A microfluidic chip hot pressing device, characterized in that: include: A heating plate (01) is arranged at the uppermost end of the device; The lower heating module (05) is arranged at the lower end of the device, with a gap between it and the heating plate (01) so that they do not contact each other; A hot pressing head (02) is detachably connected to a side of the heating plate (01) close to the lower heating module (05); The lower welding head (04) is detachably connected to a side of the lower heating module (05) close to the heating plate (01).

2. A microfluidic chip hot pressing device according to claim 1, characterized in that: The hot pressing head (02) is provided with a plurality of through holes.

3. A microfluidic chip hot pressing device according to claim 2, characterized in that: The hot pressing head fixing screw (03) can pass through the through hole on the hot pressing head (02) to fix the hot pressing head (02) on the heating plate (01).

4. The microfluidic chip hot pressing device according to claim 1, characterized in that: The lower heating module (05) is provided with a groove, which can just accommodate the lower welding head (04), and at least one side of the groove is provided with a through hole.

5. The microfluidic chip hot pressing device according to claim 4, characterized in that: The lower welding head fixing screw (06) can pass through the through hole on the side of the groove to fix the lower welding head (04) on the lower heating module (05).

6. The microfluidic chip hot pressing device according to claim 2, characterized in that: A negative pressure interface (12) is provided on one side of the lower welding head (04), and the negative pressure interface (12) is connected to a negative pressure pipeline (13).

7. The microfluidic chip hot pressing device according to claim 1, characterized in that: The side of the heating plate (01) is provided with a plurality of heating rod holes (07) for inserting heating rods.

8. The microfluidic chip hot pressing device according to claim 1, characterized in that: The upper surface of the heating plate (01) is provided with a temperature sensor mounting hole (10) for mounting a temperature sensor.

9. The microfluidic chip hot pressing device according to claim 1, characterized in that: Heating plate fixing holes (11) are provided at the four corners of the heating plate (01) for fixing the heating plate (01).

10. The microfluidic chip hot pressing device according to claim 7, characterized in that: The heating plate (01) is in contact with the heating rod, and a gap between the two is filled with a heat-conducting material, wherein the heat-conducting material includes but is not limited to a heat-conducting pad and heat-conducting silicone grease.

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