Anti-interference film coating device for chip inductor magnetic core
By arranging a hollow frame and a top plate in the electroplating tank, the problem of limited cathode clamping quantity is solved, and efficient electroplating processing of the inductor core is achieved.
Patent Information
- Application Number
- CN202422112170.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-29
- Publication Date
- 2025-09-19
- Estimated Expiration
- 2034-08-29
AI Technical Summary
In the prior art, the number of inductor cores clamped by the cathode clamp is limited, resulting in low coating processing efficiency.
A coating device including an electroplating tank and a hollow frame is designed. Multiple inductor cores can be placed in the hollow frame. The fixing and electroplating of the multiple inductor cores are achieved through the cooperation of a lifting top plate and a cathode clamp.
The efficiency of electroplating processing is improved, and more inductor cores can be processed at one time.
Smart Images
Figure CN223357801U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of coating devices, in particular to a coating device for an anti-interference chip inductor core. Background Art
[0002] Interference-resistant chip inductor cores are specially designed inductors used to suppress and reduce electromagnetic interference in circuits. They offer excellent high-frequency interference resistance, filtering out high-frequency noise signals and providing stable power or signal output. Interference-resistant chip inductor cores typically consist of a magnetic material and windings. The magnetic material is typically made of high-permeability ferrite or nickel-zinc to enhance its magnetic properties, enabling it to effectively capture and absorb surrounding electromagnetic interference signals. The windings are further enhanced by adjusting the number of turns and wiring, as well as by adding appropriate shielding materials, to improve the inductor's ability to suppress interference signals.
[0003] Anti-interference chip inductor cores need to undergo coating treatment during processing. The current coating treatment operations include surface cleaning, pretreatment, selection of coating materials, coating process and post-processing, among which electroplating operations are used in the coating process.
[0004] The electroplating process currently used is mostly for workers to use cathode clamps to clamp the inductor cores and then send them to the electroplating tank for electroplating. However, the number of inductor cores clamped by the cathode clamps is limited, and the number of cores processed at one time is small, resulting in reduced efficiency of the electroplating process. Utility Model Content
[0005] The purpose of the present invention is to provide an anti-interference type film coating device for a chip inductor magnetic core, so as to solve the problems raised in the above background technology.
[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a coating device for an anti-interference chip inductor core, comprising a plating tank and a hollow frame, wherein a hollow frame is provided in the middle of the plating tank, a bottom frame is provided inside the hollow frame, shafts are rotatably installed at both ends of the bottom frame, a shaft sleeve is sleeved on the middle surface of the shaft, a top plate is fixed on the outer surface of the sleeve, an anode wire is connected to one side of the plating tank, one end of the anode wire is connected to an anode rod, and a cathode wire is connected to the other side of the plating tank, one end of the cathode wire is connected to a cathode clamp.
[0007] When using the anti-interference type chip inductor core coating device in the present technical solution, the staff needs to first connect the external power supply to the present invention, control the operation of the present invention through the control panel, and the staff transfers the electroplating liquid to the inside of the electroplating tank through the first pipe. After transferring an appropriate amount of electroplating liquid, the staff stops the delivery of the electroplating liquid. The staff places the inductor core to be electroplated inside the bottom frame inside the hollow frame, and after the bottom surface inside the bottom frame is covered, the staff holds the handle and applies force to rotate it. The rotational force applied to the handle will be synchronized to the shaft, and after the shaft rotates, the thread on its surface will engage with the shaft The inner surface of the sleeve is provided with a thread, and the engagement of the thread causes the sleeve to move on the surface of the shaft, and the moving sleeve will move with the top plate fixed on the outer surface, so that the top plate drops and is embedded in the bottom frame to press the inductor core placed inside it. After pressing, the staff clamps the cathode clamp on the hollow frame, and after clamping, the staff removes the hook rod from the hook, hooks one end of the hook rod on the hook ring, and places the hollow frame inside the electroplating tank. After placement, the staff can start the anode rod and cathode clamp through the control panel, and start electroplating the inductor core placed in the hollow frame after starting.
[0008] Preferably, a first pipe is connected to one side of the exterior of the electroplating tank, and a valve is connected to the other side of the exterior of the electroplating tank, one end of which is connected to a second pipe. The cooperation of the first and second pipes allows electroplating liquid to enter and exit the interior of the electroplating tank, achieving the effect of providing an inlet and an outlet, and the installation of the valve allows the second pipe to stop and release flow.
[0009] Preferably, a control panel is provided on the outer front surface of the electroplating tank. The provision of the control panel enables the staff to conveniently control the operation of the utility model.
[0010] Preferably, the outer rear surface of the electroplating tank is provided with a hook, and a hook rod is hung inside the hook. The setting of the hook enables the hook rod to be hung inside it, providing a placement position for the hook rod.
[0011] Preferably, a turning handle is fixed to the top surface of the shaft, and the middle surface of the shaft and the inner surface of the sleeve are both provided with threads that mesh with each other. The provision of the turning handle facilitates the application of rotational force to the shaft by the operator, providing a point of force application. Through the cooperation between the sleeve and the shaft, since both the inner and middle surfaces are provided with threads, when the shaft rotates, the threads provided on the middle surface will mesh with the threads on the inner surface of the sleeve. The engagement of the threads causes the sleeve to move on the surface of the shaft, achieving the effect of indirectly controlling the position of the top plate through the thread engagement.
[0012] Preferably, a hook ring is provided on the top surface of the top plate. Through the cooperation of the hook rod and the hook ring, the staff can conveniently control the position of the hollow frame, so as to achieve the effect of hooking the hollow frame to allow it to enter and exit the electroplating tank.
[0013] Compared with the prior art, the beneficial effects of the present invention are:
[0014] 1. The utility model provides an engraved frame in the electroplating tank, in which a plurality of inductor cores can be placed. The top plate is then lowered to limit and fix the inductor cores placed in the bottom frame. The inductor cores are then clamped by the cathode clamp and sent to the electroplating tank for electroplating. A large number of inductor cores can be electroplated at one time, thereby improving the efficiency of the electroplating process. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 This is a schematic diagram of the main appearance structure of the utility model;
[0016] Figure 2 This is a schematic diagram of the main internal structure of the utility model;
[0017] Figure 3 This is a schematic diagram of the rear view structure of the utility model;
[0018] Figure 4 This is a schematic diagram of the appearance structure of the hollow frame of the present utility model.
[0019] In the figure: 1. Electroplating tank; 2. Control panel; 3. Valve; 4. Second pipeline; 5. Cathode wire; 6. Frame; 61. Bottom frame; 62. Shaft; 63. Bushing; 64. Hook; 65. Turning handle; 66. Top plate; 7. Anode wire; 8. First pipeline; 9. Anode rod; 10. Cathode clamp; 11. Hook; 12. Hook rod. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0021] Example 1
[0022] like Figure 1 、 Figure 2 、 Figure 3 and Figure 4As shown, the present invention proposes an anti-interference type chip inductor core coating device, including a plating tank 1 and a hollow frame 6, a hollow frame 6 is provided in the middle of the plating tank 1, a bottom frame 61 is provided inside the hollow frame 6, a shaft rod 62 is rotatably installed at both ends of the bottom frame 61, a shaft sleeve 63 is sleeved on the middle surface of the shaft rod 62, a top plate 66 is fixed on the outer surface of the shaft sleeve 63, an anode wire 7 is connected to one side of the plating tank 1, one end of the anode wire 7 is connected to the anode rod 9, and a cathode wire 5 is connected to the other side of the plating tank 1, and one end of the cathode wire 5 is connected to the cathode clamp 10.
[0023] The staff needs to first connect the external power supply of the utility model and control the operation of the utility model through the control panel 2. The staff transfers the electroplating liquid to the inside of the electroplating tank 1 through the first pipe 8. After the appropriate amount of electroplating liquid is transferred, the staff stops the delivery of the electroplating liquid. The staff places the inductor core to be electroplated inside the bottom frame 61 inside the hollow frame 6. After the bottom surface of the bottom frame 61 is covered, the staff holds the handle 65 and applies force to rotate it. The rotational force applied to the handle 65 will be synchronized to the shaft 62. After the shaft 62 rotates, the thread on its surface will engage with the thread on the inner surface of the sleeve 63. The thread engages with the sleeve 6 3 will move on the surface of the shaft 62, and the moving sleeve 63 will move with the top plate 66 fixed on the outer surface, so that the top plate 66 descends and is embedded in the bottom frame 61 to press the inductor core placed therein. After pressing, the staff will clamp the cathode clamp 10 on the hollow frame 6. After clamping, the staff will remove the hook rod 12 from the hook 11, hook one end of the hook rod 12 on the hook ring 64, and place the hollow frame 6 inside the electroplating tank 1. After placement, the staff can start the anode rod 9 and the cathode clamp 10 through the control panel 2, and start the electroplating process on the inductor core placed in the hollow frame 6 after starting.
[0024] Example 2
[0025] like Figure 1 、 Figure 2 、 Figure 3 and Figure 4 As shown, the present invention proposes an anti-interference type chip inductor core coating device. Compared with the first embodiment, this embodiment also includes: a first pipe 8 is connected to the external side of the electroplating tank 1, a valve 3 is connected to the other external side of the electroplating tank 1, and one end of the valve 3 is connected to the second pipe 4. The external front surface of the electroplating tank 1 is provided with a control panel 2, the external rear surface of the electroplating tank 1 is provided with a hook 11, and a hook rod 12 is hung inside the hook 11. A turning handle 65 is fixed to the top surface of the shaft rod 62, and the middle surface of the shaft rod 62 and the inner surface of the sleeve 63 are provided with threads, which are engaged with each other, and the top surface of the top plate 66 is provided with a hook ring 64.
[0026] In this embodiment, Figure 1 、 Figure 2 and Figure 3 As shown, through the cooperation of the first pipe 8 and the second pipe 4, the electroplating liquid can enter and exit the interior of the electroplating tank 1, achieving the effect of providing an inlet and an outlet, and the installation of the valve 3 enables the second pipe 4 to stop and release the flow;
[0027] like Figure 1 As shown, the setting of the control panel 2 enables the staff to conveniently control the operation of the utility model;
[0028] like Figure 3 As shown, the hook 11 is arranged so that the hook rod 12 can be hung therein, providing a placement position for the hook rod 12;
[0029] like Figure 4 As shown, the setting of the turning handle 65 makes it convenient for the staff to apply a rotating force to the shaft 62, and provides a force application point. Through the cooperation between the sleeve 63 and the shaft 62, since both the inner surface and the middle surface thereof are provided with threads, when the shaft 62 rotates, the threads provided on the middle surface thereof will engage with the threads on the inner surface of the sleeve 63. The engagement of the threads causes the sleeve 63 to move on the surface of the shaft 62, thereby achieving the effect of indirectly controlling the position of the top plate 66 by the thread engagement.
[0030] like Figure 3 and Figure 4 As shown, through the cooperation of the hook rod 12 and the hook ring 64, the staff can conveniently control the position of the hollow frame 6, thereby achieving the effect of hooking the hollow frame 6 to allow it to enter and exit the electroplating tank 1.
[0031] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A coating device for an anti-interference chip inductor core, comprising a plating tank (1) and a hollow frame (6), characterized in that: A hollow frame (6) is provided in the middle of the electroplating tank (1), a bottom frame (61) is provided inside the hollow frame (6), shafts (62) are rotatably mounted on both ends of the bottom frame (61), a shaft sleeve (63) is sleeved on the middle surface of the shaft sleeve (63), a top plate (66) is fixed on the outer surface of the shaft sleeve (63), an anode wire (7) is connected to one side of the electroplating tank (1), one end of the anode wire (7) is connected to an anode rod (9), and a cathode wire (5) is connected to the other side of the electroplating tank (1), one end of the cathode wire (5) is connected to a cathode clamp (10).
2. The anti-interference type chip inductor core coating device according to claim 1, characterized in that: One side of the exterior of the electroplating tank (1) is connected to a first pipe (8), the other side of the exterior of the electroplating tank (1) is connected to a valve (3), and one end of the valve (3) is connected to a second pipe (4).
3. The anti-interference type chip inductor core coating device according to claim 1, characterized in that: The external front surface of the electroplating tank (1) is provided with a control panel (2).
4. The anti-interference type chip inductor core coating device according to claim 1, characterized in that: The outer rear surface of the electroplating tank (1) is provided with a hook (11), and a hook rod (12) is hung inside the hook (11).
5. The anti-interference type chip inductor core coating device according to claim 1, characterized in that: A turning handle (65) is fixed to the top surface of the shaft rod (62), and the middle surface of the shaft rod (62) and the inner surface of the shaft sleeve (63) are both provided with threads and mesh with each other.
6. The anti-interference type chip inductor core coating device according to claim 1, characterized in that: The top surface of the top plate (66) is provided with a hook and loop (64).