FPC flexible circuit board coating electroplating device

Abstract

The utility model relates to the technical field of FPC (Flexible Printed Circuit) processing, in particular to an FPC coating electroplating device which comprises a bottom plate, an electroplating bath, an auxiliary assembly, a feeding winding drum, a limiting assembly, an anode, a cathode rolling wheel, a sleeve body and a receiving winding drum, the electroplating bath is arranged above the bottom plate and is connected with the auxiliary assembly; the auxiliary assembly comprises a moving part, the moving part is connected with a limiting plate a, the limiting plate a is connected with a block, and the block is connected with a limiting plate b; the limiting assemblies are connected to the outer sides of two ends of the electroplating bath; the limiting assembly comprises an upper roller, the upper roller is connected with a lower roller, two ends of the lower roller are connected with mounting rods a, the mounting rods a are connected with a plate body, the plate body is connected with a connecting plate, and the connecting plate is connected with an electric telescopic column. The auxiliary component is arranged on the electroplating device, and the limiting plate a and the limiting plate b are adjusted according to the width of the FPC to be produced and processed, so that the uniformity of electroplating liquid on the surface of the FPC is improved, and the practicability of the electroplating device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of FPC flexible circuit board processing, in particular to an FPC flexible circuit board coating electroplating device. Background Art

[0002] The electroplating process essentially involves immersing the object to be plated in a solution containing the desired components, which serves as the cathode. A metal plate serves as the anode. Electroplating anodes can be categorized as either soluble or insoluble. After connecting to a DC power source, the desired coating is deposited on the object. In the manufacturing process of flexible printed circuits, copper or tin is typically plated onto the flexible printed circuit board.

[0003] Chinese patent publication number CN213327877U discloses intelligent electroplating equipment for producing flexible printed circuit boards (FPCs). The equipment comprises a first upright plate, a second upright plate, and an electroplating tank. The first and second upright plates are located on the left and right sides of the electroplating tank, respectively. A first rotating shaft is installed through the front of the first upright plate. In this intelligent electroplating equipment for producing flexible printed circuit boards (FPCs), a portion of the flexible printed circuit board is located within a spray tube. The vertical distances from the left, right, and bottom sides of the spray tube's inner cavity to the outer surface of the flexible printed circuit board are all the same. By activating a drive pump connected to the spray tube, gas is generated and ejected from the various spray holes in the spray tube, giving the plating solution motion. The plating solution is evenly sprayed onto the surface of the flexible printed circuit board, effectively preventing accumulation of plating solution on the surface of the flexible printed circuit board, which could result in uneven thickness. This ensures more uniform electroplating and conserves plating materials.

[0004] Existing electroplating equipment uses rollers, reels and other components at both ends to transport the FPC flexible circuit boards to be produced and processed, but it does not have the function of limiting the sides of the FPC flexible circuit boards during transportation, resulting in displacement of the FPC flexible circuit boards, causing uneven spraying of the electroplating liquid on the surface of the FPC flexible circuit boards, and reducing practicality. Utility Model Content

[0005] In view of the problems existing in the background technology, an FPC flexible circuit board coating electroplating device is proposed.

[0006] The utility model provides an FPC flexible circuit board coating electroplating device, comprising: a base plate, an electroplating tank, an auxiliary component, a feeding reel, a limit component, an anode and a cathode rolling wheel, a sleeve and a receiving reel;

[0007] An electroplating tank is installed above the bottom plate, and the electroplating tank is connected to the auxiliary components; the auxiliary components include a moving part, the moving part is connected to the limit plate a, the limit plate a is connected to the block, the block is connected to the limit plate b, the limit plate b is connected to the guide frame, and the guide frame is connected to the guide rail;

[0008] And the limit assembly is connected to the outside of both ends of the electroplating tank; the limit assembly includes an upper roller, the upper roller is connected to the lower roller, both ends of the lower roller are connected to the mounting rod a, the mounting rod a is connected to the plate body, the plate body is connected to the connecting plate, and the connecting plate is connected to the electric telescopic column; the plate body is connected to the guide block, the guide block is connected to the guide groove, and the guide groove is set on the mounting plate.

[0009] Preferably, both ends of the upper roller are connected to mounting rods b, which are connected to the outer walls of both sides of the electroplating tank; the mounting plates are connected to both sides of the electroplating tank; and the electric telescopic columns are installed on the bottom plate.

[0010] Preferably, the electroplating tank is provided with a feed port, a discharge port and a through hole;

[0011] The feed port and the discharge port are used for the FPC flexible circuit board to enter and exit the electroplating tank; the through hole is connected to the feed port and the discharge port and is used for the connection of moving parts.

[0012] Preferably, the movable part includes a support rod movably connected to the electroplating tank, one end of the support rod is connected to a connecting rod, the connecting rod is provided with an adjustment hole, the adjustment hole is connected to the insertion rod, and is used to connect the connecting rod to the electroplating tank; the lower end of the insertion rod is movably connected to the bottom bracket, and the bottom bracket is installed on the electroplating tank.

[0013] Preferably, the other end of the support rod is connected to the limiting plate a, and the limiting plate a is connected to the feed port and the discharge port through the through hole of the support rod.

[0014] Preferably, one end of the bottom plate is connected to the feeding reel, and the feeding reel is opposite to the feeding port; the other end of the bottom plate is connected to the receiving reel, and the receiving reel is opposite to the discharging port.

[0015] Preferably, the inside of the electroplating tank is connected to anode and cathode rolling wheels, and there are two anodes and four cathode rolling wheels, two of which form a group; the two anodes are connected to both sides of the two groups of cathode rolling wheels.

[0016] Preferably, the inner wall of the electroplating tank is connected to the sleeve, the inside of the sleeve is connected to the tube body, the tube body is connected to the mounting tube, the mounting tube is connected to the injection tube, and the injection tube is provided with an injection hole.

[0017] Compared with the prior art, the present invention has the following beneficial technical effects:

[0018] The utility model is arranged on the electroplating device through an auxiliary component, and the limit plate a and the limit plate b are adjusted according to the width of the FPC flexible circuit board to be produced and processed, and are adjusted to limit the two sides of the FPC flexible circuit board, so as to avoid the FPC flexible circuit board from offsetting when moving in the channel, improve the uniformity of the electroplating liquid on the surface of the FPC flexible circuit board, and improve the practicality of the electroplating device; then the spacing between the upper and lower limit rollers is adjusted, which is convenient for adjustment according to the thickness of the FPC flexible circuit board to be produced and processed, increases the entry and exit limit of the FPC flexible circuit board, and increases the use function of the electroplating device; by arranging the guide frame and the guide rail, the guide block and the guide groove, it is convenient to increase the adjustment smoothness, improve the coordinated use of the components of the FPC flexible circuit board coating electroplating device, and conveniently improve the processing efficiency of the FPC flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the auxiliary component structure in the utility model;

[0021] Figure 3 This is a schematic diagram of the structure of the limit assembly in the utility model.

[0022] Figure markings: 1. Base plate; 2. Electroplating tank; 3. Auxiliary component; 301. Support rod; 302. Connecting rod; 303. Insert rod; 304. Bottom bracket; 305. Limit plate a; 306. Block; 307. Limit plate b; 308. Guide frame; 309. Guide rail; 4. Feed reel; 5. Limit assembly; 501. Upper roller; 502. Lower roller; 503. Mounting rod a; 504. Plate; 505. Connecting plate; 506. Electric telescopic column; 507. Mounting plate; 6. Anode; 7. Cathode roller; 8. Sleeve; 801. Mounting tube; 802. Injection tube; 9. Rewinding reel. DETAILED DESCRIPTION

[0023] The following describes the specific embodiments of the present disclosure in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present disclosure and are not intended to limit the present disclosure.

[0024] Example 1

[0025] like Figure 1 - Figure 3As shown, the utility model proposes an FPC flexible circuit board coating electroplating device, including: a base plate 1, a plating tank 2, an auxiliary component 3, a feeding reel 4, a limiting component 5, an anode 6, a cathode rolling wheel 7, a sleeve 8 and a receiving reel 9; the plating tank 2 is installed above the base plate 1, and the plating tank 2 is connected to the auxiliary component 3; the auxiliary component 3 includes a moving part, the moving part is connected to the limiting plate a305, the limiting plate a305 is connected to the block 306, the block 306 is connected to the limiting plate b307, the limiting plate b307 is connected to the guide frame 308, and the guide frame 308 is connected to the guide rail 309; the limiting component 5 is connected to the outside of both ends of the plating tank 2. Two auxiliary components 3 are set for use together, and the distance between the two limit plates a305 constitutes channel a, and the distance between the limit plates b307 constitutes channel b. Channel a and channel b are adjusted according to the width of the FPC flexible circuit board to be electroplated, so as to limit the conveying and movement of the FPC flexible circuit board and avoid displacement of the FPC flexible circuit board. The limit plate b307 is connected to the limit plate a305 through the block 306. The block 306 is installed with bolts, which is convenient for installation according to usage requirements, simple operation, and easy to use; the limit plate a305 and the limit plate b307 are connected, which is convenient for the overall adjustment of the applicable spacing of channel a and channel b, thereby improving operational efficiency; when the limit plate b307 adjusts the spacing, the guide frame 308 moves synchronously along the guide rail 309, which conveniently increases the adjustment stability and improves the practicality of the FPC flexible circuit board coating electroplating device.

[0026] Further explanation, the limit assembly 5 includes an upper roller 501, the upper roller 501 is connected to the lower roller 502, both ends of the lower roller 502 are connected to the mounting rod a503, the mounting rod a503 is connected to the plate body 504, the plate body 504 is connected to the connecting plate 505, the connecting plate 505 is connected to the electric telescopic column 506; the plate body 504 is connected to the guide block, the guide block is connected to the guide groove, and the guide groove is set on the mounting plate 507; both ends of the upper roller 501 are connected to the mounting rod b, the mounting rod b is connected to the outer walls on both sides of the electroplating tank 2; the mounting plate 507 is connected to both sides of the electroplating tank 2; the electric telescopic column 506 is installed on the base plate 1. The upper and lower spacings between the upper roller 501 and the lower roller 502 form a channel c, with limit assemblies 5 at both ends, which facilitate the FPC flexible circuit board to enter and exit the electroplating tank 2; when the channel c is adjusted and the spacing is used, the plate body 504 moves and synchronously drives the guide block, which is arranged along the guide groove to facilitate increasing the stability of the upper and lower adjustment of the lower roller 502, improving the coordination of the components of the limit assembly 5, and conveniently improving the use of the FPC flexible circuit board coating electroplating device.

[0027] Further explanation: the movable part includes a support rod 301 movably connected to the electroplating tank 2. One end of the support rod 301 is connected to a connecting rod 302. The connecting rod 302 is provided with an adjustment hole. The adjustment hole is connected to an insert rod 303 for connecting the connecting rod 302 to the electroplating tank 2. The lower end of the insert rod 303 is movably connected to a bottom bracket 304, and the bottom bracket 304 is installed on the electroplating tank 2. The other end of the support rod 301 is connected to a limit plate a305, and the limit plate a305 is connected to the feed port and the discharge port through the through hole of the support rod 301. A plurality of adjustment holes are provided on the connecting rod 302, so that after the spacing of channel a is adjusted, the insert rod 303 cooperates to fix it on the opening, which is convenient for limiting the two sides of the FPC flexible circuit board during transportation, so as to limit the range of the FPC flexible circuit board transportation and moving channel, and conveniently improve the efficiency of the FPC flexible circuit board coating and electroplating processing.

[0028] Further explanation: plating tank 2 is equipped with an inlet, an outlet, and a through-hole. The inlet and outlet are used for flexible printed circuit boards (FPCs) to enter and exit the plating tank 2. The through-hole is connected to the inlet and outlet, and is used to connect movable parts. Upper roller 501 is aligned with the upper end faces of the inlet and outlet, allowing lower roller 502 to adjust its height so that the applicable range of channel c is aligned with the inlet and outlet. Support rod 301 and connecting rod 302 are movable through the through-hole to adjust the limit plate a305, achieving the applicable range of channel a, facilitating the coordinated use of the components of the FPC coating and electroplating device.

[0029] Example 2

[0030] like Figure 1 As shown, the present invention proposes an FPC flexible circuit board coating electroplating device. Based on the above embodiment, this embodiment also records in detail the specific components such as the electroplating tank 2, the feeding reel 4 and the receiving reel 9, as well as the matching method.

[0031] To further illustrate, one end of the base plate 1 is connected to the feed reel 4, which is opposite the feed port; the other end of the base plate 1 is connected to the take-up reel 9, which is opposite the discharge port. The feed reel 4 and the take-up reel 9 are mounted on the base plate 1 via a vertical plate. Both vertical plates have rotating shafts extending therethrough, each supporting the feed reel 4 and the take-up reel 9 and the drive motor. By activating the drive motor, the FPC flexible circuit board is placed in a tensioned state, achieving the purpose of unwinding and rewinding the FPC flexible circuit board. Two take-up rollers are provided between the take-up reel 9 and the discharge port of the electroplating tank 2, and are used in conjunction with the take-up reel 9 to rewind the FPC flexible circuit board.

[0032] To further illustrate, the plating tank 2 is internally connected to anodes 6 and cathode rollers 7. Two anodes 6 are provided, and four cathode rollers 7 are provided, forming a pair. Two anodes 6 are connected to either side of two sets of cathode rollers 7. Both sets of cathode rollers 7 are positioned one above the other within the plating tank 2. The FPC passes over the upper cathode rollers 7 and the lower cathode rollers 7. The two sets work together to form a U-shaped transport path for the FPC, facilitating plating of the FPC from both sides and the bottom, improving the uniformity of the plating.

[0033] Further explanation: the inner wall of the electroplating tank 2 is connected to the sleeve 8, which is internally connected to the tube body. The tube body is connected to the mounting tube 801, which is connected to the spray tube 802. The spray tube 802 is provided with a spray hole. One end of the tube body is connected to a drive pump. When the device is in operation, the electroplating tank 2 is filled with plating liquid, and the drive pump is activated to generate gas, causing the plating liquid to be sprayed out of the spray hole through the mounting tube 801 and the spray tube 802. The plating liquid is evenly sprayed onto the surface of the FPC flexible circuit board, thereby achieving electroplating of the FPC flexible circuit board coating. The sleeve 8, the tube body, the mounting tube 801, and the spray tube 802 are connected to the electroplating coating structure. Four electroplating coating structures are provided, and all four electroplating coating structures are used in conjunction with each other. All four tube bodies are connected to the drive pump. When the FPC flexible circuit board is transported and moved, the channel can be adjusted to fit any group of electroplating coating structures, so that the plating liquid is sprayed onto the surface of the FPC flexible circuit board, improving the use of the FPC flexible circuit board coating electroplating device.

[0034] The working principle of the present invention is as follows: by operating the support rod 301 and the connecting rod 302 through the through hole, the connecting rod 302 is connected to the outside of the electroplating tank 2, and one end of the support rod 301 drives the limit plate a305, and the limit plate a305 is adjusted to adjust the spacing of the channel a. After the adjustment, the insertion rod 303 is inserted into the adjustment hole, and the insertion rod 303 is connected to the outside of the electroplating tank 2, so that it can use the fixed spacing limit for the channel a from the outside. During the adjustment of channel a, the limit plate a305 drives the block 306, and the block 306 drives the limit plate b307, so that the spacing between channel b and channel a is the same, and then channel b and channel a are adjusted according to the spacing of the FPC flexible circuit board to be produced and processed; start the electric telescopic column 506, and the electric telescopic column 506 is electrically extended. The driving end of the shrinking column 506 moves the connecting plate 505, and the connecting plate 505 drives the plate body 504, and the plate body 504 drives the mounting rod a503, and the mounting rod a503 drives the lower roller 502, and the lower roller 502 is adjusted up and down to adjust the appropriate spacing of channel c, which is convenient for adjustment according to the thickness of the FPC flexible circuit board to be produced and processed; after the channels a, b and c are adjusted according to the width and thickness of the FPC flexible circuit board, the feeding reel 4 unloads the material and the receiving reel 9 receives the material. During the unloading and receiving process, the FPC flexible circuit board passes through the two sets of cathode rolling wheels 7 along the channels a, b and c, and the electroplating liquid is sprayed onto the surface of the FPC flexible circuit board to achieve the coating electroplating processing of the FPC flexible circuit board.

[0035] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited thereto. Various changes can be made within the knowledge scope of those skilled in the art without departing from the purpose of the present invention.

Claims

1. An FPC flexible circuit board coating electroplating device, characterized in that: include: Bottom plate (1); An electroplating tank (2) is installed above the bottom plate (1), and the electroplating tank (2) is connected to an auxiliary component (3); the auxiliary component (3) includes a moving part, the moving part is connected to a limit plate a (305), the limit plate a (305) is connected to a block (306), the block (306) is connected to a limit plate b (307), the limit plate b (307) is connected to a guide frame (308), and the guide frame (308) is connected to a guide rail (309); And a limiting assembly (5) connected to the outer sides of both ends of the electroplating tank (2); the limiting assembly (5) includes an upper roller (501), the upper roller (501) is connected to a lower roller (502), both ends of the lower roller (502) are connected to a mounting rod a (503), the mounting rod a (503) is connected to a plate body (504), the plate body (504) is connected to a connecting plate (505), and the connecting plate (505) is connected to an electric telescopic column (506); the plate body (504) is connected to a guide block, the guide block is connected to a guide groove, and the guide groove is provided on a mounting plate (507).

2. The FPC flexible circuit board coating electroplating device according to claim 1, characterized in that: The two ends of the upper roller (501) are connected to mounting rods b, which are connected to the outer walls of the electroplating tank (2). The mounting plate (507) is connected to the two sides of the electroplating tank (2). The electric telescopic column (506) is installed on the bottom plate (1).

3. The FPC flexible circuit board coating electroplating device according to claim 2, characterized in that: The electroplating tank (2) is provided with a feed port, a discharge port and a through hole; The feed port and the discharge port are used for the FPC flexible circuit board to enter and exit the electroplating tank (2); the through hole is connected to the feed port and the discharge port and is used for connecting the moving parts.

4. The FPC flexible circuit board coating electroplating device according to claim 3, characterized in that: The movable part comprises a support rod (301) movably connected to the electroplating tank (2); one end of the support rod (301) is connected to a connecting rod (302); the connecting rod (302) is provided with an adjustment hole, and the adjustment hole is connected to an insertion rod (303) for connecting the connecting rod (302) to the electroplating tank (2); the lower end of the insertion rod (303) is movably connected to a bottom bracket (304), and the bottom bracket (304) is installed on the electroplating tank (2).

5. The FPC flexible circuit board coating electroplating device according to claim 4, characterized in that: The other end of the support rod (301) is connected to the limiting plate a (305), and the limiting plate a (305) is connected to the feed port and the discharge port through the through hole of the support rod (301).

6. The FPC flexible circuit board coating electroplating device according to claim 1, characterized in that: One end of the bottom plate (1) is connected to the feeding reel (4), and the feeding reel (4) is opposite to the feeding port; the other end of the bottom plate (1) is connected to the receiving reel (9), and the receiving reel (9) is opposite to the discharging port.

7. The FPC flexible circuit board coating electroplating device according to claim 1, characterized in that: The electroplating tank (2) is internally connected to an anode (6) and a cathode rolling wheel (7), and two anodes (6) are provided, and four cathode rolling wheels (7) are provided, two by two forming a group; the two anodes (6) are connected to both sides of the two groups of cathode rolling wheels (7).

8. The FPC flexible circuit board coating electroplating device according to claim 1, characterized in that: The inner wall of the electroplating tank (2) is connected to the sleeve (8), the interior of the sleeve (8) is connected to the pipe body, the pipe body is connected to the mounting pipe (801), the mounting pipe (801) is connected to the injection pipe (802), and the injection pipe (802) is provided with an injection hole.

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