Reflow soldering temperature detection test device

Abstract

The utility model relates to the technical field of substrate reflow detection, in particular to a reflow soldering temperature detection test device, which can conveniently present the temperature condition in a reflow soldering machine, and comprises a base, a substrate and a thermocouple wire with one end connected with a temperature display, transverse guide rails are arranged at the upper end and the lower end of the positioning mechanism respectively, a movable support is installed on the transverse guide rails in a sliding mode, a longitudinal guide rod is installed on the movable support, a sliding block is installed on the longitudinal guide rod in a sliding mode, and a glue dispensing gun is installed on the sliding block. And the dispensing gun is used for adhering the other end of the thermocouple wire to the circuit board on the substrate.

Description

Technical Field

[0001] The utility model relates to the technical field of substrate reflow detection, in particular to a reflow soldering temperature detection test device. Background Art

[0002] Reflow soldering technology is widely used in the field of electronic manufacturing. Inside the reflow soldering machine, the temperature will change, generally ranging from temperature one to temperature zone six. During the reflow soldering process, the temperature changes in each temperature zone will directly affect the quality of the product. Currently, the common operation is to use temperature sensors to monitor the internal temperature of the reflow soldering machine, but it is impossible to intuitively monitor the surface temperature of the product. Summary of the Invention

[0003] In order to solve the above technical problems, the utility model provides a reflow soldering temperature detection test device, which can conveniently present the temperature conditions inside the reflow soldering machine.

[0004] The technical solution is as follows: a reflow soldering temperature detection test device, characterized in that it includes a base, a substrate and a thermocouple wire with one end connected to a temperature display, the base is provided with a positioning mechanism for positioning and fixing the substrate, the upper and lower ends of the positioning mechanism are respectively provided with transverse guide rails, a movable bracket is slidably mounted on the transverse guide rail, a longitudinal guide rod is mounted on the movable bracket, a slider is slidably mounted on the longitudinal guide rod, a dispensing gun is mounted on the slider, and the dispensing gun is used to bond the other end of the thermocouple wire to the circuit board on the substrate.

[0005] It is further characterized in that the positioning mechanism includes a transverse cylinder installed on the left and right sides of the base, and a pressure block is installed on the piston rod of the transverse cylinder;

[0006] An L-shaped positioning plate is also provided on the base.

[0007] After adopting the utility model, the substrate with the circuit board installed is fixed, the movable bracket is moved to the required position, and then the slider is moved to allow the glue gun to be located above the selected sample, and then the other end of the thermocouple wire is moved to the sample, and the glue gun is used to bond and fix the thermocouple wire to the sample. When the substrate is placed in the reflow soldering equipment, the thermocouple wire can display the temperature on the sample in real time on the temperature display, which can conveniently present the temperature conditions inside the reflow soldering machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 This is a top view of the base of the utility model;

[0009] Figure 2 This is a top view of the mobile bracket;

[0010] Figure 3 Schematic diagram of the thermocouple wire bonding and fixing state. DETAILED DESCRIPTION

[0011] See Figure 1 , Figure 2 , Figure 3 As shown, a reflow soldering temperature detection test device includes a base 1, a substrate 2 and a thermocouple wire 4 with one end connected to a temperature display 3. The base 1 is provided with a positioning mechanism for positioning and fixing the substrate, the positioning mechanism includes a transverse cylinder 5 installed on the left and right sides of the base 1, a pressure block 6 is installed on the piston rod of the transverse cylinder 5, and transverse guide rails 7 are respectively provided at the upper and lower ends of the positioning mechanism. A movable bracket 8 is slidably installed on the transverse guide rail 7, a longitudinal guide rod 9 is installed on the movable bracket 8, a slider 10 is slidably installed on the longitudinal guide rod 9, and a glue gun 11 is installed on the slider 10. The glue gun 11 is used to bond the other end of the thermocouple wire 4 to the circuit board 13 on the substrate 2.

[0012] In order to better position the substrate 2, the base 1 is further provided with an L-shaped positioning plate 14, which allows the substrate 2 to abut against the L-shaped positioning plate 14 for precise positioning. If needed, a wire buckle 12 can be added to the substrate 2 to clamp and fix the thermocouple wire 4.

[0013] During actual operation, first place multiple circuit boards 13 on the substrate 12 and arrange them evenly. After one corner of the substrate 12 is against the L-shaped positioning plate 14, the horizontal cylinder 5 drives the pressure block 6 to press the substrate 12 from both sides, and move the movable bracket 8 horizontally to the required position. Then move the slider 10 longitudinally to the top of the selected circuit board sample, take out one end of the thermocouple wire 4 and bring it close to the circuit board sample, use the glue gun 11 to stick the thermocouple wire 4 on the circuit board sample, remove the substrate and put it into the reflow soldering device, the thermocouple wire 4 will feed back the temperature on the circuit board sample to the temperature display 3 and display it, which can facilitate real-time understanding of the internal temperature of the reflow soldering device, and can draw a temperature curve, which can be intuitively compared with the standard curve, and adjust the settings of each temperature zone of the reflow soldering device to meet the standard curve.

Claims

1. A reflow soldering temperature detection test device, characterized in that: It includes a base, a substrate and a thermocouple wire with one end connected to a temperature display. The base is provided with a positioning mechanism for positioning and fixing the substrate. The upper and lower ends of the positioning mechanism are respectively provided with transverse guide rails. A movable bracket is slidably mounted on the transverse guide rail. A longitudinal guide rod is mounted on the movable bracket. A slider is slidably mounted on the longitudinal guide rod. A glue gun is mounted on the slider. The glue gun is used to bond the other end of the thermocouple wire to the circuit board on the substrate.

2. A reflow soldering temperature detection test device according to claim 1, characterized in that: The positioning mechanism comprises a transverse cylinder installed on the left and right sides of the base, and a pressure block is installed on the piston rod of the transverse cylinder.

3. A reflow soldering temperature detection test device according to claim 1, characterized in that: An L-shaped positioning plate is also provided on the base.

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