Interface device and photoelectric chip device

Abstract

The utility model relates to the technical field of semiconductors, in particular to an interface device and a photoelectric chip device, the photoelectric chip device comprises a circuit board and the interface device, and the interface device comprises an optical chip waveguide, an optical connector and an optical fiber array joint; the optical chip waveguide is packaged on the circuit board, and the optical chip waveguide is provided with one of a sliding groove and a sliding block; the optical connector is provided with the other one of the sliding groove and the sliding block, the end part of the sliding groove is provided with an opening, and the sliding block can be inserted into the sliding groove from the opening and slides along the sliding groove, so that the optical connector and the optical chip waveguide are aligned and assembled; the optical fiber array joint is provided with an optical fiber array, and the optical fiber array joint is connected with the optical connector. According to the interface device, accurate alignment between the optical fiber array and the optical chip waveguide can be realized through accurate alignment between the optical fiber array joint and the optical chip waveguide, and the optical fiber array can be conveniently replaced through the optical fiber array joint.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to an interface device and a photoelectric chip device. Background Art

[0002] Co-Packaged Optics (CPO) is a commonly used semiconductor packaging technology. The main advantages of this technology are small size, low power consumption, and high optical signal density.

[0003] The integrated packaging of optoelectronic chips requires coupling and docking an optical fiber array (FA) with the optical chip; however, the integrated packaging of optoelectronic chips provided by related technologies makes it difficult to achieve precise alignment of the optical fiber and the optical chip. Utility Model Content

[0004] The purpose of the present utility model includes providing an interface device and an optoelectronic chip device. The interface device is used for the optoelectronic chip device, which can achieve accurate alignment between the optical fiber array and the optical chip waveguide through accurate alignment of the optical fiber array connector and the optical chip waveguide, and can also conveniently replace the optical fiber array through the optical fiber array connector.

[0005] The embodiment of the present utility model can be implemented as follows:

[0006] In a first aspect, the present invention provides an interface device for a circuit board, comprising:

[0007] An optical chip waveguide, the optical chip waveguide can be packaged on a circuit board, and the optical chip waveguide is provided with one of a slide groove and a slider;

[0008] an optical connector, wherein the optical connector is provided with the other of a slide groove and a slider, the end of the slide groove is provided with an opening, and the slider can be inserted into the slide groove from the opening and slide along the slide groove to align and assemble the optical connector and the optical chip waveguide; and

[0009] The optical fiber array connector is provided with an optical fiber array and is connected to an optical connector.

[0010] In an optional embodiment, the optical fiber array connector is provided with an optical fiber array, and the optical fiber array connector is plugged into and matched with the optical connector; and / or,

[0011] The optical fiber array connector is provided with one of a positioning boss and a positioning groove; the optical connector is provided with the other of the positioning boss and the positioning groove; the positioning boss and the positioning groove are detachably plugged in and matched.

[0012] In an optional embodiment, the direction in which the positioning boss slides out of the positioning groove and the direction in which the slider is plugged into the sliding groove form an angle.

[0013] In an optional embodiment, the optical fiber array connector is provided with a first positioning hole, the optical connector is provided with a second positioning hole, and the interface device further comprises a positioning pin, which is plugged into the first positioning hole and the second positioning hole; or,

[0014] One of the optical fiber array connector and the optical connector is provided with a pin shaft hole, and the other of the optical fiber array connector and the optical connector is connected with a positioning pin, which is plugged into the pin shaft hole.

[0015] In an optional embodiment, the optical connector is provided with one of the assembly groove and the assembly boss, and a support surface; the optical fiber array connector is provided with the other of the assembly groove and the assembly boss, and a lap surface; the assembly boss is plugged into the assembly groove, and the lap surface overlaps the support surface.

[0016] In an optional embodiment, the first positioning hole is provided on the overlapping surface, and the second positioning hole is provided on the supporting surface.

[0017] In an optional embodiment, the assembly groove has a first notch and a second notch, and the orientations of the first notch and the second notch are distributed at an angle; the assembly boss can be assembled in the assembly groove through either the first notch or the second notch.

[0018] In an optional embodiment, the groove wall of the assembly groove is further provided with a guiding inclined surface, which is located at the second groove opening and is used to guide the assembly boss to pass through the second groove opening and be inserted into the assembly groove.

[0019] In an optional embodiment, the interface device further includes a pressing assembly, the pressing assembly including a buckle and a pressing buckle rotatably connected to the buckle, the buckle is connected to the circuit board, and the pressing buckle is configured to be rotatable relative to the buckle to a first position and a second position; wherein,

[0020] When the pressing buckle is rotated to the first position, the pressing buckle presses the optical fiber array connector tightly onto the optical connector;

[0021] When the pressing buckle is rotated to the second position, the pressing buckle avoids the moving path for separating the optical fiber array connector and the optical connector.

[0022] In an optional embodiment, the buckle includes a buckle body and a pressing platform connected to the buckle body. The buckle body is rotatably connected to the buckle, and the pressing platform protrudes relative to the buckle body. When the buckle body rotates to the first position, the pressing platform abuts against the optical fiber array connector to press the optical fiber array connector tightly onto the optical connector.

[0023] In an optional embodiment, the buckle includes a convex rib, and when the buckle is located in the first position, the convex rib engages with the buckle, so that the buckle is locked in the first position.

[0024] In an optional embodiment, the clamping assembly further includes an elastic member connected between the buckle and the snap buckle, and the elastic member is used to cause the buckle to have a tendency to rotate toward the first position, or the elastic member is used to cause the buckle to have a tendency to rotate toward the second position.

[0025] In a second aspect, the present invention provides an optoelectronic chip device, which includes a circuit board and the aforementioned interface device, wherein the optical chip waveguide is packaged on the circuit board.

[0026] The beneficial effects of the interface device of the embodiment of the present invention include: the interface device provided by the embodiment of the present invention includes a circuit board, an optical chip waveguide, an optical connector and an optical fiber array connector, the optical chip waveguide is packaged on the circuit board, and the optical chip waveguide is provided with one of a slide groove and a slider; the optical connector is provided with the other of the slide groove and the slider, the end of the slide groove is provided with an opening, the slider can be inserted into the slide groove from the opening and slide along the slide groove to align and assemble the optical connector and the optical chip waveguide; the optical fiber array connector is provided with an optical fiber array, and the optical fiber array connector is connected to the optical connector. The optical connector and the optical chip waveguide are aligned and assembled by the slide groove and the slider, and the optical fiber array connector is assembled on the optical connector by plugging, which can ensure the precise alignment and assembly between the optical fiber array connector and the optical chip waveguide, thereby achieving accurate alignment between the optical fiber array and the optical chip waveguide.

[0027] The optoelectronic chip device of the embodiment of the present invention includes all the beneficial effects of the aforementioned interface device, for example: the optical connector and the optical chip waveguide are aligned and assembled through the slide groove and the slider, and the optical fiber array connector is assembled on the optical connector by plugging, which can ensure the precise alignment and assembly between the optical fiber array connector and the optical chip waveguide, thereby achieving accurate alignment between the optical fiber array and the optical chip waveguide. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0029] Figure 1 This is a schematic structural diagram of the optoelectronic chip device in an embodiment of the present invention at a first viewing angle;

[0030] Figure 2This is a schematic structural diagram of a circuit board, an optical chip waveguide, and an optical connector in an embodiment of the present utility model;

[0031] Figure 3 This is a schematic diagram of the exploded structure of the optical connector and the optical fiber array connector in the embodiment of the present utility model;

[0032] Figure 4 This is a schematic diagram of the exploded structure of the optical connector, optical fiber array connector, and positioning pin in the embodiment of the present utility model at a second viewing angle;

[0033] Figure 5 This is a schematic structural diagram of the optoelectronic chip device in an embodiment of the present invention at a second viewing angle;

[0034] Figure 6 This is a schematic structural diagram of the circuit board and the pressing assembly in the embodiment of the present utility model from a first viewing angle;

[0035] Figure 7 Schematic diagram of the structure of the circuit board and the pressing assembly in the embodiment of the present utility model at a second viewing angle.

[0036] Icons: 010 - optoelectronic chip device; 100 - circuit board; 101 - positioning hole; 200 - optical chip waveguide; 201 - slider; 300 - optical connector; 301 - slide groove; 302 - opening; 310 - positioning boss; 320 - second positioning hole; 330 - assembly groove; 331 - first notch; 332 - second notch; 333 - guide slope; 340 - support surface; 400 - optical fiber array connector; 41 0-positioning groove; 411-third notch; 412-fourth notch; 420-first positioning hole; 430-assembly boss; 440-lap surface; 500-positioning pin; 600-pressing assembly; 610-clip; 611-accommodating groove; 612-convex rib; 613-welding foot; 614-positioning column; 620-press; 621-press body; 622-pressing platform; 623-rotating shaft; 624-third positioning hole. DETAILED DESCRIPTION

[0037] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0038] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are intended to fall within the scope of protection of the present invention.

[0039] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0040] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the utility model product is usually placed when in use. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0041] In addition, the terms "first", "second", etc., if used, are merely used to distinguish and describe, and should not be understood as indicating or implying relative importance.

[0042] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention can be combined with each other.

[0043] One of the key technical points of the integrated packaging of optoelectronic chips (also known as optoelectronic co-packaging, CPO, Co-Packaged Optics) is the coupling and docking of the fiber array (FA) and the optical chip. In related technologies, the fiber array (FA) and the optical chip are usually coupled and docked by gluing.

[0044] Due to the large number of optical chips in CPO, there are also many corresponding optical fibers, and the optical fibers are easily messy and inconvenient for wiring on the outside. For example, the relevant technology uses glue to bond the optical fibers and optical chips, which is not only inconvenient to operate, but also difficult to achieve precise alignment of the optical fibers and optical chips; and the bonding method also makes it difficult to replace the optical fiber array.

[0045] Please refer to Figure 1 To address the aforementioned issues, this embodiment provides an optoelectronic chip device 010. This device can accurately align the optical fiber array and the optical chip waveguide 200 through the optical fiber array connector 400. Furthermore, the optical fiber array can be easily replaced through the optical fiber array connector 400. The optoelectronic chip device 010 of this embodiment will be described in detail below with reference to the accompanying drawings.

[0046] Please refer to Figure 1 、 Figure 2 and Figure 3 The optoelectronic chip device 010 of this embodiment includes a circuit board 100 and an interface device; the interface device includes an optical chip waveguide 200, an optical connector 300 and an optical fiber array connector 400. The optical chip waveguide 200 is packaged on the circuit board 100, and the optical chip waveguide 200 is provided with a slider 201; the optical connector 300 is provided with a slide groove 301, and the end of the slide groove 301 is provided with an opening 302. The slider 201 can be inserted into the slide groove 301 from the opening 302 and slide along the slide groove 301 to align and assemble the optical connector 300 and the optical chip waveguide 200; the optical fiber array connector 400 is provided with an optical fiber array, and the optical fiber array connector 400 is plugged into and matched with the optical connector 300.

[0047] The optical connector 300 and the optical chip waveguide 200 are aligned and assembled by the slide groove 301 and the slider 201, and the optical fiber array connector 400 is assembled on the optical connector 300 by plugging, which can ensure the precise alignment and assembly between the optical fiber array connector 400 and the optical chip waveguide 200, thereby achieving accurate alignment between the optical fiber array and the optical chip waveguide 200; moreover, since the optical fiber array connector 400 is plugged into the optical connector 300, it is convenient to remove the optical fiber array connector 400 assembled on the optical connector 300, and replace the optical fiber array by a new optical fiber array connector 400, that is, the optical fiber array can be conveniently replaced through the optical fiber array connector 400.

[0048] It should be understood that in other embodiments, the optical chip waveguide 200 is provided with a slide groove 301, and an opening 302 is provided at the end of the slide groove 301; the optical connector 300 is provided with a slider 201, and the slider 201 can be inserted into the slide groove 301 from the opening 302 and slide along the slide groove 301 to align and assemble the optical connector 300 and the optical chip waveguide 200.

[0049] In other embodiments, the fiber array connector 400 and the optical connector 300 may be connected by bonding, snapping, pressing, or other fastener connections, which are not specifically limited here.

[0050] It should be noted that the manner in which the optical fiber array is arranged on the optical fiber array connector 400 is similar to that in the related art and will not be described in detail here.

[0051] It should also be noted that the circuit board 100 may refer to a PCB board, which includes a glass substrate and an optical chip encapsulated on the glass substrate. The above-mentioned optical chip waveguide 200 is encapsulated on the glass substrate of the PCB board and coupled with the optical chip; the optical chip is used to complete the modulation of the optical signal and transmit the optical signal to the optical chip waveguide 200, and the optical chip waveguide 200 is used to guide the transmission of the optical signal; the optical fiber array is accurately aligned with the optical chip waveguide 200 through the optical fiber array connector 400 and the optical connector 300, thereby achieving accurate alignment with the optical chip.

[0052] The plug-in matching structure of the optical fiber array connector 400 and the optical connector 300 can be set as needed; please refer to Figure 3 and Figure 4 In this embodiment, the fiber array connector 400 is provided with a positioning groove 410; the optical connector 300 is provided with a positioning boss 310; the positioning boss 310 is removably plugged into the positioning groove 410. The removable plug-in fit between the positioning boss 310 and the positioning groove 410 ensures accurate assembly position between the fiber array connector 400 and the optical connector 300, while also ensuring easy assembly and disassembly of the fiber array connector 400, thereby facilitating replacement of the fiber array through the fiber array connector 400.

[0053] Of course, in other embodiments, the optical fiber array connector 400 is provided with a positioning boss 310 ; the optical connector 300 is provided with a positioning groove 410 ; and the positioning boss 310 and the positioning groove 410 are detachably plugged in and matched.

[0054] Optionally, in order to ensure that the stability of the optical connector 300 assembled with the optical chip waveguide 200 through the sliding and plugging cooperation between the slider 201 and the slide groove 301 is not destroyed when the optical fiber array connector 400 is disassembled, the direction in which the positioning boss 310 slides out of the positioning groove 410 is configured to be distributed at an angle to the plugging direction of the slider 201 and the slide groove 301. In this way, when the optical fiber array connector 400 is disassembled from the optical connector 300, even if the optical connector 300 is subjected to an external force, since the direction of the external force is the direction of separation of the positioning boss 310 from the positioning groove 410, and this direction is at an angle to the sliding direction of the slider 201 and the slide groove 301, the slider 201 and the slide groove 301 are unlikely to move relative to each other under the action of the external force, thereby ensuring the assembly stability between the optical connector 300 and the optical chip waveguide 200.

[0055] Optionally, the angle between the direction in which the positioning boss 310 slides out of the positioning groove 410 and the plugging direction between the slider 201 and the slide groove 301 is 90°, 88°, 93°, etc., which is not specifically limited here. The cam 310 is then moved out of the cam 310 so that the cam 310 can be moved out of the cam 310. The cam 310 is then moved out of the cam 310 so that the cam 310 can be moved out of the cam 310. The cam 310 is then moved out of the cam 310 so that the cam 310 can be moved out of the cam 310.

[0056] It should be understood that the direction in which the positioning boss 310 is plugged into the positioning groove 410 may be the same as or different from the direction in which the positioning boss 310 slides out of the positioning groove 410 , and this is not specifically limited herein.

[0057] In order to further improve the assembly position accuracy between the optical fiber array connector 400 and the optical connector 300, and thereby ensure the accurate alignment of the optical fiber array and the optical chip waveguide 200 through the optical fiber array connector 400; please refer to Figure 4 The fiber array connector 400 is provided with a first positioning hole 420, and the optical connector 300 is provided with a second positioning hole 320. The interface device further includes a positioning pin 500, which is plugged into the first positioning hole 420 and the second positioning hole 320. The plug-in cooperation between the positioning pin 500 and the first positioning hole 420 and the second positioning hole 320, and the mutual cooperation between the plug-in cooperation between the positioning boss 310 and the positioning groove 410, can improve the positioning accuracy of the fiber array connector 400 and the optical connector 300 in three angular directions; illustratively, the three angular directions mentioned above can refer to the front-back, left-right, and up-down directions.

[0058] Optionally, the locating pin 500 is in close contact with the wall of at least one of the first locating hole 420 and the second locating hole 320 to form an interference fit, so that the locating pin 500 can be used to reliably locate the assembly position between the fiber array connector 400 and the optical connector 300.

[0059] Furthermore, the first positioning hole 420 and the second positioning hole 320 can both be obtained by ultra-precision grinding, so that the accuracy level of the first positioning hole 420 and the second positioning hole 320 reaches the micron level, and the corresponding positioning pin 500 can also be ultra-precision turned to achieve micron-level accuracy; in this way, the micron-level accuracy of the assembly position between the optical fiber array connector 400 and the optical connector 300 is ensured by utilizing the cooperation of the positioning pin 500 and the first positioning hole 420 and the second positioning hole 320, and thus the alignment accuracy of the optical fiber array with the optical chip waveguide 200 through the optical fiber array connector 400 is ensured.

[0060] Of course, in other embodiments, a pin hole can be provided in one of the optical fiber array connector 400 and the optical connector 300, and a positioning pin 500 can be connected to the other of the optical fiber array connector 400 and the optical connector 300, and the positioning pin 500 can be plugged into the pin hole.

[0061] Please refer to Figure 3 and Figure 4 In order to further improve the assembly stability between the optical connector 300 and the optical fiber array connector 400, the optical connector 300 is provided with an assembly groove 330 and a support surface 340; the optical fiber array connector 400 is provided with an assembly boss 430 and a lap surface 440; the assembly boss 430 is plugged into the assembly groove 330, and the lap surface 440 overlaps the support surface 340.

[0062] Of course, in other embodiments, the optical connector 300 is provided with an assembly boss 430 ; the optical fiber array connector 400 is provided with an assembly groove 330 , and the assembly boss 430 is plugged into the assembly groove 330 .

[0063] Furthermore, the overlapping surface 440 is distributed around the outer periphery of the assembly boss 430, and the first positioning hole 420 is provided on the overlapping surface 440; the supporting surface 340 is distributed around the outer periphery of the assembly groove 330, and the second positioning hole 320 is provided on the supporting surface 340. This arrangement enables the first positioning hole 420 and the second positioning hole 320 to be arranged relative to each other when the assembly boss 430 is plugged into the assembly groove 330 and the overlapping surface 440 overlaps the supporting surface 340, further ensuring that the fiber array connector 400 is accurately assembled to the optical connector 300 and is easy to operate.

[0064] Furthermore, the positioning groove 410 is provided on the assembly boss 430, and the positioning boss 310 is provided at the bottom of the assembly groove 330. Such a configuration can further ensure the assembly position accuracy and stability between the optical fiber array connector 400 and the optical connector 300.

[0065] The number of first positioning holes 420, second positioning holes 320, and positioning pins 500 can be selected as needed. In this embodiment, the number of first positioning holes 420, second positioning holes 320, and positioning pins 500 is two, and the positioning pins 500 are plugged and matched with the first positioning holes 420 and the second positioning holes 320 in a one-to-one correspondence. Of course, in other embodiments, the number of first positioning holes 420, second positioning holes 320, and positioning pins 500 can also be one, three, four, etc., and is not specifically limited here.

[0066] Please refer to Figure 2 and Figure 4 In this embodiment, the assembly groove 330 includes a first notch 331 and a second notch 332, with the first notch 331 and the second notch 332 oriented at an angle. The assembly boss 430 can be assembled into the assembly groove 330 via either the first notch 331 or the second notch 332. This arrangement allows for more flexible assembly and alignment of the fiber array connector 400 to the optical connector 300, improving assembly efficiency.

[0067] Optionally, the orientation of the second slot 332, the support surface 340 and the second positioning hole 320 are the same; in this way, when the assembly boss 430 is inserted into the assembly slot 330 from the second slot 332, the overlapping surface 440 can be conveniently overlapped with the support surface 340, and the first positioning hole 420 and the second positioning hole 320 can be relative and connected, thereby ensuring the ease of assembly and stability.

[0068] Please refer to Figure 2 、 Figure 3 and Figure 4 It should be understood that in order to simultaneously complete the plug-in assembly or separation of the positioning boss 310 and the positioning groove 410 when the assembly boss 430 is plugged into or separated from the assembly groove 330, the positioning groove 410 has a third notch 411 and a fourth notch 412, the direction of the third notch 411 is opposite to the direction of the first notch 331, and the direction of the fourth notch 412 is opposite to the direction of the second notch 332; when the assembly boss 430 slides from the first notch 331 into the assembly groove 330, the positioning boss 310 slides from the third notch 411 into the positioning groove 410; when the assembly boss 430 slides from the second notch 332 into the assembly groove 330, the positioning boss 310 slides from the fourth notch 412 into the positioning groove 410.

[0069] Optionally, the included angle between the orientation of the first notch 331 and the orientation of the second notch 332 is 90°, 87°, 95°, etc., which is not specifically limited here.

[0070] It should be noted that when it is necessary to replace the optical fiber array through the optical fiber array connector 400, the optical fiber array connector 400 to be replaced is assembled together with the optical connector 300 through the positioning pin 500. When disassembling the optical fiber array connector 400, it is necessary to lift the optical fiber array connector 400 so that the optical fiber array connector 400 is separated from the optical connector 300 in the direction of the second slot 332; when installing the new optical fiber array connector 400, the assembly boss 430 of the new optical fiber array connector 400 is inserted into the assembly groove from the second slot 332, and the new optical fiber array connector 400 is plugged into the positioning pin 500.

[0071] It should also be noted that, when the positioning pin 500 is not provided, the assembly boss 430 of the optical fiber array connector 400 can be inserted into the assembly groove from the first notch 331 to enable the optical fiber array connector 400 to be plugged into the optical connector 300 .

[0072] Please refer to Figure 4 Optionally, a guide slope 333 is further provided on the groove wall of the assembly groove 330, and the guide slope 333 is located at the second groove 332, for guiding the assembly boss 430 to be inserted into the assembly groove 330 through the second groove 332; specifically, when the assembly boss 430 is inserted into the assembly groove from the second groove 332, the assembly boss 430 can slide and cooperate with the guide slope 333, thereby improving the accuracy of the assembly boss 430 in the assembly groove, thereby improving the accuracy of the fiber optic array connector 400 being inserted into the optical connector 300, and improving the assembly efficiency.

[0073] Furthermore, two opposite groove walls of the assembly groove 330 are provided with guiding inclined surfaces 333 ; thus, the accuracy and assembly efficiency of the optical fiber array connector 400 being plugged into the optical connector 300 can be further ensured.

[0074] In order to further improve the stability and reliability of the fiber array connector 400 assembled to the optical connector 300; please refer to Figure 5 and Figure 6The interface device of this embodiment also includes a pressing component 600, which includes a buckle 610 and a buckle 620 rotatably connected to the buckle 610. The buckle 610 is connected to the circuit board 100. Specifically, the buckle 610 is connected to the glass substrate and presses the optical connector 300 against the glass substrate; the buckle 620 is configured to be able to rotate to a first position and a second position relative to the buckle 610; wherein, when the buckle 620 rotates to the first position, the buckle 620 presses the optical fiber array connector 400 against the optical connector 300; when the buckle 620 rotates to the second position, the buckle 620 avoids the movement path for separating the optical fiber array connector 400 and the optical connector 300. In this way, the fiber optic array connector 400 can be pressed and locked in a stable assembled state with the optical connector 300 by rotating the press buckle 620 to the first position. When the fiber array needs to be replaced through the fiber optic array connector 400, the press buckle 620 can be rotated to the second position so that the press buckle 620 no longer presses the fiber optic array connector 400 on the optical connector 300, and avoids the moving path of the fiber optic array connector 400 to be removed from the optical connector 300, so that the removal of the fiber optic array connector 400 is not blocked by the press buckle 620.

[0075] Furthermore, when the pressing buckle 620 is in the first position, it presses against the side of the optical fiber array connector 400 facing away from the optical connector 300. The pressing buckle 620 includes a pressing buckle body 621 and a pressing platform 622 connected to the pressing buckle body 621. The pressing buckle body 621 is rotatably connected to the buckle 610, and the pressing platform 622 protrudes relative to the pressing buckle body 621. When the pressing buckle body 621 is rotated to the first position, the pressing platform 622 abuts against the side of the optical fiber array connector 400 facing away from the optical connector 300, thereby pressing the optical fiber array connector 400 against the optical connector 300. This arrangement can improve the stability of the pressing buckle 620 in pressing the optical fiber array connector 400.

[0076] Furthermore, the buckle 610 includes a rib 612. When the buckle 620 is in the first position, the rib 612 engages with the buckle 620, locking the buckle 620 in the first position. This ensures the stability of the fiber array connector 400 being locked in the connection state with the optical connector 300 by the buckle 620.

[0077] Of course, in other embodiments, when the buckle 620 is located in the first position, the buckle 620 can also be connected to the buckle 610 through fasteners such as bolts, so that the buckle 620 is locked in the first position.

[0078] Optionally, the buckle 610 has a receiving groove 611 for receiving the buckle 620 located in the first position, and a portion of the optical connector 300 is located in the receiving groove 611. Both side walls of the receiving groove 611 have ribs 612. When the buckle 620 is rotated to the first position, the two sides of the buckle 620 are respectively engaged with the ribs 612 on both sides of the receiving groove 611 to ensure the stability of the buckle 620 in the first position.

[0079] Optionally, the buckle body 621 is provided with a third positioning hole 624, which is used to avoid the positioning pin 500. That is, when the buckle 620 rotates to the first position, the positioning pin 500 is plugged into the third positioning hole 624. The number of the third positioning holes 624 matches the number of the positioning pins 500.

[0080] The connection method between the buckle 610 and the circuit board 100 can be selected as needed; please refer to Figure 6 and Figure 7 , exemplarily, the clip 610 is connected with a positioning column 614 and a solder foot 613 , the glass substrate of the circuit board 100 is provided with a positioning hole 101 , the positioning column 614 is plugged into the positioning hole 101 , and is soldered to the glass substrate through the solder foot 613 .

[0081] In some embodiments, the compression assembly 600 further includes an elastic member (not shown) connected between the pressing buckle 620 and the latch 610. The elastic member is configured to cause the pressing buckle 620 to rotate toward the first position. This configuration improves the stability of the pressing buckle 620 in the first position, thereby ensuring a stable connection between the fiber array connector 400 and the optical connector 300.

[0082] Exemplarily, the elastic member is a torsion spring, and the buckle body 621 is connected to a rotating shaft 623. The buckle body 621 is rotatably connected to the buckle 610 via the rotating shaft 623. The torsion spring is sleeved on the rotating shaft 623, and one torsion arm of the torsion spring is connected to the buckle body 621, and the other torsion arm is connected to the buckle 610. When the buckle 620 is not in the first position, the torsion spring is in a deformed state, and the elastic action of the torsion spring can cause the buckle 620 to rotate toward the first position. When the buckle 620 is in the first position, the buckle 620 can also be stably locked in the first position under the elastic action of the torsion spring. The stability is improved by the double locking of the elastic member and the rib 612.

[0083] Of course, the elastic member can also be a tension spring, etc., which is not specifically limited here.

[0084] In other embodiments, the elastic member is used to cause the buckle 620 to have a tendency to rotate toward the second position. This configuration can improve the efficiency of the buckle 620 rotating to the second position when the optical fiber array connector 400 needs to be replaced, thereby improving replacement efficiency. It also ensures that the buckle 620 can be stably maintained in the second position until the optical fiber array connector 400 is completely replaced, ensuring easy replacement.

[0085] In summary, the interface device of the optoelectronic chip device 010 of the present invention can accurately position and assemble the optical connector 300 on the optical chip waveguide 200 through the sliding cooperation of the slider 201 and the slide groove 301, and realize the positioning and assembly of the optical fiber array connector 400 and the optical connector 300 by plugging the positioning groove 410 with the positioning boss 310, plugging the assembly boss 430 with the assembly groove 330, and plugging the positioning pin 500 with the first positioning hole 420 and the second positioning hole 320, so as to ensure the precise alignment assembly between the optical fiber array connector 400 and the optical chip waveguide 200, thereby realizing the accurate alignment between the optical fiber array and the optical chip waveguide 200; moreover, since the optical fiber array connector 400 is plugged in and cooperated with the optical connector 300, it is convenient to remove the optical fiber array connector 400 assembled on the optical connector 300, and replace the optical fiber array by replacing the new optical fiber array connector 400, that is, the optical fiber array can also be conveniently replaced through the optical fiber array connector 400.

[0086] The above is only a specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any changes or replacements that can be easily thought of by any technician familiar with this technical field within the technical scope disclosed in the present invention should be covered by the protection scope of the present invention.

Claims

1. An interface device for a circuit board (100), characterized in that: include: An optical chip waveguide (200), the optical chip waveguide (200) can be packaged on the circuit board (100), and the optical chip waveguide (200) is provided with one of a slide groove (301) and a slider (201); An optical connector (300), wherein the optical connector (300) is provided with the other of the slide groove (301) and the slider (201), an opening (302) is provided at the end of the slide groove (301), and the slider (201) can be inserted into the slide groove (301) from the opening (302) and slide along the slide groove (301) to align and assemble the optical connector (300) and the optical chip waveguide (200); and An optical fiber array connector (400) is provided with an optical fiber array, and the optical fiber array connector (400) is connected to the optical connector (300).

2. The interface device according to claim 1, wherein: An optical fiber array connector (400), wherein the optical fiber array connector (400) is provided with an optical fiber array, and the optical fiber array connector (400) is plugged and matched with the optical connector (300); and / or, The optical fiber array connector (400) is provided with one of a positioning boss (310) and a positioning groove (410); the optical connector (300) is provided with the other of the positioning boss (310) and the positioning groove (410); the positioning boss (310) and the positioning groove (410) are detachably plugged in and matched.

3. The interface device according to claim 2, wherein: The direction in which the positioning boss (310) slides out of the positioning groove (410) and the direction in which the slider (201) is plugged into the slide groove (301) are distributed at an angle.

4. The interface device according to claim 1, wherein: The optical fiber array connector (400) is provided with a first positioning hole (420), the optical connector (300) is provided with a second positioning hole (320), and the interface device further comprises a positioning pin (500), wherein the positioning pin (500) is plugged into the first positioning hole (420) and the second positioning hole (320); or, One of the optical fiber array connector (400) and the optical connector (300) is provided with a pin shaft hole, and the other of the optical fiber array connector (400) and the optical connector (300) is connected with a positioning pin (500), and the positioning pin (500) is plugged into the pin shaft hole.

5. The interface device according to claim 4, characterized in that: The optical connector (300) is provided with one of an assembly groove (330) and an assembly boss (430), and a support surface (340); the optical fiber array connector (400) is provided with the other of the assembly groove (330) and the assembly boss (430), and a lap joint surface (440); the assembly boss (430) is plugged into the assembly groove (330), and the lap joint surface (440) is lap jointed with the support surface (340).

6. The interface device according to claim 5, characterized in that: The first positioning hole (420) is provided on the overlapping surface (440), and the second positioning hole (320) is provided on the supporting surface (340); and / or, The assembly groove (330) has a first notch (331) and a second notch (332), and the orientation of the first notch (331) and the orientation of the second notch (332) are distributed at an angle; the assembly boss (430) can be assembled in the assembly groove (330) through either the first notch (331) or the second notch (332).

7. The interface device according to claim 6, characterized in that: The groove wall of the assembly groove (330) is further provided with a guiding inclined surface (333), and the guiding inclined surface (333) is located at the second groove opening (332) and is used to guide the assembly boss (430) to be inserted into the assembly groove (330) through the second groove opening (332).

8. The interface device according to claim 1, wherein: The interface device further comprises a pressing assembly (600), the pressing assembly (600) comprising a buckle (610) and a pressing buckle (620) rotatably connected to the buckle (610), the buckle (610) being connected to the circuit board (100), and the pressing buckle (620) being configured to be rotatable relative to the buckle (610) to a first position and a second position; wherein, When the pressing buckle (620) is rotated to a first position, the pressing buckle (620) presses the optical fiber array connector (400) tightly onto the optical connector (300); When the pressing buckle (620) is rotated to the second position, the pressing buckle (620) avoids the moving path for separating the optical fiber array connector (400) and the optical connector (300).

9. The interface device according to claim 8, characterized in that: The pressing buckle (620) comprises a pressing buckle body (621) and a pressing platform (622) connected to the pressing buckle body (621); the pressing buckle body (621) is rotatably connected to the buckle (610); the pressing platform (622) protrudes relative to the pressing buckle body (621); when the pressing buckle body (621) rotates to the first position, the pressing platform (622) abuts against the optical fiber array connector (400), so that the optical fiber array connector (400) is tightly pressed against the optical connector (300); and / or, The buckle (610) includes a convex rib (612), and when the buckle (620) is located at the first position, the convex rib (612) is engaged with the buckle (620), so that the buckle (620) is locked in the first position; and / or, The pressing assembly (600) further includes an elastic member connected between the buckle (620) and the snap buckle (610), and the elastic member is used to make the buckle (620) have a tendency to rotate toward the first position, or the elastic member is used to make the buckle (620) have a tendency to rotate toward the second position.

10. An optoelectronic chip device, characterized in that: The invention comprises a circuit board and the interface device according to any one of claims 1 to 9, wherein the optical chip waveguide (200) is packaged on the circuit board (100).

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