2U internal circulation air and liquid cooling mixed heat dissipation server

Abstract

The utility model relates to the technical field of server heat dissipation, and particularly discloses a 2U internal circulation air and liquid cooling mixed heat dissipation server which comprises a server case assembly, a liquid cooling assembly, a fan and a first circuit board, the server case assembly comprises a base, a front window, a rear window and an upper cover, and the front window and the rear window are arranged at the front end and the rear end of the base respectively. The upper cover covers the base; a first circuit board is fixedly connected to the base, the fan is arranged between the front window and the first circuit board, the liquid cooling assembly comprises a heat exchanger, a miniature water pump and a liquid cooling plate, the heat exchanger is arranged between the front window and the fan, the liquid cooling plate is arranged on the surface of a chip on the first circuit board, and a water outlet of the heat exchanger communicates with the miniature water pump. A water outlet of the micro water pump and a water inlet of the heat exchanger are respectively communicated with the liquid cooling plate through hoses. Heat dissipation is efficiently and accurately conducted on a high-power-consumption chip in the server through the liquid cooling plate, heat dissipation is conducted on a low-power-consumption element in the server through air cooling, and independent heat dissipation of the server is achieved through combination of the liquid cooling mode and the air cooling mode.

Description

Technical Field

[0001] The utility model relates to the technical field of server heat dissipation, in particular to a 2U internal circulation air-liquid cooling mixed heat dissipation server. Background Art

[0002] Currently, rack-mounted server cooling technologies primarily fall into two categories: air-cooled forced convection and liquid-cooled. Liquid cooling can be divided into direct liquid cooling (immersion cooling) and indirect liquid cooling (cold plate cooling). Traditional air-cooled forced convection cooling, when the heat flux density of a single server chip is high, requires the use of high-power axial fans and a complex heat sink design to meet the chip's cooling needs. This solution has numerous drawbacks, primarily high fan power consumption, high noise levels, low heat dissipation efficiency, and high server energy consumption. When server chip power consumption exceeds 350W or even 500W, traditional air cooling cannot meet the chip's normal cooling needs. Liquid cooling is required for server cooling. Currently, mainstream liquid cooling methods require an external coolant supply. An external liquid cooling source (chiller) is installed outside the server to provide coolant to the server's liquid cold plate. This type of liquid-cooled server also has disadvantages. The main drawback is that a single liquid-cooled server cannot be used independently without a liquid cooling source. When a customer uses only one server device, a separate liquid cooling source is required to ensure stable operation of this device. The liquid cooling source is large and inconvenient to deploy, and it still produces a lot of noise during operation. At the same time, each machine is equipped with an external liquid cooling source, and the energy consumption of the entire system is still high. Therefore, it is necessary to design and develop a server cooling solution that can operate independently and has high cooling performance to meet the cooling needs of different server configuration scenarios.

[0003] It should be noted that the above introduction to the technical background is merely intended to provide a clear and complete description of the technical solutions of this application and facilitate understanding by those skilled in the art. Simply because these solutions are described in the background technology section of this application, it should not be assumed that the above technical solutions are well known to those skilled in the art. Utility Model Content

[0004] The purpose of the utility model is to overcome the shortcomings of the existing technology and provide a 2U internal circulation air-liquid cooling hybrid heat dissipation server. The liquid cooling heat dissipation circulation system is designed inside the server. The server can be used independently without an external liquid cooling source. At the same time, it supports liquid cooling cold plate heat dissipation of high-power chips. Other low-power devices inside the server still use forced air cooling for heat dissipation. The heat dissipation form of the whole machine is internal circulation air-liquid cooling hybrid heat dissipation.

[0005] In order to achieve the above-mentioned objectives, the utility model provides a 2U internal circulation air liquid cooling hybrid heat dissipation server, including a server chassis assembly, a liquid cooling assembly, a fan and a first circuit board, the server chassis assembly including a base, a front window, a rear window and an upper cover, the front window and the rear window are respectively arranged at the front and rear ends of the base, the upper cover covers the top of the base to close the base; the first circuit board is fixedly connected to the base, the fan is arranged between the front window and the first circuit board, the liquid cooling assembly includes a heat exchanger, a micro water pump and a liquid cooling plate, the heat exchanger is arranged between the front window and the fan, the liquid cooling plate is arranged on the chip surface located on the first circuit board, the water outlet of the heat exchanger is connected to the micro water pump, and the water outlet of the micro water pump and the water inlet of the heat exchanger are respectively connected to the liquid cooling plate through hoses.

[0006] Furthermore, the air inlet side of the heat exchanger abuts against the front window, and the air outlet side of the heat exchanger abuts against the air inlet side of the fan.

[0007] Furthermore, the gap around the contact end surface between the air outlet side of the heat exchanger and the air inlet side of the fan is filled with foam.

[0008] Furthermore, a fan bracket is fixedly connected to the base, and the fan is installed in the fan bracket.

[0009] Furthermore, the upper cover includes a first upper cover and a second upper cover, the first upper cover is arranged above the front window to the fan, and the second upper cover is arranged above the fan to the rear window.

[0010] Furthermore, a second circuit board and a third circuit board are installed in the base, and the second circuit board and the third circuit board are located below the second upper cover.

[0011] Furthermore, the outer side of the base is also fixedly connected to a right hanging ear of the chassis and a left hanging ear of the chassis.

[0012] Furthermore, the opening ratio of the front window is greater than 60%, and the air inlet holes of the front window are regular hexagonal honeycomb holes.

[0013] Furthermore, a power supply compartment is provided in the base, and a power supply is installed in the power supply compartment.

[0014] The above solution of the utility model has the following beneficial effects:

[0015] The 2U internal circulation air-liquid cooling hybrid heat dissipation server provided by the utility model integrates the liquid cooling heat dissipation circulation system into the server, adopts air cooling to dissipate heat to the liquid cooling circulation medium and the inside of the server chassis at the same time, and at the same time, the liquid cooling circulation medium can accurately and efficiently dissipate heat to high-power consumption chips and other components in the server through the liquid cooling plate of the liquid cooling system; at the same time, other low-power consumption devices in the server still use forced air cooling for heat dissipation, and the heat dissipation form of the whole machine is internal circulation air cooling and liquid cooling hybrid heat dissipation. Different cooling methods are adopted according to the different cooling requirements of different electronic components in the server, so that the server can be used alone without an external liquid cooling source.

[0016] Other beneficial effects of the present invention will be described in detail in the subsequent specific implementation section. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall internal structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the overall structure of the server chassis assembly of the present invention;

[0019] Figure 3 This is a schematic diagram of the overall structure of the liquid cooling assembly of the present utility model;

[0020] Figure 4 This is a schematic diagram of the installation of the liquid cooling assembly and the first circuit board of the present invention.

[0021] [Description of Reference Numerals]

[0022] 1-Server chassis assembly; 11-Base; 12-Front window; 13-Right chassis mounting ear; 14-Left chassis mounting ear; 15-Fan bracket; 16-First upper cover; 17-Second upper cover; 18-Power supply compartment; 19-Rear window; 2-Liquid cooling assembly; 21-Heat exchanger; 22-Micro water pump; 23-Hose; 24-Liquid cooling plate; 3-Fan; 4-First circuit board; 41-Chip; 5-Second circuit board; 6-Third circuit board; 7-Power supply. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention. The various specific technical features and embodiments described in the specific embodiments can be combined in any suitable manner unless there is any contradiction. For example, different embodiments can be formed by combining different specific technical features / embodiments. In order to avoid unnecessary repetition, the various possible combinations of the specific technical features / embodiments in the present invention will not be described separately.

[0024] It should be noted that the terms "setting" and "connecting" should be understood in a broad sense. For example, they can be directly set, installed, or connected, or they can be indirectly set or connected through a central component or a central structure. In addition, the orientations or positional relationships indicated by "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. in the present invention are based on the orientations or positional relationships shown in the drawings or the conventional placement state or usage state. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the structure, feature, device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limiting the present invention.

[0025] like Figures 1-4 As shown, this embodiment provides a 2U internal recirculation air-liquid-cooled hybrid heat dissipation server, comprising a server chassis assembly 1, a liquid cooling assembly 2, a fan 3, and a first circuit board 4. The server chassis assembly 1 comprises a base 11, a front window 12, a rear window 19, and a top cover. The front window 12 and rear window 19 are located at the front and rear ends of the base 11, respectively. The front window 12 has an aperture ratio greater than 60%, and the air inlet holes of the front window 12 are regular hexagonal honeycomb holes, ensuring that the air intake of the front window 12 meets the cooling requirements. The top cover covers the top of the base 11 to seal it, ensuring that the external cooling air enters through the front window 12, flows through the interior of the server assembly 1, and finally exits through the rear window 19. A first circuit board 4 is fixedly connected to the base 11, and a high-power chip 41 is mounted on the first circuit board 4. In this embodiment, M3 fixing nuts are press-riveted on the base 11 to secure the first circuit board 4. Other commonly used fixing methods can also be used in other embodiments. The outer side of the base 11 is also fixedly connected to a right chassis mounting ear 13 and a left chassis mounting ear 14 , and the mounting ears are used to install the server into the cabinet.

[0026] In this embodiment, the fan 3 is arranged between the front window 12 and the first circuit board 4. Specifically, the base 11 is fixedly connected to the fan bracket 15, and the fan 3 is installed and fixed in the fan bracket 15. In this embodiment, the number of fans 3 installed is preferably 4 axial flow fans with a specification of 8038 to provide strong power. In other embodiments, different numbers and models of fans can be selected according to heat dissipation needs. The liquid cooling component 2 includes a heat exchanger 21, a micro water pump 22 and a liquid cooling plate 24. The heat exchanger 21 is arranged between the front window 12 and the fan 3. The cold air entering from the front window 12 first passes through the heat exchanger 21 to cool the circulating cooling medium. In this embodiment, the heat exchanger 21 is preferably a finned tube made of pure copper with high heat exchange efficiency. The liquid cooling plate 24 is arranged on the surface of the chip 41 to perform liquid cooling and heat dissipation on the high-power consumption and high-heat-generating chip 41. Furthermore, the water outlet of the heat exchanger 21 is connected to a micro water pump 22. The water outlet of the micro water pump 22 and the water inlet of the heat exchanger 21 are respectively connected to the liquid cooling plate 24 via a hose 23. The micro water pump 22 transports the cooling medium (such as water) cooled by the heat exchanger 21 to the water inlet of the liquid cooling plate 24 via the hose 23. The cooling medium in the liquid cooling plate 24 exchanges heat with the chip 41 and is then transported back to the water inlet of the heat exchanger 21 via the hose 23, thereby achieving internal circulation of the cooling medium. Specifically, the number of liquid cooling plates 24 corresponds to the number of chips 41 on the first circuit board 4. In this embodiment, there are two chips 41 and two liquid cooling plates 24. The two liquid cooling plates 24 are respectively arranged on two different chips 41. The two liquid cooling plates 24 are also connected in series using a hose 23. The hose 23 is preferably a rubber hose, which is convenient for bending and arranging the hose 23 according to the internal structural characteristics of the server.

[0027] Furthermore, the upper cover includes a first upper cover 16 and a second upper cover 17. The first upper cover 16 is located above the front window 12 and the fan 3, and the second upper cover 17 is located above the fan 3 and the rear window 19, thereby achieving partitioning. When the cooling unit or circuit unit needs to be maintained, the corresponding upper cover can be removed. The air inlet side of the heat exchanger 21 abuts the front window 12, and the air outlet side of the heat exchanger 21 abuts the air inlet side of the fan 3. The gap around the contact end surface between the air outlet side of the heat exchanger 21 and the air inlet side of the fan 3 is filled with foam. The sealing on all sides ensures that all cold air drawn in by the fan 3 through the front window 12 can directly pass through the heat exchanger 21 for heat exchange.

[0028] In this embodiment, the base 11 also houses a second circuit board 6 and a third circuit board 7, located beneath the second upper cover 17. These circuit boards are standard circuit boards without high-power chips. In other embodiments, those skilled in the art may also install a different number of standard circuit boards as needed. The base 11 also houses a power supply compartment 18, which houses a power supply 7 for powering the server.

[0029] When the 2U internal circulation air-liquid cooling hybrid heat dissipation server provided by the present invention is used, the fan 3 is started, and the cold air is sucked in from the front window 12 and first passes through the heat exchanger 21 to cool the cooling circulating medium in the heat exchanger 21. The cold air is blown to the low-power electronic components in the server chassis assembly 1 through the fan 3 for air cooling, and finally discharged from the rear window 19. At the same time, the cooling medium in the heat exchanger 21 that has undergone heat exchange and cooling is transported to the water inlet of the liquid cooling plate 24 by the micro water pump 22. The liquid cooling plate 24 is in direct contact with the surface of the chip 41 for heat exchange. The cooling medium that has completed the heat exchange flows back to the water inlet of the heat exchanger 21 through the water outlet of the liquid cooling plate 24, realizing internal circulation. The present invention uses the liquid cooling plate 24 to efficiently and accurately dissipate heat from the high-power chips inside the server, and uses air cooling to dissipate heat from the low-power components in the server. The combination of liquid cooling and air cooling realizes independent heat dissipation of the server.

[0030] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles described in the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A 2U internal circulation air-liquid cooling hybrid heat dissipation server, characterized in that: The server chassis assembly (1) comprises a server chassis assembly (1), a liquid cooling assembly (2), a fan (3) and a first circuit board (4); the server chassis assembly (1) comprises a base (11), a front window (12), a rear window (19) and an upper cover; the front window (12) and the rear window (19) are respectively arranged at the front and rear ends of the base (11); the upper cover covers the base (11) to close the base (11); the first circuit board (4) is fixedly connected to the base (11); the fan (3) is arranged between the front window (12) and the first circuit board (4); The liquid cooling assembly (2) comprises a heat exchanger (21), a micro water pump (22) and a liquid cooling plate (24), wherein the heat exchanger (21) is arranged between the front window (12) and the fan (3), and the liquid cooling plate (24) is arranged on the surface of the chip (41) located on the first circuit board (4). The water outlet of the heat exchanger (21) is connected to the micro water pump (22), and the water outlet of the micro water pump (22) and the water inlet of the heat exchanger (21) are respectively connected to the liquid cooling plate (24) through a hose (23).

2. The 2U internal circulation air-liquid cooling hybrid heat dissipation server according to claim 1, characterized in that: The air inlet side of the heat exchanger (21) abuts against the front window (12), and the air outlet side of the heat exchanger (21) abuts against the air inlet side of the fan (3).

3. The 2U internal circulation air-liquid cooling hybrid heat dissipation server according to claim 2, characterized in that: The gaps around the contact end surfaces of the air outlet side of the heat exchanger (21) and the air inlet side of the fan (3) are filled with foam.

4. The 2U internal circulation air-liquid cooling hybrid heat dissipation server according to claim 1, characterized in that: A fan bracket (15) is fixedly connected to the base (11), and the fan (3) is installed in the fan bracket (15).

5. The 2U internal circulation air-liquid cooling hybrid heat dissipation server according to claim 1, characterized in that: The upper cover comprises a first upper cover (16) and a second upper cover (17), wherein the first upper cover (16) is arranged above the front window (12) to the fan (3), and the second upper cover (17) is arranged above the fan (3) to the rear window (19).

6. The 2U internal circulation air-liquid cooling hybrid heat dissipation server according to claim 5, characterized in that: A second circuit board (5) and a third circuit board (6) are also installed in the base (11), and the second circuit board (5) and the third circuit board (6) are located below the second upper cover (17).

7. The 2U internal circulation air-liquid cooling hybrid heat dissipation server according to claim 1, characterized in that: The outer side of the base (11) is also fixedly connected to a right hanging ear (13) of the chassis and a left hanging ear (14) of the chassis.

8. The 2U internal circulation air-liquid cooling hybrid heat dissipation server according to claim 1, characterized in that: The opening rate of the front window (12) is greater than 60%, and the air inlet holes of the front window (12) are regular hexagonal honeycomb holes.

9. The 2U internal circulation air-liquid cooling hybrid heat dissipation server according to claim 1, characterized in that: A power supply compartment (18) is also provided in the base (11), and a power supply (7) is installed in the power supply compartment (18).

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