Forming clamp and forming equipment for transistor and cooling fin

Abstract

The utility model provides a forming clamp and forming equipment for a transistor and a cooling fin. The forming clamp comprises a base, a clamping device and a clamping device, the transistor positioning groove is located in the top surface of the base and used for placing a transistor, and the transistor comprises a transistor body and an insulating sleeve arranged on the periphery of the transistor body in a sleeving mode; the push rod is used for extending into the insulating sleeve from the side part of the transistor positioning groove and pushing the transistor body to a preset position; and the pressing strip positioning groove is positioned at the bottom of the transistor positioning groove and is used for placing a pressing strip, and the pressing strip is used for locking the transistor body on the cooling fin after the transistor body is pushed to the preset position. The forming clamp provided by the utility model can reliably lock the transistor body on the cooling fin, and ensures that the cooling fin has reliable heat dissipation performance.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor production equipment, and in particular to a molding fixture and molding equipment for transistors and heat sinks. Background Art

[0002] Transistors are widely used in electronic devices. Transistors generate heat during operation, so heat sinks are often used to dissipate heat and ensure long-term stable operation. Currently, a pressure strip can be used to secure the transistor to the heat sink, forming a single piece.

[0003] Transistors can be categorized by their packaging structure into metal-encapsulated (gold-encapsulated) transistors and plastic-encapsulated (plastic-encapsulated) transistors. When using a heat sink to dissipate heat from a gold-encapsulated transistor, insulation is required between the two. One method involves wrapping the transistor in a silicone sleeve and then securing the transistor to the heat sink with a pressure strip.

[0004] However, for the above transistors with silicone sleeves, since the position of the transistor body in the silicone sleeve is not fixed, the current molding fixture cannot ensure that the pressure strip can be accurately pressed on the transistor body, and the locking effect is poor, so that the heat dissipation effect of the heat sink cannot be guaranteed. Utility Model Content

[0005] The present application provides a transistor and heat sink molding fixture and molding equipment, which can reliably lock the transistor body on the heat sink to ensure that the heat sink has reliable heat dissipation performance.

[0006] In a first aspect, a molding fixture for a transistor and a heat sink is provided, comprising: a base; a transistor positioning groove located on a top surface of the base and used to place a transistor, wherein the transistor comprises a transistor body and an insulating sleeve disposed around the periphery of the transistor body;

[0007] A push rod, used to extend from the side of the transistor positioning groove into the insulating sleeve and push the transistor body to a preset position;

[0008] The pressure strip positioning groove is located at the bottom of the transistor positioning groove and is used to place the pressure strip. The pressure strip is used to lock the transistor body on the heat sink after the transistor body is pushed to the preset position.

[0009] In a possible design, the forming fixture further includes: a heat sink positioning groove for placing the heat sink, and the transistor positioning groove is located at the bottom of the heat sink positioning groove.

[0010] In a possible design, the forming fixture further includes: an avoidance groove for allowing the push rod to pass through and extend into the transistor positioning groove.

[0011] In a possible design, the transistor positioning groove includes: a main positioning groove for placing and positioning the insulating sleeve; and a pin groove for accommodating the pins of the transistor when the transistor body is pushed to the preset position.

[0012] In a possible design, the transistor positioning groove includes a first positioning groove and a second positioning groove, and the pressure strip is used to lock the transistor body in the first positioning groove and the second positioning groove onto the heat sink.

[0013] In one possible design, the push rod includes a first push rod and a second push rod, the first push rod is used to push the transistor body in the first positioning groove to the preset position, and the second push rod is used to push the transistor body in the second positioning groove to the preset position.

[0014] In a possible design, the forming fixture further includes: a driving rod for synchronously driving the first push rod and the second push rod to move, and the first push rod and the second push rod are spaced apart from each other and connected to the driving rod in parallel.

[0015] In a possible design, the forming fixture further includes: a bottom transmission plate, slidably disposed on the bottom surface of the base along the extension and contraction direction of the push rod;

[0016] The side transmission plate is located on the side of the base, and two ends of the side transmission plate are fixedly connected to the bottom transmission plate and the driving rod respectively.

[0017] In a possible design, the forming fixture further includes: a support block, disposed on the bottom surface of the base, for supporting the base.

[0018] In a second aspect, a molding device for a transistor and a heat sink is provided, wherein the molding device includes a molding fixture provided by any possible design in the first aspect.

[0019] According to the molding fixture provided in the embodiment of the present application, the pressure strip and the transistor are first placed in the corresponding positioning grooves, and then the push rod is operated to extend into the interior of the insulating sleeve and push the transistor body therein to a pre-set reasonable position (preset position), that is, the push rod can correct the position of the transistor body so that the pressure strip can be accurately pressed on the transistor body, thereby being able to reliably lock the transistor body on the heat sink, effectively ensuring the assembly quality of the transistor and the heat sink, and ensuring that the heat sink has reliable heat dissipation performance.

[0020] According to the molding fixture provided in the embodiment of the present application, the size and number of the transistor positioning grooves and the pressure strip positioning grooves on the base and the design of the push rod can be adapted to the molding of various types and quantities of transistors and heat sinks. It has high versatility and is conducive to large-scale promotion and implementation. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0022] Figure 1 It is a structural schematic diagram of the forming fixture of the transistor and the heat sink provided in this application.

[0023] Figure 2 yes Figure 1 An exploded view of the forming fixture is shown.

[0024] Figure 3 yes Figure 1 Schematic diagram of the working process of the push rod.

[0025] Figure 4 yes Figure 1 A top view of the base in Figure 2.

[0026] Figure 5 yes Figure 1 Schematic diagram of the structure of the push rod assembly.

[0027] Figure 6 yes Figure 1 Schematic diagram of the principle of determining the length of the push rod.

[0028] Reference numerals:

[0029] 10. Base; 11. First positioning groove; 12. Second positioning groove; 13. Pressure strip positioning groove; 14. Heat sink positioning groove; 15. Avoidance groove; 16. Main positioning groove; 17. Pin groove; 18. Support block;

[0030] 20. Transistor; 21. Transistor body; 22. Insulation sleeve; 23. Pin;

[0031] 30. Push rod assembly; 31. First push rod; 32. Second push rod; 33. Drive rod; 34. Bottom transmission plate; 35. Side transmission plate; 36. Slide rail; 37. Slider. DETAILED DESCRIPTION

[0032] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0033] In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly defined. In this application, unless otherwise clearly defined and defined, the terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral whole; it can be directly connected or indirectly connected through an intermediate medium; it can be internal communication between two elements or an interactive relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0034] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0035] In the description of this application, it should be understood that the terms "inside", "outside", "upper", "bottom", "front", "back" and the like indicate directions or positional relationships (if any) based on the attached Figure 1 The orientation or positional relationship shown is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as a limitation on this application.

[0036] Transistors are widely used electronic components in electronic devices. Transistors generate heat during operation. If this heat is not dissipated promptly, it can damage the transistor and cause device failure. Therefore, transistors are often equipped with heat sinks to help dissipate heat and ensure long-term stable operation of electronic devices.

[0037] At present, the transistor can be locked onto the heat sink through a pressure strip so that the transistor and the heat sink form an integrated structure. The heat generated by the transistor can be promptly conducted to the heat sink and then dissipated into the environment through the heat sink, achieving the purpose of heat dissipation and cooling.

[0038] The molding of the transistor and the heat sink only requires aligning the holes of the transistor and the heat sink and locking them with screws. Therefore, the general transistor and heat sink molding fixture only needs to slot on the fixture, place the pressure strip first, then place the transistor, and finally place the heat sink on top, and use screws to lock the heat sink and pressure strip, thereby forming the transistor and heat sink into an integrated structure.

[0039] Transistors can be divided into metal package (referred to as gold package) transistors, plastic package (referred to as plastic package) transistors, glass shell package (referred to as glass package) transistors, surface package (chip) transistors and ceramic package transistors according to the packaging structure.

[0040] Among them, compared with other types of transistors such as plastic seals, gold-sealed (such as iron-sealed) transistors have better heat dissipation performance and higher reliability, and have been widely used. When a heat sink is used to dissipate heat from a gold-sealed transistor, insulation needs to be set between the two. One insulation method is to wrap the transistor with a silicone sleeve with insulating properties, and then use a pressure strip to lock the transistor body to the heat sink. When a heat sink needs to be molded with multiple transistors at the same time, each transistor needs to be reliably locked to the heat sink.

[0041] However, when using a pressure strip to lock a transistor with a silicone sleeve on a heat sink, since there is no positioning measure between the transistor body and the silicone sleeve, the position of the transistor body in the silicone sleeve is not fixed. The current molding fixture cannot guarantee the relative position of the transistor body and the heat sink, and thus cannot guarantee that the pressure strip can be accurately pressed on the transistor body, and the locking effect cannot be achieved, so that the heat dissipation effect of the heat sink cannot be guaranteed.

[0042] In view of this, an embodiment of the present application provides a forming fixture for a transistor and a heat sink, which is provided with a push rod, which can extend into the silicone sleeve and push the transistor body therein to a suitable position, that is, the push rod can correct the position of the transistor body so that the pressure strip can be accurately pressed on the transistor body, thereby being able to reliably lock the transistor body on the heat sink, ensuring that the heat sink has reliable heat dissipation performance.

[0043] Figure 1 It is a structural schematic diagram of the forming fixture of the transistor and the heat sink provided in this application. Figure 2 yes Figure 1 An exploded view of the forming fixture is shown. Figure 3 yes Figure 1 Schematic diagram of the working process of the push rod. Figure 4yes Figure 1 A top view of the base in Figure 2. Figure 5 yes Figure 1 Schematic diagram of the structure of the push rod assembly. Figure 1-Figure 5 As shown, the forming fixture provided in the embodiment of the present application includes a base 10 and a push rod assembly 30 arranged on the base 10. The base 10 is a rectangular plate structure, and the top surface of the base 10 is provided with multiple positioning grooves including a transistor positioning groove and a pressure strip positioning groove 13.

[0044] The top surface of the base 10 is provided with at least one transistor positioning groove, such as a first positioning groove 11 and a second positioning groove 12. The transistor positioning groove is used to place or accommodate the transistor 20. The transistor positioning groove corresponds to the transistor 20 one by one, and the shapes of the two match each other. The transistor positioning groove can realize the positioning function of the transistor 20 located therein. For example, the transistor positioning groove can be a rectangular groove.

[0045] The top surface of the base 10 is also provided with at least one beading positioning groove 13 for placing or accommodating a beading. The beading positioning groove 13 corresponds to the beading in a one-to-one manner, and the shapes of the two match each other, thereby locating the beading located therein. For example, the beading positioning groove 13 may be a rectangular groove.

[0046] The pressure strip positioning groove 13 is located at the bottom of the transistor positioning groove (for example, the first positioning groove 11 and the second positioning groove 12). The pressure strip positioning groove 13 and the transistor positioning groove are mutually conductive, and part of the notch of the pressure strip positioning groove 13 is located on the bottom wall or bottom surface of the transistor positioning groove. The pressure strip in the pressure strip positioning groove 13 is used to lock the transistor 20 in the transistor positioning groove or install it on the heat sink.

[0047] like Figures 1-4 As shown, the pressure strip positioning groove 13 connects the first positioning groove 11 and the second positioning groove 12. Part of the notch of the pressure strip positioning groove 13 is located on the bottom wall of the first positioning groove 11, and the other part of the notch is located on the bottom wall of the second positioning groove 12. The pressure strip in the pressure strip positioning groove 13 can simultaneously lock the two transistors 20 in the first positioning groove 11 and the second positioning groove 12 on the heat sink, that is, one heat sink can be used to dissipate heat for two or more transistors 20.

[0048] like Figure 3 As shown, transistor 20 includes a transistor body 21 and an insulating sleeve 22. Insulating sleeve 22 is disposed around the periphery of transistor body 21. Transistor body 21 can move relative to insulating sleeve 22, i.e., the positions of the two are not fixed. Exemplarily, insulating sleeve 22 is longer than transistor body 21 and can completely cover transistor body 21.

[0049] like Figure 1 、 Figure 2 and Figure 5 As shown, the push rod assembly 30 includes at least one push rod, for example, a first push rod 31 and a second push rod 32. The push rod is used to extend into the insulating sleeve 22 from the side opening of the transistor positioning groove and push the transistor body 21 to a preset position. At this preset position, the pressure strip can be accurately pressed on the transistor body 21 to achieve a reliable locking effect.

[0050] like Figure 1 and Figure 3 As shown, the insulating sleeve 22 is a hollow structure with openings at both ends. The front end of the push rod faces the proximal opening of the insulating sleeve 22. The push rod can extend from the proximal opening into the interior of the insulating sleeve 22 and can push the transistor body 21 toward the distal opening so that the transistor body 21 can reach a pre-set reasonable position (i.e., a preset position). After the transistor body 21 is pushed to the preset position, the holding bar is locked so that the holding bar can reliably lock the transistor body 21 to the heat sink.

[0051] According to the molding fixture provided in the embodiment of the present application, the pressure strip and the transistor 20 are first placed in the corresponding positioning grooves, and then the push rod is operated to extend into the interior of the insulating sleeve 22 and push the transistor body 21 therein to a pre-set reasonable position (preset position), that is, the push rod can correct the position of the transistor body 21 so that the pressure strip can be accurately pressed on the transistor body 21, thereby being able to reliably lock the transistor body 21 on the heat sink, effectively ensuring the assembly quality of the transistor 20 and the heat sink, and ensuring that the heat sink has reliable heat dissipation performance.

[0052] According to the molding fixture provided in the embodiment of the present application, by adjusting the size and number of the transistor positioning grooves and the pressure strip positioning grooves 13 on the base 10 and the design of the push rod, it can adapt to the molding of various types and quantities of transistors and heat sinks, has high versatility, and is conducive to large-scale promotion and implementation.

[0053] In some examples, the transistor 20 or the transistor body 21 can be a silicon transistor, a germanium transistor, or a gallium arsenide transistor; can be a unipolar transistor or a bipolar transistor; can be a low-power transistor, a medium-power transistor, or a high-power transistor; can be a low-frequency transistor, a high-frequency transistor, or an ultra-high-frequency transistor; can be a low-noise amplifier transistor, a switching transistor, a high reverse voltage transistor, etc., but is not limited to these.

[0054] For example, the transistor 20 or the transistor body 21 may be a diode, a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) transistor, or a rectifier bridge.

[0055] In some examples, transistor 20 or transistor body 21 may be a gold-sealed transistor, such as an iron-sealed transistor, but is not limited thereto.

[0056] In some examples, the insulating sleeve 22 may be a plastic sleeve, a rubber sleeve, or a silicone sleeve. For example, the insulating sleeve 22 may be a silicone sleeve, which not only provides reliable insulation but also has excellent thermal conductivity, allowing the heat generated by the transistor body 21 to be efficiently and promptly transferred to the heat sink.

[0057] In some examples, the heat sink can be a metal heat sink, for example, a heat sink made of aluminum (alloy), copper (alloy) or stainless steel. The heat sink can also be a non-metallic heat sink, for example, a ceramic heat sink or a graphene (ene) heat sink, but is not limited to this.

[0058] In some examples, the pressure strip locks the transistor body 21 onto the heat sink. The heat sink and the pressure strip are fixedly connected, and the transistor body 21 is clamped between the heat sink and the pressure strip, so that the transistor body 21 can be reliably attached to the surface of the heat sink. The heat generated by the transistor body 21 during operation can be efficiently and smoothly conducted to the heat sink through the insulating sleeve 22.

[0059] For example, the heat sink and the pressure strip can be reliably connected by screwing, snapping, riveting or welding. For example, the heat sink and the pressure strip can be fastened by screws (i.e., screwed), and through holes for the screws to pass through can be provided on the heat sink and the pressure strip.

[0060] In some examples, such as Figure 2 As shown, the transistor positioning groove (using the second positioning groove 12 as an example) includes a main positioning groove 16 and a pin groove 17. The main positioning groove 16 is used to accommodate and position the insulating sleeve 22. The pin groove 17 is located on the side of the main positioning groove 16 away from the push rod. The width of the pin groove 17 is smaller than the width of the main positioning groove 16. When the transistor body 21 is pushed to the preset position by the push rod, the pins 23 of the transistor 20 are exposed from the insulating sleeve 22. The pin groove 17 is used to accommodate the exposed pins 23.

[0061] Illustratively, in this preset position, the front end of the pin 23 is close to the side wall of the pin groove 17, for example, the front end of the pin 23 can abut the side wall of the pin groove 17. At this time, the pin groove 17 can also play a limiting role on the transistor body 21, and reliably maintain the transistor body 21 in the preset position.

[0062] In other words, a push rod can be used to extend into the interior of the insulating sleeve 22 to move the transistor body 21 relative to the insulating sleeve 22 until the pin 23 at the front end of the transistor body 21 can rest against the side wall of the pin groove 17, and then the push is stopped. At this time, the push rod can be withdrawn from the insulating sleeve 22 and retracted into the avoidance groove 15.

[0063] By providing the pin slot 17 to accommodate the pin 23, it is not only convenient to observe and verify whether the transistor body 21 is pushed to the preset position, but the pin slot 17 can also protect the pin 23 and facilitate electrical connection between the pin 23 and the circuit board.

[0064] In some examples, such as Figures 1-4 As shown, the molding fixture provided in the embodiment of the present application further includes a heat sink positioning groove 14 , which is used to place a heat sink, and the transistor positioning groove is located at the bottom of the heat sink positioning groove 14 .

[0065] The heat sink positioning groove 14 is used to place or accommodate the heat sink. The heat sink positioning groove 14 corresponds to the heat sink one by one, and the shapes of the two match each other, so as to realize the positioning function of the heat sink located therein. For example, the heat sink positioning groove 14 can be a rectangular groove.

[0066] The heat sink positioning groove 14 is electrically connected to the transistor positioning groove, and the opening of the transistor positioning groove is formed on the bottom wall of the heat sink positioning groove 14. During assembly, the holding strip, transistor 20, and heat sink are placed in their corresponding positioning grooves in sequence. The holding strip and heat sink are then screwed together, and the transistor 20 located therein is then secured or mounted on the heat sink.

[0067] In the embodiment of the present application, the heat sink positioning groove 14 is provided to install and position the heat sink without resorting to other positioning methods, which is beneficial to improving the assembly efficiency and quality of the transistor 20 and the heat sink.

[0068] In some examples, such as Figures 1-4 As shown, the openings of the first positioning groove 11 and the second positioning groove 12 are formed on the bottom wall of the heat sink positioning groove 14, and the pressure strip positioning groove 13 connects the first positioning groove 11 and the second positioning groove 12. In this way, the pressure strip in the pressure strip positioning groove 13 can simultaneously lock the two transistors 20 in the first positioning groove 11 and the second positioning groove 12 onto the heat sink in the heat sink positioning groove 14, so that two or more transistors 20 can be cooled simultaneously through a single heat sink.

[0069] In some examples, the pressure strip in the pressure strip positioning groove 13 can also only lock a transistor 20 in the first positioning groove 11 or the second positioning groove 12 on the heat sink in the heat sink positioning groove 14, that is, the pressure strip, the transistor 20 and the heat sink correspond one to one, and this application does not limit this.

[0070] In some examples, such as Figures 1-4 As shown, the molding fixture provided in this embodiment of the present application further includes a clearance groove 15 provided on the top surface of the base 10. The clearance groove 15 extends from the edge of the base 10 to the transistor positioning groove, allowing the push rod to pass through and extend into the transistor positioning groove. This allows the push rod to continue extending into the insulating sleeve 22 to push the transistor body 21 to a predetermined position.

[0071] The avoidance grooves 15 correspond one-to-one to the transistor positioning grooves, and the two are connected to each other. For example, the first positioning groove 11 is connected to one of the avoidance grooves 15, and the second positioning groove 12 is connected to the other avoidance groove 15. The push rods (for example, the first push rod 31 and the second push rod 32) are retractably arranged in the avoidance grooves 15. The front end of the push rod can pass through the avoidance groove 15 to extend into the transistor positioning groove, and can also be retracted from the transistor positioning groove to the avoidance groove 15.

[0072] like Figures 1-4 As shown, a portion of the slot opening of the avoidance groove 15 is opened on the bottom wall of the heat sink positioning groove 14, and another portion of the slot opening passes through the side wall of the heat sink positioning groove 14 and extends to the edge of the base 10. The push rod is telescopically arranged in the avoidance groove 15.

[0073] In some examples, the push rod can be slidably arranged in the avoidance groove 15, which is conducive to ensuring that the push rod can reliably and smoothly perform telescopic movement, which is conducive to improving the movement accuracy of the push rod, and thus can accurately push the transistor body 21 to the preset position, which is conducive to improving the assembly quality.

[0074] In some examples, the push rod can be kept in the avoidance groove 15 at all times. When the transistor body 21 needs to be pushed, the front end of the push rod extends from the avoidance groove 15 into the transistor positioning groove. When the pushing is completed, the front end retracts from the transistor positioning groove into the avoidance groove 15.

[0075] In some examples, such as Figure 1-Figure 3 、 Figure 5 As shown, the aforementioned push rod includes a first push rod 31 and a second push rod 32. The first push rod 31 and the second push rod 32 are each arranged in an avoidance groove 15. The first push rod 31 is used to push the transistor body 21 in the first positioning groove 11 to a preset position, and the second push rod 32 is used to push the transistor body 21 in the second positioning groove 12 to a preset position.

[0076] That is to say, multiple push rods can be provided to push the multiple transistor bodies 21 to achieve position correction of the multiple transistor bodies 21 , thereby facilitating improved assembly efficiency.

[0077] In some examples, such as Figure 1 、 Figure 2 as well as Figure 5 As shown, the push rod assembly 30 further includes a driving rod 33 , the first push rod 31 and the second push rod 32 are spaced apart from each other and connected in parallel to the driving rod 33 , and the driving rod 33 is used to synchronously drive the first push rod 31 and the second push rod 32 to move.

[0078] Through the above arrangement, the driving rod 33 can drive multiple push rods to push multiple transistor bodies 21 at the same time, that is, only one driving operation is required to achieve position correction of multiple transistor bodies 21, which is beneficial to improving assembly efficiency.

[0079] Considering that different transistor bodies 21 may have different lengths, in order to be able to synchronously push multiple transistor bodies 21 into place, the lengths of different push rods may be different. Figure 6 yes Figure 1 The schematic diagram of the principle of determining the length of the push rod in Figure 6 Let's introduce how to determine the length of the putter.

[0080] like Figure 6 As shown, the base 10 is a rectangular structure, and a plurality of push rods are arranged along the short side of the rectangular structure. The push rods are arranged perpendicularly on the driving rod 33, and the driving rod 33 is parallel to the long side of the rectangular structure. On this basis, it is assumed that the distance between the pins 23 of different transistors 20 and the upper edge of the base is d i (i represents transistors 20 with different serial numbers), the overall length of the transistor is D i (i.e. the sum of the lengths of the transistor body 21 and the pin 23), the length of each push rod is L i Among them, D i It is determined by the size of the material itself. After placing the transistor body 21 on the pressure strip at this imaginary position (i.e., the preset position), d i The value of is the distance from the transistor positioning groove (pin groove 17) to the upper edge of the base 10. i and D i If the length of the push rod is known, it can be determined by the following formula (the C value can be set according to the actual pushing effect. Generally, C is required to be greater than the width of the base 10, mainly for practical convenience):

[0081] L i +D i +d i =C (C is a constant).

[0082] According to the above formula, by reasonably designing different d i and the length of the push rod L i The push rod assembly 30 provided in the embodiment of the present application can be used to push multiple different sizes (i.e. different Di ) are pushed into place at one time, solving the positioning problem of multiple transistor bodies 21 in the insulating sleeve 22 and the pressure strip.

[0083] In some examples, the driving rod 33 is provided with multiple (e.g., 3, 4, or 6) parallel and spaced apart push rods. The multiple push rods are disposed one-to-one within the multiple parallel avoidance grooves 15 to push the multiple transistor bodies 21 to move. The multiple transistor bodies 21 can be locked onto the same heat sink or onto different heat sinks, which is not limited in this application.

[0084] For example, Figure 1 、 Figure 2 as well as Figure 5 As shown, the driving rod 33 is provided with four parallel and spaced apart push rods. These three push rods are used to push the four transistor bodies 21 to move. Two of the transistor bodies 21 are locked on one heat sink, and the other two transistor bodies 21 are locked on another heat sink. In other examples, the four transistor bodies 21 can also be locked on the same heat sink.

[0085] In some examples, such as Figure 1 、 Figure 2 and Figure 5 As shown, the push rod assembly 30 also includes a bottom transmission plate 34 and a side transmission plate 35. The bottom transmission plate 34 is connected to the side transmission plate 35. For example, the bottom transmission plate 34 is horizontally arranged and the side transmission plate 35 is vertically arranged. The two are perpendicular to each other and form an "L" shape structure.

[0086] Among them, the bottom transmission plate 34 is slidably set on the bottom surface of the base 10 along the telescopic direction or length direction of the push rod, and the side transmission plate 35 is located on the side of the base 10. The two ends of the side transmission plate 35 are fixedly connected to the bottom transmission plate 34 and the driving rod 33 respectively.

[0087] Through the above arrangement, multiple push rods can be slidably arranged on the base 10 in turn through structures such as the driving rod 33, the side transmission plate 35 and the bottom transmission plate 34, so that the push rods can only perform telescopic movement in the forward and backward directions within the avoidance groove 15, and no movement in other dimensions will occur, which is beneficial to improving the movement accuracy of the push rods, and can accurately push the transistor body 21 to the preset position, which is beneficial to improving the assembly quality.

[0088] In some examples, a slide rail 36 is provided on the bottom surface of the base 10, and a slider 37 is provided on the side of the bottom transmission plate 34 facing the base 10, and the slider 37 and the slide rail 36 are slidably engaged with each other. Then, the bottom transmission plate 34 is slidably provided on the bottom surface of the base 10.

[0089] In some examples, a driving device such as a servo motor or a stepper motor can be used to drive the bottom transmission plate 34 to slide back and forth on the slide rail 36 .

[0090] In some examples, such as Figure 1 As shown, the molding fixture provided in the embodiment of the present application further includes a support block 18, which is disposed on the bottom surface of the base 10 for supporting the base 10. Two support blocks 18 can be provided, one on each side edge of the bottom surface of the base 10, so that the base 10 and the two support blocks 18 together form an "inverted U" structure, thereby achieving reliable support for the base 10.

[0091] An embodiment of the present application also provides a molding device for a transistor and a heat sink, and the molding device includes the molding fixture provided in the above embodiment.

[0092] In some examples, the molding device may further include a loading device, a unloading device, and a locking device, etc. For example, the loading device and / or the unloading device may include a manipulator or a manipulator arm, and the locking device may include a screw tightening device, etc., but is not limited thereto.

[0093] Since the molding device adopts the molding fixture provided by the above embodiment, the molding device also has the technical effects corresponding to the molding fixture, which will not be described in detail here.

[0094] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A forming fixture for a transistor and a heat sink, characterized in that: include: Base (10); A transistor positioning groove is located on the top surface of the base (10) and is used to place a transistor (20), wherein the transistor (20) comprises a transistor body (21) and an insulating sleeve (22) sleeved around the outer periphery of the transistor body (21); A push rod, used for extending into the insulating sleeve (22) from the side of the transistor positioning groove and pushing the transistor body (21) to a preset position; The pressure strip positioning groove (13) is located at the bottom of the transistor positioning groove and is used to place a pressure strip, and the pressure strip is used to lock the transistor body (21) on the heat sink after the transistor body (21) is pushed to the preset position.

2. The forming fixture according to claim 1, characterized in that: The molding fixture further comprises: The heat sink positioning groove (14) is used for placing the heat sink, and the transistor positioning groove is located at the bottom of the heat sink positioning groove (14).

3. The forming fixture according to claim 2, characterized in that: The molding fixture further comprises: The avoidance groove (15) is used for allowing the push rod to pass through and extend into the transistor positioning groove.

4. The forming fixture according to any one of claims 1 to 3, characterized in that: The transistor positioning groove includes: A main positioning groove (16) for placing and positioning the insulating sleeve (22); The pin groove (17) is used to accommodate the pin (23) of the transistor (20) when the transistor body (21) is pushed to the preset position.

5. The forming fixture according to any one of claims 1 to 3, characterized in that: The transistor positioning groove comprises a first positioning groove (11) and a second positioning groove (12), and the pressure strip is used to lock the transistor body (21) in the first positioning groove (11) and the second positioning groove (12) onto the heat sink.

6. The forming fixture according to claim 5, characterized in that: The push rod comprises a first push rod (31) and a second push rod (32), wherein the first push rod (31) is used to push the transistor body (21) in the first positioning groove (11) to the preset position, and the second push rod (32) is used to push the transistor body (21) in the second positioning groove (12) to the preset position.

7. The forming fixture according to claim 6, characterized in that: The molding fixture further comprises: The driving rod (33) is used for synchronously driving the first push rod (31) and the second push rod (32) to move. The first push rod (31) and the second push rod (32) are spaced apart from each other and connected to the driving rod (33) in parallel.

8. The forming fixture according to claim 7, characterized in that: The molding fixture further comprises: A bottom transmission plate (34) is slidably arranged on the bottom surface of the base (10) along the extension and contraction direction of the push rod; The side transmission plate (35) is located on the side of the base (10), and the two ends of the side transmission plate (35) are fixedly connected to the bottom transmission plate (34) and the driving rod (33) respectively.

9. The forming fixture according to any one of claims 1-3 and 6-8, characterized in that: The molding fixture further comprises: A support block (18) is provided on the bottom surface of the base (10) and is used to support the base (10).

10. A transistor and heat sink molding device, characterized in that: The molding fixture comprises the molding fixture as described in any one of claims 1 to 9.

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