Ejector pin structure, wafer tray assembly and processing equipment of semiconductor device

Abstract

The utility model discloses an ejector pin structure, a wafer tray assembly and processing equipment of a semiconductor device. The ejector pin structure comprises an ejector pin body, wherein a radially outward convex part is arranged below the ejector pin body; the first heavy hammer part is located at the lower end of the ejector pin body, the inner wall of the first heavy hammer part comprises a first groove, and the first groove is located in a connecting area of the first heavy hammer part and the ejector pin body; the spring is located on the lower surface of the convex part, is compressed when the ejector pin body is pressed downwards, provides upward elastic force to abut the convex part into the first groove so as to lock and combine the ejector pin body and the first heavy hammer part, is released when the ejector pin body is pressed downwards again and rotated, and pops the convex part out of the first groove through the upward elastic force; and the ejector pin body and the first heavy hammer part are unlocked and separated. Under the condition that the tray does not need to be dismounted, the ejector pin body can be quickly mounted or replaced, the complexity and time of maintenance work are reduced, the tray can be prevented from being damaged in the dismounting and mounting process, and the maintenance cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to a thimble structure, a wafer tray assembly, and processing equipment for semiconductor devices. Background Art

[0002] In semiconductor process equipment, especially the reaction chamber in thin film deposition equipment, due to the particularity of some deposition processes, there is a lack of cleaning functions such as remote plasma system (RPS). As the process continues, thin film will gradually accumulate on the components in the chamber, especially for key components such as lift pins and wafer trays that involve relative motion, which need to be removed and cleaned in a timely manner. In addition, when the ejector pins have been working for a long time, each ejector pin is prone to different degrees of wear. Therefore, new ejector pins need to be replaced regularly to avoid the risk of unstable wafer transfer due to different degrees of wear of each ejector pin, thereby causing scratches on the back of the wafer.

[0003] The traditional method of installing or replacing the heavy hammer ejector pin requires first dismantling the entire wafer tray and then removing the ejector pin for replacement or cleaning. This not only increases the complexity and time of maintenance work, but may also cause damage to the wafer tray during the disassembly and assembly process, thereby increasing maintenance costs.

[0004] In order to solve the above-mentioned problems existing in the prior art, the art urgently needs an improved ejector pin structure that can realize the rapid installation or replacement of the ejector pin without removing the wafer tray, which not only greatly improves the operating efficiency and reduces the complexity and time of maintenance work, but also avoids damage to the wafer tray during the disassembly and assembly process, thereby reducing maintenance costs. Utility Model Content

[0005] The following is a brief summary of one or more aspects to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceivable aspects and is neither intended to identify key or critical elements of all aspects nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that will be provided later.

[0006] In order to overcome the above-mentioned defects of the prior art, the utility model provides a ejector pin structure, a wafer tray assembly, and a semiconductor device processing equipment, which can realize the rapid installation or replacement of the ejector pin without removing the wafer tray, thereby greatly improving the operating efficiency and reducing the complexity and time of maintenance work, and also preventing the wafer tray from being damaged during the disassembly and assembly process, thereby reducing maintenance costs.

[0007] Specifically, according to the first aspect of the present utility model, the ejector structure provided includes: an ejector body, a radially outward protrusion is provided below the ejector body; a first weight portion is located at the lower end of the ejector body, and the inner wall of the first weight portion includes a first groove, wherein the first groove is located in the connection area between the first weight portion and the ejector body; and a spring is located on the lower surface of the protrusion, wherein the spring is compressed when the ejector body is pressed down, providing an upward elastic force to push the protrusion into the first groove to lock and combine the ejector body and the first weight portion, and is released when the ejector body is pressed down again and rotated, and the protrusion is popped out of the first groove by the upward elastic force to unlock and separate the ejector body and the first weight portion.

[0008] Furthermore, in some embodiments of the present invention, the inner wall of the first weight portion further includes a second groove, and the second groove is an upper opening structure. When the ejector body is pressed down again, the protrusion is rotated into the second groove, and the upward elastic force released by the spring pops out the protrusion from the upper opening structure of the second groove.

[0009] Furthermore, in some embodiments of the present invention, a plurality of protrusions are provided below the ejector body, and the inner wall of the first weight portion includes a corresponding number of a plurality of first grooves and a plurality of second grooves, and each of the first grooves and each of the second grooves are spaced apart to accommodate the plurality of protrusions in the locked and unlocked states, respectively.

[0010] Furthermore, in some embodiments of the present invention, the ejector pin structure further includes: a second weight portion, located at the lower end of the first weight portion, and the second weight portion is detachably connected to the first weight portion via a connecting component.

[0011] Furthermore, in some embodiments of the present invention, a gasket is further included between the lower surface of the protrusion and the spring. In the locked state, the gasket is used to stabilize the spring in the compressed state, so that the spring stably provides the upward elastic force to the ejector body to keep the protrusion pressed upward into the first groove.

[0012] Furthermore, in some embodiments of the present invention, the upper end of the ejector body includes a limiting portion, and during the descending process of the ejector body inserted into the ejector hole of the wafer tray, the descending distance of the ejector body is limited by the limiting portion.

[0013] In addition, the above-mentioned wafer tray assembly provided according to the second aspect of the present invention includes: a wafer tray, which includes a pin hole for accommodating the above-mentioned pin structure provided by the first aspect of the present invention; and the pin structure, which can be raised and lowered in the wafer tray for receiving or delivering wafers.

[0014] Furthermore, in some embodiments of the present invention, the limiting portion at the upper end of the ejector body of the ejector structure is in the shape of an inverted cone, and the upper end of the ejector hole is an inverted cone-shaped opening of corresponding size, so that when the ejector body is descending, the inverted cone-shaped limiting portion and the inverted cone-shaped opening of the ejector hole are engaged and matched to limit the position.

[0015] Furthermore, in some embodiments of the present invention, the wafer tray assembly also includes: a driving device, connected to the wafer tray, for driving the wafer tray to rise and fall, wherein when the wafer tray rises to the point where the inverted conical surface opening of its ejector hole contacts the inverted conical limiting portion at the upper end of the ejector body, the ejector structure rises synchronously with the wafer tray, and when the wafer tray descends and before the inverted conical surface opening of its ejector hole loses contact with the inverted conical limiting portion at the upper end of the ejector body, the ejector structure descends synchronously with the wafer tray.

[0016] In addition, the processing equipment for the above-mentioned semiconductor device provided according to the third aspect of the present invention includes: a reaction chamber for providing a reaction space for process treatment; and the above-mentioned wafer tray assembly provided by the second aspect of the present invention, on which wafers are placed for process treatment of the wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or characteristics may have the same or similar reference numerals.

[0018] Figure 1 A schematic structural diagram of a semiconductor device processing device provided according to some embodiments of the present utility model is shown;

[0019] Figure 2 A schematic structural diagram of a wafer tray assembly provided according to some embodiments of the present utility model is shown;

[0020] Figure 3 An exploded view of an ejector pin structure provided according to some embodiments of the present utility model is shown;

[0021] Figure 4Shows a schematic structural diagram of an ejector body provided according to some embodiments of the present utility model;

[0022] Figure 5 A schematic diagram of a top view of the structure of a first weight part provided according to some embodiments of the present utility model is shown;

[0023] Figure 6 A schematic cross-sectional view of the ejector body and the first weight portion when locked and combined according to some embodiments of the present invention is shown; and

[0024] Figure 7 A schematic diagram of the assembly structure of the ejector body and the first weight part provided according to some embodiments of the present utility model is shown.

[0025] Reference numerals:

[0026] 100 Semiconductor device processing equipment;

[0027] 110 reaction chamber;

[0028] 120 wafer tray assembly;

[0029] 121 wafer tray;

[0030] 122 thimble hole;

[0031] 130 sprinkler heads;

[0032] 140 pads;

[0033] 141 hole position;

[0034] 200 ejector pin structure;

[0035] 210 ejector pin body;

[0036] 211 convex part;

[0037] 220 First Hammer Division;

[0038] 221 first groove;

[0039] 222 second groove;

[0040] 230 limiter;

[0041] 240 Second Hammer Division;

[0042] 250 springs;

[0043] 251 Gaskets; and

[0044] 260 Connecting parts. DETAILED DESCRIPTION

[0045] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and functions of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this utility model are limited to this implementation. On the contrary, the purpose of introducing the utility model in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide an in-depth understanding of the present invention, the following description will contain many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0046] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0047] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood to refer to the orientations depicted in that section and the accompanying drawings. These relative terms are used solely for convenience of description and do not necessarily imply that the devices described herein must be manufactured or operated in a specific orientation. Therefore, they should not be construed as limiting the present invention.

[0048] It is understood that although the terms "first," "second," "third," etc. may be used herein to describe various components, regions, layers, and / or portions, these components, regions, layers, and / or portions should not be limited by these terms, and these terms are merely used to distinguish different components, regions, layers, and / or portions. Thus, a first component, region, layer, and / or portion discussed below may be referred to as a second component, region, layer, and / or portion without departing from some embodiments of the present invention.

[0049] As mentioned above, the traditional method of installing or replacing the heavy hammer ejector pin requires first dismantling the entire wafer tray and then removing the ejector pin for replacement or cleaning. This not only increases the complexity and time of maintenance work, but may also cause damage to the wafer tray during the disassembly and assembly process, thereby increasing maintenance costs.

[0050] In order to solve the above-mentioned problems existing in the prior art, the utility model provides a ejector pin structure, a wafer tray assembly, and a semiconductor device processing equipment, which can realize the rapid installation or replacement of the ejector pin without removing the wafer tray, thereby greatly improving the operating efficiency and reducing the complexity and time of maintenance work, and also preventing the wafer tray from being damaged during the disassembly and assembly process, thereby reducing maintenance costs.

[0051] In some non-limiting embodiments, the above-mentioned ejector pin structure provided in the first aspect of the present invention can be configured in the above-mentioned wafer tray assembly provided in the second aspect of the present invention, and the wafer tray assembly can be further configured in the above-mentioned semiconductor device processing equipment provided in the third aspect of the present invention.

[0052] The following describes the ejector pin structure in conjunction with embodiments of certain wafer tray assemblies and certain semiconductor device processing equipment. Those skilled in the art will appreciate that these embodiments of wafer tray assemblies and semiconductor device processing equipment are merely non-limiting embodiments of the present invention, intended to clearly demonstrate the main concepts of the present invention and provide specific solutions that facilitate implementation by the public, rather than to limit the full operating mode or functionality of the ejector pin structure. Similarly, the ejector pin structure is merely a non-limiting embodiment of the present invention and does not constitute a limitation on the various configurations of the wafer tray assemblies and semiconductor device processing equipment.

[0053] Please see Figure 1 , Figure 1 A schematic structural diagram of a semiconductor device processing device provided according to some embodiments of the present utility model is shown.

[0054] like Figure 1 As shown, in some embodiments of the present invention, a semiconductor device processing apparatus 100 may primarily include a reaction chamber 110. Optionally, a bushing structure may be provided on the inner wall of the reaction chamber 110 to provide a reaction zone for processing the wafer 400 therein. A wafer tray assembly 120 may be provided within the reaction chamber 110 to hold the wafer 400. Furthermore, a showerhead 130 may be provided above the reaction chamber 110 to spray reaction gas onto the wafer tray 121, thereby performing a thin film deposition process on the surface of the wafer 400.

[0055] Specifically, see Figure 2 , Figure 2 A schematic structural diagram of a wafer tray assembly provided according to some embodiments of the present utility model is shown.

[0056] Combine Figure 1 and Figure 2As shown, in some embodiments, the wafer tray assembly 120 may include: a wafer tray 121, which includes a plurality of ejector holes 122 for accommodating the ejector structure 200. The wafer tray 121 may include a heating component for heating the surface of the wafer 400 to provide it with a temperature that meets the process conditions. The ejector structure 200 can be raised and lowered in the wafer tray 121 to receive or deliver the wafer 400. And, as shown in FIG. Figure 1 As shown, a liner 140 may be provided at the bottom of the reaction chamber 110. The liner 140 may be provided with a number of holes 141 corresponding to the number of the ejector structures 200, so that when the ejector structure 200 falls to the ground, its bottom falls into the corresponding hole 141 below it, completing the landing positioning of the ejector structure 200 and preventing the ejector structure 200 from falling in an oblique position.

[0057] Furthermore, in some optional embodiments, the ejector pin structure 200 may include two forms, namely fixed ejector pins and active ejector pins. A fixed ejector pin refers to an ejector pin without an independent driving element, and its movement depends on the lifting mechanism of the wafer tray 121. It only requires a set of driving devices to drive the wafer tray 121 to rise and fall. For a fixed ejector pin, its lifting depends on the lifting and falling of the wafer tray 121. For example, the rising process of the fixed ejector pin is the falling process of the wafer tray 121. The falling of the wafer tray 121 makes the fixed ejector pin higher than the surface of the wafer tray 121, thereby achieving the rising of the fixed ejector pin. Similarly, the falling process of the fixed ejector pin is the rising process of the wafer tray 121. The rising of the wafer tray 121 makes the upper end of the fixed ejector pin flush with the surface of the wafer tray 121, thereby achieving the falling of the fixed ejector pin. The active ejector pin is equipped with an independent driving device such as an air cylinder and a motor, which can achieve lifting movement relatively independent of the wafer tray 121, but two sets of driving devices need to be provided separately. The active ejector can be independently raised and lowered by its corresponding ejector drive device.

[0058] In some embodiments of the present invention, in order to reduce equipment costs, a fixed ejector pin can be selected in combination with a wafer tray 121. A set of driving devices for driving the wafer tray 121 can be used to realize the respective lifting functions of the ejector pin structure 200 and the wafer tray 121.

[0059] like Figure 2As shown, in some embodiments of the present invention, since the fixed ejector structure 200 primarily relies on its own weight to achieve relative movement with the wafer tray 121, the ejector structure 200 may include an ejector body 210 and a first weight portion 220. The first weight portion 220 may be located at the lower end of the ejector body 210 to increase the weight of the ejector body 210. Furthermore, the upper end of the ejector body 210 may further include a stop portion 230. During the process of descending the ejector body 210 while inserted into the ejector hole 122 of the wafer tray 121, the stop portion 230 can limit the descending distance of the ejector body 210.

[0060] Specifically, in some optional embodiments, such as Figure 2 As shown, the limiting portion at the upper end of the ejector body 210 can be in the shape of an inverted cone, and the upper end of the ejector hole 122 can be set to an inverted cone opening of corresponding size, so that when the ejector body 210 is descending, the inverted cone limiting portion 230 can be engaged with the inverted cone opening at the upper end of the ejector hole 122 to limit the position, thereby preventing the ejector body 210 from separating from the wafer tray 121 during the descent process.

[0061] In other embodiments, when the ejector structure 200 is a fixed ejector, the stopper 230 can be used to synchronize the rise and fall of the ejector structure 200 and the wafer tray 121. Specifically, when the wafer tray 121 rises to a certain height, the inverted conical stopper 230 at the upper end of the ejector body 210 contacts and engages with the inverted conical opening at the upper end of the ejector hole 122 in the wafer tray 121. The upper end of the ejector body 210 retracts into the ejector hole 122 of the wafer tray 121, thereby allowing the ejector body 210 to be driven to rise synchronously during the subsequent ascent of the wafer tray 121, and the first weight portion 220 is also lifted synchronously with the ejector body 210. Similarly, during the descent of the wafer tray 121, and before the bottom of the ejector pin body 210 contacts the pad 140, the inverted conical opening of the ejector pin hole 122 always maintains contact with the inverted conical limiting portion 230, and the ejector pin body 210 will also descend synchronously with the wafer tray 121, and the first weight portion 220 will also be synchronously descended together with the ejector pin body 210.

[0062] In some embodiments of the present invention, the ejector body 210 and the first weight portion 220 may be detachably assembled and combined, so that the ejector body 210 can be quickly and conveniently installed or replaced without removing the wafer tray 121 .

[0063] Specifically, please refer to Figure 3 、 Figure 4 and Figure 5 , Figure 3An exploded view of an ejector pin structure provided according to some embodiments of the present invention is shown. Figure 4 The following is a schematic structural diagram of an ejector body provided according to some embodiments of the present invention. Figure 5 A schematic top view of the structure of the first heavy hammer portion provided according to some embodiments of the present utility model is shown.

[0064] like Figure 3 As shown, in some preferred embodiments of the present invention, the ejector structure 200 may include, from top to bottom, an ejector body 210 , a first weight portion 220 , a gasket 251 , a spring 250 , a second weight portion 240 and a connecting component 260 .

[0065] Specifically, please see Figure 4 , especially according to Figure 4 As shown in the partially enlarged view I, a radially outward convex portion 211 may be provided on the lower side wall of the ejector body 210. The ejector body 210 is connected to the first weight portion 220 at its lower end through its convex portion 211. Figure 5 In a connection area between the first weight portion 220 and the ejector body 210 , an inner wall of the first weight portion 220 may include a first groove 221 .

[0066] Please continue back Figure 3 The spring 250 in the ejector structure 200 can be located on the lower surface of the protrusion 211 of the ejector body 210 and contact the lower surface of the protrusion 211. The spring 250 is compressed when the ejector body 210 is pressed down, thereby providing an upward elastic force to push the protrusion 211 into the first groove 221 to lock the ejector body 210 and the first hammer part 220. For details, please refer to Figure 6 and Figure 7 Common understanding, Figure 6 The figure shows a cross-sectional structural diagram of the ejector body and the first weight part when locked and combined according to some embodiments of the present invention. Figure 7 A schematic diagram of the assembly structure of the ejector body and the first weight part provided according to some embodiments of the present utility model is shown.

[0067] When it is necessary to remove the ejector body 210 from the first weight portion 220, the ejector body 210 can be pressed down again and rotated to rotate the protrusion 211 on the ejector body 210 out of the corresponding first groove 221 of the first weight portion 220. At this time, the spring 250, which was originally in a compressed state, is released. The elastic force that originally used to push the protrusion 211 upward to push it into the first groove 221 is completely released, and the protrusion 211 can be ejected from the first groove 221. In other words, the ejector body 210 is ejected from the first weight portion 220, and the ejector body 210 and the first weight portion 220 are unlocked and separated.

[0068] Furthermore, in some preferred embodiments, Figure 5 As shown, the inner wall of the first weight part 220 may further include a second groove 222. Figure 7 As shown, the second groove 222 can be an upwardly open structure. To remove the ejector body 210 from the first weight portion 220, the ejector body 210 can be pressed down again and rotated, causing the protrusion 211 on the ejector body 210 to move from the first groove 221 of the first weight portion 220 into the second groove 222. The upward elastic force released by the relaxed spring 250 then causes the protrusion 211 on the ejector body 210 to pop out of the upwardly open structure of the second groove 222, thereby unlocking and separating the ejector body 210 and the first weight portion 220.

[0069] like Figure 3 As shown, a gasket 251 may optionally be included between the lower surface of the protrusion 211 of the ejector body 210 and the spring 250. When the ejector body 210 and the first weight portion 220 are in a locked state, the gasket 251 is used to stabilize the spring 250 in a compressed state, so that the spring 250 can always and stably provide an upward elastic force to the ejector body 210, thereby keeping the protrusion 211 of the ejector body 210 pressed upward into the first groove 221 of the first weight portion 220.

[0070] In some preferred embodiments, in order to improve the stability of the locking combination between the ejector body 210 and the first hammer part 220, as shown in FIG. Figure 4 As shown, a plurality of protrusions 211, for example, four, are provided below the ejector body 210. Figure 5 As shown, the inner wall of the first weight portion 220 may also include a corresponding number of first grooves 221 and a plurality of second grooves 222, for example, including four first grooves 221 and four second grooves 222. Furthermore, each first groove 221 and each second groove 222 may be spaced apart so as to accommodate each of the plurality of protrusions 211 when the ejector body 210 and the first weight portion 220 are in a locked and engaged state or an unlocked and separated state.

[0071] Furthermore, in order to ensure that the fixed ejector structure 200 can fall smoothly and vertically without deflection, the ejector structure 200 can also achieve the above effect by adding a heavy hammer part. Figure 3 The ejector pin structure 200 may further include a second weight portion 240. Figure 6 As shown, the second weight portion 240 may be located at the lower end of the first weight portion 220 , and the second weight portion 240 may be detachably connected to the first weight portion 220 via a connecting component 260 .

[0072] Specifically, if Figure 3 As shown, the connecting component 260 can be a vacuum screw, and screw holes are provided on the first weight part 220 and the second weight part 240. The first weight part 220 and the second weight part 240 are threadedly connected by the vacuum screw. When the reaction chamber 110 is evacuated to a vacuum state to perform process treatment, since the connecting component 260 in the ejector pin structure 200 is a vacuum screw, the central axis of the vacuum screw is provided with a central through hole. Therefore, the gas remaining in the threaded blind hole will be quickly evacuated from the central through hole of the vacuum screw, allowing the vacuum state in the reaction chamber 110 to reach the target value, avoiding affecting the vacuum system or even contaminating it.

[0073] In summary, the utility model provides a ejector pin structure, a wafer tray assembly, and a semiconductor device processing equipment, which can realize the rapid installation or replacement of the ejector pin without removing the wafer tray, which not only greatly improves the operating efficiency and reduces the complexity and time of maintenance work, but also avoids damage to the wafer tray during the disassembly and assembly process, thereby reducing maintenance costs.

[0074] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A ejector pin structure, characterized in that: include: The ejector body has a radially outward convex portion at its lower portion; a first weight portion, located at the lower end of the ejector body, and having an inner wall thereof including a first groove, wherein the first groove is located in a connection area between the first weight portion and the ejector body; and a spring located on the lower surface of the protrusion, wherein the spring is compressed when the ejector body is pressed down, providing an upward elastic force to push the protrusion into the first groove to lock and combine the ejector body and the first weight portion, and is released when the ejector body is pressed down again and rotated, and the protrusion is ejected from the first groove by the upward elastic force to unlock and separate the ejector body and the first weight portion.

2. The ejector pin structure according to claim 1, wherein: The inner wall of the first weight part also includes a second groove, which is an upper opening structure. When the ejector body is pressed down again, the protrusion is rotated into the second groove, and the upward elastic force released by the spring pops out the protrusion from the upper opening structure of the second groove.

3. The ejector pin structure according to claim 2, wherein: A plurality of protrusions are provided below the ejector body, and the inner wall of the first weight part includes a corresponding number of a plurality of first grooves and a plurality of second grooves, and each of the first grooves and each of the second grooves are arranged at intervals to accommodate the plurality of protrusions in the locked and unlocked states, respectively.

4. The ejector pin structure according to claim 1, wherein: Also includes: The second weight part is located at the lower end of the first weight part, and the second weight part is detachably connected to the first weight part through a connecting component.

5. The ejector pin structure according to claim 1, wherein: A gasket is further included between the lower surface of the protrusion and the spring. In the locked state, the gasket stabilizes the spring in the compressed state, so that the spring stably provides the upward elastic force to the ejector body, keeping the protrusion pressed upward into the first groove.

6. The ejector pin structure according to claim 1, wherein: The upper end of the ejector body includes a limiting portion, and during the descending process of the ejector body inserted into the ejector hole of the wafer tray, the descending distance of the ejector body is limited by the limiting portion.

7. A wafer tray assembly, characterized in that: include: A wafer tray comprising an ejector pin hole for accommodating the ejector pin structure according to any one of claims 1 to 6; as well as The ejector pin structure is movably disposed in the wafer tray and is used to receive or deliver wafers.

8. The wafer tray assembly according to claim 7, wherein: The limiting portion at the upper end of the ejector body of the ejector structure is in an inverted cone shape, and the upper end of the ejector hole is an inverted cone opening of corresponding size, so that when the ejector body is descending, the inverted cone limiting portion and the inverted cone opening of the ejector hole are engaged and matched to limit the position.

9. The wafer tray assembly according to claim 8, wherein: Also includes: A driving device is connected to the wafer tray and is used to drive the wafer tray to rise and fall, wherein when the wafer tray rises to the point where the inverted conical opening of its ejector hole contacts the inverted conical limiting portion at the upper end of the ejector body, the ejector structure rises synchronously with the wafer tray, and when the wafer tray descends and before the inverted conical opening of its ejector hole loses contact with the inverted conical limiting portion at the upper end of the ejector body, the ejector structure descends synchronously with the wafer tray.

10. A semiconductor device processing equipment, characterized in that: include: A reaction chamber, used to provide a reaction space for process treatment; as well as The wafer tray assembly according to any one of claims 7 to 9, wherein wafers are placed thereon and are used for processing the wafers.

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