Circuit board heat dissipation structure of mobile phone

Abstract

The utility model relates to the technical field of heat dissipation structures, in particular to a circuit board heat dissipation structure of a mobile phone, which comprises a circuit board, the circuit board comprises a heat dissipation mechanism used for top heat dissipation and a buckle mechanism used for fixing, and a plurality of protective shells are fixedly mounted at two ends of the top of the circuit board. And heat dissipation grooves are formed in the multiple protective shells, and micro fans are fixedly installed at the opposite ends of the multiple heat dissipation grooves correspondingly. When the circuit board works, heat can be generated, heat dissipation of the top of the circuit board and heat dissipation of the bottom of the circuit board are combined through the heat dissipation mechanism, heat dissipation efficiency is greatly improved, heat generated by the circuit board can be dissipated rapidly, it is guaranteed that the temperature of the circuit board cannot rise continuously, the service life of the circuit board is prolonged, and the service life of the circuit board is prolonged. And the overall reliability of the mobile phone is also improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation structures, and in particular relates to a heat dissipation structure of a circuit board of a mobile phone. Background Art

[0002] The circuit board heat dissipation structure of a mobile phone is a device used to dissipate the heat generated by the mobile phone circuit board when it is working. It can quickly transfer the heat on the circuit board to parts such as the mobile phone casing, thereby achieving heat dissipation. It can effectively reduce the temperature of the circuit board and ensure that the mobile phone's processor, memory and other key components operate within an appropriate temperature range, thereby ensuring the stable performance of the mobile phone.

[0003] Chinese patent: CN210928431U, proposes a circuit board heat dissipation structure for a mobile phone, which solves the problem that the circuit board heat dissipation structure of mobile phones currently on the market is inconvenient when installed and disassembled with the mobile phone circuit board, causing certain troubles to the work of related workers, and the heat dissipation effect is poor and difficult to meet the specified requirements. It includes a shell, and both sides of the shell are provided with slide grooves. The utility model, by providing a shell and a slide groove, etc., makes the circuit board heat dissipation structure of the mobile phone more convenient when installed and disassembled with the mobile phone circuit board, facilitating the work of relevant personnel. By providing a heat dissipation pipe and clean water, etc., the circuit board heat dissipation structure of the mobile phone has a good heat dissipation effect and can meet the specified requirements. The heat dissipation fins are provided to further improve the heat dissipation effect of the circuit board heat dissipation structure of the mobile phone.

[0004] During use of the above patent, the clean water heat dissipation method may have the risk of water leakage, once the water leaks, the circuit board may be damaged, and the clean water heat dissipation effect may be relatively limited. It is also difficult to quickly replace the heat sink, and the steps are relatively more complicated, which reduces the convenience of maintenance. Utility Model Content

[0005] The purpose of the present utility model is to provide a circuit board heat dissipation structure for a mobile phone, so as to solve the problems in the existing technology of water heat dissipation, such as the risk of water leakage, the limited effect of water heat dissipation, the difficulty in quickly replacing the heat sink, and the cumbersomeness.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solutions: a circuit board heat dissipation structure for a mobile phone, comprising a circuit board, wherein the circuit board comprises a heat dissipation mechanism for top heat dissipation and a snap mechanism for fixing;

[0007] A plurality of protective shells are fixedly installed at both ends of the top of the circuit board, a plurality of the protective shells are provided with heat dissipation slots inside, and a micro fan is fixedly installed at one opposite end of the plurality of heat dissipation slots.

[0008] Preferably, a plurality of graphene heat sinks are fixedly mounted on the top of the circuit board, and the plurality of graphene heat sinks are arranged at equal distances.

[0009] Preferably, both ends of the graphene heat sink are fixedly connected to heat conducting plates, one end of the heat conducting plate passes through the side wall of the protective shell and extends to the bottom of the heat dissipation groove, and a heat dissipation fin is fixedly installed on the top of the heat conducting plate.

[0010] Preferably, both ends of the bottom of the circuit board are fixedly connected with an L-shaped plate, the inner side of the L-shaped plate is slidably connected with a heat spreader, and the top surface of the heat spreader is in contact with the bottom surface of the circuit board.

[0011] Preferably, a slide groove is provided on one side of the circuit board, a connecting groove is provided on one side of the slide groove, and a clamping groove is provided on one side of the heat spreader.

[0012] Preferably, a spring is movably connected to the top of the inner wall of the sliding groove, a latch is fixedly connected to the bottom end of the spring, and the latch is slidably connected to the inner wall of the slot.

[0013] Preferably, a connecting block is fixedly connected to one side of the latch tongue, and the connecting block is slidably connected to the inner wall of the connecting groove.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] 1. When the circuit board is working, the utility model generates heat. The heat dissipation at the top of the circuit board is combined with the heat dissipation at the bottom of the circuit board through the heat dissipation mechanism, which greatly improves the heat dissipation efficiency. The heat generated by the circuit board can be quickly dissipated, ensuring that the temperature of the circuit board will not continue to rise. This not only extends the service life of the circuit board, but also improves the overall reliability of the mobile phone.

[0016] 2. When the heat spreader needs to be replaced, the latch mechanism can be used to withdraw the latch from the heat spreader's slot, releasing the latch, so that the heat spreader can be quickly replaced. This makes the disassembly and installation process smoother, reduces maintenance costs, and greatly improves the convenience of replacement. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a side structural diagram of the present utility model;

[0018] Figure 2 This is a schematic diagram of the end cross-sectional structure of the utility model;

[0019] Figure 3 It is a side cross-sectional structural schematic diagram of the utility model;

[0020] Figure 4 for Figure 3 Schematic diagram of the enlarged structure at point A in the middle.

[0021] In the picture:

[0022] 1. Circuit board; 2. Heat sink;

[0023] 3. Heat dissipation mechanism; 31. Protective shell; 32. Micro fan; 33. Heat sink; 34. Graphene heat sink; 35. Heat dissipation fins; 36. Heat conducting sheet;

[0024] 4. Snap mechanism; 41. L-shaped plate; 42. Slide groove; 43. Connecting groove; 44. Connecting block; 45. Spring; 46. Locking tongue; 47. Slot. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] Reference Figures 1-4 As shown, the utility model provides a circuit board heat dissipation structure for a mobile phone, comprising a circuit board 1, wherein the circuit board 1 comprises a heat dissipation mechanism 3 for top heat dissipation and a snap mechanism 4 for fixing;

[0027] A plurality of protective shells 31 are fixedly mounted on both ends of the top of the circuit board 1 . Heat dissipation slots 33 are provided inside the plurality of protective shells 31 . Micro fans 32 are fixedly mounted on opposite ends of the plurality of heat dissipation slots 33 .

[0028] In this embodiment, the protective shell 31 is used to protect the heat dissipation fins 35 from being damaged. The micro fan 32 can actively accelerate the air flow and discharge the hot air inside the heat dissipation slot 33 in time to prevent the circuit board 1 from being affected in performance or even damaged due to excessive temperature.

[0029] In a further embodiment, a plurality of graphene heat sinks 34 are fixedly mounted on the top of the circuit board 1 , and the plurality of graphene heat sinks 34 are arranged at equal intervals.

[0030] In this embodiment, when the circuit board 1 generates heat, the heat is quickly transferred to the graphene heat sink 34 . The graphene heat sink 34 can quickly absorb and transfer the heat generated by the circuit board 1 , thereby greatly improving the heat dissipation efficiency.

[0031] In a further embodiment, both ends of the graphene heat sink 34 are fixedly connected to a heat conducting plate 36 , one end of the heat conducting plate 36 passes through the side wall of the protective shell 31 and extends to the bottom of the heat dissipation groove 33 , and a heat dissipation fin 35 is fixedly installed on the top of the heat conducting plate 36 .

[0032] In this embodiment, after the graphene heat sink 34 absorbs the heat generated by the circuit board 1, the heat is transferred to the heat sink fins 35 through the heat conducting plates 36 at both ends. The heat sink fins 35 increase the contact area with the air. When the micro fan 32 drives the air flow, the heat can be dissipated from the heat sink 33 more efficiently.

[0033] In a further embodiment, L-shaped plates 41 are fixedly connected to both ends of the bottom of the circuit board 1 , and a heat spreader 2 is slidably connected to the inner side of the L-shaped plate 41 , and the top surface of the heat spreader 2 contacts the bottom surface of the circuit board 1 .

[0034] In this embodiment, the L-shaped plate 41 provides an installation position and support for the heat spreader 2, so that the heat spreader 2 contacts the bottom surface of the circuit board 1, can quickly absorb the heat at the bottom of the circuit board and spread it evenly. The heat spreader 2 is slidably connected to the inside of the L-shaped plate, which is convenient for installation and disassembly, while also ensuring good contact with the circuit board 1.

[0035] In a further embodiment, a slide groove 42 is provided on one side of the circuit board 1 , a connecting groove 43 is provided on one side of the slide groove 42 , and a clamping groove 47 is provided on one side of the heat spreader 2 .

[0036] In this embodiment, the slide groove 42, the connecting groove 43 and the card slot 47 are designed to achieve a fixed connection between the circuit board 1 and the heat spreader 2. When the heat spreader 2 needs to be installed, the snap mechanism 4 cooperates with the slide groove 42, the connecting groove 43 and the card slot 47 to achieve a fixing effect.

[0037] In a further embodiment, a spring 45 is movably connected to the top of the inner wall of the slide groove 42 , a latch 46 is fixedly connected to the bottom end of the spring 45 , and the latch 46 is slidably connected to the inner wall of the latch groove 47 .

[0038] In this embodiment, the cooperation of the spring 45 and the tongue 46 can quickly fix the heat spreader 2 on the circuit board 1 without the use of additional tools, thereby improving the installation efficiency. After the tongue 46 is inserted into the slot 47, it can provide a stable connection force to ensure that the heat spreader 2 will not loosen or fall off during use, thereby ensuring the stability of the heat dissipation effect.

[0039] In a further embodiment, a connecting block 44 is fixedly connected to one side of the latch tongue 46 , and the connecting block 44 is slidably connected to the inner wall of the connecting groove 43 .

[0040] In this embodiment, when the tongue 46 moves up and down under the action of the spring 45, the connecting block 44 slides in the connecting groove 43 together with the tongue 46. On the one hand, the connecting block 44 plays the role of connecting the tongue 46, and on the other hand, it ensures the stability and directionality of the movement of the tongue 46 during its movement.

[0041] The working principle of the present invention is as follows: when the circuit board 1 is working, it will generate heat. First, the heat on the top of the circuit board 1 will be quickly conducted to the equidistantly arranged graphene heat sinks 34. The heat conducting plates 36 at both ends of the graphene heat sink 34 will transfer the heat to the heat dissipation fins 35. At the same time, the micro fan 32 starts working. When the micro fan 32 drives the air flow, the heat dissipation fins 35 can more efficiently dissipate the heat from the heat dissipation slot 33, preventing the circuit board 1 from being affected by excessive temperature or even damaged. In addition, the heat at the bottom of the circuit board 1 will be conducted to the heat spreader 2 in contact with it, which will quickly absorb the heat at the bottom of the circuit board 1 and evenly diffuse it. This design greatly improves the heat dissipation efficiency by combining top heat dissipation with bottom heat dissipation, and can achieve that the heat generated by the circuit board 1 can be quickly dissipated, ensuring that the temperature of the circuit board 1 will not continue to rise, which not only extends the service life of the circuit board 1, but also improves the overall reliability of the mobile phone.

[0042] When the heat spreader 2 needs to be replaced, push the connecting block 44, which will drive the tongue 46 to move upward, compress the spring 45, and make the tongue 46 withdraw from the slot 47 of the heat spreader 2, thereby releasing the buckle. Then, slide the old heat spreader 2 outward from the inside of the L-shaped plate 41, and then prepare the new heat spreader 2, align it with the inside of the L-shaped plate 41 and slide it in. When the slot 47 on the heat spreader 2 moves to a position aligned with the tongue 46, release the connecting block 44, and the elastic force of the spring 45 will push the tongue 46 to slide downward and get into the slot 47, completing the installation and fixation of the new heat spreader 2. This design makes the disassembly and installation process smoother, reduces maintenance costs, and greatly improves the convenience of replacement.

[0043] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board heat dissipation structure for a mobile phone, comprising a circuit board (1), characterized in that: The circuit board (1) comprises a heat dissipation mechanism (3) for top heat dissipation and a snap mechanism (4) for fixing; A plurality of protective shells (31) are fixedly mounted on both ends of the top of the circuit board (1); heat dissipation slots (33) are provided inside the plurality of protective shells (31); and micro fans (32) are fixedly mounted on opposite ends of the plurality of heat dissipation slots (33).

2. The circuit board heat dissipation structure of a mobile phone according to claim 1, characterized in that: A plurality of graphene heat sinks (34) are fixedly mounted on the top of the circuit board (1), and the plurality of graphene heat sinks (34) are arranged at equal distances.

3. The circuit board heat dissipation structure of a mobile phone according to claim 2, characterized in that: Both ends of the graphene heat sink (34) are fixedly connected to heat conducting plates (36), one end of the heat conducting plate (36) passes through the side wall of the protective shell (31) and extends to the bottom of the heat dissipation groove (33), and a heat dissipation fin (35) is fixedly installed on the top of the heat conducting plate (36).

4. The circuit board heat dissipation structure of a mobile phone according to claim 1, characterized in that: Both ends of the bottom of the circuit board (1) are fixedly connected to an L-shaped plate (41), the inner side of the L-shaped plate (41) is slidably connected to a heat spreader (2), and the top surface of the heat spreader (2) is in contact with the bottom surface of the circuit board (1).

5. The circuit board heat dissipation structure of a mobile phone according to claim 4, characterized in that: A sliding groove (42) is provided on one side of the circuit board (1), a connecting groove (43) is provided on one side of the sliding groove (42), and a clamping groove (47) is provided on one side of the heat spreader (2).

6. The circuit board heat dissipation structure of a mobile phone according to claim 5, characterized in that: The top of the inner wall of the sliding groove (42) is movably connected with a spring (45), the bottom end of the spring (45) is fixedly connected with a latch tongue (46), and the latch tongue (46) is slidably connected to the inner wall of the latch groove (47).

7. The circuit board heat dissipation structure of a mobile phone according to claim 6, characterized in that: A connecting block (44) is fixedly connected to one side of the latch tongue (46), and the connecting block (44) is slidably connected to the inner wall of the connecting groove (43).

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