Damp-proof structure of HDI circuit board

Abstract

The utility model discloses a moisture-proof structure of an HDI circuit board, which relates to the technical field of circuit boards and comprises the components of a circuit board which bears circuit connection and component installation; the protection assembly is connected to the upper portion of the circuit board, and the protection assembly comprises a horizontally-arranged fixed part and movable parts vertically connected to the two sides of the lower portion of the fixed part; the filling area is arranged on the surface of the fixing part in a concave shape, a drying agent is placed in the filling area, and flow guide assemblies are installed on the lower portion of the fixing part and the inner side of the filling area; according to the utility model, the protective cover formed by combining the movable part and the fixed part is arranged at the upper part of the circuit board, and the surface of the protective cover is provided with the filling area capable of placing the drying agent, so that the drying agent can be placed in the filling area when the protective cover is matched with a radiator to carry out heat dissipation treatment on the circuit board; the air flow can be dehumidified under the action of the drying agent, and the generated air flow is blown to the circuit board through the flow guide assembly, so that the drying effect is improved, and the moisture influence on the circuit board is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a moisture-proof structure of an HDI circuit board. Background Art

[0002] A circuit board, also known as a printed circuit board or printed circuit board, is a highly reliable and flexible printed circuit board made of polyimide or polyester film. It has the characteristics of high wiring density, light weight, thin thickness and good bendability.

[0003] Reference is made to the existing patent announcement number: CN206879282U, a moisture-proof structure of a circuit board on a leakage protector, including a PCB board, on which electronic components are welded, a protective shell covering the welded electronic components, a glue filling hole and a vent hole provided on the protective shell, and a filling glue provided between the protective shell and the PCB board. By filling the electronic components and the protective shell with glue, the electronic components are isolated from the air to achieve a waterproof function.

[0004] However, existing circuit boards are susceptible to moisture in various environments. High humidity can lead to poor circuit performance and even short circuits. Common moisture-proofing methods include applying moisture-proof paint or adhesive, using moisture-proof packaging, and installing the circuit boards in sealed enclosures or cabinets. While these methods offer some protection against moisture, they still have limitations. For example, moisture-proof paint or adhesive can gradually lose their effectiveness over time; moisture-proof packaging loses its effectiveness after being unpacked; and sealed enclosures or cabinets, while effective at preventing moisture, can affect the circuit boards' heat dissipation. Utility Model Content

[0005] The purpose of this utility model is to address the shortcomings of the prior art by proposing a moisture-proof structure for an HDI circuit board. This utility model provides a protective cover composed of a movable portion and a fixed portion disposed above the circuit board. The surface of the protective cover is configured with a loading area for a desiccant. This allows the desiccant to dehumidify the airflow when the circuit board is cooled by a radiator. The airflow is then directed toward the circuit board through a guide assembly, improving the drying effect and reducing the effects of moisture on the circuit board.

[0006] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0007] A moisture-proof structure for an HDI circuit board, comprising:

[0008] Circuit board, which carries circuit connections and component mounting;

[0009] A protective assembly connected to the upper portion of the circuit board, the protective assembly comprising a horizontally arranged fixed portion and movable portions vertically connected to both sides below the fixed portion;

[0010] A filling area is concavely arranged on the surface of the fixing portion, a desiccant is placed inside the filling area, and a guide assembly is installed at the lower part of the fixing portion and inside the filling area;

[0011] A heat dissipation mechanism is installed on the upper portion of the fixing portion.

[0012] The utility model is further configured that the protection assembly further includes: an elastic member and a slider;

[0013] The elastic members are all mounted on both sides of the lower portion of the fixed portion, the sliders are all mounted on the movable ends of the elastic members, and the movable portions are all mounted on the surface of the sliders.

[0014] The utility model is further configured such that a cover plate is connected to the upper portion of the filling area, and the surface of the filling area is constructed as a grid-like air-permeable net.

[0015] The utility model is further configured such that the guide assembly includes: a rotating shaft, a mounting plate, a blade 1 and a blade 2;

[0016] The mounting plates are respectively mounted on both sides of the lower part of the fixing part, the rotating shaft is connected between the mounting plates and passes through the filling area, the blade one is mounted on both sides of the surface of the rotating shaft, and the blade two is mounted on the surface of the rotating shaft and is located in the filling area.

[0017] The utility model is further configured such that the blade 1 and the blade 2 are arranged perpendicularly.

[0018] The utility model is further configured that the heat dissipation mechanism includes: a bracket and a radiator;

[0019] The bracket is installed on the upper part of the fixing part, and the lower part of the bracket is installed with a radiator located above the filling area.

[0020] The utility model is further configured such that components are constructed on the surface of the circuit board, and mounting holes are opened around the surface of the circuit board.

[0021] The utility model is further configured such that the blades 1 and 2 are both distributed in a ring array.

[0022] The beneficial effects of the present invention are as follows: the present invention provides a protective cover composed of a movable part and a fixed part on the upper part of the circuit board, and the surface of the protective cover is structured with a filling area for placing a desiccant, so that when the radiator is used to dissipate heat for the circuit board, the air flow can be dehumidified under the action of the desiccant, and the generated air flow is blown to all directions of the circuit board through the guide component, thereby improving the drying effect and reducing the influence of moisture on the circuit board.

[0023] 1. The moisture-proof structure of the HDI circuit board is equipped with a guide component that cooperates with the radiator. When the radiator is operating, the airflow generated by the radiator after operation can be dehumidified by the desiccant because the desiccant that can absorb a certain amount of moisture is filled in the filling area. At this time, the airflow will also drive the second blade to rotate, so that the second blade can not only move the desiccant to increase the activity of the desiccant and its contact with the air, but also drive the first blade to rotate through the rotating shaft. Under the action of the first and second blades, an airflow is generated to blow to all sides of the circuit board, thereby improving the drying effect and reducing the impact of moisture on the circuit board.

[0024] 2. The moisture-proof structure of the HDI circuit board is provided with a protective component. When the protective component is connected to the circuit board, personnel can pull the movable parts on both sides so that the movable parts can stretch the elastic parts through the slider, thereby clamping the movable parts on both sides of the circuit board. Subsequently, the elastic action generated by the elastic parts can pull the movable parts to clamp the movable parts and the fixed parts on the circuit board for protection, reducing damage to the circuit board and the impact of humid environments, and making disassembly and connection convenient and quick. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a first overall structural diagram of a moisture-proof structure of an HDI circuit board proposed by the present invention;

[0026] Figure 2 This is a second overall structural diagram of a moisture-proof structure of an HDI circuit board proposed by the present invention;

[0027] Figure 3 This is a schematic diagram of the front cross-section structure of a moisture-proof structure of an HDI circuit board proposed in the present invention;

[0028] Figure 4 The figure is a schematic side cross-sectional view of a moisture-proof structure of an HDI circuit board proposed in the present invention.

[0029] In the figure: 1. Circuit board; 2. Fixed part; 3. Bracket; 4. Cover; 5. Component; 6. Movable part; 7. Radiator; 8. Loading area; 9. Breathable net; 10. Rotating shaft; 11. Mounting plate; 12. Blade 1; 13. Blade 2; 14. Slider; 15. Elastic part. DETAILED DESCRIPTION

[0030] The technical solution of this patent is further described in detail below in conjunction with specific implementation methods.

[0031] The following describes in detail embodiments of the present invention, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0032] In the description of this patent, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings. They are only for the convenience of describing this patent and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on this patent.

[0033] In the description of this patent, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," and "set" should be understood in a broad sense. For example, they can refer to fixed connection or set, detachable connection or set, or integral connection or set. Those skilled in the art will understand the specific meanings of the above terms in this patent based on the specific circumstances.

[0034] Reference Figure 1-4 , a moisture-proof structure for an HDI circuit board, comprising: a circuit board 1, which carries circuit connections and component installations; a protective component, which is connected to the upper part of the circuit board 1, the protective component comprising a horizontally arranged fixed part 2 and movable parts 6 vertically connected to both sides below the fixed part 2, providing protection for the circuit board 1, the fixed part 2 firmly supports the entire protective component, and the movable part 6 can be adjusted as needed to adapt to different installation environments; a filling area 8, which is concavely arranged on the surface of the fixed part 2, and a desiccant is placed inside the filling area 8, which can effectively absorb moisture in the surrounding environment, thereby reducing the risk of the circuit board 1 getting damp, and a guide component is installed at the lower part of the fixed part 2 and the inner side of the filling area 8, through which the dried air flow can be guided to blow to the four sides of the circuit board 1, further preventing moisture from eroding the circuit board 1; a heat dissipation mechanism is installed on the upper part of the fixed part 2, for dissipating the heat generated by the circuit board 1 in time to maintain the normal operating temperature of the circuit board 1.

[0035] Specifically, refer to Figure 4The protective assembly also includes: an elastic member 15 and a slider 14; the elastic members 15 are installed on both sides of the lower part of the fixed part 2, the sliders 14 are installed on the movable end of the elastic member 15, and the movable part 6 is installed on the surface of the slider 14. Through this embodiment, when protecting the circuit board 1, personnel can pull the movable parts 6 on both sides so that the movable parts 6 can stretch the elastic members 15 through the sliders 14, thereby clamping the movable parts 6 on both sides of the circuit board 1. Subsequently, the elastic action generated by the elastic member 15 can pull the movable part 6 to clamp the movable part 6 and the fixed part 2 on the circuit board 1 for protection, reducing damage to the circuit board 1 and the influence of the humid environment, and making disassembly and connection convenient and quick.

[0036] Furthermore, a cover plate 4 is connected to the upper portion of the filling area 8, and the surface of the filling area 8 is constructed as a grid-shaped air-permeable net 9. Through this design, the cover plate 4 can prevent the airflow generated by the radiator 7 when it is working from blowing the desiccant in the filling area 8 around, causing waste and affecting the drying effect, and the airflow generated by the radiator 7 can also pass through the cover plate 4 and blow into the filling area 8, and then the airflow will also penetrate the air-permeable net 9 on the surface of the filling area 8 and blow toward the circuit board 1.

[0037] Specifically, refer to Figure 3-4 The guide assembly includes: a rotating shaft 10, a mounting plate 11, a blade 12 and a blade 2 13; the mounting plates 11 are respectively mounted on both sides of the lower part of the fixed part 2, the rotating shaft 10 is connected between the mounting plates 11 and passes through the filling area 8, the blade 12 is mounted on both sides of the surface of the rotating shaft 10, and the blade 2 13 is mounted on the surface of the rotating shaft 10 and is located in the filling area 8. Through this embodiment, the mounting plate 11 provides a stable support for the rotating shaft 10. The design of the rotating shaft 10 allows it to rotate within a certain range, thereby driving the blade 12 and the blade 2 13 to move. The airflow generated by the radiator 7 after work can be dehumidified first under the action of the desiccant, and at this time the airflow will also drive the blade 2 13 to rotate, so that the blade 2 13 can both move the desiccant to increase the activity of the desiccant and the contact with the air, and can also drive the blade 12 to rotate through the rotating shaft 10.

[0038] Furthermore, blade 1 12 and blade 2 13 are arranged perpendicularly. Through this design, an airflow blowing to all directions of the circuit board 1 can be generated under the action of blade 1 12 and blade 2 13, so that the airflow directions generated by blade 1 12 and blade 2 13 are different, thereby improving the drying effect.

[0039] Specifically, refer to Figure 1 、 Figure 3 and Figure 4The heat dissipation mechanism includes: a bracket 3 and a radiator 7; the bracket 3 is installed on the upper part of the fixing part 2, and the lower part of the bracket 3 is installed with the radiator 7 located above the filling area 8. Through this embodiment, the bracket 3 plays the role of supporting and fixing the radiator 7. Through effective heat dissipation, the heat dissipation mechanism can reduce the temperature of the circuit board and its surrounding environment, thereby reducing the possibility of moisture condensation. The radiator 7 can adopt a high-power cooling fan so that the airflow generated after it works can stably blow the blade 2 13 to rotate.

[0040] Furthermore, components 5 are constructed on the surface of the circuit board 1, and mounting holes are provided on all four sides of the surface of the circuit board 1. Through this design, the components 5 are precisely placed on the surface of the circuit board 1 according to the predetermined layout and functional requirements. Through reasonable component layout, the function of the circuit board can be realized, and the mounting holes allow the circuit board 1 to be firmly fixed to the housing or bracket of the device using screws or other fasteners.

[0041] Working principle: When using the present invention, first, when connecting the protective component to the circuit board 1, the personnel can pull the movable parts 6 on both sides so that the movable parts 6 can stretch the elastic parts 15 through the slider 14, thereby clamping the movable parts 6 on both sides of the circuit board 1. Then, the elastic action generated by the elastic parts 15 can pull the movable parts 6 to clamp the movable parts 6 and the fixed parts 2 on the circuit board 1 for protection, reducing the damage to the circuit board 1 and the influence of the humid environment. The disassembly and connection are convenient and quick. Then, as the circuit board 1 is used, the radiator 7 is in operation. Since the interior of the filling area 8 is filled with a desiccant that can absorb a certain amount of moisture, the airflow generated after the radiator 7 is working can first be dehumidified under the action of the desiccant. At this time, the airflow will also drive the blade 2 13 to rotate, so that the blade 2 13 can not only move the desiccant to increase the activity of the desiccant and the contact with the air, but also drive the blade 12 to rotate through the rotating shaft 10. Under the action of the blade 1 12 and the blade 2 13, an airflow is generated to blow to all sides of the circuit board 1, thereby improving the drying effect and reducing the influence of moisture on the circuit board 1.

[0042] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A moisture-proof structure for an HDI circuit board, characterized in that: include: A circuit board (1) carries circuit connections and component mounting; A protective component connected to the upper portion of the circuit board (1), the protective component comprising a horizontally arranged fixed portion (2) and movable portions (6) vertically connected to both sides below the fixed portion (2); A filling area (8) is concavely arranged on the surface of the fixing portion (2), a desiccant is placed inside the filling area (8), and a guide assembly is installed at the lower part of the fixing portion (2) and the inner side of the filling area (8); A heat dissipation mechanism is installed on the upper portion of the fixing portion (2).

2. The moisture-proof structure of an HDI circuit board according to claim 1, characterized in that: The protection assembly further includes: an elastic member (15) and a slider (14); The elastic members (15) are mounted on both sides of the lower portion of the fixed portion (2), the sliders (14) are mounted on the movable ends of the elastic members (15), and the movable portions (6) are mounted on the surfaces of the sliders (14).

3. The moisture-proof structure of an HDI circuit board according to claim 1, characterized in that: The upper portion of the filling area (8) is connected to a cover plate (4), and the surface of the filling area (8) is constructed as a grid-shaped air-permeable net (9).

4. The moisture-proof structure of an HDI circuit board according to claim 1, characterized in that: The flow guide assembly comprises: a rotating shaft (10), a mounting plate (11), a blade 1 (12) and a blade 2 (13); The mounting plates (11) are respectively mounted on both sides of the lower portion of the fixing portion (2); the rotating shaft (10) is connected between the mounting plates (11) and passes through the loading area (8); the blade one (12) is mounted on both sides of the surface of the rotating shaft (10); and the blade two (13) is mounted on the surface of the rotating shaft (10) and is located in the loading area (8).

5. The moisture-proof structure of an HDI circuit board according to claim 4, characterized in that: The blade one (12) and the blade two (13) are arranged perpendicularly to each other.

6. The moisture-proof structure of an HDI circuit board according to claim 1, characterized in that: The heat dissipation mechanism comprises: a bracket (3) and a radiator (7); The bracket (3) is mounted on the upper portion of the fixing portion (2), and a radiator (7) located above the loading area (8) is mounted on the lower portion of the bracket (3).

7. The moisture-proof structure of an HDI circuit board according to claim 1, characterized in that: Components (5) are constructed on the surface of the circuit board (1), and mounting holes are provided around the surface of the circuit board (1).

8. The moisture-proof structure of an HDI circuit board according to claim 4, characterized in that: The blade one (12) and the blade two (13) are both distributed in a ring array.

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