Power device embedded type PCB structure

Abstract

The utility model relates to a PCB (Printed Circuit Board) structure with an embedded power device, which comprises a substrate, copper-clad foils attached to the upper surface and the lower surface of the substrate, a heat dissipation piece embedded in the substrate, the power device arranged on the surface of the heat dissipation piece, and a crimping piece crimped with the power device, two sides of the power device are provided with pins, the heat dissipation piece is provided with connecting grooves, the connecting grooves are located at two sides of the power device, the number of the connecting grooves is the same as that of the pins, and the pins are inserted into the connecting grooves; the crimping part comprises a crimping cap, a crimping column and an elastic element, the crimping column penetrates through and is slidably connected to the crimping cap, the crimping column is sleeved with the elastic element, the crimping cap covers the connecting groove and the power device, and the crimping column tightly presses the pin. The power device embedded type PCB structure designed by the utility model not only can improve the heat dissipation effect of the power device and ensure the stable operation of the power device, but also can realize the rapid disassembly and assembly of the power device.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB boards, and in particular to a power device embedded PCB structure. Background Art

[0002] With the development of the electronic design and manufacturing industry, more and more electronic components are being integrated on limited PCB boards, and the resulting heat generation is becoming increasingly serious. To address this problem, embedded components and heat sinks are currently commonly used to improve the integration and heat dissipation capabilities of PCB boards. For some embedded power devices, such as chips, they are usually soldered to the heat sink inside the substrate before being embedded in the substrate to ensure heat dissipation of the power devices. However, during the PCB manufacturing process, the scrap rate is high. If power components are scrapped along with the PCB boards, it will cause great waste. Therefore, the power devices need to be disassembled and reused. Since the power devices are soldered to the heat sink, disassembly is complicated and easily damaged. Utility Model Content

[0003] In response to the above-mentioned problems, the purpose of the present invention is to design a power device embedded PCB structure, which can not only improve the heat dissipation effect of the power device and ensure the stable operation of the power device, but also realize the rapid disassembly and assembly of the power device.

[0004] The purpose of the utility model is achieved through the following technical solutions:

[0005] A power device embedded PCB structure is designed, including a substrate, copper foil adhered to the upper and lower surfaces of the substrate, a heat sink embedded in the substrate, a power device arranged on the surface of the heat sink, and a crimping piece crimped to the power device; pins are provided on both sides of the power device, and the heat sink is provided with connecting grooves, the connecting grooves are located on both sides of the power device, the number of the connecting grooves is the same as the number of the pins, and the pins are inserted into the connecting grooves; the crimping piece includes a crimping cap, a crimping post that penetrates and is slidably connected to the crimping cap, and an elastic element sleeved on the crimping post, the crimping cap is covered with the connecting groove and the power device, and the crimping post presses the pins.

[0006] The embedded PCB structure of power devices designed in this scheme can be a multi-layer laminate or a single-layer board, that is, the middle substrate can be an insulating substrate or a laminated multi-layer circuit board. By burying the power device in the substrate, the number of soldered components per unit area of ​​the PCB board is increased. In order to improve the heat dissipation capacity of the power device and ensure the normal operation of the embedded power device, a heat sink is buried under the power device. The heat sink adopts a ceramic-based heat sink block, which can ensure both high thermal conductivity and high insulation. The power device and the heat sink are connected by a crimping structure instead of a welding structure, which is simple to assemble and disassemble and has a firm connection. The pins of the power device are inserted into the connection groove, and the power device is covered with a crimping cap to play a protective role. The crimping column and the elastic element cooperate to press and fix the pins of the power device. The crimping column is a copper column and the elastic element is a spring. The crimping column and the PCB circuit are connected to play an electrical connection role. The above design not only improves the heat dissipation effect of the power device and ensures the stable operation of the power device, but also enables the rapid disassembly and assembly of the power device. During the PCB board manufacturing process, if the product is scrapped, the embedded power device can be quickly removed and reused to reduce costs.

[0007] Furthermore, the heat sink includes connection blocks symmetrically arranged on both sides of the power device, the connection grooves are opened on the connection blocks, and the crimping caps are connected to the connection blocks.

[0008] The power device is located between the two connecting blocks. Connecting grooves corresponding to the pins on both sides of the power device are opened on the sides of the two connecting blocks close to the power device. The pins on both sides of the power device are deeply inserted into the connecting grooves, thereby limiting the movement of the power device. The crimping cap and the connecting block form a closed structure, covering the power device, thereby isolating the power device from the outside world.

[0009] Furthermore, a positioning pin is provided on the upper surface of the connecting block where it connects with the crimping cap, and a positioning hole corresponding to the positioning pin is opened on the crimping cap.

[0010] In order to facilitate the assembly of the connecting block and the crimping cap, a positioning pin and positioning hole matching structure is used between the two. The positioning pin on each connecting block is not limited in design form and can be designed as a rectangular pin or as at least one round pin. The positioning hole is designed to match the positioning pin.

[0011] Furthermore, the two side surfaces of the connecting block connected to the crimping cap are provided with limiting grooves, the crimping cap is provided with limiting holes corresponding to the limiting grooves, and the connecting block also includes a pin inserted into the limiting grooves and the limiting holes.

[0012] A latch structure is provided on the two side surfaces where the connecting block and the crimping cap meet to connect and fix the two. The limiting groove is an L-shaped slot, the limiting hole is a straight hole, and the latch is L-shaped. After the latch is inserted into the limiting groove and the limiting hole, the surface of the latch is flush with the end face of the limiting hole; at the same time, the end of the latch that cooperates with the straight limiting hole is a bevel structure to facilitate the removal of the latch.

[0013] Furthermore, the crimping cap is provided with a through hole corresponding to the crimping column, the crimping column includes a pressure block abutting the pin, and a connecting column passing through the through hole, the elastic element is sleeved on the outer periphery of the connecting column and the upper and lower ends are respectively abutted against the crimping cap and the pressure block.

[0014] After the crimping cap is fixedly connected to the connection block using a latch, the elastic element mounted on the connection column is compressed, causing the crimping block to press against the pins on both sides of the power device, thereby connecting the power device to the external circuit. This crimping connection method replaces traditional soldering or gluing methods, not only providing a stable connection, but also facilitating the disassembly and recycling of the power device.

[0015] Furthermore, a top end of the connecting column away from the pressing block is exposed from the crimping cap.

[0016] The crimping post plays the role of electrical connection and conduction. After the crimping cap and the connecting block are assembled, the connecting post extends out of the surface of the crimping cap. During the processing and manufacturing of the PCB board, it is connected to the copper clad layer circuit, thereby realizing the electrical connection of the power device.

[0017] Furthermore, the heat sink also includes a plurality of T-shaped positioning blocks arranged on the side, the base plate is provided with corresponding T-shaped positioning grooves, and the positioning blocks are embedded in the positioning grooves.

[0018] In order to avoid the heat sink from being misaligned when embedded in the groove of the substrate, a wedge-shaped structure is used to limit the heat sink and the groove of the substrate. This can effectively avoid the heat sink from being misaligned when the PCB board is processed, thereby ensuring the stability of the power device connection.

[0019] Furthermore, the bottom surface of the heat sink is flush with the lower surface of the substrate, and the top surface of the crimping cap is flush with the upper surface of the substrate.

[0020] The bottom surface of the heat sink is flush with the lower surface of the substrate, and the top surface of the crimping cap is flush with the upper surface of the substrate, thus forming an integrated flat structure. The copper foil is pressed and pasted on the upper and lower surfaces of the substrate through the prepreg to form a PCB board. The copper foil is then processed into specific outer layer circuits to finally form a PCB board with embedded power devices.

[0021] Compared with the prior art, the beneficial effects of the present invention are:

[0022] The embedded PCB structure of power devices designed in this scheme can be a multi-layer laminate or a single-layer board, that is, the middle substrate can be an insulating substrate or a laminated multi-layer circuit board. By burying the power device in the substrate, the number of soldered components per unit area of ​​the PCB board is increased. In order to improve the heat dissipation capacity of the power device and ensure the normal operation of the embedded power device, a heat sink is buried under the power device. The heat sink adopts a ceramic-based heat sink block, which can ensure both high thermal conductivity and high insulation. The power device and the heat sink are connected by a crimping structure instead of a welding structure, which is simple to assemble and disassemble and has a firm connection. The pins of the power device are inserted into the connection groove, and the power device is covered with a crimping cap to play a protective role. The crimping column and the elastic element cooperate to press and fix the pins of the power device. The crimping column is a copper column and the elastic element is a spring. The crimping column and the PCB circuit are connected to play an electrical connection role. The above design not only improves the heat dissipation effect of the power device and ensures the stable operation of the power device, but also enables the rapid disassembly and assembly of the power device. During the PCB board manufacturing process, if the product is scrapped, the embedded power device can be quickly removed and reused to reduce costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a structural diagram of a power device embedded in a PCB according to an embodiment of the present invention.

[0024] Figure 2 This is a structural diagram of the assembly of a heat sink and a press-fit component according to an embodiment of the present invention.

[0025] Figure 3 for Figure 2 Top view of .

[0026] Figure 4 for Figure 2 Exploded diagram.

[0027] Illustrations: 1. Substrate; 2. Copper clad foil; 3. Heat sink; 4. Power device; 5. Press-fit component; 31. Connecting groove; 32. Connecting block; 33. Positioning block; 41. Pin; 51. Press-fit cap; 52. Press-fit column; 53. Elastic element; 321. Positioning pin; 322. Limiting groove; 323. Pin; 511. Positioning hole; 512. Limiting hole; 513. Through hole; 521. Press block; 522. Connecting column. DETAILED DESCRIPTION

[0028] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein.

[0029] like Figures 1 to 4As shown, this embodiment provides a power device embedded PCB structure, including a substrate 1, a copper foil 2 attached to the upper and lower surfaces of the substrate 1, a heat sink 3 embedded in the substrate 1, and a power device 4 fixed to the surface of the heat sink 3 by a crimping member 5; pins 41 are provided on both sides of the power device 4, and the heat sink 3 is provided with a connecting groove 31, which is located on both sides of the power device 4. The number of the connecting grooves 31 is the same as the number of the pins 41, and the pins 41 are inserted into the connecting groove 31; the crimping member 5 includes a crimping cap 51, a crimping column 52 that is penetrated and slidably connected to the crimping cap 51, and an elastic element 53 sleeved on the crimping column 52, the crimping cap 51 covers the connecting groove 31 and the power device 4, and the crimping column 52 presses the pin 41 tightly.

[0030] The power device embedded PCB structure designed in this scheme can be a multi-layer laminate or a single-layer board, that is, the middle substrate 1 can be an insulating substrate or a laminated multi-layer circuit board. By embedding the power device 4 in the substrate 1, the number of soldered components per unit area of ​​the PCB board is increased. In order to improve the heat dissipation capacity of the power device 4 and ensure the normal operation of the embedded power device 4, a heat sink 3 is embedded below the power device 4. The heat sink 3 adopts a ceramic-based heat sink block, which can ensure both high thermal conductivity and high insulation. The power device 4 and the heat sink 3 are connected by a press-fit structure instead of a welding structure, which is simple to assemble and disassemble and has a firm connection. The pin 41 of the power device 4 is inserted into the connection groove 31, and the power device 4 is covered with a press-fit cap 51 to play a protective role. The pin 41 of the power device 4 is pressed and fixed by the press-fit column 52 and the elastic element 53. The press-fit column 52 is a copper column, and the elastic element 53 is a spring. The press-fit column 52 is electrically connected to the circuit of the PCB. The above design not only improves the heat dissipation effect of the power device 4 and ensures the stable operation of the power device 4, but also enables the rapid disassembly and assembly of the power device 4. During the PCB board manufacturing process, if the product is scrapped, the embedded power device 4 can be quickly removed and reused, thereby reducing costs.

[0031] like Figures 2 to 4As shown, the heat sink 3 includes connecting blocks 32 symmetrically arranged on either side of the power device 4, with connecting grooves 31 defined in the connecting blocks 32 and crimping caps 51 disposed and connected to the connecting blocks 32. The power device 4 is located between the two connecting blocks 32. Connecting grooves 31 corresponding to the pins 41 on either side of the power device 4 are defined on the sides of the two connecting blocks 32 near the power device 4. The pins 41 on either side of the power device 4 are deeply embedded in the connecting grooves 31, thereby restricting the movement of the power device 4. The crimping caps 51 and the connecting blocks 32 form a closed structure, covering the power device 4 and isolating it from the outside world. The upper surface where the connection block 32 and the crimping cap 51 meet is provided with a positioning pin 321, and the crimping cap 51 is provided with a positioning hole 511 corresponding to the positioning pin 321. To facilitate assembly of the connection block 32 and the crimping cap 51, a matching structure of the positioning pin 321 and the positioning hole 511 is adopted between the two. The positioning pin 321 on each connection block 32 is not limited in design form and can be designed as a rectangular pin or as at least one round pin. The positioning hole 511 is designed to match the positioning pin 321. The two side surfaces where the connection block 32 meets the crimping cap 51 are provided with limiting grooves 322, and the crimping cap 51 is provided with limiting holes 512 corresponding to the limiting grooves 322. The connection block 32 also includes a pin 323 inserted into the limiting grooves 322 and the limiting holes 512. A latch structure is provided on the two sides where the connecting block 32 and the crimping cap 51 meet to connect and fix the two. The limiting groove 322 is an L-shaped slot, the limiting hole 512 is a straight hole, and the latch 323 is L-shaped. After the latch 323 is inserted into the limiting groove 322 and the limiting hole 512, the surface of the latch 323 is flush with the end face of the limiting hole 512. At the same time, the end of the latch 323 that matches the straight limiting hole 512 is a bevel structure to facilitate the removal of the latch. The crimping cap 51 is provided with a through hole 513 corresponding to the crimping column 52. The crimping column 52 includes a pressure block 521 that abuts the pin 41, and a connecting column 522 that passes through the through hole 513. The elastic element 53 is sleeved on the outer periphery of the connecting column 522 and abuts the crimping cap 51 and the pressure block 521 at its upper and lower ends, respectively. After the crimping cap 51 is fixedly connected to the connecting block 32 using the latch 323, the elastic element 53 mounted on the connecting post 522 is compressed, causing the pressing block 521 to press against the pins 41 on both sides of the power device 4, thereby connecting the power device 4 to the external circuit. This crimping connection method replaces traditional soldering or gluing methods, not only providing a stable connection, but also facilitating the disassembly and recycling of the power device 4.

[0032] like Figure 1 and Figure 2As shown, the top end of the connecting post 522, away from the pressing block 521, is exposed from the crimping cap 51. The crimping post 52 serves as an electrical connection. After the crimping cap 51 and the connecting block 32 are assembled, the connecting post 522 extends out of the surface of the crimping cap 51. During the PCB manufacturing process, it is connected to the copper clad layer circuit, thereby achieving electrical connection with the power device 4.

[0033] like Figure 1 and Figure 2 As shown, the heat sink 3 also includes several T-shaped positioning blocks 33 provided on the side, and the substrate 1 is provided with corresponding T-shaped positioning grooves, in which the positioning blocks 33 are embedded. To prevent the heat sink 3 from being misaligned when embedded in the substrate groove, a wedge-shaped structure is used to limit the position between the heat sink and the substrate groove. This can effectively prevent the heat sink 3 from being misaligned during PCB processing, thereby ensuring the stability of the connection of the power device 4. The bottom surface of the heat sink 3 is flush with the lower surface of the substrate 1, and the top surface of the crimping cap 51 is flush with the upper surface of the substrate 1, forming a single flat structure. The copper foil 2 is pressed and adhered to the upper and lower surfaces of the substrate 1 through a prepreg to form a PCB board. The copper foil 2 is then processed into a specific outer layer circuit, ultimately forming a PCB board with embedded power devices.

[0034] In the description of the present invention, it should be understood that terms such as "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0035] Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referenced. Therefore, the term "first," "second," and the like may explicitly or implicitly include one or more of the features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0036] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A power device embedded PCB structure, comprising a substrate and copper foils attached to the upper and lower surfaces of the substrate, characterized in that: It also includes a heat sink embedded in the substrate, a power device provided on the surface of the heat sink, and a crimping piece crimped to the power device; pins are provided on both sides of the power device, and the heat sink is provided with connecting grooves, the connecting grooves are located on both sides of the power device, the number of the connecting grooves is the same as the number of the pins, and the pins are inserted into the connecting grooves; the crimping piece includes a crimping cap, a crimping column that is passed through and slidably connected to the crimping cap, and an elastic element sleeved on the crimping column, the crimping cap cover is provided on the connecting groove and the power device, and the crimping column presses the pins.

2. The power device embedded PCB structure according to claim 1, characterized in that: The heat sink comprises connecting blocks symmetrically arranged on both sides of the power device, the connecting grooves are opened on the connecting blocks, and the crimping caps are connected to the connecting blocks.

3. The power device embedded PCB structure according to claim 2, characterized in that: A positioning pin is provided on the upper surface of the connecting block where the connecting block and the crimping cap meet, and a positioning hole corresponding to the positioning pin is opened on the crimping cap.

4. The power device embedded PCB structure according to claim 2, characterized in that: The two side surfaces of the connecting block connected to the crimping cap are provided with limiting grooves, the crimping cap is provided with limiting holes corresponding to the limiting grooves, and the connecting block further comprises a pin inserted in the limiting grooves and the limiting holes.

5. The power device embedded PCB structure according to claim 1, characterized in that: The crimping cap is provided with a through hole corresponding to the crimping column. The crimping column includes a pressure block abutting the pin and a connecting column passing through the through hole. The elastic element is sleeved on the outer periphery of the connecting column and the upper and lower ends are respectively abutted against the crimping cap and the pressure block.

6. The power device embedded PCB structure according to claim 5, characterized in that: The top end of the connecting column away from the pressing block is exposed from the pressing cap.

7. The power device embedded PCB structure according to claim 1, characterized in that: The heat sink also includes a plurality of T-shaped positioning blocks arranged on the side, the base plate is provided with corresponding T-shaped positioning grooves, and the positioning blocks are embedded in the positioning grooves.

8. The power device embedded PCB structure according to claim 2, characterized in that: The bottom surface of the heat sink is flush with the lower surface of the substrate, and the top surface of the crimping cap is flush with the upper surface of the substrate.

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