Mainboard chip mounter

Abstract

The utility model relates to a mainboard chip mounter, which comprises a base, a pressing structure, a clamp structure and a chip mounting driving structure, the pressing structure and the clamp structure are mounted on the base, the chip mounting driving structure is mounted at the lower end of the clamp structure, a chip and a mainboard are sequentially placed on the clamp structure, and the pressing structure drives the mainboard to be pressed on the clamp structure. The patch driving structure is used for driving to attach a patch to the main board, the patch driving structure comprises an air cylinder, a connecting block, a supporting block, a guide block, an attaching block and a driving block, the air cylinder is connected with the driving block through the connecting block, the supporting block is fixedly arranged on the clamp structure, the guide block is clamped on the clamp structure, and the air cylinder drives the driving block to move and drives the attaching block to move along the guide block. According to the mainboard chip mounter, the chip and the mainboard are sequentially placed on the clamp, the pressing structure drives the mainboard to be pressed on the clamp structure, and the chip mounting driving structure drives the chip to be attached to the mainboard, so that the chip is automatically attached to the mainboard, and the chip mounting qualification rate and the chip mounting efficiency are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of mobile phone production, in particular to a mainboard mounting machine. Background Art

[0002] As the core component of a mobile phone, the processing quality of the mobile phone motherboard directly affects the performance of the mobile phone to a certain extent. The mobile phone motherboard is processed through multiple steps, among which the patch process of the mobile phone motherboard is a conventional process. In the existing technology, the patch of the mobile phone motherboard is generally manually attached to the mobile phone motherboard. However, the manual patch precision is low, resulting in a low pass rate of the finished product, frequent rework, and low patch efficiency, which leads to increased production costs. Utility Model Content

[0003] The main purpose of the utility model is to provide a motherboard placement machine to solve the above technical problems and to automatically place chips on mobile phone motherboards.

[0004] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0005] A motherboard patch machine includes a base, a clamping structure, a clamping structure and a patch driving structure, the clamping structure and the clamping structure are installed on the base, the patch driving structure is installed at the lower end of the clamping structure, the patch and the motherboard are placed on the clamping structure in sequence, the clamping structure drives the motherboard to be pressed onto the clamping structure, and the patch driving structure drives the patch to be attached to the motherboard, the patch driving structure includes a cylinder, a connecting block, a supporting block, a guide block, a bonding block and a driving block, the cylinder is connected to the driving block through the connecting block, the supporting block is fixed on the clamping structure, the guide block is clamped on the clamping structure, the cylinder drives the driving block to move, and drives the bonding block to move along the guide block.

[0006] As a preferred technical solution, the driving block is provided with a through hole, and the fitting block moves longitudinally in the through hole.

[0007] As a preferred technical solution, an oblique guide groove is provided on the side wall of the penetration hole, and a guide rod is provided on the fitting block. The guide rod passes through the lower end of the fitting block and moves along the oblique guide groove.

[0008] As a preferred technical solution, the upper surface of the guide block is provided with a patch positioning column for positioning the patch, and the patch is placed on the patch positioning column.

[0009] As a preferred technical solution, the fixture structure is provided with a mainboard positioning column for positioning the mainboard, and the mainboard is inserted into the mainboard positioning column.

[0010] As a preferred technical solution, the clamp structure is further provided with a groove, and the groove is provided at the edge of the clamp structure.

[0011] As a preferred technical solution, the pressing structure includes a rotating cylinder, a rotating rod and a pressing block, the pressing block is installed at the lower end of the rotating rod, and the rotating cylinder drives the rotating rod to rotate.

[0012] The beneficial effect of the present invention is that the above-mentioned motherboard patch machine places the patch and the motherboard on the fixture in sequence, the pressing structure drives the motherboard to be pressed onto the fixture structure, and the patch driving structure drives the patch to be attached to the motherboard, thereby completing automatic patching on the motherboard to improve the patch pass rate and patch efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a structural diagram of the motherboard placement machine involved in the utility model;

[0014] Figure 2 This is a structural diagram of the pressing structure and the clamping structure involved in the present utility model;

[0015] Figure 3 It is a cross-sectional view of the clamp structure involved in the present utility model. DETAILED DESCRIPTION

[0016] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0017] like Figure 1 As shown, a motherboard placement machine includes a base 1, a clamping structure 4, a clamping structure 2 and a patch driving structure 3. The clamping structure 4 and the clamping structure 2 are installed on the base 1, and the patch driving structure 3 is installed on the clamping structure 2. A start button 11 is provided on the base 1. The patch and the motherboard are placed on the clamping structure 2 in sequence through external equipment or manually. The operator clicks the operation button 11, and the clamping structure 4 drives the motherboard to be pressed on the clamping structure 2, and the patch driving structure 3 drives the patch to be attached to the motherboard, thereby completing the automatic placement of the patch on the motherboard.

[0018] like Figure 2 and Figure 3As shown, the fixture structure 2 includes a fixture base plate 21, a support column 22 and a fixture 23. The support column 22 is fixed around the fixture base 21, and the fixture 23 is fixed at the upper end of the support column 22, so that a certain space is formed between the fixture base plate 21 and the fixture 23 for the installation of the patch drive structure 3. The patch drive structure 3 is installed at the bottom of the fixture 23. After the clamping structure 4 drives to clamp the mainboard, the patch drive structure 3 drives the patch to be attached to the mainboard from the lower end of the fixture 23.

[0019] The patch drive structure 3 includes a cylinder 31, a connecting block 32, a supporting block 34, a guide block 35, a bonding block 36 and a driving block 33. The cylinder 31 and the supporting block 34 are installed at the lower end of the fixture 23. The guide block 35 is clamped on the fixture 23. The cylinder 31 is connected to the driving block 33 through the connecting block 32. The driving block 33 moves in the supporting block 34 to ensure that the driving block 33 can move close to the bottom of the fixture 23. A through hole 331 is provided on the driving block 33. The bonding block 36 is provided with a guide block 35. 6 moves longitudinally in the through hole 331. An oblique guide groove 332 is provided on the side wall of the through hole 331. A guide rod 361 is provided on the bonding block 36. The guide rod 361 passes through the lower end of the bonding block 36 and moves along the oblique guide groove 332. The cylinder 31 drives the connecting block 32 to move, thereby driving the driving block 33 to move, so that the guide rod 361 moves along the oblique guide groove 332, thereby driving the bonding block 36 to move along the guide block 35, so as to achieve bonding of the patch to the mainboard.

[0020] The upper surface of the guide block 35 is provided with a patch positioning post 351 for positioning the patch. The patch is provided with a positioning hole. The patch is placed on the patch positioning post 351 through the positioning hole, thereby fixing the position of the patch. The fixture 23 is provided with a motherboard positioning post 231 for positioning the motherboard. The motherboard is provided with a mounting hole. The motherboard is placed on the motherboard positioning post 231 through the mounting hole to prevent the patch and motherboard from moving and causing misalignment when the patch is attached. At the same time, the upper ends of the patch positioning post 351 and the motherboard positioning post 231 are conical in shape to guide the placement of the motherboard and the patch. The fixture 23 is also provided with a groove 232. The groove 232 is set at the edge of the fixture 23 and is set along the edge of the motherboard, a total of external material removal structure or manual removal.

[0021] The pressing structure 4 includes a rotating cylinder 41, a rotating rod 42 and a pressing block 43. The pressing block 43 is installed at the lower end of the rotating rod 42. The rotating cylinder 41 drives the rotating rod 42 to rotate. When the mainboard needs to be pressed, the rotating cylinder 41 drives the rotating rod 42 to rotate to the top of the mainboard, and then drives the rotating rod 42 to move downward, so that the pressing block 43 presses the mainboard.

[0022] The above-described embodiments are merely preferred examples of the present invention and are not intended to limit the scope of implementation of the present invention. Therefore, any equivalent changes or modifications made based on the structures, features, and principles described in the scope of the patent application of the present invention should be included in the scope of the patent application of the present invention.

Claims

1. A motherboard placement machine, characterized in that: It includes a base, a clamping structure, a clamping structure and a patch driving structure, the clamping structure and the clamping structure are installed on the base, the patch driving structure is installed at the lower end of the clamp structure, the patch and the main board are placed on the clamp structure in sequence, the clamping structure drives the main board to be pressed onto the clamp structure, and the patch driving structure drives the patch to be adhered to the main board, the patch driving structure includes a cylinder, a connecting block, a supporting block, a guide block, a bonding block and a driving block, the cylinder is connected to the driving block through the connecting block, the supporting block is fixed on the clamp structure, the guide block is clamped on the clamp structure, the cylinder drives the driving block to move, and drives the bonding block to move along the guide block.

2. The motherboard placement machine according to claim 1, characterized in that: The driving block is provided with a through hole, and the fitting block moves longitudinally in the through hole.

3. The motherboard placement machine according to claim 2, characterized in that: An oblique guide groove is provided on the side wall of the penetration hole, and a guide rod is provided on the fitting block. The guide rod passes through the lower end of the fitting block and moves along the oblique guide groove.

4. The motherboard placement machine according to claim 3, characterized in that: The upper surface of the guide block is provided with a patch positioning column for positioning the patch, and the patch is placed on the patch positioning column.

5. The motherboard placement machine according to claim 4, characterized in that: The clamp structure is provided with a mainboard positioning column for positioning the mainboard, and the mainboard is inserted into the mainboard positioning column.

6. The motherboard placement machine according to claim 5, characterized in that: The clamp structure is further provided with a groove, and the groove is provided at the edge of the clamp structure.

7. The motherboard placement machine according to claim 1, characterized in that: The pressing structure includes a rotating cylinder, a rotating rod and a pressing block. The pressing block is installed at the lower end of the rotating rod. The rotating cylinder drives the rotating rod to rotate.

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