Display TOP lamp bead device and light-emitting module

Abstract

The utility model discloses a lamp bead device for displaying TOP and a light-emitting module, and relates to the technical field of semiconductor devices, the lamp bead device comprises an LED support, the LED support comprises a base and a fence extending from the edge of the base, the fence is enclosed on the base to form an accommodating space, and an LED chip is arranged on the base in the accommodating space; the positive electrode of the LED chip is connected to the positive electrode pin through wire bonding; the negative electrode of the LED chip is connected to the negative electrode pin through wire bonding; and the transparent packaging layer is arranged in the containing space and covers the LED chip, an embedded assembly is arranged between the transparent packaging layer and the surrounding combination surface, and the transparent packaging layer is arranged in the containing space through the embedded assembly so as to cover the LED chip. According to the utility model, the sealing performance of the display TOP lamp bead device is improved, and the possibility of water vapor invasion is reduced, so that the structural sealing performance of the display TOP lamp bead device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor devices, and specifically to a display TOP lamp bead device and a light-emitting module. Background Art

[0002] Existing TOP LED devices usually use TOP stamping injection molding brackets as LED brackets. The LED bracket is divided into two sides, the front side is composed of PPA and stamped metal parts as the functional area of ​​the lamp bead. The PPA part is formed into a fence (i.e., a bowl) through injection molding to protect the functional area. The back side consists of PPA and pins, which are formed by bending. Among them, the front functional area uses silver glue or insulating glue to fix the LED chip in the functional area, and then the bonding wires are welded to the chip electrodes and the functional area to form an electrical connection between the chip and the functional area. The LED bracket is sealed with glue through a dispensing process, and then blanked into RGB three-primary color lamp beads.

[0003] As market requirements become increasingly higher and the usage environment becomes more diverse, especially under conditions of high humidity, LED devices are required to have better sealing properties.

[0004] However, existing LED devices are all formed by encapsulating with glue. Due to the inherent characteristics of the material, the joint surface between the encapsulating glue layer and the enclosure is prone to water vapor intrusion. Moreover, when the internal temperature of the LED device or the ambient temperature changes significantly, the joint surface between the encapsulating glue layer and the enclosure is more likely to cause delamination, thereby making it easier for water vapor to invade, thereby reducing the service life of the LED device. Utility Model Content

[0005] In response to the shortcomings of the existing technology, the purpose of the present invention is to provide a display TOP lamp bead device and a light-emitting module, aiming to improve the sealing between the transparent packaging layer and the LED bracket in the display TOP lamp bead device, thereby reducing the possibility of water vapor intrusion from between the transparent packaging layer and the LED bracket, so as to improve the structural sealing of the display TOP lamp bead device.

[0006] The first aspect of the present invention is to provide a TOP display lamp bead device, the lamp bead device comprising:

[0007] An LED bracket, comprising a base and a fence extending from an edge of the base, wherein the fence is enclosed on the base to form an accommodating space, and an LED chip is arranged on the base in the accommodating space;

[0008] A positive electrode pin, to which the positive electrode of the LED chip is connected via wire bonding;

[0009] A cathode pin, to which the cathode of the LED chip is connected via wire bonding;

[0010] and a transparent encapsulation layer, wherein the transparent encapsulation layer is arranged in the accommodating space to cover the LED chip, and a chimeric component is provided on the joint surface between the transparent encapsulation layer and the enclosure, and the transparent encapsulation layer is arranged in the accommodating space through the chimeric component to cover the LED chip.

[0011] According to one aspect of the above technical solution, the interlocking assembly includes at least one first interlocking portion provided on the inner wall of the enclosure, and at least one second interlocking portion provided on the outer wall of the transparent encapsulation layer, the number of the first interlocking portions and the second interlocking portions corresponding to each other and being interlockingly connected.

[0012] According to one aspect of the above technical solution, either one of the first fitting portion and the second fitting portion is a groove, and the other is a protrusion corresponding to the groove.

[0013] According to one aspect of the above technical solution, the first engaging portion is a groove provided on the inner side wall of the enclosure, and the second engaging portion is a protrusion provided on the outer side wall of the transparent encapsulation layer.

[0014] According to one aspect of the above technical solution, the groove is a discontinuous groove or a continuous groove, and the protrusion is a discontinuous protrusion or a continuous protrusion corresponding to the discontinuous groove or the continuous groove.

[0015] According to one aspect of the above technical solution, the first engaging portion includes two or more continuous grooves that are spaced apart, the second engaging portion includes two or more continuous protrusions that are spaced apart, and the second engaging portions are embedded one by one in the first engaging portion.

[0016] According to one aspect of the above technical solution, the first engaging portions are arranged at equal intervals along the height direction of the inner side wall of the enclosure, and the continuous grooves are arranged at equal intervals along the height direction of the outer side wall of the transparent encapsulation layer.

[0017] According to one aspect of the above technical solution, the first engaging portion is a right-angled groove to form a first stepped structure, and the second engaging portion is a corresponding right-angled protrusion to form a second stepped structure.

[0018] According to one aspect of the above technical solution, the LED chip includes a first LED chip, a second LED chip and a third LED chip, and the first LED chip, the second LED chip and the third LED chip emit different colors;

[0019] Any one of the positive pins and the negative pins is a common pin, and the other is a graded pin, wherein the graded pins include a first pin, a second pin and a third pin;

[0020] One end of the first LED chip, the second LED chip and the third LED chip are all connected to the common pin, and the other ends are connected to the first pin, the second pin and the third pin respectively.

[0021] The second aspect of the present invention is to provide a light-emitting module, including the display TOP lamp bead device described in the above technical solution.

[0022] Compared with the prior art, the display TOP lamp bead device and light-emitting module shown in the utility model have the following beneficial effects:

[0023] The LED bracket shown in the present invention includes a base and an enclosure, wherein the base and the enclosure are enclosed to form an accommodating space, the LED chip is arranged in the accommodating space and is located on the base, and the positive and negative poles of the LED chip are respectively connected to the positive pin and the negative pin through wire bonding, and in order to improve the sealing of the device, a mosaic component is provided between the enclosure and the transparent packaging layer of the LED bracket, which advantageously increases the water vapor intrusion path of the joint surface between the enclosure and the transparent packaging layer, improves the difficulty of water vapor intrusion during use, and reduces the probability of water vapor intrusion, and by setting the mosaic component, the transparent packaging layer can be firmly arranged in the accommodating space, and the mosaic component can also release part of the internal stress when the temperature of the device rises, which is conducive to always maintaining the sealing between the enclosure and the transparent packaging layer, avoiding delamination of the enclosure and the transparent packaging layer in extreme cases, thereby improving the service life of the display TOP lamp bead device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0025] Figure 1 This is a schematic diagram showing the structure of a TOP lamp bead device shown in one embodiment of the present invention;

[0026] Figure 2 for Figure 1 A magnified schematic diagram of part A in the middle;

[0027] Figure 3 This is a partial structural diagram showing a TOP lamp bead device in one embodiment of the present invention;

[0028] Figure 4 This is a bottom view of a TOP lamp bead device shown in one embodiment of the present invention;

[0029] Description of Figure Numbers:

[0030] LED bracket 10, base 11, enclosure 12, first interlocking portion 12a, accommodating space 13, LED chip 20, positive pin 31, negative pin 32, first pin 321, second pin 322, third pin 323, wire 40, transparent packaging layer 50, second interlocking portion 50a. DETAILED DESCRIPTION

[0031] To make the objectives, features, and advantages of the present invention more readily apparent, the following detailed description of specific embodiments of the present invention is provided in conjunction with the accompanying drawings. The accompanying drawings illustrate several embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present invention.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of this invention are intended only to describe specific embodiments and are not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0033] Example 1

[0034] See also Figure 1 - Figure 4 The first embodiment of the present invention provides a TOP lamp bead device. The lamp bead device shown in this embodiment includes an LED bracket 10, which includes a base 11 and a barrier 12 extending from the edge of the base 11, commonly known as a bowl cup, thereby enclosing a receiving space 13 on the base 11. The LED chip is arranged in the receiving space 13 and is located on the base 11.

[0035] The LED chips mounted on the base 11 within the accommodating space 13 include a first LED chip, a second LED chip, and a third LED chip, such as an R-LED chip, a G-LED chip, and a B-LED chip, which are configured to emit red, green, and blue light, respectively. The base 11 of the LED bracket 10 is provided with an adhesive portion for securing the LED chips. The first, second, and third LED chips are each secured to the base 11 via an adhesive portion, such as silver glue.

[0036] The first, second, and third LED chips are all bonded to the positive pin 31 and negative pin 32 of the lamp bead device via wires 40. There is one positive pin 31, which is a common-pole pin, and three negative pins 32, which are polarity-dividing pins: a first pin 321, a second pin 322, and a third pin 323. The positive electrodes of the first, second, and third LED chips are bonded to the bonding portion of the positive pin 31 via wires 40, while the negative electrodes of the first, second, and third LED chips are bonded to the bonding portions of the first, second, and third pins 321, 322, and 323, respectively, via wires 40.

[0037] The positive and negative leads 31 and 32 are both metal, typically made of copper. This is due to its excellent electrical conductivity, ductility, corrosion resistance, and chemical stability. The bonding portion is the metal portion of the positive and negative leads 31 and 32 that extends into the housing 13 of the LED holder 10. One end of the bonding portion extends into the housing 13 for bonding to the LED chip, while the other end remains outside the LED holder 10 for bonding to the circuit board.

[0038] In this embodiment, to enhance the sealing of the LED lamp device, a fitting assembly is provided between the enclosure 12 of the LED holder 10 and the transparent encapsulation layer 50. This fitting assembly securely connects the transparent encapsulation layer 50 to the interior of the enclosure 12, thereby reducing the possibility of moisture intrusion during use. The transparent encapsulation layer 50 is used to guide light when the LED chip is powered on. As a separate component from the LED holder 10, it is required to provide excellent moisture isolation from the enclosure 12 of the LED holder 10 to enhance the sealing of the LED lamp device.

[0039] As shown in the figure, the interlocking component includes at least one first interlocking portion 12a provided on the inner wall of the enclosure 12, and at least one second interlocking portion 50a provided on the outer wall of the transparent encapsulation layer 50. The number of the first interlocking portions 12a and the second interlocking portions 50a is equal, for example, 3, 4 and 5, and the first interlocking portions 12a and the second interlocking portions 50a are correspondingly interlocked and connected.

[0040] By way of example and not limitation, the first interlocking portions 12a are five grooves provided on the inner sidewall of the enclosure 12, and the second interlocking portions 50a are five protrusions provided on the outer sidewall of the transparent encapsulation layer 50, with the five grooves correspondingly interlocking with the five protrusions. Since the enclosure 12 is part of the LED bracket 10 and is injection-molded using PPA material, the first interlocking portions 12a are formed during the injection molding of the LED bracket 10. The transparent encapsulation layer 50 is a structural layer formed after the glue is cured, which is formed by filling and curing the accommodating space 13. Therefore, the second interlocking portions 50a are a mating structure of the first interlocking portions 12a. That is, the first interlocking portions 12a are pre-formed grooves, while the second interlocking portions 50a are protrusions formed after the glue is cured in the accommodating space 13.

[0041] Specifically, the groove of the first engaging portion 12a shown in this embodiment is a continuous groove. For example, when the horizontal cross-section of the enclosure 12 is annular, the horizontal cross-section of the groove of the first engaging portion 12a is also an annular continuous groove. When the horizontal cross-section of the enclosure 12 is rectangular, the horizontal cross-section of the groove of the first engaging portion 12a is also a rectangular continuous groove. Similarly, because the groove of the first engaging portion 12a is a continuous groove and is pre-formed by injection molding, the second engaging portion 50a is formed after the glue is filled into the accommodating space 13 and solidified to form the transparent encapsulation layer 50.

[0042] More specifically, the first engaging portion 12a includes five continuous grooves arranged at intervals on the inner wall of the enclosure 12, and the second engaging portion 50a includes five continuous grooves arranged at intervals on the outer wall of the transparent encapsulation layer 50, and the five continuous protrusions are embedded one by one in the five continuous grooves, and the five continuous protrusions are formed based on the five continuous grooves formed in advance by injection molding.

[0043] It should be noted here that the transparent encapsulation layer 50 is not pre-cured and then assembled into the accommodating space 13, but is formed by curing the glue. The second embedding portion 50a is a specific pattern located on the surface of the transparent encapsulation layer 50 after the glue is cured. This characteristic pattern is formed based on the structural contour of the first embedding portion 12a.

[0044] In this embodiment, an interlocking component including a first interlocking portion 12a and a second interlocking portion 50a that are interlocked with each other is provided between the enclosure 12 of the LED bracket 10 and the transparent encapsulation layer 50. This can increase the water vapor intrusion path between the joint surface of the enclosure 12 and the transparent encapsulation layer 50, making it more difficult for water vapor to invade into the accommodating space 13 to corrode the LED chip. In addition, such an interlocking method increases the structural stability of the transparent encapsulation layer 50 and the LED bracket 10, and can effectively prevent the transparent encapsulation layer 50 from falling off.

[0045] It should also be noted that during the use of the display TOP lamp bead device, as the temperature of the lamp bead device increases or the ambient temperature increases, the internal stress of the lamp bead device will also increase relatively. Through the interlocking component set between the enclosure 12 and the transparent packaging layer 50 in this embodiment, the internal stress of the lamp bead device can be released, and delamination between the transparent packaging layer 50 and the enclosure 12 can be avoided, thereby ensuring that the LED lamp bead device always has good sealing performance and improving the service life of the LED lamp bead device.

[0046] In summary, compared with the prior art, the display TOP lamp bead device shown in this embodiment has the following beneficial effects:

[0047] The LED bracket 10 shown in this embodiment includes a base 11 and an enclosure 12, wherein the base 11 and the enclosure 12 enclose a accommodating space 13, the LED chip is arranged in the accommodating space 13 and is located on the base 11, and the positive and negative poles of the LED chip are bonded to the positive pin 31 and the negative pin 32 respectively through a wire 40. In order to improve the sealing of the device, a mosaic component is provided between the enclosure 12 of the LED bracket 10 and the transparent encapsulation layer 50, which advantageously increases the water vapor intrusion path of the joint surface between the enclosure 12 and the transparent encapsulation layer 50, improves the difficulty of water vapor intrusion during use, and reduces the probability of water vapor intrusion. By setting the mosaic component, the transparent encapsulation layer 50 can be firmly arranged in the accommodating space 13, and the mosaic component can also release part of the internal stress when the temperature of the device rises, which is conducive to always maintaining the sealing between the enclosure 12 and the transparent encapsulation layer 50, avoiding delamination between the enclosure 12 and the transparent encapsulation layer 50 under extreme conditions, thereby improving the service life of the display TOP lamp bead device.

[0048] Example 2

[0049] The second embodiment of the present invention also provides a display TOP lamp bead device. The display TOP lamp bead device shown in this embodiment has a similar structure to the display TOP lamp bead device shown in the first embodiment, except that:

[0050] In this embodiment, the first engaging portion provided on the inner side wall of the enclosure is a protrusion, such as a discontinuous protrusion or a continuous protrusion, and correspondingly, the outer side wall of the transparent encapsulation layer formed after the glue filled in the accommodating space is cured is a discontinuous groove or a continuous groove, which can also improve the sealing between the enclosure and the transparent encapsulation layer, and avoid delamination between the enclosure and the transparent encapsulation layer under extreme circumstances, thereby improving the service life of the display TOP lamp bead device.

[0051] Example 3

[0052] The third embodiment of the present invention also provides a display TOP lamp bead device. The display TOP lamp bead device shown in this embodiment has a similar structure to the display TOP lamp bead device shown in the first embodiment, except that:

[0053] In this embodiment, the first engaging portion provided on the inner side wall of the enclosure is a discontinuous protrusion, and correspondingly, the outer side wall of the transparent encapsulation layer formed after the glue filled in the accommodating space is cured is a discontinuous groove, which can also improve the sealing between the enclosure and the transparent encapsulation layer, and avoid delamination between the enclosure and the transparent encapsulation layer under extreme circumstances, thereby improving the service life of the display TOP lamp bead device.

[0054] Specifically, the discontinuous protrusions have multiple spaced protrusions at the same level, with spaces formed between adjacent protrusions; the corresponding discontinuous grooves have multiple spaced grooves at the same level, with spaces formed between adjacent grooves.

[0055] Of course, in some other feasible embodiments, the multiple protrusions of the spaced protrusions are not arranged at the same horizontal height, and correspondingly, the multiple grooves of the spaced grooves are also not arranged at the same horizontal height. This can ensure a higher structural stability between the enclosure and the transparent packaging layer, but the sealing performance may be slightly reduced.

[0056] Example 4

[0057] The fourth embodiment of the present utility model provides a light-emitting module, which includes the display TOP lamp bead device shown in any of the above embodiments, and also includes a circuit board, etc. The positive pin and the negative pin in the display TOP lamp bead device are exposed at one end of the LED bracket and bonded to the solder joint of the circuit board, thereby completing the electrical connection between the display TOP lamp bead device and the circuit board.

[0058] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0059] The above-described embodiments merely represent several implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A TOP lamp bead device, characterized in that: The lamp bead device includes: An LED bracket, comprising a base and a fence extending from an edge of the base, wherein the fence is enclosed on the base to form an accommodating space, and an LED chip is arranged on the base in the accommodating space; A positive electrode pin, to which the positive electrode of the LED chip is connected via wire bonding; A cathode pin, to which the cathode of the LED chip is connected via wire bonding; and a transparent encapsulation layer, wherein the transparent encapsulation layer is arranged in the accommodating space to cover the LED chip, and a chimeric component is provided on the joint surface between the transparent encapsulation layer and the enclosure, and the transparent encapsulation layer is arranged in the accommodating space through the chimeric component to cover the LED chip.

2. The display TOP lamp bead device according to claim 1, characterized in that: The interlocking assembly includes at least one first interlocking portion provided on the inner wall of the enclosure, and at least one second interlocking portion provided on the outer wall of the transparent encapsulation layer. The number of the first interlocking portions corresponds to that of the second interlocking portions and they are interlockingly connected.

3. The display TOP lamp bead device according to claim 2, characterized in that: Either one of the first fitting portion and the second fitting portion is a groove, and the other is a protrusion corresponding to the groove.

4. The display TOP lamp bead device according to claim 3, characterized in that: The first engaging portion is a groove provided on the inner side wall of the enclosure, and the second engaging portion is a protrusion provided on the outer side wall of the transparent packaging layer.

5. The display TOP lamp bead device according to claim 4, characterized in that: The groove is a discontinuous groove or a continuous groove, and the protrusion is a discontinuous protrusion or a continuous protrusion corresponding to the discontinuous groove or the continuous groove.

6. The display TOP lamp bead device according to claim 5, characterized in that: The first embedding portion includes two or more continuous grooves that are spaced apart, the second embedding portion includes two or more continuous protrusions that are spaced apart, and the second embedding portions are embedded in the first embedding portion one by one.

7. The display TOP lamp bead device according to claim 6, characterized in that: The first engaging portions are arranged at equal intervals along the height direction of the inner side wall of the enclosure, and the continuous grooves are arranged at equal intervals along the height direction of the outer side wall of the transparent encapsulation layer.

8. The display TOP lamp bead device according to claim 7, characterized in that: The first engaging portion is a right-angle groove to form a first stepped structure, and the second engaging portion is a corresponding right-angle protrusion to form a second stepped structure.

9. The display TOP lamp bead device according to any one of claims 1 to 8, characterized in that: The LED chips include a first LED chip, a second LED chip, and a third LED chip, and the first LED chip, the second LED chip, and the third LED chip emit light of different colors; Any one of the positive pins and the negative pins is a common pin, and the other is a graded pin, wherein the graded pins include a first pin, a second pin and a third pin; One end of the first LED chip, the second LED chip and the third LED chip are all connected to the common pin, and the other ends are connected to the first pin, the second pin and the third pin respectively.

10. A light emitting module, characterized in that: The device comprises a display TOP lamp bead device as described in any one of claims 1 to 9.

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