Damp and hot gas cooling and drying device

Abstract

The utility model provides a damp and hot gas cooling and drying device which comprises a refrigeration cavity, a heat conduction column, a semiconductor refrigeration sheet, a heat dissipation module and a heat conduction pipe, and an air inlet hole, a gas-liquid separation valve and an air outlet hole are formed in the refrigeration cavity; the heat conduction column is located in the hollow cavity of the refrigeration cavity, and one end of the heat conduction column is fixed to one end face of the refrigeration cavity. The refrigeration surface of the semiconductor refrigeration sheet is attached to the outside of the end surface of the refrigeration cavity connected with the heat conduction column; the heat dissipation module is connected to the heating surface of the semiconductor chilling plate; the heat conduction pipe is bent into a spiral structure and is wound and attached to the heat conduction column, an air inlet of the heat conduction pipe is communicated with the air inlet hole, an air outlet of the heat conduction pipe is communicated with an inlet of the gas-liquid separation valve, and an air outlet of the gas-liquid separation valve is communicated with the air outlet hole. The wet and hot gas is condensed in the heat conduction pipe, and then the condensed moisture is separated through the gas-liquid separation valve, so that the dry gas is obtained, and the whole device is simple in structure, convenient to carry, good in cooling effect and high in efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of gas drying, in particular to a device for cooling and drying hot and humid gas. Background Art

[0002] During production and experimentation, moisture in the gas may have adverse effects on equipment and processes, so the gas needs to be dried to remove moisture. Gas drying methods include adsorption drying, freeze drying, thermal drying, membrane separation, etc. Thermal drying refers to filtering the gas containing water vapor first, then heating the filtered gas to evaporate the water vapor to form water vapor, thereby forming a hot and humid mixed gas with the gas, and then rapidly cooling the hot and humid gas to condense the moisture in the gas into water. The cooled gas and condensed water are discharged separately, and separated to obtain dry cold gas. Thermal drying is widely used in industrial production due to its advantages such as large processing capacity and low processing cost.

[0003] When cooling hot and humid gas, the current process mostly uses water curtains, water baths or ventilation ducts to cool the hot and humid gas. However, these methods require the construction of a complete set of systems, and the cooling effect is not ideal. In addition, the construction of a complete system also means that the cooling device requires a lot of space, transportation costs, labor costs and time costs. Summary of the Invention

[0004] In response to the shortcomings of the existing technology, the utility model provides a device for cooling and drying humid hot gas. The device uses a semiconductor refrigeration plate to cool the heat pipe in the refrigeration chamber, so that the humid hot gas is condensed in the heat pipe, and then the condensed water is separated by a gas-liquid separation valve to obtain dry gas. The entire device has a simple structure, is easy to carry, and has good cooling effect and high efficiency.

[0005] The device cools the heat pipe connected to the cooling cavity, thereby cooling the high-temperature gas passing through the heat pipe. The device has a simple structure, is easy to carry, and has good cooling effect and high efficiency.

[0006] The technical solutions adopted to achieve the above-mentioned purpose of the utility model are:

[0007] A device for cooling and drying hot and humid gas, wherein hot and humid gas flows through the device for cooling, condensing and drying, and the device comprises:

[0008] The refrigeration chamber is a closed structure with a hollow cavity inside and an air inlet, a gas-liquid separation valve and an air outlet.

[0009] A heat-conducting column is located in the hollow cavity of the refrigeration chamber, one end of the heat-conducting column is fixed to one end surface of the refrigeration chamber, and the other end of the heat-conducting column is suspended in the air;

[0010] The semiconductor refrigeration plate includes a cooling surface and a heating surface. The cooling surface of the semiconductor refrigeration plate is installed against the outside of the end surface of the refrigeration cavity connected to the heat-conducting column to cool the heat-conducting column.

[0011] The heat dissipation module is connected to the heating surface of the semiconductor refrigeration plate to dissipate the heat generated by the heating surface;

[0012] The heat conduction pipe is bent into a spiral structure and coiled on the heat conduction column. The air inlet of the heat conduction pipe is connected to the air inlet hole on the refrigeration chamber, the air outlet of the heat conduction pipe is connected to the inlet of the gas-liquid separation valve, and the air outlet of the gas-liquid separation valve is connected to the air outlet hole on the refrigeration chamber.

[0013] The refrigeration chamber includes a cylinder and end cover plates connected to both ends of the cylinder, and the heat conducting column is fixed to one of the end cover plates.

[0014] The end cover plate fixed to the heat-conducting column, the cylinder and the heat-conducting column are connected to form an integrated structure, and the end cover plate fixed to the heat-conducting column is made of heat-conducting material.

[0015] The end cover plate not fixed to the heat-conducting column is detachably connected to the cylinder through a flange, and the air inlet, gas-liquid separation valve and air outlet on the refrigeration cavity are all arranged on the end cover plate not fixed to the heat-conducting column.

[0016] The outside of the refrigeration chamber is wrapped with a heat-insulating layer.

[0017] A wiring panel is fixed to the outside of the end face of the refrigeration cavity connected to the heat-conducting column. The wiring panel is a square frame structure with a wire groove provided on the wiring panel. The semiconductor refrigeration plate is placed in the square frame of the wiring panel and abuts against the refrigeration cavity, and the wires on the semiconductor refrigeration plate are led out through the wire groove and connected to an external power supply.

[0018] The end surface of the refrigeration cavity connected to the heat-conducting column is fixed with a heat-conducting base. When the wiring panel is fixed on the refrigeration cavity, the heat-conducting base is located in the square frame of the wiring panel. The semiconductor cooling plate is fixed to the heat-conducting base to cool the heat-conducting base, thereby cooling the heat-conducting base and thus cooling the heat-conducting column.

[0019] A heat dissipation base is fixed to the bottom of the heat dissipation module, and the heat dissipation module is fixed on the refrigeration cavity so that the heat dissipation base is in contact with the heating surface of the semiconductor refrigeration plate.

[0020] The heat conduction pipe is a copper pipe.

[0021] The air inlet of the heat conducting pipe and the air inlet hole on the refrigeration chamber, the air outlet of the heat conducting pipe and the inlet of the gas-liquid separation valve, and the air outlet of the gas-liquid separation valve and the air outlet hole on the refrigeration chamber are all connected through the gas pipeline.

[0022] Compared with the existing technology, the humid hot gas cooling and drying device provided by the utility model has the following advantages: 1. In the utility model, the heat conduction tube in the refrigeration cavity is cooled by a semiconductor refrigeration plate, the humid hot gas is condensed in the heat conduction tube, and the condensed water is separated by a gas-liquid separation valve to obtain dry gas. The whole device has a simple structure, is easy to carry, and has good cooling effect and high efficiency.

[0023] 2. The heat pipe in the present invention is preferably a copper pipe, which has good heat conduction effect and can ensure that the semiconductor refrigeration plate can continuously cool the heat pipe; and the heat pipe is bent into a spiral structure, which prolongs the residence time of the moist hot gas in the heat pipe, thereby increasing the gas cooling time and enhancing the cooling effect.

[0024] 3. The heating surface of the semiconductor refrigeration plate in the present invention is connected to a heat dissipation module, which dissipates the heat generated by the semiconductor refrigeration plate into the atmosphere in a timely manner to ensure the cooling effect of the semiconductor refrigeration plate; at the same time, the insulation layer wrapped around the outside of the refrigeration cavity isolates the external atmospheric environment from the environment inside the refrigeration cavity, ensuring the cooling effect and efficiency inside the refrigeration cavity.

[0025] 4. The refrigeration chamber in the present invention includes a cylinder and end covers connected to both ends of the cylinder. The end covers not fixed to the heat-conducting columns are detachably connected to the cylinder through flanges, which facilitates the installation and maintenance of the heat-conducting pipes in the refrigeration chamber. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the overall structure of the hot and humid gas cooling and drying device provided by the utility model;

[0027] Figure 2 This is a schematic diagram of an explosion of the hot and humid gas cooling and drying device provided by the utility model;

[0028] Figure 3 A partial cross-sectional view of the hot and humid gas cooling and drying device provided by the present invention;

[0029] In the figure: 1-refrigeration chamber, 101-cylinder, 102-fixed end cover, 103-movable end cover, 2-heat conducting column, 3-semiconductor refrigeration plate, 4-heat dissipation module, 5-heat conducting pipe, 6-cable panel, 601-wire trough, 7-heat conducting base, 8-adapter plate, 9-heat dissipation base, 10-air inlet nozzle, 11-air outlet nozzle, 12-gas-liquid separation valve, 1201-drain outlet. DETAILED DESCRIPTION

[0030] The present invention will be described in detail below with reference to the accompanying drawings.

[0031] The structure of the hot and humid gas cooling and drying device provided by the utility model is as follows Figures 1 to 3 As shown, water-containing gas is heated to generate hot and humid gas, which then flows through a cooling and drying device, where the water vapor contained in the hot and humid gas is cooled, condensed, and dried. In this embodiment, the hot and humid gas cooling and drying device includes a refrigeration chamber 1, a heat-conducting column 2, a semiconductor cooling plate 3, a heat dissipation module 4, and a heat pipe 5.

[0032] The refrigeration chamber is a sealed structure with a hollow cavity inside. Preferably, the refrigeration chamber is a cylindrical structure with a hollow cavity inside. In this embodiment, the refrigeration chamber includes a cylinder 101 and end covers connected to both ends of the cylinder. Specifically, one end cover (herein designated as the fixed end cover 102) is connected to the cylinder as an integrated structure, and the other end cover (herein designated as the movable end cover 103) is detachably connected to the cylinder via a flange, facilitating the subsequent installation and connection of the heat pipe in the refrigeration chamber.

[0033] The heat-conducting column is a heat-conducting column. The heat-conducting column is located in the hollow cavity of the refrigeration cavity. One end of the heat-conducting column is fixed to one end surface of the refrigeration cavity, and the other end of the heat-conducting column is suspended in the air. Specifically, the heat-conducting column is fixed to the fixed end cover plate of the refrigeration cavity. Preferably, the heat-conducting column, the fixed end cover plate and the cylinder are connected to form an integrated structure.

[0034] A semiconductor refrigeration plate is a heat exchange functional element made of semiconductor material. It is an existing element whose principle is based on the Peltier effect. This element has the advantages of small size, high efficiency, fast cooling and cooling, and high integration. The semiconductor refrigeration plate includes a cooling surface and a heating surface. The cooling surface of the semiconductor refrigeration plate is installed against the outside of the end surface (i.e., the fixed end cover plate) of the refrigeration chamber connected to the heat-conducting column to cool the heat-conducting column. Specifically, the fixed end cover plate is made of a heat-conducting material, such as copper, iron, etc., to ensure the cooling efficiency of the semiconductor refrigeration plate on the heat-conducting column. In order to facilitate production and manufacturing, in this embodiment, the fixed end cover plate, the cylinder and the heat-conducting column are all made of a heat-conducting material. Since the cylinder is made of a heat-conducting material, it exchanges heat with the outside world quickly. In this embodiment, the outside of the refrigeration chamber (outside the cylinder) is wrapped with a thermal insulation layer (not shown in the figure). The thermal insulation layer is made of ceramic fiber material, which has a good thermal insulation and sealing effect.

[0035] Because the semiconductor refrigeration chip generates heat while cooling (the temperature of the heating surface of the semiconductor refrigeration chip is approximately 60°C during operation), the heat generated by the semiconductor refrigeration chip's heating surface needs to be dissipated promptly through a heat dissipation module. In this embodiment, the heat dissipation module is connected to the heating surface of the semiconductor refrigeration chip and dissipates the heat generated by the heating surface into the atmosphere. At the same time, the insulation layer wrapped around the outside of the refrigeration chamber isolates the external atmospheric environment from the environment inside the refrigeration chamber, ensuring the cooling effect and efficiency inside the refrigeration chamber.

[0036] The heat dissipation module is a conventional heat dissipation structure, including an integrated fan and heat sink. The heat dissipation module can be operated after being connected to an external power supply.

[0037] In this embodiment, a wiring panel 6 is fixed to the outside of the fixed end cover plate by bolts. The wiring panel is a square frame structure with a wire trough 601 provided on the wiring panel. The semiconductor cooling plate is placed in the square frame of the wiring panel and is in contact with the fixed end cover plate. The wires on the semiconductor cooling plate are led out through the wire trough and connected to an external power supply. After the semiconductor cooling plate is powered, the semiconductor cooling plate begins to cool. Specifically, a heat-conducting base 7 is fixed to the outside of the fixed end cover plate. When the wiring panel is fixed to the fixed end cover plate, the heat-conducting base is located in the square frame of the wiring panel. The semiconductor cooling plate is fixed to the heat-conducting base, cooling the heat-conducting base, and further cooling the fixed end cover plate and the heat-conducting column. Furthermore, a high thermal conductivity thermal grease is applied between the heat-conducting base and the semiconductor cooling plate. An adapter plate 8 is bolted to the cable panel, also in a square frame configuration. A heat sink base 9 is bolted to the bottom of the heat sink module. The bottom of the heat sink module is bolted to the adapter plate, positioning the heat sink base within the adapter plate's square frame. The heat sink base abuts the heating surface of the semiconductor refrigeration fin, thereby transferring heat generated by the semiconductor refrigeration fin's heating surface to the heat sink module via the heat sink base, where it is dissipated. Specifically, a high-thermal-conductivity thermal grease is applied between the heat sink base and the semiconductor refrigeration fin. The semiconductor refrigeration fin is then fixed in place by securing the connections between the end cover, cable panel, adapter plate, and heat sink module, ensuring that the semiconductor refrigeration fin's cooling and heating surfaces are in close contact with the heat-conducting base and heat-dissipating base, respectively. Simultaneously, the heat generated by the semiconductor refrigeration fin's cooling and heating surfaces are transferred to the heat-conducting column and heat sink module, respectively, via the heat-conducting base and heat-dissipating base, ensuring that the semiconductor refrigeration fin's cooling and heat dissipation do not affect each other. Preferably, both the heat-conducting base and heat-dissipating base are made of copper for excellent thermal conductivity.

[0038] In this embodiment, the refrigeration chamber is provided with an air inlet, a gas-liquid separation valve 12, and an air outlet. Specifically, the air inlet, gas-liquid separation valve, and air outlet are all provided on a movable end cover. The heat pipe is bent into a spiral structure and coiled against the heat-conducting column. The two ends of the heat pipe are respectively connected to the air inlet and air outlet on the refrigeration chamber. Preferably, the heat pipe is a copper pipe with good thermal conductivity. The spiral structure increases the residence time of the gas in the cold heat pipe, thereby achieving a good cooling effect. Specifically, an air inlet nozzle 10 and an air outlet nozzle 11 are respectively installed on the air inlet and air outlet. The air inlet of the heat pipe is connected to the air inlet of the refrigeration chamber, the air outlet of the heat pipe is connected to the inlet of the gas-liquid separation valve, and the air outlet of the gas-liquid separation valve is connected to the air outlet on the refrigeration chamber. The drain port 1201 of the gas-liquid separation valve discharges condensed moisture. Preferably, the port of the heat pipe near the suspended end of the heat-conducting column is the air inlet, and the port of the heat pipe near the fixed end of the heat-conducting column is the air outlet. Specifically, the air inlet of the heat pipe and the air inlet hole on the refrigeration chamber, the air outlet of the heat pipe and the inlet of the gas-liquid separation valve, and the air outlet of the gas-liquid separation valve and the air outlet hole on the refrigeration chamber are all connected through a gas pipeline (not shown in the figure). In order to ensure the refrigeration effect in the refrigeration chamber, after the gas pipeline is installed and the movable end cover is fixed, thermal silicone oil with high thermal conductivity is injected into the refrigeration chamber through the oil filling hole provided on the movable end cover to ensure that the temperature of the entire section of the heat pipe is uniform. After the thermal silicone oil is injected, the oil filling hole is sealed. Since the interior of the refrigeration chamber is immersed in thermal silicone oil, a hose with good acid corrosion resistance is selected for the gas pipeline.

[0039] The working principle of the moist hot gas cooling and drying device provided by the utility model is as follows: after the semiconductor refrigeration plate is powered on, the cooling surface of the semiconductor refrigeration plate continues to cool down, cooling the heat-conducting base, the fixed end cover plate, the heat-conducting column and the heat-conducting pipe. The generated heat is dissipated through the heat dissipation module, and the moist hot gas enters the cold heat-conducting pipe through the air inlet hole, is cooled down in the heat-conducting pipe, and then enters the gas-liquid separation valve under the action of air pressure and undergoes gas-liquid separation. The separated dry gas is discharged through the air outlet of the gas-liquid separation valve, and the condensed moisture is discharged through the drain port of the gas-liquid separation valve.

Claims

1. A device for cooling and drying humid hot gas, wherein humid hot gas flows through the device for cooling, condensing and drying, and is characterized by: The hot and humid gas cooling and drying device comprises: The refrigeration chamber is a closed structure with a hollow cavity inside and an air inlet, a gas-liquid separation valve and an air outlet. A heat-conducting column is located in the hollow cavity of the refrigeration chamber, one end of the heat-conducting column is fixed to one end surface of the refrigeration chamber, and the other end of the heat-conducting column is suspended in the air; The semiconductor refrigeration plate includes a cooling surface and a heating surface. The cooling surface of the semiconductor refrigeration plate is installed against the outside of the end surface of the refrigeration cavity connected to the heat-conducting column to cool the heat-conducting column. The heat dissipation module is connected to the heating surface of the semiconductor refrigeration plate to dissipate the heat generated by the heating surface; The heat conduction pipe is bent into a spiral structure and coiled on the heat conduction column. The air inlet of the heat conduction pipe is connected to the air inlet hole on the refrigeration chamber, the air outlet of the heat conduction pipe is connected to the inlet of the gas-liquid separation valve, and the air outlet of the gas-liquid separation valve is connected to the air outlet hole on the refrigeration chamber.

2. The hot and humid gas cooling and drying device according to claim 1, characterized in that: The refrigeration chamber comprises a cylinder and end cover plates connected to both ends of the cylinder, and the heat conducting column is fixed to one of the end cover plates.

3. The hot and humid gas cooling and drying device according to claim 2, characterized in that: The end cover plate fixed to the heat-conducting column, the cylinder and the heat-conducting column are connected to form an integrated structure, and the end cover plate fixed to the heat-conducting column is made of heat-conducting material.

4. The hot and humid gas cooling and drying device according to claim 2, characterized in that: The end cover plate not fixed to the heat-conducting column is detachably connected to the cylinder through a flange, and the air inlet, gas-liquid separation valve and air outlet on the refrigeration cavity are all arranged on the end cover plate not fixed to the heat-conducting column.

5. The hot and humid gas cooling and drying device according to claim 1, characterized in that: The outside of the refrigeration chamber is wrapped with a heat-insulating layer.

6. The hot and humid gas cooling and drying device according to claim 1, characterized in that: A wiring panel is fixed to the outside of the end face of the refrigeration cavity connected to the heat-conducting column. The wiring panel is a square frame structure with a wire groove provided on the wiring panel. The semiconductor refrigeration plate is placed in the square frame of the wiring panel and abuts against the refrigeration cavity, and the wires on the semiconductor refrigeration plate are led out through the wire groove and connected to an external power supply.

7. The hot and humid gas cooling and drying device according to claim 6, characterized in that: The end surface of the refrigeration cavity connected to the heat-conducting column is fixed with a heat-conducting base. When the wiring panel is fixed on the refrigeration cavity, the heat-conducting base is located in the square frame of the wiring panel. The semiconductor cooling plate is fixed to the heat-conducting base to cool the heat-conducting base, thereby cooling the heat-conducting base and thus cooling the heat-conducting column.

8. The hot and humid gas cooling and drying device according to claim 1, characterized in that: A heat dissipation base is fixed to the bottom of the heat dissipation module, and the heat dissipation module is fixed on the refrigeration cavity so that the heat dissipation base is in contact with the heating surface of the semiconductor refrigeration plate.

9. The hot and humid gas cooling and drying device according to claim 1, characterized in that: The heat conducting pipe is a copper pipe.

10. The hot and humid gas cooling and drying device according to claim 1, characterized in that: The air inlet of the heat conducting pipe and the air inlet hole on the refrigeration chamber, the air outlet of the heat conducting pipe and the inlet of the gas-liquid separation valve, and the air outlet of the gas-liquid separation valve and the air outlet hole on the refrigeration chamber are all connected through the gas pipeline.

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