Tool for measuring perpendicularity and levelness of wire net and equipment of multi-wire cutting machine

Abstract

The utility model relates to the technical field of cutting machines, in particular to a tool for measuring perpendicularity and levelness of a wire net and equipment of a multi-wire cutting machine. The device comprises three cutting rollers, the three cutting rollers are located at the three vertexes of a regular triangle, the peripheries of the cutting rollers are closed and surround a wire net, the device further comprises a gradienter and a dial indicator, a datum plate is arranged on the wire net and is in an L shape, the transverse portion and the vertical portion of the L shape of the datum plate are tangent to the cutting rollers, a workpiece positioning plate is arranged above the cutting rollers, and the workpiece positioning plate is arranged on the periphery of the wire net. The gradienter is a frame type gradienter, and the pointer of the dial indicator is contacted with the side surface of the frame type gradienter or the lower plane of the workpiece positioning plate. By means of the technical scheme, the problem that the perpendicularity and the horizontal precision of the wire net and the feeding direction are low is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of cutting machines, in particular to a tool for measuring the verticality and horizontality of a wire network and equipment of a multi-wire cutting machine. Background Art

[0002] Multi-wire cutting is a new cutting method that uses high-speed reciprocating motion of a metal wire to bring abrasives into the semiconductor processing area for grinding, and simultaneously cuts hard and brittle materials such as semiconductors into hundreds of thin slices at a time.

[0003] After the multi-wire saw is installed with the cutting roller, there is no effective detection of the verticality and horizontal accuracy of the wire mesh and the feed Z axis, and it cannot prevent the wafer angle deviation and total thickness deviation of the wafer after cutting. Utility Model Content

[0004] In order to solve the problems in the related art, the utility model provides a multi-wire cutting machine measuring tool for measuring the verticality and horizontality of the wire network and the equipment, which solves the problem of low verticality and horizontal accuracy of the wire network and the feeding direction.

[0005] To solve the above problems, the following technical solutions are provided:

[0006] The multi-wire cutting machine of the utility model measures the wire net vertically and horizontally with the equipment, and the tooling includes three cutting rollers, and the three cutting rollers are located at the three vertices of an equilateral triangle, and the outer periphery of the cutting roller is closed around the wire net, and also includes a spirit level and a micrometer, and a reference plate is provided on the wire net, and the reference plate is L-shaped, and the horizontal and vertical parts of the L-shaped reference plate are arranged tangent to the cutting rollers, and a workpiece positioning plate is provided above the cutting rollers; the spirit level is a frame level, and the needle of the micrometer is in contact with the side of the frame level or the needle is in contact with the lower plane of the workpiece positioning plate.

[0007] In the above scheme, the verticality of the wire mesh and the workpiece feed direction is measured by using a reference plate in conjunction with a frame level and a micrometer. The reference plate is placed flat on the wire mesh, and the side of the reference plate is visually observed to be basically parallel to the wire mesh. The frame level is placed on the reference plate, and the micrometer is adsorbed on the lower end of the workpiece positioning plate. The needle of the micrometer is located on the side of the frame level. The micrometer is zeroed, and the workpiece is fed downward to measure and adjust the error. The parallelism of the workpiece positioning plate and the wire mesh is measured. The reference plate is placed flat on the wire mesh, and the side of the reference plate is visually observed to be basically parallel to the wire mesh. The micrometer is adsorbed on the reference plate, and the needle of the micrometer is located on the lower plane of the workpiece positioning plate. The micrometer is zeroed, and the front and rear points on one side of the lower plane of the workpiece positioning plate are respectively hit to measure and adjust the error, thereby solving the problem of low verticality and horizontal accuracy of the wire mesh and the feed direction, and preventing the chip angle deviation and total thickness deviation of the chip caused by cutting.

[0008] A cutting head is connected to the workpiece positioning plate, the frame level is located at one end of the reference plate, the frame level is arranged vertically, the micrometer is located near the edge of the lower surface of the workpiece positioning plate, and the needle of the micrometer contacts the side of the frame level.

[0009] In the above scheme, by setting the cutting head, the cutting head feeds downward, the stroke is set at 100mm, and the error is measured and adjusted within 0.02mm, which can ensure that the feed direction of the workpiece is perpendicular to the wire mesh.

[0010] The micrometer is located on the reference plate, and the needle of the micrometer contacts the lower end surface of the workpiece positioning plate.

[0011] In the above scheme, by setting the dial indicator, the error between any two points in the lower plane of the workpiece positioning plate can be measured and adjusted to within 0.03mm, thereby ensuring that the workpiece positioning plate is parallel to the wire mesh.

[0012] The dial gauge includes a magnetic gauge seat, which is located on the end of the dial gauge, so that the dial gauge is adsorbed on the workpiece positioning plate or the reference plate.

[0013] In the above solution, the magnetic meter holder is provided so that it can be adsorbed on the iron surface conveniently and quickly, thereby improving the stability and accuracy of the measurement, making the operation easier and improving work efficiency.

[0014] The length of the L-shaped transverse portion of the reference plate is slightly greater than the length between the two cutting rollers.

[0015] The workpiece positioning plate is provided with a groove, and the lower surface of the cutting head is provided with a protrusion adapted to the groove.

[0016] In the above solution, the grooves and protrusions are arranged correspondingly for positioning.

[0017] The above solution has the following advantages:

[0018] 1. The multi-wire cutting machine of the present invention measures the verticality of the wire net and the equipment, and the horizontal tooling includes three cutting rollers. The outer periphery of the cutting roller is closed around the wire net. A reference plate is provided on the wire net. The reference plate is L-shaped. The horizontal and vertical parts of the L-shaped reference plate are arranged tangentially with the cutting roller. A workpiece positioning plate is provided above the cutting roller. The level is a frame level. The needle of the dial indicator contacts the side of the frame level or the needle contacts the lower plane of the workpiece positioning plate. The verticality of the wire net and the workpiece feeding direction is measured by the reference plate in conjunction with the frame level and the dial indicator. The reference plate is placed flat on the wire net. It is visually observed that the side of the reference plate is basically parallel to the wire net. The frame level is placed flat on the wire net. The instrument is placed on the reference plate, the dial indicator is adsorbed on the lower end of the workpiece positioning plate, the dial indicator needle is located on the side of the frame level, the dial indicator is zeroed, fed downward, measured and adjusted for errors; to measure the parallelism of the workpiece positioning plate and the wire mesh, the reference plate is placed flat on the wire mesh, and the side of the reference plate is visually parallel to the wire mesh. The dial indicator is adsorbed on the reference plate, the dial indicator needle is located on the lower plane of the workpiece positioning plate, the dial indicator is zeroed, and the front and rear points on one side of the lower plane of the workpiece positioning plate are respectively hit to measure and adjust the error, effectively detecting the verticality and horizontal accuracy of the wire mesh and the feed direction, and preventing the wafer angle deviation and total thickness deviation of the wafer caused by the cutting.

[0019] 2. A cutting head is connected to the workpiece positioning plate, and the frame level is located at one end of the reference plate. The frame level is arranged vertically, and the dial indicator is located near the edge of the lower surface of the workpiece positioning plate. The needle of the dial indicator contacts the side of the frame level. Through the setting of the cutting head, the cutting head feeds downward, and the stroke is set at 100mm. The error is measured and adjusted within 0.02mm to ensure that the feed direction of the workpiece is perpendicular to the wire mesh. The dial indicator is located on the reference plate, and the needle of the dial indicator contacts the lower end surface of the workpiece positioning plate. Through the setting of the dial indicator, the error of any two points in the lower plane of the workpiece positioning plate is measured and adjusted within 0.03mm to ensure that the workpiece positioning plate is parallel to the wire mesh. The dial indicator contains a magnetic base, which is located on the end of the dial indicator, so that the dial indicator is adsorbed on the workpiece positioning plate or the reference plate. Through the setting of the magnetic base, it is convenient and quick to adsorb on the iron surface, thereby improving the stability and accuracy of the measurement, making the operation easier, and helping to improve work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to make the content of the utility model easier to understand, the present invention is further described in detail below based on specific embodiments of the utility model in conjunction with the accompanying drawings, wherein:

[0021] Figure 1 This is a schematic diagram of the structure of the verticality detection tool in the tooling for measuring the verticality and horizontality of the wire network and equipment of the multi-wire cutting machine;

[0022] Figure 2A side view of the verticality detection tool used to measure the verticality and horizontality of the wire mesh and equipment of a multi-wire cutting machine;

[0023] Figure 3 This is a schematic diagram of the structure of the multi-wire cutting machine measuring wire network and the vertical and horizontal tooling A of the equipment;

[0024] Figure 4 This is an enlarged structural diagram of the multi-wire cutting machine measuring wire network and the vertical and horizontal tooling B of the equipment;

[0025] Figure 5 This is a schematic diagram of the structure of the levelness detection tool in the multi-wire cutting machine measuring tool for the vertical and horizontal measurement of the wire network and equipment;

[0026] Explanation of the accompanying symbols: 1. Cutting roller; 2. Wire mesh; 3. Micrometer; 301. Needle; 302. Magnetic base; 4. Reference plate; 5. Workpiece positioning plate; 6. Frame level; 7. Cutting head; 8. Groove; 9. Protrusion. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] like Figures 1 to 5 As shown, the multi-wire cutting machine of the present invention measures the wire net vertically and horizontally with the equipment, and the tooling includes three cutting rollers 1. The three cutting rollers 1 are located at the three vertices of an equilateral triangle. The outer periphery of the cutting rollers 1 is closed and surrounded by a wire net 2. A reference plate 4 is provided on the wire net 2. The reference plate 4 is L-shaped. The horizontal and vertical parts of the L-shaped reference plate 4 are arranged tangentially to the cutting rollers 1. The length of the L-shaped horizontal part of the reference plate 4 is slightly larger than the length between the two cutting rollers 1. A workpiece positioning plate 5 is provided above the cutting rollers 1. The level is a frame level 6. The micrometer 3 The needle 301 contacts the side of the frame level 6 or the needle 301 contacts the lower plane of the workpiece positioning plate 5. Through the reference plate 4, the frame level 6 and the micrometer 3 are used to measure the verticality of the wire mesh 2 and the workpiece feeding direction to ensure that the feed direction of the workpiece is perpendicular to the wire mesh 2. The parallelism of the workpiece positioning plate 5 and the wire mesh 2 is measured to ensure that the workpiece positioning plate 5 is parallel to the wire mesh 2. The verticality and horizontal accuracy of the wire mesh 2 and the feeding direction are effectively detected to prevent the wafer angle deviation and the total thickness deviation of the wafer caused by cutting.

[0029] The dial indicator 3 includes a magnetic base 302, which is located on the end of the dial indicator 3, so that the dial indicator 3 can be adsorbed on the workpiece positioning plate 5 or the reference plate 4. Through the setting of the magnetic base 302, the dial indicator 3 can be conveniently and quickly adsorbed on the iron surface, thereby improving the stability and accuracy of the measurement, making the operation easier, and helping to improve work efficiency.

[0030] In the first embodiment, the verticality between the wire mesh 2 and the workpiece feed direction is measured, such as Figure 1 、 2 As shown, a cutting head 7 is connected to the workpiece positioning plate 5, a frame level 6 is located at one end of the reference plate 4 near the L-shaped vertical portion, the frame level 6 is arranged vertically, and a micrometer 3 is located near the edge of the lower surface of the workpiece positioning plate 5, as shown in FIG. Figure 3 As shown, the needle 301 of the micrometer 3 is against the side of the frame level 6, as shown in FIG. Figure 4 As shown, a groove 8 is provided on the workpiece positioning plate 5, and a protrusion 9 adapted to the groove 8 is provided on the lower surface of the cutting head 7. The working process is as follows:

[0031] A1. Place the horizontal portion of the reference plate 4L-shaped flat on the wire mesh 2, and visually check that the side of the reference plate 4 is substantially parallel to the wire mesh 2;

[0032] B1. Place the frame level 6 on the reference plate 4, with the front end of the frame level 6 aligned with the side of the reference plate 4;

[0033] C1. The dial indicator 3 is adsorbed on the front end of the lower plane of the workpiece positioning plate 5 by the magnetic base 302. The needle 301 of the dial indicator 3 is located on the side of the frame level 6. The needle 301 and the side of the frame level 6 are against each other, and the dial indicator 3 is zeroed;

[0034] D1. Feed the cutting head 7 downward with a stroke of about 100 mm. Measure and adjust the reading error of the dial indicator 3 to within 0.02 mm.

[0035] E1. Move the reference plate 4, frame level 6, and dial indicator 3 to the rear end of the cutting roller 1 and repeat step D1 to feed, measure, and adjust.

[0036] Example 2: Measure the parallelism of the workpiece positioning plate 5 and the wire mesh 2. Figure 5 As shown, the dial gauge 3 is located on the reference plate 4, and the needle 301 of the dial gauge 3 abuts against the lower end surface of the workpiece positioning plate 5. The working process is as follows:

[0037] A2. Place the horizontal portion of the reference plate 4L-shaped flat on the wire mesh 2, and visually check that the side of the reference plate 4 is substantially parallel to the wire mesh 2;

[0038] B2. The dial gauge 3 is adsorbed on the reference plate 4. The needle 301 of the dial gauge 3 is located on the lower plane of the workpiece positioning plate 5. The needle 301 is offset against the lower plane of the workpiece positioning plate 5. The dial gauge 3 is zeroed.

[0039] C2. Mark any two points on the front and back of the lower plane of the workpiece positioning plate 5;

[0040] D2. Adjust the workpiece positioning plate 5 according to the reading. Repeat the measurement of the two points and make adjustments until the reading error is within 0.03mm.

[0041] In the description of the present invention, it should be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention. In the description of the present invention, unless otherwise specified and limited, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a mechanical connection or an electrical connection, or it can be the internal communication of two elements, it can be a direct connection, or it can be an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0042] Obviously, the above embodiments are merely examples for clear explanation and are not limitations on the implementation methods. For ordinary technicians in the field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to enumerate all the implementation methods here, and the obvious changes or modifications derived therefrom are still within the scope of protection of the present invention.

Claims

1. A multi-wire cutting machine measuring wire net is vertical to the equipment and horizontal to the tooling, comprising three cutting rollers (1), the three cutting rollers (1) being located at the three vertices of an equilateral triangle, the outer periphery of the cutting rollers (1) being closed around the wire net (2), characterized in that: The invention also comprises a level and a micrometer (3); a reference plate (4) is provided on the wire mesh (2); the reference plate (4) is L-shaped; the horizontal part and the vertical part of the L-shaped reference plate (4) are arranged tangentially to the cutting roller (1); a workpiece positioning plate (5) is provided above the cutting roller (1); the level is a frame level (6); the needle (301) of the micrometer (3) contacts the side surface of the frame level (6) or the needle (301) contacts the lower plane of the workpiece positioning plate (5).

2. The multi-wire cutting machine measuring wire network and equipment vertical and horizontal tooling according to claim 1, characterized in that: A cutting head (7) is connected to the workpiece positioning plate (5), the frame level (6) is located at one end of the reference plate (4), the frame level (6) is arranged vertically, the micrometer (3) is located near the edge of the lower surface of the workpiece positioning plate (5), and the needle (301) of the micrometer (3) contacts the side of the frame level (6).

3. The multi-wire cutting machine measuring wire network and equipment vertical and horizontal tooling according to claim 1, characterized in that: The micrometer (3) is located on the reference plate (4), and the needle (301) of the micrometer (3) contacts the lower end surface of the workpiece positioning plate (5).

4. The multi-wire cutting machine measuring wire network and equipment vertical and horizontal tooling according to claim 1, characterized in that: The dial gauge (3) comprises a magnetic gauge seat (302), and the magnetic gauge seat (302) is located on the end of the dial gauge (3), so that the dial gauge (3) is adsorbed on the workpiece positioning plate (5) or the reference plate (4).

5. The multi-wire cutting machine measuring wire network and equipment vertical and horizontal tooling according to claim 1, characterized in that: The length of the L-shaped transverse portion of the reference plate (4) is slightly greater than the length between the two cutting rollers (1).

6. The multi-wire cutting machine measuring tool for measuring the verticality and horizontality of the wire network and the equipment as claimed in claim 2, characterized in that: The workpiece positioning plate (5) is provided with a groove (8), and the lower surface of the cutting head (7) is provided with a protrusion (9) adapted to the groove (8).

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