Silicon crystal plate edge cutting and grinding integrated device

Abstract

The utility model is suitable for the technical field of silicon crystal plates, and provides a silicon crystal plate edge cutting and grinding integrated device which comprises a pair of vertical frames, supports are fixed to the tops of the vertical frames, a truss is fixed between the two supports, cutter assemblies are fixed to the truss in a bilateral symmetry mode, and edge grinding assemblies are further installed on the vertical frames and located behind the cutter assemblies. The cutter assembly comprises a fixing block, a cutting groove, a groove and a protruding block, a blade is placed in the groove, the edge grinding assembly comprises a polishing and grinding motor, and an output shaft of the polishing and grinding motor is provided with a cloth wheel. When the bolt on the fixing block is locked, the protruding block enters the groove to extrude the blade so that the blade can be fixed, the width of the groove is consistent with that of the blade, and the blade cannot shake. In addition, the structure is further provided with an edge grinding assembly, the side edge of the silicon crystal plate after edge cutting can be further ground, and a notch is more attractive.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon crystal plate production, and in particular relates to an integrated device for cutting and grinding an edge of a silicon crystal plate. Background Art

[0002] Silicon crystal panels are widely used in the construction and interior decoration industries. Their primary component is gypsum, which is also mixed with glass fiber to enhance product strength. During production, gypsum slurry is mixed with glass fiber and stirred until evenly mixed. The mixture is then applied to the lower formwork, where it is then scraped, vibrated, and pressed onto the upper formwork.

[0003] The gypsum mixture is transported between the upper and lower templates for a certain period of time before crystallizing and forming. After the upper and lower templates leave in turn, the formed silicon crystal plate is sent to the conveyor belt. At the same time, since a small amount of slurry will overflow from the side when the upper and lower templates are pressed together, burrs will form on the side of the silicon crystal plate after solidification, and a trimming device is needed to remove the burrs.

[0004] Existing cutting devices include a portal frame with a blade fixed on each side of the portal frame. However, the blade is easy to loosen and is difficult to adjust. Moreover, even after the blade trims the edge, the incision is relatively stiff and not beautiful. Utility Model Content

[0005] In view of the above problems, the purpose of the present invention is to provide an integrated device for trimming and grinding silicon wafers, aiming to solve the above technical problems.

[0006] The utility model adopts the following technical solutions:

[0007] The integrated silicon wafer trimming and grinding device includes a pair of vertical frames, a bracket is fixed on the top of the vertical frames, a truss is fixed between the two brackets, a cutter assembly is fixed symmetrically on the left and right of the truss, and a grinding assembly is also installed on the vertical frame behind the cutter assembly, wherein the cutter assembly includes a fixed block, and the fixed block has a groove opened inward from the end surface, wherein one of the two surfaces formed by the groove is formed with a groove, and the other surface forms a corresponding protrusion, a blade is placed in the groove, and the outer end of the fixed block also has a bolt passing through the groove, and the grinding assembly includes a polishing motor, and the output shaft of the polishing motor has a cloth wheel.

[0008] Furthermore, the inner end of the fixing block has a notch, and the truss is provided with a long hole. After the notch of the fixing block is attached to the bottom of the truss, a fixing bolt is passed through the long hole and locked with the fixing block.

[0009] Furthermore, the edging assembly also includes an inclined plate fixed to the inner side of the stand, and the polishing motor is fixed to the inclined plate through a pair of clamps.

[0010] Furthermore, the bracket includes a pair of square tubes, angle steels are fixed to the tops of the pair of square tubes, and both ends of the truss are fixed to the angle steels on the corresponding sides.

[0011] Furthermore, a recycling box is fixed on the stand, a material drop opening is provided at the top of the recycling box, and a sliding door is provided on the side wall of the recycling box.

[0012] The beneficial effects of the present invention are as follows: in this structure, a pair of adjustable cutter assemblies are provided, and an oblique groove is opened on the fixed block of the cutter assembly. One of the two sides of the oblique groove has a groove, and the other side has a protrusion. The blade is placed in the groove. When the bolt on the fixed block is locked, the protrusion enters the groove and squeezes the blade to fix the blade. The groove width is consistent with the blade, and the blade will not shake. In addition, this structure is also provided with an edge grinding assembly, which can further grind the side edge of the silicon wafer after edge cutting to make the incision more beautiful. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 The invention provides a three-dimensional integrated device for cutting and grinding silicon wafer edges. Figure 1 ;

[0014] Figure 2 The invention provides a three-dimensional integrated device for cutting and grinding silicon wafer edges. Figure 2 ;

[0015] Figure 3 It is an enlarged structural diagram of the cutter assembly provided in an embodiment of the present utility model. DETAILED DESCRIPTION

[0016] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0017] In order to illustrate the technical solution of the present invention, specific embodiments are provided below.

[0018] like Figure 1-3As shown, the integrated silicon wafer trimming and grinding device provided in this embodiment includes a pair of vertical frames 1, a bracket 2 is fixed on the top of the vertical frame 1, a truss 3 is fixed between the two brackets 2, a cutter assembly 4 is symmetrically fixed on the left and right of the truss 3, and a grinding assembly 5 is also installed on the vertical frame 1 behind the cutter assembly 4, wherein the cutter assembly 4 includes a fixed block 41, and the fixed block 41 has a groove 42 opened inward from the end surface, wherein one of the two surfaces formed by the groove 42 is formed with a groove 43, and the other surface forms a corresponding protrusion 44, a blade 45 is placed in the groove 43, and the outer end of the fixed block 41 also has a bolt passing through the groove 42, and the grinding assembly 5 includes a polishing motor 51, and the output shaft of the polishing motor 51 has a cloth wheel 52.

[0019] In this structure, the blade is placed in the groove of the fixed block. The protrusion contacts the blade, creating a certain friction between them, preventing the blade from sliding down automatically due to gravity. The width of the protrusion is slightly smaller than the width of the groove. After adjusting the blade position, tighten the bolts on the fixed block. The fixed block deforms, and the protrusion presses toward the blade, thus effectively securing the blade. Furthermore, because the blade width matches the groove width, the conveyor belt removes burrs from both sides of the silicon wafer as it passes by. The blade is confined within the groove, making it less prone to shaking and extremely secure.

[0020] Furthermore, as shown, the inner end of the fixing block 41 has a notch 46. The truss 3 has an elongated hole 31. After the notch 46 of the fixing block is attached to the bottom of the truss 3, a fixing bolt 47 is inserted through the elongated hole 31 to lock it to the fixing block. The fit between the notch and the truss prevents the fixing block from deflecting, further ensuring blade stability. The elongated hole also allows for fine-tuning the left and right position of the cutter assembly, ensuring precise incision placement.

[0021] In this embodiment, after trimming, the silicon wafer is transported backward. This embodiment also includes an edge grinding assembly. The edge grinding assembly 5 includes an inclined plate 53 fixed to the inside of the stand 1. The polishing motor 51 is secured to the inclined plate 53 via a pair of clamps 54. The polishing motor is tilted, as is the cloth wheel, which polishes the trimmed edges, resulting in a smoother and more aesthetically pleasing cut.

[0022] During the specific production process, the stand 1 is made of channel steel, and the bracket 2 includes a pair of square tubes 21, with angle steels 22 fixed to the top of the pair of square tubes 21. The two ends of the truss 3 are fixed to the corresponding angle steels 22. Similarly, the two ends of the truss are also notched. A recycling box 6 is also fixed to the stand, with a drop opening 61 at the top of the recycling box 6 and a sliding door 62 on the side wall of the recycling box 6. The waste materials and dust after grinding fall into the recycling box for collection, preventing the waste materials and dust from falling directly on the ground and being difficult to collect and polluting the workshop.

[0023] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A silicon wafer edge trimming and grinding integrated device, characterized in that: It includes a pair of vertical frames, a bracket is fixed on the top of the vertical frame, a truss is fixed between the two brackets, a cutter assembly is fixed on the left and right of the truss symmetrically, and an edging assembly is also installed on the vertical frame behind the cutter assembly, wherein the cutter assembly includes a fixed block, and the fixed block has a groove opened inward from the end surface, wherein one of the two surfaces formed by the groove is formed with a groove, and the other surface forms a corresponding bulge, a blade is placed in the groove, and the outer end of the fixed block also has a bolt passing through the groove, and the edging assembly includes a polishing motor, and the output shaft of the polishing motor has a cloth wheel.

2. The integrated silicon wafer trimming and grinding device according to claim 1, characterized in that: The inner end of the fixing block is provided with a notch, and the truss is provided with a long hole. The notch of the fixing block is attached to the bottom of the truss and then a fixing bolt is passed through the long hole to be locked with the fixing block.

3. The integrated silicon wafer trimming and grinding device according to claim 2, characterized in that: The edging assembly further includes an inclined plate fixed to the inner side of the stand, and the polishing motor is fixed to the inclined plate via a pair of clamps.

4. The integrated silicon wafer edge trimming and grinding device according to claim 3, characterized in that: The bracket includes a pair of square tubes, angle steels are fixed to the tops of the pair of square tubes, and both ends of the truss are fixed to the angle steels on corresponding sides.

5. The integrated silicon wafer trimming and grinding device according to claim 4, characterized in that: A recycling box is also fixed on the stand, a material drop opening is provided at the top of the recycling box, and a push door is also provided on the side wall of the recycling box.

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